POLOS CPK WAFER SPINNER SOP

Transcription

1 POLOS CPK WAFER SPINNER SOP June 2013 Start-up Procedure: 1. Press the green Start button between the two upper displays to turn on the spinner. 2. If any of the marked orange lights in the upper right corner are lit, then make sure to notify one of the CPK master users immediately. The CPK should not be used until this problem is resolved. 3. Open the cabinets below and look for a small valve located behind the chemicals. Rotate the valve so that it is oriented horizontally to provide pressure to the chemicals. Verify pressure is provided using the pressure gauge nearby; less than 10 psi is ideal. 4. Follow the commands on the screen which will involve opening and closing the lid and pressing any key on the display.

2 Job Procedure: 5. The first step is to ensure that you have the correct chuck for holding your sample. Two screws hold the chuck in place and should be removed before changing chucks. Replacement chucks are located behind the process domes. 6. The next step is to load your wafer into the MF-319 side of the CPK if you wish to develop your sample. The right side is the MF-319 side. Simply place your sample in the holder so that there is very little rotational movement. There is no vacuum to hold the sample in place. 7. Gently close the dome lid and press down hard on the latch to be sure that there is a seal on the dome. 8. Select the program that you want if it is one of the permanent programs. This is done by pressing <PROG>, typing in the appropriate program number, and hitting the <ENTER> button (<ENTER> is located to the right of <DEL>). Two permanent program spots are reserved: 2 and 3. Program 3 is reserved for photomasks created using the 2mm write head and program 2 functions best for photomasks using the other write heads. 9. If the program you want is not on the list you must write your own program. To write your own program, follow the instructions in the next section of the SOP. 10. Finally, once your program is established, press the <I/O> button to begin development. 11. When the program is finished, use the latch to raise the dome and you can remove your sample. 12. Follow the same procedure on the other side if you want to use the chrome etch system. Program 2 should be used for all mask etch jobs. 13. When finished follow the shut-down procedure shown below.

3 Programming Procedure: 1. The easiest method to creating a program is to copy an existing program and editing it. This is done by starting in RUN mode and selecting the program you wish to copy. Once the program to be copied is loaded, select <PROG> and hit the indentation button located under <1>. Lastly type in the program to be copied to and hit <ENTER>. 2. To enter program mode, select the <MODE> button and choose program mode from the menu. 3. Change to one of the custom programs (11-20) by pressing the <PROG> button and typing in the appropriate number and hitting the <ENTER> button. 4. To return to RUN mode at any time hit <ESC> 2 times (<ESC> is the button to the left of <DEL>). This usually exits without saving 5. To ensure changes to a program are saved you must hit <PROG> and select a different program before hitting <ESC> twice. 6. Change the step currently being edited by moving the cursor to the step line, inputting the step number you want to edit, and hitting the <ENTER> key. 7. The next line down controls the rotation of the sample. A small arrow to the left of the number indicates the direction of movement. The symbol (<-) shows that it will rotate counterclockwise while (->) causes it to rotate clockwise. This value is changed by pressing <0> or <1> and hitting <ENTER>. This has to be set before the rotational speed can be changed. Once it has been changed simply input the desired rpm and press <ENTER>. 8. The next line down controls the run time for the step. To change this value simply being inputting the number and hit <ENTER> when finished. 9. The next line controls the rate of rotational acceleration of the current step compared to the previous step. It is changed in the same way as the run time. 10. The last thing to change is which, if any, valve is activated during the step. Different valves can be selected by highlighting valve on the display and typing in the number corresponding to the valve you wish to activate. Activated valves will be marked with an asterisk underneath. Valves will automatically close at the end of the step. Relays 1 and 2 are not used for any procedures and therefore should never be activated. The following shows which numbers correspond to which action: i. 1 = Dome Rinse ii. 2 = Dome N2 iii. 3 = Wafer Rinse iv. 4 = Wafer N2 v. 5 = Chemical Dispense (MF 319 or Chrome Etchant, depending on bowl) vi. 6 = Bottom Rinse

4 11. Finally, when you reach the last step of your program press <I/O> to establish that as the final step in your process. This is signified by the word END appearing next to the last step and any steps after this one. Shut-down Procedure: 1. If any of the orange lights at the top of the CPK are lit, then follow the shut down procedure and notify one of the CPK master users. These lights mean that at least one of the containers below needs to be replaced. 2. When finished processing on the CPK, press the stop button on the display, directly under the start button. 3. Next is to shut down pressure to the chemicals. This is done by opening up the cabinets below and located the valve opened previously. Turn these valves vertical to release pressure on the chemicals. The pressure gauge should drop to zero when the valve is closed. 4. Finally it is important to keep the environment clean so we ask that it be sprayed down and dried after use. The DI water and nitrogen hoses are located near the domes. We ask that you spray everything inside the domes with water and then use the nitrogen gun to push any standing water into the back of the bowl where there is a drain.

5 APPENDIX DEFAULT PROGRAMS MF-319 Program 2 20mm and 4mm photomasks 1 Right Right Left Left Right Left Right Left Right Right Right ,2,3 12 Right MF-319 Program 6 2mm photomasks 1 Right Right Left Left Right Right ,2,3 7 Right Chrome Etch Program 2 All photomasks 1 Right Right Left Right Right Left Left Left ,6 9 Right ,2 10 Right ,3,6 11 Right