Kevin Donnelly, General Manager, Memory and Interface Division

Transcription

1 Kevin Donnelly, General Manager, Memory and Interface Division Robust system solutions including memory and serial link interfaces that increase SoC and system quality.

2 Driving Factors for Systems Today Mobile Increased battery life Reduced weight HD image and video capture Improved graphics Higher resolution displays Faster time-to-market Cloud Faster response times Reduced power consumption Increased storage Reduced system cost Lower total cost of ownership Memory and Links are key enablers for Mobile and Cloud systems Rambus Inc.

3 Memory and Interface Solutions Our Value: Memory Architectures & Chip Interfaces DRAM SoC SoC Differentiation: Absolutely best power and signal integrity solutions from chip, through package, and PCB System-aware PHY interface design Enhanced industry standards Product Focus: Memory architectures for system performance High-speed DDR PHYs for mobile and server >10Gbps multi-protocol serial links for data center Why we win: Advanced architectures providing higher performance and lower power Chip companies are not focused on SIP while SIP competitors focus only on standard solutions Broad, foundational patent portfolio Rambus Inc.

4 Features Rambus Leadership in Memory Solutions Mobile Interface Type RDRAM SDRAM DDR XDR DDR2 GDDR3 XDR2 DDR3 GDDR5 LPDDR2 LPDDR3 LPDDR3, R+ DDR4 XDR Year Introduced Max Data Rate 500Mb/s 133Mb/s 400Mb/s 3200Mb/s 800Mb/s 1200Mb/s 12800Mb/s 1600 Mb/s 7000 Mb/s 1066Mb/s 4300Mb/s 1600Mb/s 2400Mb/s 3200Mb/s Programmable Read Latency Variable Block Size Core Prefetch Dual Edge Clocking DLL or PLL on a DRAM Advanced Power States Programmable Write Delay Double Bus Rate Control Driver Impedance/On Die Termination Calibration using Precision Resistor Fly-By Command/Address Timing Deskew/Flexphase Bank Grouping/Microthreading Channel Equalization Technology Near ground signaling (NGS) Technology Multi Channel Die Rambus Leadership Product Industry Standard Compliant Product Note: This list is not exhaustive. Many of the generically labeled innovations listed in the far left hand column are patented or patent pending. Dates shown refer to when innovations were included in the standard when promulgated (some features may no longer be required to conform to such standard), a commercial product or referenced in a datasheet.

5 R+ Enhanced Standard Solutions Fully Standards Compatible Faster time-to-market Multi-modal functionality Reduced Power Improved power efficiency Lower signaling and standby power R+ DDRn Memory R+ LPDDR3 R+ DDR4 Multi-Modal R+ Next-Gen DDR R+ Enhanced Standard Solutions R+ Serial Links R+ Multi-Protocol PHYs: PCIe1/2/3, CEI6/11, XAUI, 10G, SATA1/2/3, etc. Cost-Effective Flexible packaging options Improved margin and yield Enhanced testability Improved Performance Increased data rates Higher bandwidth Higher capacity Rambus Inc.

6 R+ LPDDR3 DRAM Solution Enables engagement with broader market Next-generation performance with compatibility to industry standards Rambus Inc.

7 Customer Engagement SIP core licensing enables deep customer collaboration R&D Program initiation Product development / tape-out Customer product launch Use fees / royalties 3-6 months 6-18 months 3-12 months 2-10 years Non-recurring engineering (NRE) fees Use fees/royalties over life of product Per use (i.e. chip tape-out) Per chip (i.e. unit-based, ASP-based) Rambus Inc.

8 Example Applications of Rambus Solutions Mobile Cloud Multi-Protocol Serial Links High performance, low power serial links for networking and IOs R+ LPDDR3 DRAM 2.13Gbps, 30% lower power than LPDDR3; SoC PHYs compatible with LPDDR4, LPDDR3 Next-Gen Main Memory Beyond DDR4 6.4Gbps, up to 55% better power efficiency than DDR3, zero DRAM idle power Rambus Inc.

9 Engagement Model Expanded, New Offerings IP Core Solutions Architecture License Patent License Tools Services Training Access to technical experts Advanced system design and analysis HW and SW to enhance design and validation Access to patents System IP, specs and validation suites Process-specific hard and soft macros optional optional optional MID has two customer categories: DRAM companies & SOC companies Rambus Inc.

10 Tools that Simplify Integration POWERFUL & USABLE Optimized for ease-ofuse to speed time to market, LabStation Validation Platform is a comprehensive tool suite to bring-up, validate and characterize complex low-power, highperformance memory and serial link IP. RAPID ITERATION COMPREHENSIVE SCRIPTING COMPLETE CHARACTERIZATION Rambus Inc.

11 Current and Example Prospective Customers DRAM Customers SoC Customers Prospective Customers Rambus Inc.

12 Rambus Joins JEDEC NEWS RELEASE Rambus Joins JEDEC Committee to Advance Server Memory Systems Intends to help improve power and performance in cloud and server-based memory environments SUNNYVALE, CALIF. May 14, 2014 Rambus Inc. (NASDAQ:RMBS) today announced it has joined JEDEC Committee 40 (JC-40), which focuses on standards and performance test criteria for integrated circuits in the fastgrowing cloud and server-based memory environments. As part of this membership, Rambus will work with other memory technology leaders to help define new architectural directions in server memory that can improve power, performance, and cost and drive greater market and platform growth across the industry. The need for memory systems to meet the increasing demands of the cloud is growing rapidly and we re continually exploring new memory architectures that solve real world Important milestone JC-40: standards and test criteria for ICs used in cloud and server-based memory systems Importance and opportunity in the server and cloud memory ecosystems Rambus can contribute to future architectures and standards Rambus Inc.

13 Growth Opportunity for Memory & Interfaces $M Opportunities in both mobile and server verticals Rev 2013 SAM 2015 SAM 2018 SAM Significant potential in SoC and opportunities in DRAM DRAM revenue will grow as we continue to license technology to DRAM companies SoC revenue will grow as we license our patent portfolio as well as memory and serial link SIP Revenue DRAM SoC Rambus Inc.

14 Summary: Memory and Interfaces Offerings address large and growing mobile devices and cloud infrastructure market opportunities Represent significant growth opportunities going forward R+ solutions have significantly lowered the barriers to adoption for our innovative architecture solutions Standards compliant, but better! Broad licensing of our inventions provides substantial ROI and fuels future growth Reasonable market rates help increase penetration and expand our customer base Rambus Inc.