Metallizer for BD-R/RE Production and Beyond. Oerlikon Systems. R. Bieri Head of Metallizer Balzers, March 2011

Transcription

1 Metallizer for BD-R/RE Production and Beyond Oerlikon Systems R. Bieri Head of Metallizer Balzers, March 2011

2 Layer Stack done on Oerlikon Metallizer Page 2 15/03/2011 Media Tech 2011 R. Bieri SYOM

3 Oerlikon Metallizer: more then 20 Years in the OD Industry MO Disc CD-RW, DVD+/-RW, DVD-RAM, BD-R/RE BDXL SDS 100 SDS 131 BIG SPRINTER SPRINTER-8 SPRINTER-9/13 SPRINTER CDI 901 CDI 915 SWIVEL98 TWISTER CUBE SPEED & SWIVEL2000 SWIVEL & Cube Star & CUBE LITE RF 2003 Page 3 15/03/2011 Media Tech 2011 R. Bieri SYOM

4 BD Recordable Media Layers, the Heart of the Recordable Disc It s all about the layers! done on Oerlikon Metallizer Page 4 15/03/2011 Media Tech 2011 R. Bieri SYOM

5 The right Metallizer for your Process HtL, LtH, Pre-Recorded Sprinter Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Recordable LtH & Pre-Recorded & Recordable LtH Page 5 15/03/2011 Media Tech 2011 R. Bieri SYOM

6 Sprinter Family: The Industry Standard Sprinter-5 BD-R Sprinter-9 BD-R/RE Sprinter-13 BD-RE, BDXL Page 6 15/03/2011 Media Tech 2011 R. Bieri SYOM

7 The Complete Layer Stack in one System Page 7 15/03/2011 Media Tech 2011 R. Bieri SYOM

8 The Complete Layer Stack in one System Reflective Layer Protective Layer Recording Layer Protective Layer Page 8 15/03/2011 Media Tech 2011 R. Bieri SYOM

9 Sprinter Advantages Speed: Highest Throughput Reflective Layer Protective Layer Uniformity: Excellent Layer Uniformity Recording Layer Flexible Configuration: the right sputter source for your process Protective Layer Page 9 15/03/2011 Media Tech 2011 R. Bieri SYOM

10 Sprinter Advantages: Speed Speed: Highest Throughput Dry Cycle Time 2.8 sec > 1200 discs/h fast target change high uptime Uniformity: Excellent Layer Uniformity Flexible Configuration: the right sputter source for your process Page 10 15/03/2011 Media Tech 2011 R. Bieri SYOM

11 Speed: Indicat for ARQ21 DC & RF and Disc Loader Disc Loader Dry Cycle Time: Sprinter-5: < 2.8 sec Sprinter-9: < 2.8 sec * Sprinter-13: < 2.8 sec (* incl. process time < 1.7 sec) Indicat Indirect cooling plate Fast Target Change Time < 30 sec fixed cooling membrane Page 11 15/03/2011 Media Tech 2011 R. Bieri SYOM

12 Sprinter Advantages: Uniformity Speed: Highest Throughput Dry Cycle Time 2.8 sec > 1200 discs/h Reflective Layer Protective Layer Uniformity: Excellent Layer Uniformity < +/- 2.5 % for most sputter materials Disc rotation during sputtering stable production condition Recording Layer Flexible Configuration: the right sputter source for your process Protective Layer Page 12 15/03/2011 Media Tech 2011 R. Bieri SYOM

13 Thickness [nm] Thickness [nm] Uniformity: Layer Uniformity for your Process Magnet system tuning to reach film thickness uniformity: (for most sputter materials) ± 2.5 % within a disc Thickness Uniformity Thickness Uniformity Radius [mm] top-down +2.5% % left-right Radius [mm] top-down +2.0% -2.0% left-right Page 13 15/03/2011 Media Tech 2011 R. Bieri SYOM

14 Sprinter Advantages: Flexibility for any Process Speed: Highest Throughput Dry Cycle Time 2.8 sec > 1200 discs/h BD-R SL BD-RE SL BD-R DL Uniformity: Excellent Layer Uniformity < +/- 2.5 % for most sputter materials Disc rotation during sputtering Flexible Configuration: DC, DC pulsed, DC Flexicat RF, RF Flexicat Cooling Station CS21 MSQ Multi Source 4th Gen OD BDXL BD-RE DL Page 14 15/03/2011 Media Tech 2011 R. Bieri SYOM

15 Flexible Configuration: Process Station Selection Disc Loader ARQ21 DC ARQ21 RF ARQ21 RF Flexicat ARQ21 DC Flexicat MSQ MCIS CS21 Window HS21 Page 15 15/03/2011 Media Tech 2011 R. Bieri SYOM

16 Selected Sputter Rates for ARQ21DC and ARQ21RF ARQ21 DC Al-alloy Ag-alloy TeGeSb Cu-alloy SiN 33 nm/sec 33 nm/sec 10 nm/sec 30 nm/sec 3 nm/sec ARQ21 RF ZnS-SiO2 GeCrN GeN 12 nm/sec 2.5 nm/sec 2.5 nm/sec Page 16 15/03/2011 Media Tech 2011 R. Bieri SYOM

17 MSQ (4 x ARQ81) MSQ - Multi Source Quattro One to four DC /RF sputter cathodes in one process chamber Alloy sputtering (with individual power supply for each cathode) Serial sputtering to reduce investment costs (less process chambers and power supplies) Optimized geometry for superior radial composition uniformity when mixing different target materials Ideal for sputtering thin layers (<10nm) Ideal for low power sputtering Page 17 15/03/2011 Media Tech 2011 R. Bieri SYOM

18 ARQ21RF & DC Flexicat Cathode Movable Magnet Array for Uniformity Change Page 18 15/03/2011 Media Tech 2011 R. Bieri SYOM

19 Thickness [nm] ARQ21RF & DC Flexicat Cathode Mode a.) Layer Uniformity depending on magnet position Thickness Uniformity (new Ag Target) Radius [mm] 0% 10% 20% 30% 40% 50% Page 19 15/03/2011 Media Tech 2011 R. Bieri SYOM

20 Thickness ARQ21RF & DC Flexicat Cathode Mode b.) Constant layer uniformity over target life Less than 2% thickness uniformity over whole target life! Uniformity ZnS-SiO2 Flexicat 21 cathode 2kWh Flexicat 21 (new target) 130kWh Flexicat 21 (old target) Radius [mm] Page 20 15/03/2011 Media Tech 2011 R. Bieri SYOM

21 The right Metallizer for your Process HtL, LtH, Pre-Recorded Sprinter Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Recordable LtH & Pre-Recorded & Recordable LtH Page 21 15/03/2011 Media Tech 2011 R. Bieri SYOM

22 Single Layer Sputter System Overview Swivel, Cube Lite & Cube Star Single & Dual Cathode Metallizer for: Aluminum Silver, Ag-Alloys Silicon Gold, CD-Gold Reactive Sputtering (SiN, etc) RF sputtering SWIVEL & Cube Lite CUBE STAR & CUBE STAR FLEX Page 22 15/03/2011 Media Tech 2011 R. Bieri SYOM

23 Swivel & Cube Lite for DC & RF Sputtering Single Cathode System Same base design for Swivel & Cube Lite Focus target cathode or flat target cathode Fixed or moving inner mask DC, DC reactive or RF sputtering Lowest running costs & smallest footprint Excellent service accessibility Task oriented touch screen panel, error tracking Large installed base Page 23 15/03/2011 Media Tech 2011 R. Bieri SYOM

24 Cube Star Dual Cathode System Flexible cathode and pivot arm configuration for DC and DC reactive sputtering Dual cathode design enables sputtering of very thick layers Flip Unit for front and back side metallization Smallest footprint, everything integrated Task oriented touch screen panel Error tracking / service support / analysis tool Large installed base

25 Cube Lite Swivel, Cube Lite, Cube Star The Right Cathode for every Material Swivel, Cube Lite, Cube Star Cathode Name Main Sputter Material Application Remarks ARQ 931S Ag, Ag-Alloy, Al, Si, Au DVD9 L1 & L0, BD L0 Focus Target ARQ931SiN Si reactive for SiN BD Backside Coating SiN Focus Target ARQ 950 Ag/Ag-Alloy DVD R DL BD-ROM DL L1 Focus Target ARQ 941 Conductive Material Flat Target w center hole ARQ 21 DC & RF Conductive & Dielectric Material Barrier Layer BD-R LtH Flat Target w/o center hole Highest flexibility Excellent uniformity Outstanding target utilization -> longest target life Fastest target changes Page 25 15/03/2011 Media Tech 2011 R. Bieri SYOM

26 Swivel ARQ931: best Target Utilization Weight new target 4.5 kg Weight used target 2.1 kg Target utilization > 52% (Silver) = 1 mio 10nm Page 26 15/03/2011 Media Tech 2011 R. Bieri SYOM

27 Wrap-Up: Metallizer for today's and tomorrows OD Media Sprinter Recordable Media (-R, -RE, -XL) Swivel & Cube Star Recordable LtH & Pre-Recorded & Recordable LtH Page 27 15/03/2011 Media Tech 2011 R. Bieri SYOM

28 Page 28 15/03/2011 Media Tech 2011 R. Bieri SYOM Thank you for your attention Please visit us at booth A29