Frank Ruiz, Ruiz & Associates Steve Doe, Parker Hannifin Corporation. IFPAC SM Fifteenth International Forum Process Analytical Chemistry SM

Transcription

1 Frank Ruiz, Ruiz & Associates Steve Doe, Parker Hannifin Corporation IFPAC SM - 00 Fifteenth International Forum Process Analytical Chemistry SM January -, 00, Amelia Island, Florida, U.S.A Instrumentation

2 Agenda Part I: Mechanics, Steve Doe Surface Mount History in the Semiconductor Industry Substrate Design: SP76 Parallels & Enhancements Elastomer or Metallic Device Interface Seals? Part II: System Design, Frank Ruiz Device Design for System Flexibility Designing a Sample Conditioning System Future Developments

3 Surface Mount History Parker: surface mount supplier to semiconductor market for several years

4 Surface Mount History SP76 based on Semiconductor Industry ½ footprint SEMI organization forum for industry standards Initial SEMI surface mount effort in early 990 s Motivations similar to those of today s Petrochemical Industry Market penetration most significant in Asia Global Standard for interface seal? / 8 footprint being introduced (and embraced) Semiconductor Industry Use: Gas Delivery Analytical Industry Use: Sample Conditioning

5 Substrate Design Meets SP76 design specification for elastomeric seal option, however...

6 Substrate Design Achieves added system flexibility with streams, and

7 Substrate Design Provides ability to mount larger devices such as current designs for flow controllers, regulators and other devices.

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9 Substrate Design

10 Substrate Design

11 Substrate Block to Block Sealing Incorporates standard O-RingO seal (size -007) / 8 through hole w/ counterbore to capture o-ringo Blocking flow passages provides system flexibility Developing plug from either a solid elastomer or metallic disk molded into O-RingO

12 Substrate Design

13 Substrate Design

14 Substrate Design

15 Elastomeric or Metallic Device Seals? Elastomeric: Pro s Used in numerous sample systems devices; entrenched, successful technology Con s x0 - cc He/sec leak integrity Metallic: x0-0 cc He/sec leak integrity Seal & mating surfaces subject to handling damage resulting in leaks

16 Elastomeric or Metallic Device Seals? Conclusion: Recommend Elastomeric for majority of sampling systems and Metallic for PPB detection level applications

17 Designing a Sample Conditioning System." BASE BLOCKS (. CR) (. CL) (. C) (. CR) A A B B C C D D AA - B-B C-C D - D

18 Designing a Sample Conditioning System TWO STANDARD BASE SIZES." BASE.7" BASE

19 COMPONENTS PRESS. XTR PRESSURE TRANSDUCER TEMP. SENSOR TEMPERATURE SENSOR FILTER NEEDLE VALVE -WAY VALVE BALL VALVE PRESSURE REDUCING REGULATOR BACK PRESSURE REGULATOR RELIEF VALVE FLOW CONTROLLER

20 Designing a Sample Conditioning System PRESSURE REDUCING REGULATOR IR-000 EXAMPLE E IR-000 PRESSURE L REGULATOR (. CL) D D E All three Outlet ports are common to the diaphragm cavity. CHANNEL # IR-000 BODY Spring Hole D-D Three Inlet ports tied together inside the body of the component. Component Component INLET OUTLET E-E BLANK

21 IN IN BLOCKED These inlet channels are connected together inside the component. PRESSURE REGULATOR These outlet ports are connected together inside the component. L The number in the circle is the channel to which this port is connected. "L" Is Channel, Left Center Port. (. C) OUT OUT BLOCKED A A BLANK (. C) CHANNEL NUMBERS IR-000 OUT BLOCKED IN BLANK AA - PRIMARY FLOW DIRECTION

22 IR-000 CONNECTIONS TO SUBSTRATE (TOP VIEW OF SUBSTRATE) PRESSURE L REGULATOR PRESSURE REGULATOR R (. CL) (. CR) IR-000 IR-000 OUTLET OF COMPONENT INLET OF COMPONENT BLANK OUTLET OF COMPONENT PLUGGED PRESSURE REGULATOR L PRESSURE REGULATOR R (. C) (. C) IR-000 IR-000

23 NeSSI SYSTEM Temp O FLOW CONTROLLER AIR ZERO R-max PARKER STREAM SWITCH HO Temp FLOW CONTROLLER AIR PUMP ZERO R-max PARKER STREAM SWITCH N RETURN HDR.

24 RETURN HDR. Surface Mount Technology for NeSSI SYSTEM (Modified) CIRCUIT O Temp FLOW CONTROLLER C AIR ZERO R-max PARKER STREAM SWITCH CIRCUIT HO Temp FLOW CONTROLLER C PUMP AIR ZERO R-max PARKER STREAM SWITCH N

25 NeSSI SYSTEM (Modified) HO O Temp FLOW CONTROLLER 6 9 PUMP AIR ZERO R-max PARKER STREAM SWITCH N RETURN HDR.

26 IR-000 CONNECTIONS TO SUBSTRATE (TOP VIEW OF SUBSTRATE) PRESSURE L REGULATOR PRESSURE R REGULATOR (. CL) (. CR) IR-000 IR-000 OUTLET OF COMPONENT INLET OF COMPONENT BLANK OUTLET OF COMPONENT PLUGGED PRESSURE L REGULATOR PRESSURE R REGULATOR (. C) (. C) IR-000 IR-000

27 FROM R-max TO R-max IN RTN. R L BACK PRESSURE REGULATOR PRESSURE REGULATOR R ANALYZER CELL R a FROM R-max RETURN HDR. TO R-max (. CR) BY-PASS (. CL) (. CR) (. CR) SAMPLE IN FILTER BPR-000 IR-000 HO CELL a L TEMP R L FLOW CONTROLLER VENT RECOVERY ACTUATING AIR ASPIRATOR (. CL) (. CR) (. CL) DOME AIR (. C) 6 ACTUATING AIR NORMALLY OPEN COMMON NORMALLY CLOSED 9 ASPIRATOR DOME TEMP. SENSOR." SUBSTRATE METERING VALVE." SUBSTRATE FLOW CONTROLLER WITH EXTERNAL NEEDLE VALVE UPSTREAM REFERENCE -WAY R-max NeSSI SYSTEM No. H0 ANALYZER

28 NeSSI SYSTEM (Modified) HO O 0 Temp FLOW CONTROLLER PUMP AIR ZERO R-max PARKER STREAM SWITCH N RETURN HDR.

29 FROM R-max TO R-max IN RTN. R L BACK PRESSURE REGULATOR PRESSURE REGULATOR R NeSSI SYSTEM No. EXTERNAL H0 ANALYZER FROM R-max RETURN HDR. TO R-max SAMPLE IN TO ANALYZER (. CR) BY-PASS (. CL) (. CR) FILTER BPR-000 IR-000 FROM ANALYZER 0 R TEMP L FLOW CONTROLLER RETURN ACTUATING AIR ASPIRATOR (. C) (. C) (. CL) DOME AIR NORMALLY OPEN (. C) 6 7 ACTUATING AIR VENT RECOVERY COMMON DOME NORMALLY CLOSED 9 0 ASPIRATOR FROM ANALYZER METERING VALVE." SUBSTRATE TEMP. SENSOR." SUBSTRATE FLOW CONTROLLER WITH EXTERNAL NEEDLE VALVE UPSTREAM REFERENCE -WAY R-max

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32 Future Developments (Steve & Frank) Solicit input from other suppliers to include analyzer & sensor devices on stick Develop automation software for system design Develop pricing for total offering Re-present system with updates at PITTCON-00 Build beta-site system for field testing?

33 Thank you! Questions?