CDDFN P - Surface Mount TVS Diode Array
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- Jonah Harmon
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1 Features n RoHS compliant* n Low capacitance -.4 pf (I/O to I/O) n ESD protection to IEC (Level 4) Applications n HDMI 1.3, 1.4 and 2. n DisplayPort n Digital Visual Interface (DVI) n SATA and esata n USB 3. n Memory protection n SIM card ports CDDFN1-3324P - Surface Mount TVS Diode Array General Information The Model CDDFN1-3324P device provides ESD, CDE and EFT protection for high-speed data ports, meeting IEC (ESD) requirements. The Transient Voltage Suppressor array, protecting up to four data lines, offers a Working Peak Reverse Voltage of 3.3 V and a Minimum Breakdown Voltage of 4.5 V. The DFN1 packaged device has an ultra-low typical capacitance of only.4 pf between I/O lines. This allows it to be used for protecting sensitive components used on high-speed interfaces. The small footprint of the device allows for flow-through routing on the PCB, helping to maintain matched impedances of the high-speed data lines. Pin Pin Pin Pin Pins 3, 8 Absolute Maximum Ratings (@ T A = 25 C Unless Otherwise Noted) Parameter Symbol CDDFN1-3324P Unit Peak Pulse Power (t p = 8/2 μs) P pp 3 W Peak Pulse Current (t p = 8/2 μs) I pp 4 A Operating Temperature T J -55 to +85 ºC Storage Temperature T STG -55 to +15 ºC Electrical Characteristics (@ T A = 25 C Unless Otherwise Noted) Parameter Symbol Min. Typ. Max. Unit Working Peak Reverse Voltage V WM 3.3 V Breakdown 1 ma V BR 4.5 V Leakage V WM I R.1.5 µa 1.65 V, f = 1 MHz (I/O to ) 1.65 V, f = 1 MHz (I/O to I/O) C IN pf C CROSS.4.8 pf Clamping 8/2 I PP V C 7.5 V ESD Protection per IEC Contact Discharge Air Discharge kv WARNING Cancer and Reproductive Harm - *RoHS Directive 22/95/EC Jan. 27, 23 including annex and RoHS Recast 211/65/EU June 8, 211.
2 CDDFN1-3324P - Surface Mount TVS Diode Array Product Dimensions Recommended Footprint PIN 1 MARKING 1. ±.5 (.39 ±.2).25 (.1).4 (.16) 2.5 ±.5 (.98 ±.2).875 (.34) 1.55 (.61).2 (.8) PIN 1 IDENTIFICATION CHAMFER.1 X 45 (.39) 1.95 (.77) REF..1 (.39) R.25 ±.5 (.1 ±.2).4 ±.5 (.16 ±.2).5 (.2) BSC.4 ±.5 (.16 ±.2).75 TYP. (.3).5 (.2) Typical Part Marking 1. (.39).675 (.27) 3-DIGIT PRODUCT CODE CONTROL CODE ( ).2 ±.5 (.8 ±.2) 324 XX. -.5 (. -.2).152 (.6) REF. Environmental Specifications Moisture Sensitivity Level..3 ESD Classification (HBM)... 3B DIMENSIONS: MM (INCHES) How to Order Device Pinout 1 1 Pin Function 1,2,4,5 Input and Output Lines 6,7,9,1 3,8 NC (No Internal Connection) for Feed-Through Layout design Common Code Chip Diode Package DFN1 = DFN-1 Package Working Peak Reverse Voltage 33 = 3.3 V RWM (Volts) Number of Lines 24 = 2 Ground / 4 Data Lines Suffix P = Ultra-low Capacitance CD DFN P P VIEW
3 CDDFN1-3324P - Surface Mount TVS Diode Array Rating & Characteristic Curves Typical Voltage vs. Capacitance C IN Typical Voltage vs. Capacitance C CROSS Input Capacitance (pf) Input Voltage (V) Input Capacitance (pf) f = 1 MHz,.2 T = 25 C Input Voltage (V) f = 1 MHz, T = 25 C Typical Insertion Loss S21 Insertion Loss (db) e+8 1e+9 Frequency (Hz) 3 GHz:.535 db Typical Analog Cross Talk 2 1 Analog Cross Talk (db) e+8 1e+9 Frequency (Hz) Typical Transmission Line Pulsing (TLP) Transmission Line Pulsing (TLP) Current (A) Pulse from a transmission line 1 V_pulse 1 ns TLP_V I/O to + - TLP_I V 16 A = 1 V V 8 A = 7.5 V Transmission Line Pulsing (TLP) Voltage (V)
4 CDDFN1-3324P - Surface Mount TVS Diode Array Reference Application The Bourns Model CDDFN1-3324P is designed to protect high-speed data ports from ESD transients. For high-speed ports above 5 Gbps such as HDMI 2. and USB 3., maintaining signal line impedance is a critical requirement. The use of a DFN1 package using a feedthrough layout provides minimal impedance change on the high-speed data line, while the ultra-low capacitance performance of the device limits signal degradation on each channel. I/O PORT CONNECR I/O PORT CONNECR 1 1 PROTECTED IC PROTECTED IC Model CDDFN1-3324P Layout on HDMI Port HDMI CONNECR TMDS_D2+ TMDS_ TMDS_D1+ TMDS_ TMDS_D+ TMDS_ TMDS_CK+ TMDS_ CE_REMOTE N/C DDC_CLK DDC_DAT +5 V OUT HOTPLUG_DET LINE-1 LINE-2 LINE-3 LINE CDDFN1-3324P LINE-1 LINE-2 LINE-3 LINE V CDDFN1-3324P C = 1 nf (OPTIONAL) Via hole to CDSOT236-54C Via hole to +5 V Feed-Through Layout - Model CDDFN1-3324P in HDMI Application TMDS_D2+ TMDS_D1+ TMDS_D+ TMDS_CK+ TMDS_D2- TMDS_D2- TMDS_D1- TMDS_D- TMDS_CK- TMDS_D1- TMDS_D- TMDS_CK- CE_REMOTE DDC_CLK DDC_DAT Via hole to HOTPLUG_DET HDMI 2. Eye Diagram Test Without Model CDDFN1-3324P (PCB Only) HDMI 2. Eye Diagram Test With Model CDDFN1-3324P
5 CDDFN1-3324P mm SMD - Surface Trimming Mount Potentiometer TVS Diode Array Packaging Information The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-D standard. P Pin 1 Location B P 1 d Index Hole E F W T 12 D 2 D 1 D P A C Trailer Device Leader End 1 pitches (min.) 1 pitches (min.) Start DIMENSIONS: MM (INCHES) W 1 Direction of Feed Item Symbol DFN-1 Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter A B C d D 1.7 ±.8 (.67 ±.3) 2.3 ±.8 (.91 ±.3).75 ±.5 (.3 ±.2) 1.15 ±.1 (.45 ±.4) 178 (7.8) Reel Inner Diameter D ±.4 (2.142 ±.16) Feed Hole Diameter D ±.2 (.512 ±.8) Sprocket Hole Position Punch Hole Position Punch Hole Pitch E F P 1.75 ±.1 (.69 ±.4) 3.5 ±.5 (.138 ±.2) 4. ±.1 (.157 ±.4) Sprocket Hole Pitch P 4. ±.1 (.157 ±.4) Embossment Center P 1 2. ±.5 (.79 ±.2) Overall Tape Thickness Tape Width T W.2 ±.3 (.8 ±.12) /-.1 ( /-.4) Reel Width W ± 1. (.484 ±.39) Quantity per Reel -- 3 Asia-Pacific: Tel: asiacus@bourns.com Europe: Tel: eurocus@bourns.com The Americas: Tel: americus@bourns.com REV. 12/18 The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at
6 Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns products manufactured by or on behalf of Bourns, Inc. and Unless otherwise expressly indicated in writing, Bourns products and data sheets relating thereto are subject to change and complete before placing orders for Bourns products. The characteristics and parameters of a Bourns product set forth in its data sheet are based on laboratory conditions, and statements regarding the suitability of products for certain types of applications are based on Bourns knowledge of typical requirements in generic applications. The characteristics and parameters of a Bourns product with other components the actual performance of the Bourns product as meeting the requirements of a particular industry of Bourns products are responsible for ensuring compliance with safety-related requirements and standards applicable to Bourns on a case-by-case basis, use of any Bourns Bourns standard products that are suitable for use in aircraft standard the user s sole risk. custom products shall be negotiated on a case-by-case basis by Bourns and the user for which such Bourns standard products shall also apply to such Bourns custom products. Users shall not sell, transfer, export or re-export any Bourns Bourns products and Bourns technology and technical data may not under any circumstance be exported or re-exported to countries subject to international sanctions or embargoes. Bourns products may not, without bilingual versions are available at: Web Page: PDF:
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