Glass Ceramic ESD Suppressor

Transcription

1 Glass Ceramic ESD Suppressor Ideal ESD Suppressor for Ultra High Speed Lines /19

2 Contents Development Background Electrical Characteristics Application in Circuit IC Module Mobile RF Antenna TV/STB HDMI/USB3.0 2/19

3 Development Background ESD protection for ultra high speed transmission interface With the development of HD technology and large storage devices, the transmission speed becomes faster and faster, which result in the development of ultra high speed transmission interface, such as HDMI, USB3.0 etc. At the same time, ESD protection is urgently required in those interfaces. USB3.0 port While those ESD protection components should meet with features below: ultra low capacitance high cut-off frequency quick response time low clamping voltage In this context, has presented Glass Ceramic ESD suppressor-gesd series to content ESD protection requests of ultra high speed lines. 3/19

4 Material and Structure 1.ESD material 3.Outer electrode GESD Glass substrate : 2.Internal electrode 4.Glass substrate Ultra low dielectric constant, low capacitance high reliability 1. ESD material: Nonlinear Coefficient Glass 2. Internal electrode: Ag 3. Outer electrode: Ag, Ni, Sn 4. Glass substrate: SiO 2 ESD material: 1 low dielectric constant, fast response time(<0.5ns), low trigger voltage and low clamping voltage. 2 Non-linearity Bidirectional V/I characteristics, excellent ESD suppression capability, low leakage current. 4/19

5 Parameter Description Max. DC Working Voltage: V WDC This is the maximum continuous DC voltage which may be applied up to the maximum operation temperature of the device. This voltage is always less than the trigger voltage and clamping voltage. Trigger Voltage: V T This is the voltage at which GESD changes from the off-state to the on-state and enters Its conduction mode on IEC kV/30A. ESD Clamping Voltage: Vc Max. peak voltage across the GESD measured at 30ns after initiation of pulse on IEC kV/30A. Cut-off frequency: f 0 At this frequency, insert loss must less than -0.3dB. Capacitance: Cp This is capacitance of GESD which is measured at frequency of 1MHz and 1Vrms. 5/19

6 Part Number GESD 1005 H 090 CR10 G P T GESD Picture 1 Type GESD Glass Ceramic ESD Suppressor 4 Max. Continuous Working Voltage Example Nominal Value 090 9V 2 External Dimensions (L W) (mm) 0603 [0201] [0402] [0603] Example Nominal Value CR pF 3 Feature Code H For High Speed 6 Tolerance of Capacitance G Maximum 7 Terminal Code P Ni, Sn Plating 8 Packing T Tape & Reel 6/19

7 Cross reference Murata AEM LXES03AAA1-098 / GESD0603H series / ES0402V014CT GESD1005H series / ES0603V014CT GESD1608H series / / GESDA2080H series 7/19

8 Electrical Characteristics Part Number Max. DC Working Voltage Trigger Voltage Max. Clamping Voltage Cut-off Frequency Typical Capacitance Test Condition DC rms, 1MHz Units Volts Volts Volts GHz pf Symbol Vw DC V T *1 V C *2 f 0 C GESD0603H090CR10GPT 9 100~ ~0.10 GESD1005H090CR10GPT 9 100~ ~0.10 GESD1608H090CR10GPT 9 100~ ~0.10 8/19

9 Characteristic Curves 0.1 Capacitance vs. Frequency Z vs. Frequency Capacitance (pf) Impedance (Ω) Frequency (MHz) Frequency (MHz) 9/19

10 Characteristic Curves 0 Attenuation vs. Frequency Attenuation S11 (db) Frequency (MHz) Cut-off frequency of GESD series has exceeded 7.0GHz@-0.3dB 10/19

11 Characteristic Curves 140 ESD Waveform(IEC :8kV, Contact) Voltage (V) Time (ns) GESD series ESD suppressor provides low trigger voltage( V T : V), low clamping voltage(vc<30v) and fast response time( <0.5ns ). 11/19

12 Performance Comparison Type Polymer ESD Suppressor Transient Voltage Suppressor Glass Ceramic ESD Suppressor (PESD) (TVS) (GESD) Material + Construction PCB or Ceramic substrate + Polymer material Chip packaging Glass ceramic substrate + Inorganic material (high temperature co-fired ) Clamping voltage low low low Leakage current very small(<1na) small(<100na) very small (<1nA) Capacitance 0.05~0.15 pf 0.5 pf 0.05~0.10 pf ESD standed times 1000 / 1000 Stability good good good Directivity bi-directional uni-directional or bidirectional bi-directional Max. Operating Temp Price middle high low 12/19

13 Application Example - IC Module ESD protection for Vcc power lines and signal lines of IC chip With the shrinkage of line width in semiconductor manufacturing, ESD withstand voltage of IC maybe decrease to 1KV (HBM) from original 2kV. In order to well protect IC die from ESD damage, ESD components should be placed external IC to achieve better IEC ESD standard. Machine application Smartphone BT earphone data card Recommend component:gesd0603h090cr10gpt 13/19

14 Application Example Mobile RF Antenna ESD protection for antenna Recommend components : GESD0603H090CR10GPT GESD1005H090CR10GPT Mobile portable electronic devices 1 Because of frequent contact with human body, it is susceptible to ESD damage. 2 With the most advanced semiconductor technology, IC is susceptible to ESD damage. 3 High transmission rate of antenna for mobile phone. Application Notes for ESD suppressor 1 Portable electronic products request that the size of the ESD protection components must be small enough. 2 Capacitance: low Capacitance make sure it won t affect high-speed transmission signal. 3 Leakage current: Small leakage ensure low power consumption. 14/19

15 Application Example - TV/STB Power Clock Audio & Video CPU Control Audio decoder LVDS DSP Video decoder DCA RF Tuner Video decoder LCD panel modem Inverter Keypad SD card HDMI/DVI USB Application of GESD products on TV/STB mainly:hdmi USB3.0 GESD series can be used instead of PESD series ESD suppressor. 15/19

16 ESD protection solution for HDMI HDMI Recommend components : GESD1005H090CR10GPT GESD1608H090CR10GPT HDMI running speed depends on the ability of transmitters and receivers, signal resolution and color depth, the highest rate of each pair of TMDS data lines is 3.4Gbps. Application Notes for ESD suppressor on HDMI 1 Portable electronic products request that the size of the ESD protection components must be small enough. 2 Capacitance: low Capacitance (< 0.15pF) make sure it won t affect high-speed transmission. 16/19

17 ESD protection solution for USB3.0 USB3.0 Vbus D+ D- SSTX+ SSTX -SSRX+ SSRX ḠND The transmission rate of USB3.0 is 4.8Gb/s. Application Notes for ESD suppressor on USB3.0 1 Low Capacitance (< 0.15pF) 2 Low leakage current 1 3 Inserting and pulling on port frequently required ESD protection devices with high withstand capacity of ESD suppression and stable performance. Position Recommend components 1~6 GESD1005H090CR10GPT or GESD1608H090CR10GPT 17/19

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