CDDFN P - Surface Mount TVS Diode Array

Transcription

1 *RoHS COMPLIANT Features n RoHS compliant* n Low capacitance -.4 pf (I/O to I/O) n ESD protection to IEC (Level 4) Applications n HDMI 1.3, 1.4 and 2. n DisplayPort n Digital Visual Interface (DVI) n SATA and esata n USB 3. n Memory protection n SIM card ports General Information The Model CDDFN1-3324P device provides ESD, CDE and EFT protection for high-speed data ports, meeting IEC (ESD) requirements. The Transient Voltage Suppressor array, protecting up to four data lines, offers a Working Peak Reverse Voltage of 3.3 V and a Minimum Breakdown Voltage of 4.5 V. The DFN1 packaged device has an ultra-low typical capacitance of only.4 pf between I/O lines. This allows it to be used for protecting sensitive components used on high-speed interfaces. The small footprint of the device allows for flow-through routing on the PCB, helping to maintain matched impedances of the high-speed data lines. Pin Pin Pin Pin Pins 3, 8 Absolute Maximum Ratings (@ T A = 25 C Unless Otherwise Noted) Parameter Symbol CDDFN1-3324P Unit Peak Pulse Power (t p = 8/2 μs) P pp 3 W Peak Pulse Current (t p = 8/2 μs) I pp 4 A Operating Temperature T J -55 to +85 ºC Storage Temperature T STG -55 to +15 ºC Electrical Characteristics (@ T A = 25 C Unless Otherwise Noted) Parameter Symbol Min. Typ. Max. Unit Working Peak Reverse Voltage V WM 3.3 V Breakdown 1 ma V BR 4.5 V Leakage V WM I R.1.5 µa 1.65 V, f = 1 MHz (I/O to ) 1.65 V, f = 1 MHz (I/O to I/O) C IN pf C CROSS.4.8 pf Clamping 8/2 I PP V C 7.5 V ESD Protection per IEC Contact Discharge Air Discharge kv *RoHS Directive 22/95/EC Jan. 27, 23 including annex and RoHS Recast 211/65/EU June 8, 211.

2 Product Dimensions Recommended Footprint PIN 1 MARKING 1. ±.5 (.39 ±.2).25 (.1).4 (.16) 2.5 ±.5 (.98 ±.2).875 (.34) 1.55 (.61).2 (.8) PIN 1 IDENTIFICATION CHAMFER.1 X 45 (.39) 1.95 (.77) REF..1 (.39) R ( ).25 ±.5 (.1 ±.2).4 ±.5 (.16 ±.2).5 (.2) BSC.4 ±.5 (.16 ±.2).75 TYP. (.3).2 ±.5 (.8 ±.2).5 (.2) Typical Part Marking 1. (.39).675 (.27) CDDFN1-3324P Environmental Specifications Moisture Sensitivity Level..3 ESD Classification (HBM)... 3B Device Pinout P VIEW. -.5 (. -.2) Pin DIMENSIONS: MM (INCHES) Function 1,2,4,5 Input and Output Lines 6,7,9,1 3,8.152 (.6) REF. NC (No Internal Connection) for Feed-Through Layout design How to Order Common Code Chip Diode Package DFN1 = DFN-1 Package Working Peak Reverse Voltage 33 = 3.3 V RWM (Volts) Number of Lines 24 = 2 Ground / 4 Data Lines Suffix P = Ultra-low Capacitance CD DFN P

3 Rating & Characteristic Curves Typical Voltage vs. Capacitance C IN Typical Voltage vs. Capacitance C CROSS Input Capacitance (pf) Input Voltage (V) Input Capacitance (pf) f = 1 MHz,.2 T = 25 C Input Voltage (V) f = 1 MHz, T = 25 C Typical Insertion Loss S21 Insertion Loss (db) e+8 1e+9 Frequency (Hz) 3 GHz:.535 db Typical Analog Cross Talk 2 1 Analog Cross Talk (db) e+8 1e+9 Frequency (Hz) Typical Transmission Line Pulsing (TLP) Transmission Line Pulsing (TLP) Current (A) Pulse from a transmission line 1 V_pulse 1 ns TLP_V I/O to + - TLP_I V 16 A = 1 V V 8 A = 7.5 V Transmission Line Pulsing (TLP) Voltage (V)

4 Reference Application The Bourns Model CDDFN1-3324P is designed to protect high-speed data ports from ESD transients. For high-speed ports above 5 Gbps such as HDMI 2. and USB 3., maintaining signal line impedance is a critical requirement. The use of a DFN1 package using a feedthrough layout provides minimal impedance change on the high-speed data line, while the ultra-low capacitance performance of the device limits signal degradation on each channel. I/O PORT CONNECR I/O PORT CONNECR PROTECTED IC PROTECTED IC Model CDDFN1-3324P Layout on HDMI Port HDMI CONNECR TMDS_D2+ TMDS_D1+ TMDS_D+ TMDS_CK+ CE_REMOTE N/C DDC_CLK DDC_DAT +5 V OUT HOTPLUG_DET LINE-1 LINE-2 LINE-3 LINE-4 CDDFN1-3324P LINE-1 LINE-2 LINE-3 LINE V CDDFN1-3324P C = 1 nf (OPTIONAL) Via hole to CDSOT236-54C Via hole to +5 V Feed-Through Layout - Model CDDFN1-3324P in HDMI Application TMDS_D2+ TMDS_D1+ TMDS_D+ TMDS_CK+ TMDS_D2- TMDS_D2- TMDS_D1- TMDS_D- TMDS_CK- TMDS_D1- TMDS_D- TMDS_CK- CE_REMOTE DDC_CLK DDC_DAT Via hole to HOTPLUG_DET HDMI 2. Eye Diagram Test Without Model CDDFN1-3324P (PCB Only) HDMI 2. Eye Diagram Test With Model CDDFN1-3324P

5 CDDFN1-3324P mm SMD - Surface Trimming Mount Potentiometer TVS Diode Array Packaging Information The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-D standard. P Pin 1 Location B P 1 d Index Hole E F W T 12 D 2 D 1 D P A C Trailer Device Leader End 1 pitches (min.) 1 pitches (min.) Start DIMENSIONS: MM (INCHES) W 1 Direction of Feed Item Symbol DFN-1 Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter A B C d D 1.7 ±.8 (.67 ±.3) 2.3 ±.8 (.91 ±.3).75 ±.5 (.3 ±.2) 1.15 ±.1 (.45 ±.4) 178 (7.8) Reel Inner Diameter D ±.4 (2.142 ±.16) Feed Hole Diameter D ±.2 (.512 ±.8) Sprocket Hole Position Punch Hole Position Punch Hole Pitch E F P 1.75 ±.1 (.69 ±.4) 3.5 ±.5 (.138 ±.2) 4. ±.1 (.157 ±.4) Sprocket Hole Pitch P 4. ±.1 (.157 ±.4) Embossment Center P 1 2. ±.5 (.79 ±.2) Overall Tape Thickness Tape Width T W.2 ±.3 (.8 ±.12) /-.1 ( /-.4) Reel Width W ± 1. (.484 ±.39) Quantity per Reel -- 3 Asia-Pacific: Tel: asiacus@bourns.com Europe: Tel: eurocus@bourns.com The Americas: Tel: americus@bourns.com REV. 4/18 The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

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