T0504SP. Features. Applications. Mechanical Characteristics. Description. Circuit Diagram. Pin Configuration. Chip Integration Technology Corporation

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1 Features Transient protection for high-speed data lines IEC (ESD) ±25kV (Air) ±17kV (Contact) IEC (EFT) 40A (5/50 ns) Cable Discharge Event (CDE) Package optimized for high-speed lines Ultra-small package (2.5mmx1.0mmx0.55mm) Protects six data lines Low capacitance: 0.2pF Typical(I/O-I/O) Low leakage current: Low clamping voltage RWM (Typical) Each I/O pin can withstand over 1000 ESD strikes for ±8kV contact discharge Description Applications Serial ATA PCI Express Desktops, Servers and Notebooks MDDI Ports USB 2.0/3.0 Power and Data Line Protection Display Ports High Definition Multi-Media Interface (HDMI) Digital Visual Interfaces (DVI) Mechanical Characteristics DFN L package Flammability Rating: UL 94V-0 Marking: Part number Packaging: Tape and Reel is an ultra-low capacitance Transient Voltage Suppressor (TVS) designed to provide electrostatic discharge (ESD) protection for highspeed data interfaces. With typical capacitance of 0.2 pf only, is designed to protect parasitic-sensitive systems against over-voltage and over-current transient events. It complies with IEC (ESD), Level 4 (±15kV air, ±8kV contact discharge), IEC (electrical fast transient - - EFT) (40A,5/50 ns), very fast charged device model (CDM) ESD and cable discharge event (CDE), etc. Circuit Diagram I/O_2 I/O_1 GND I/O_4 I/O_3 uses ultra-small DFN L package. Each device can protect four high-speed data lines The combined features of ultra-low capacitance, ultra-small size and high ESD robustness make ideal for high-speed data ports and high-frequency lines (e.g.,hdmi & DVI) applications.. The low camping voltage of the guarantees a minimum stress on the protected IC. Pin Configuration DFN L (Top View) 1

2 Absolute Maximum Rating Symbol Parameter Value Units V ESD ESD per IEC (Air) ESD per IEC (Contact) ±25 ±17 T OPT Operating Temperature -55/+125 o T STG Storage Temperature -55/+150 C kv o C o Electrical Characteristics (T = 25 C) Symbol Parameter V RWM Nominal Reverse Working Voltage I PP I I R Reverse Leakage RWM V BR Reverse Breakdown T I T V C I PP Test Current for Reverse Breakdown Clamping I PP Maximum Peak Pulse Current V BR V RWM V C I T I R I R IT V RWM V BR V C V C ESD Parasitic Capacitance V R Reverse Voltage f Small Signal Frequency I PP I F Forward Current Bi-Directional TVS V F Forward F Symbol Test Condition Minimum Typical Maximum Units V RWM 5.0 V V RWM = 5V,T = 25 C I R Between I/O and GND I T = 1mA Between I/O and GND I PP = 1A, t p = 8/20μs Between I/O and GND V R = 0V, f = 1MHz Between I/O and GND V R = 0V, f = 1MHz Between I/O and I/O V BR V C C ESD C ESD μa V 12 V 0.2 pf 0.2 pf 2

3 ., Voltage Sweeping of I/O to GND Insertion Loss S21 of I/O to GND Current (A) Voltage (V) Insertion Loss (db) E E E E E+10 Frequency (Hz) Capacitance vs. Voltage of I/O to GND (f = 1MHz) Capacitance vs. Reverse Voltage Normalized Capacitance vs. Reverse Voltage Capacitance (pf) Normalized Capacitance Reverse Voltage (V) Reverse Voltage (V) ESD Clamping of I/O to GND (+8kV Contact per IEC ) ESD Clamping of I/O to GND (-8kV Contact per IEC ) Clamping Voltage (V) Clamping Voltage (V) Time (ns) Time (ns) 3

4 Application Information Pin Connection in PCB provides ESD protection for four data lines simultaneously. The pin connection is shown in the figure below. Four parallel data lines, from inner IC to I/O port connector, coule connect to four I/O pins directly. Pin 3 of is the GND pin, which should connect to the GND of PCB. The wire should be as short as possible in order to minimize the parasitic inductance. To I/O Port Connector Date lines To I/O Port Connector Date lines GND I/O1 I/O2 I/O3 I/O To Inner IC Date lines To Inner IC Date lines PCB Layout Guidelines For optimum ESD protection and the whole circuit performance, the following PCB layout guidelines are recommended: GND pin to the PCB GND rail path should be as short as possible. It could reduce the ESD transient return path to GND. The vias connecting GND pins to the PCB GND should be wide. Place as close to the connector port as possible. It could reduce the parasitic inductance and restrict ESD coupling into adjacent traces. Avoid running critical signals near board edges. Figure 1 pin connection in PCB 4

5 Application Information TMDS_D2+ TMDS_D2+ HDMI RECEIVER TMDS_D2- TMDS_D1+ TMDS_D1- TMDS_D0+ TMDS_D0- TMDS_CLK+ TMDS_CLK- CEC TMDS_D2- TMDS_D1+ TMDS_D1- TMDS_D0+ TMDS_D0- TMDS_CLK+ TMDS_CLK- CEC HDMI CONNECTOR T0514TL NC SCL SDA SCL SDA GND +5V HTP_D HTP_D Figure 2 Layout Top View for HDMI Interface With & T0514TL 5

6 Package Outline DFN L package Thermally-Enhanced MSL-1 Level D e b E L Pin1 Dot by Marking Pin1 Idenification Chamfer A3 A A1 Package Dimensions (Controlling dimensions are in millimetes) Symbol A A1 Dimensions (mm) Dimensions (inch) Minimum Maximum Minimum Maximum A REF REF. b D E e L BSC BSC

7 Tape and Reel Specification T P0 P2 Φ2: 1.50±0.10 Device Orientation in Tape Top Cover Tape o 5 Max W A0 B0 E F K0 P Φ: 0.80±0.05 Pin1 Location Symbol W A0 B0 K0 E F P P0 P2 T Dimensions (mm) ± ± ± ± ± ± ± ± ±0.02 Marking Codes T54SP Pin1 Identification Note: (1) "T54SP" is part number, fixed. Ordering Information Part Number Working Voltage Quantity Per Reel Reel Size 5V 3,000 7 Inch 7

8 CITC reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design, purchase or use. CITC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does CITC assume any liability for application assistance or customer product design. CITC does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of CITC. CITC products are not authorized for use as critical components in life support devices or systems without express written approval of CITC. Tel: Fax: Add:Rm. 3, 2F., No.32, Taiyuan St., Zhubei City, Hsinchu County 302, Taiwan (R.O.C.) 8