Future Matters US Disclosure

Transcription

1 Disclaimer This presentation has been prepared by Samsung Electronics Co., Ltd. (the "Company"). It does not purport to contain all the information that a prospective investor may require in connection with any potential investment in the Company. You should not treat the contents of this presentation, or any information provided in connection with it, as financial advice, financial product advice or advice relating to legal, taxation or investment matters. No representation or warranty (whether express or implied) is made by the Company or any of its officers, advisers, agents or employees as to the accuracy, completeness or reasonableness of the information, statements, opinions or matters (express or implied) arising out of, contained in or derived from this presentation or provided in connection with it, or any omission from this presentation, nor as to the attainability of any estimates, forecasts or projections set out in this presentation. This presentation is provided expressly on the basis that you will carry out your own independent inquiries into the matters contained in the presentation and make your own independent decisions about the affairs, financial position or prospects of the Company. The Company reserves the right to update, amend or supplement the information at any time in its absolute discretion (without incurring any obligation to do so). Neither the Company, nor its related bodies corporate, officers, their advisers, agents and employees accept any responsibility or liability to you or to any other person or entity arising out of this presentation including pursuant to the general law (whether for negligence, under statute or otherwise). Any such responsibility or liability is, to the maximum extent permitted by law, expressly disclaimed and excluded. Nothing in this material should be construed as either an offer to sell or a solicitation of an offer to buy or sell securities. It does not include all available information and should not be used in isolation as a basis to invest in the Company. Future Matters This presentation contains reference to certain intentions, expectations, future plans, strategy and prospects of the Company. Those intentions, expectations, future plans, strategy and prospects may or may not be achieved. They are based on certain assumptions, which may not be met or on which views may differ and may be affected by known and unknown risks. The performance and operations of the Company may be influenced by a number of factors, many of which are outside the control of the Company. No representation or warranty, express or implied, is made by the Company, or any of its directors, officers, employees, advisers or agents that any intentions, expectations or plans will be achieved either totally or partially or that any particular rate of return will be achieved. Given the risks and uncertainties may cause the Company's actual future results, performance or achievements to be materially different from those expected, planned or intended, recipients should not place undue reliance on these intentions, expectations, future plans, strategy and prospects. The Company does not warrant or represent that the actual results, performance or achievements will be as expected, planned or intended. US Disclosure This document does not constitute any part of any offer to sell, or the solicitation of any offer to buy, any securities in the United States or to, or for the account or benefit of any "US person" as defined in Regulation S under the US Securities Act of 1993 ("Securities Act"). The Company's shares have not been, and will not be, registered under the Securities Act or the securities laws of any state or other jurisdiction of the United States, and may not be offered or sold in the United States or to any US person without being so registered or pursuant to an exemption from registration including an exemption for qualified institutional buyers.

2 SAMSUNG MEMORY Investor Presentation 2017

3 BUSINESS UPDATE Contents MEMORY MARKET OPPORTUNITIES SAMSUNG STRATEGY KEY TAKEAWAYS

4 SAMSUNG MEMORY OVERVIEW #1 in Memory Worldwide Since 1992 FY 2016 Net Revenue Market Share (Revenue) $33B DRAM NAND 59% 41% 47% 40% FY2016 Market Share : Estimated Source: Samsung 1/19

5 STRONG FINANCIAL PERFORMANCE Market Share (Revenue) FY2016 Market Share : Estimated 44% Revenue $33B Source: Samsung 2/19

6 SAMSUNG S TRACK RECORD OF INNOVATION First to market memory products DRAM GB HBM2 HBM: High Bandwidth Memory 1xnm 8Gb DDR4 16Gb LPDDR4 NAND 48Layer V-NAND 16TB SAS SSD for Server 512GB smallest BGA SSD BGA: Ball Grid Array 3/19

7 BUSINESS UPDATE Contents MEMORY MARKET OPPORTUNITIES SAMSUNG STRATEGY KEY TAKEAWAYS

8 CONNECTIVITY IS DRIVING GROWTH IN BIG DATA Each Minute 150,000,000 2,800,000 Number of Connected Devices 15B in B in , ,000 Source: Excelacom, CISCO 4/19

9 OPPORTUNITIES IN BIG DATA ERA DIVERSE TERMINAL DEVICES for Data Creation EXPONENTIAL GROWTH for Storing & Processing Data 5/19

10 MEMORY IS AT THE CORE OF BIG DATA Improvements to system performance will be driven by memory Memory Wall High Bandwidth High Capacity Memory System Performance Clock Core CP U 6/19

11 BENEFITS OF HIGH PERFORMANCE DRAM H/W Config. Cost comparison for 10,000 Datacenter Servers Higher Freq. CPU Lower Freq. DRAM 2.6GHz 12 cores Higher Freq. DRAM Lower Freq. CPU 2.3GHz 12 cores 13% Build-up Cost $92M TCO 14% $79M 16GB x 16pcs 1866Mbps 32GB x 8pcs 2133Mbps System Power 19% 10.5 MW/4yr 8.5 MW/4yr Energy H/W Cost Datacenter: built on 20U Rack H/W Configuration at same system performance TCO: Total Cost of Ownership for four years 2.6GHz 2.3GHz Operating Cost 7/19

12 BENEFITS OF SSD ADOPTION HDD and SSD comparison for 100PB Datacenter 15Krpm 600GB HDD x 166K 16TB SSD x 6K $63M TCO 40% Footprint. 350 racks 13 racks. 96% Enclosures $41M 196m 2 7m 2 Operating Cost Power 99% 1,542 MW/yr 19 MW/yr Energy H/W Cost AFR Datacenter: built on 40U Rack TCO: Total Cost of Ownership for four years AFR: Annual Failure Rate 90% Maintenance Enclosure: Server cost excluding storage HDD SSD 8/19

13 SSD REPLACEMENT OF HDD Increasing adoption driven by lower TCO & higher capacity $51B for Server Potential Market for SSD HDD SSD for PC for Server CAGR 15% for PC TCO: Total Cost of Ownership Source: Samsung, Gartner 9/19

14 MEMORY-CENTRIC COMPUTING EVOLUTION CAGR GB MOBILITY DEVICES Gb 260B 180B NAND 34% 110B 80B # Devices 5G Mobile Connectivity 100B DRAM 20% 50B 20B B Storage Demand CAGR GB SERVER Gb Smartphone and IoT 75B 50B 25B NAND 63% DRAM 23% 70B 50B 30B Big Data Big Data Processing Source: Samsung 0B B 10/19

15 BUSINESS UPDATE Contents MEMORY MARKET OPPORTUNITIES SAMSUNG STRATEGY KEY TAKEAWAYS

16 SAMSUNG S STRATEGY Solutions Total Solutions/Portfolio Diversify Product Portfolio DRAM Logic NAND NAND NAND NAND Fulfill Customer Needs Technology Operations Advanced Technology Scaling Operational Excellence Strengthen Cost Leadership 11/19

17 CONTINUOUS TECHNOLOGY SCALING Pushing limits without EUV DRAM 1x Cost/Gb Higher Aspect Ratio (Capacitor) Process node (nm) x 1y 1z 35nm 28nm 25nm 20nm 1xnm 1ynm 1znm Lower Leakage Current Innovation Extreme Ultra Violet Source: Samsung 12/19

18 TECHNOLOGY BREAKTHROUGH WITH V-NAND Paradigm shift in NAND scaling NAND 1x Cost/GB Roadmap beyond 100 layers 1xx 9x Planar V-NAND 21nn 19nm 16nm 14nm V24 V32 V48 V64 V9x V24 V32 V48 V # of layers Source: Samsung 13/19

19 ADVANTAGES OF V-NAND OVER PLANAR NAND Capacity 4x Speed 2x Endurance 10x Wafer Cost / Investment Power Efficiency 2x 14/19

20 UNIQUE CAPABILITIES FOR MEMORY SOLUTIONS Integrating key components to deliver value-added solutions INTEGRATED SOLUTION ADVANCED PACKAGING TECHNOLOGY SOFTWARE / Perf. LOGIC (CONTROLLER) ADVANCED PROCESS TECHNOLOGY 4 8 Perf. STACKING TSV: Through Silicon Via / Perf. TSV COMPONENT 15/19

21 FUTURE DRAM SOLUTIONS Prioritizing for Premium and Full Customization HIGH TEMPERATURE TOLERANCE EMI TOLERANCE BEYOND CHIPS Automotive LPDDR4 105 NAND STACKING PACKAGE SOFTWARE SMALL FORM FACTOR MV46 epop All-in-one IOT optimized HIGH PERFORMANCE 8GB HBM2 HBM DRAM EMI: Electro Magnetic Interference CONTROLLER Logic Processor Si Interposer PCB Buffer BUFFER LOGIC CHIP PERFORMANCE PACKAGE LOW-COST SUBSTRATE HBM: High Bandwidth Memory 16/19

22 FUTURE NAND SOLUTIONS 2 Track Strategy of HDD replacement and Value creation TRACK 1 HDD REPLACEMENT PC Datacenter Enterprise NAND NAND TRACK 2 HIGH DENSITY / QUALITY 16TB SSD SOFTWARE CONTROLLER SMALL FORM FACTOR 512GB BGA SSD STACKING PACKAGE SOFTWARE VALUE CREATION CONTROLLER BGA: Ball Grid Array 17/19

23 The next creation starts here Placing memory at the forefront of future innovation and creative IT life Technology Customers Employees Society Leading technological breakthroughs Supporting customers future innovation Fostering employees creativity Enriching a new way of digital life 18/19

24 BUSINESS UPDATE Contents MEMORY MARKET OPPORTUNITIES SAMSUNG STRATEGY KEY TAKEAWAYS

25 KEY TAKEAWAYS Strengthen leadership in market share and profitability with advanced technology Take advantage of new opportunities from memory-centric computing Lead the market by maximizing synergy with components, package and solution products Continue to deliver customer satisfaction and pursue sustainable growth 19/19