MS9000SE: 2 Ways Rework Station. Catalogue (Ver.1.06) Overview. Main Features;

Transcription

1 MS9000SE: 2 Ways Rework Station. Catalogue (Ver.1.06) Overview MS9000SE is the all-round rework system which almost all SMD can be reworked. And the original ITTS auto profiler system is operates of the system easily and exactly. Many kinds, such as a connector, and a socket, a shield cover, of SMD can be reworked as well as BGA and CSP, and also QFP of a fine pitch. Furthermore, if the adapter of a separate item is used, reworking of chip components such as 0402 (01005) etc. is also available. Main Features; Top heater system can be changed to the Air or IR. Reworking for chip components of to 0805 also possible. It has the function of all-reworking processes. (Removing-Cleaning-Printing-Replacing-Soldering) Newly ITTS (Intelligence Thermal Trace System) Clear & High image magnification by large-size monitor. Mount of a package is load-free. It can change to 4 languages, Japanese, English, Chinese, and Korean. Built-in 2+4 CH Thermal profile checker. (with an analysis function) 1

2 *Easy Changeable of Top Heater System By Hot Air Heating By IR Heating The top heater of a normal machine is an air system. If the heating nozzle of a top heater is removed and it equips with IR heating unit, the top heater of equipment will be IR. Exchange of the IR unit is easy at one-touch. If IR unit is connected, a control screen will be automatic and will change to IR control screen. *Reworking of a chip size component. Reflow Nozzle by Air Tweezers Nozzle by Air A reflow nozzle reworks SMD, such as almost all BGA. If the size of a nozzle is changed, it can rework to 2x2 to 50x50-mm of SMD. 2

3 And when reworking SMD of chip size, it changes into a reflow nozzle and uses a tweezers nozzle. It can respond to the chip components from to Only by a spacer exchanging, it responds to each parts in which sizes differ. And L size model is prepared for the chip of 0603 to or more size parts can be reworked like BGA. It does not use tweezers nozzle. It will be necessary to heat by N2 gas in soldering of microscopic parts, such as The generator of N2 gas is also prepared as the option. MS15N (N2 Gas Generator) ITTS automatic operation is controlled by the sensor at "CA for CH-1, and CA for CH-2". The CH-1 is the temperature of surface of the component, and the CH-2 is the temperature of under-side of the board. In generally, the temperature of CH-2 makes it the same as CH-1; then the temperature of solder will be the approximately same. The CA sensor for CH-1 and CH-2 must be sensing correctly of surface temperature each. It is very important. The suitable CA sensor kit for the subject is model ST-50K. *Solder Cleaning After removing parts, it can clean the solder remnants which remained in the land of the board. It sucks up solder remnants with the cleaning nozzle of a vacuum type. MS9000SE-CLN 3

4 * Solder Printing SND-N (Printing Tool) Squeezing Auto-Pick Up Transferring In BGA, It uses a printing tool for the package, and prints the solder-paste. MS9000SE vacuumed of the printed package from the printing tool automatically. In SND-N, printing of a transfer type is also possible. In that case, probably, the solder paste should use for transfer. Model SND-N has two functions, one is printing by metal mask, and other one is by transcription. 4

5 The special printing tool MS9000SE-CPT is prepared for the fine size parts such as It picks up and prints the chip component taped. A suitable amount of solder paste is pushed out with a special metal mask. MS9000SE-CPT (Adhesive tape is heat-resistant polyimide films currently used also at the newest reflow system) MS9000SE-CPP Solder Print-Pin: If the solder for transfer can be used, printing of solder is possible for it to the board by a transfer pin. Supply of solder is possible at SND-N. Solder Transferring Solder Printing Solder Print-Pin Solder Print-Pin: The pin is prepared for each size of a chip. There are they from to (Such as MS9000SE-CPP-(01005/0201/0402/0603/1206) 5

6 *ITTS Auto-Thermal Profiler The profile data can be sending to the PC. It is transmitted in the SVC data of the Excel. The data sample showed And the data is printed out from the PC as "the data sample". The size of it is A4. The data sample is shown as: CH-1 Surface on the PKG. CH-2 Under the board. CH-3 to CH6 at the other position. ITTS is automatically operated so that the temperature on the surface of the PKG by CH-1 sensor, and the under-side of the board by CH-2 sensor. If setting temperature of CH-2 is the same as CH-1, In the case, solder temperature will be same as it. Manual 6 zones control mode is M. In this case, the profile control data inputted are able to up to six. the printed out format is different from the A. Data Sample When make a temperature profile, with M mode for the first time. When the most suitable profile is not provided in A mode. In the case, It make with M mode. MS9000SE has a supporting function to facilitate it. They are two means. One is by Data Conversion Screen. The input data with the M mode are provided if input the temperature data of the profile to expect in the same way as ITTS. Other one is SKIP. While measuring temperature characteristics, the skip button is operated and a temperature profile will be made. *The Vision System The function of the positioning is very important function of the rework station. Since there is from small CSP of fine pitch lead to large size of BGA recently. 6

7 MS9000SE rework station has the highly efficient vision system. Board Image Board & Components Image Original Image Magnifier Image The theory of a vision function Vision Calibrator tool Precise position is decided by accuracy of the optical axis obtained from PARTS and BOARD the drawing. Always exact positioning is possible with the attached tool for calibration. 7

8 Accessories The process for the reworking required many kinds of the Tools, attachments and also other machines. We are preparing all of them required for the process. Standard Accessories: 1. Board support Tool. 2. Under board support pins system (2 rails and 4 pins) 3. Power Cable (3 cores) x 1 (approx. 5M) 4. Air Tube x 1 (6mmD approx. 3M) 5. Solder Printing Tool SND-N x 1 (Metal mask & Transcriber ) 6. Nozzle x 2 (3535Z10 x 1 / 1515Z10 x 1) 7. Center Vacuum bit x 1 set (S/M/L) 8. Vison Calibration tool x 1 Reflow Nozzle Center Vacuum Bit. Vision Calibration Tool Optional Accessories: 1. IR Heater Unit: MS9000SE-IRH 2. Tweezers Nozzle: MS9000SE-CHU.(L) 3. External Camera System: MS9000SE-ECS 4. Solder Cleaning Nozzle: MS9000SE-CLN 5. Re flow Nozzle: It chooses according to the size. 0000Z00 6. Spot Bottom Heater Unit: MS9000SE-SBH IR Heater Unit 7. Printing Tool for Chip Size parts:ms9000se-cpt 8. Solder Printing Pin MS9000SE-CPP 9. Pickup Pin for Chip Size parts: MS9000SE-PUP 10. The metal mask to each tool. MS9000SE-MAS 11. Wide Bottom Heater: It must be equipped by us. MS9000SE-WBH 12. Sensor Kit: it consisted of 5 sensors with Lead wire. ST50K 13. Solder Printing Tool: Model SND-N (Transcriber type) 14. Transferring Solder NSV300HF-F (250g by Senju Metal Ind.) 8

9 15. Re-balling Tool: Manual re-balling Jig. RBL 16. PCB Prevention Jig: for preventing warp of the board. 17. BGA Scope: Visual check of the BGA. MS1000U 18. X-Ray Inspection System. MSX RBC-1 Re-balling and Printing Tool. 20. MS-15N N2 Gas Generator. Spot Bottom Heater Tweezers Nozzle Print Tool for Chip Parts, Pickup Pin CA Sensor for Sensor Kit ST50K (ST51S is for Chip size parts) 9

10 *MS9000SE has two kinds from which a control system differs. Even though how to use they differs a little, a function is almost the same. 1. MS9000SE-PC (Control system is by original PC with Windows7) 2. MS9000SE-TP ( Control system is by Logic unit ) Please check the specification of the following page. And please decide the model whose usage you suited. 10

11 *Main Specifications (option item) Item MS9000SE-TP MS9000SE-PC Board Size 300 x 400mm (400x500mm) Board Space Top: 45mm / Bottom 25mm Board Holder 4 arms lock BGA Size 1mm~50mm (Chip Size Parts) 01005~0805 / space/height 200μ/ 10mm Top Heater By N2 Gas Hot Air 1080VA ( IR 800VA) Possible Bottom Heater IR Halogen 1000VA 150x320mm (wide bottom 2KVA) Temp. Controller Sensor K type for Controller x 2 / measuring x 4/ 6 colors Auto-Profiler PID Logic Controller Windows7/1GHz /SSD/120GB Temp. Control Step A mode:4+1 / M mode:6 By PC control Ranges 300 x 500 seconds max. 6CH 6 Colors Graph Operation Touch -Panel Wireless-Key-Board & Touch-P Control Data Capacity 500MB CSV 50GB Analyzer Software Analysis Output A4 Color. File Save 100 files each by A and M 35KB/file x Up to 50GB Z Axis Control Vertical Accuracy Operation Safety Limit Stepping Motor Control 10μ/pulse ±20μm Top Origin/Joystick operation by 4 steps 30g XY Table Level Accuracy Moving Range Pulse motor control with Joystick x 5 Steps + Pulse step ±20μm / operation : 50μm/pulse 300 x 400mm (400 x 500mm) Vision System x72max Auto-Focus / CCD Camera Color Monitor 19inch LCD (NTSC) 22 inch Touch Panel (External Camera) (2Million pixel CCD Camera with Holder) Dimension 560x645x810mm Weight 65Kg Approx. Power AC200~240V 2.5KVA Single Phase (4.5KVA) Air 0.5~0.8Mpa Dry & Clean 150L/min or more. Safety Control. Pass-word, Emergency SW/Interlock etc. The specifications are subject to change without notice 11