Adapter Technologies
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1 Adapter Technologies Toll Free: (800) U.S. Only Tel: (952) Fax: (952)
2 Introduction Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering Electrical and Mechanical ISO9001:2008 Registration Adapter Technology Overview Pluggable BGA adapter system (Giga-snaP ) Surface mount package emulators Package convertors & Fix adapters Prototype, probe & analysis adapters Receptacles, extenders, rotators and socket plugs Electronic modules
3 Pluggable BGA Adapter System (Giga-snaP ) 10 Years BGA device soldered on top module & base module soldered on PCB Short contact Gold plated clips & terminals Epoxy over-mold & Matched CTE Low insertion/extraction force 0.5mm to 1.27mm pitch 2x2mm to 45x45mm device 2000 pin count Shortest signal path (2-7GHz) Low insertion force (15-25g) Co-planarity <100µm Tape & reel High bandwidth applications Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs No solder wicking & No substrate warping Easy operation to plug and remove module system DDR memory BGA adapter system 2000 pin count BGA system plugged together & shown separately 0.5mm pitch BGA Pluggable adapter system Daughter card interface system or Board-to-board connector system
4 Surface Mount Package Emulators 15 Years 0.4mm pitch QFP emulator base with female interface Leadless SOIC emulator J-leaded PLCC Emulator foot Gull-wing QFP Emulator foot Short contact High bandwidth applications Gold plated clips & terminals Side castellation Low insertion/extraction force 0.4mm to 1.27mm pitch 2x2mm to 50x50mm device QFN, QFP, SOIC, PLCC 500 pin count Gull-wing options Leadless options Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs Easy hand soldering and reflow soldering Easy operation to plug and remove module system Leadless QFN emulator Leadless PLCC emulator PLCC plug Side castellation SOIC emulator
5 Package Convertors & Fix Adapters 20 Years BGA device mounted to QFP footprint on mother board Shortest signal routing Gold plated interconnection Shaped solder Conventional PCB material 0.4mm to 2.54mm pitch 2x2mm to 50x50mm device BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc 2000 pin count Tray, Panel, Tape & Reel options QFP device mounted to PLCC Footprint on target board with shortest trace length Minimal loss for high bandwidth applications No additional real estate needed. Ideal for replacing obsolete IC and field upgradeable system designs Solders same as IC it replaces. No change in assembly process CTE match and high temperature applications SOIC to DIP convertor using blind hole technology BGA convertor in scored panel BGA to BGA conversion with complex signal swap due to device enhancement without additional real estate SOIC device mounted to PLCC footprint using solder column technology for high volume production SOIC pitch convertor
6 Prototype, Probe & Analysis Adapters 20 Years Power PC BGA device interfaced to Logic analyzer and mother board for functional analysis Shortest signal routing Gold plated interconnection Conventional PCB material 0.4mm to 1.27mm pitch 2x2mm to 50x50mm device BGA, LGA, QFN, SOIC, PLCC, QFP, DIP, PGA, etc 2000 pin count Agilent, Tektronix compatible Rigid & flex options SOIC, PLCC adapter 0.5mm pitch 21x21 array 289 position BGA solder balls to AMP connectors using rigid flex PCB with socket fixture Minimal loss for high bandwidth applications No additional real estate needed. Ideal for IC prototype and system analysis testing CTE match and high temperature applications Allows QFN device to be socketed to mother board with signals brought out to test pins 60 pin, 0.8mm pitch BGA rigid-flex probing adapter with AMP mictor and BGA surface mount foot Flexible top side traces Probing solution without additional interconnect BGA proto adapter with Clamshell pogo pin socket Flex emulator 125 position AMP Z pack connector to 80 position female interface
7 Receptacles, Extenders, Rotators & Socket Plugs 20 Years Rigid PCB extender alleviates height constraints Flex PCB extender allows communication between device to moving head Gold plated interconnection Circular receptacle Array receptacle Small footprint Conventional PCB material Flexible top side traces Differential and impedance matched signal routing 0.5mm to 2.54mm pitch 2x2mm to 50x50mm device BGA, LGA, QFN, QFP, SOIC 2000 pin count Rigid & flex options Custom fixtures in days No additional real estate needed. Ideal for IC prototype and daughter card interface CTE match and high temperature applications Probing solution without additional interconnect High speed applications with accommodation of space constraints Height extender PLCC device clips with probing option PLCC socket plugs Receptacles for burn-in sockets
8 Electronic Modules 8 Years Multi chip module with components on both side Conventional PCB material Shortest signal routing Conductive filled via Optimized plated thru hole with filled via Fiducial, Kapton dot Shaped solder (QFN, QFP) 0.25mm to 2.54mm pitch 3 mil trace/space Laser micro vias Embedded caps & resistors Lead free options Tray, Tape & Reel options Turnkey solutions CTE match and high temperature applications Minimal loss for high bandwidth applications BGA device, discrete & voltage regulator No additional real estate needed. Ideal for replacing obsolete IC and field upgradeable system designs Excellent thermal dissipation and high current applications Low inductance and high speed applications Optical alignment, pick & place assembly Easy assembly (industry standard reflow profile) Daughter card module Interfaced to QFP footprint Dual technology (SMT & thru hole) assembly QFP device, discrete & connector SoC module with high density connector BGA device, SOIC device & discrete
9 Custom Capability Custom adapter designs in 2 days Match customer s PCB footprint Custom adapter manufacturing in 10 days In-house automated optical inspection Stencil print, Pick & Place, Reflow Adapter signal integrity simulation Innovative adapter technologies In-house machining Quick turn production
Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering Electrical and Mechanical ISO9001:2008 Registration
Overview Company Overview Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering Electrical and Mechanical ISO9001:2008 Registration Adapter Technology Overview Pluggable
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INPUT/OUTPUT CONNECTORS D-SUBMINIATURE PIN-IN-PASTE CONNECTORS OVERVIEW The D-Subminiature connectors are one of the most popular I/O solutions, addressing segments such as Telecommunications, Industrial,
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![ELECTRICAL SPECIFICATIONS** Frequency. Power Handling. Directivity. .064±.013 [1.64±0.33] Pin ±.004 [3.05±0.10] Pin 3](/thumbs/89/100344529.jpg "ELECTRICAL SPECIFICATIONS** Frequency. Power Handling. Directivity. .064±.013 [1.64±0.33] Pin ±.004 [3.05±0.10] Pin 3")
Pico Xinger 20dB Directional Coupler Description The 1P620 Pico Xinger is a low profile, miniature 20dB directional coupler in an easy to use surface mount package designed for MMDS and WLAN applications.
Getting Started. 1.3 X-MWsystem Vocabulary. X-MWprobe X-MWanchor X-MWjumper. X-MWblock RF. X-MWblock Bias and Control. X-MWprotoplate X-MWwall X-MWlid
1. X-Microwave System (X-MWsystem) 1.1 Overview RF and Microwave design and product development is an incredibly interesting and challenging field. The Craft is truly an art and it takes years to learn