Specification For LTCC 4-Phased Antenna Feeder (Quadrifilar)
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1 Specification For LTCC 4-Phased Antenna Feeder (Quadrifilar) Model Name : Customer : Title: Name : APPROVED By Date : Signature : RN Technologies co., Ltd. Issued Date : Designed : Approved :
2 / Description 1-1. Part number: 1-. Features - 4-Way Coupler 6dB, (0, 90, 180, 70 ) - Surface mount type - Suitable for operation frequency 150~1660MHz - RoHS compliance - High stability in temperature and humidity for LTCC base - Low loss for Silver(Ag) conductor - Miniature size and high power capability - Lead-free alloy solderable - Thermal expansion corresponding with common substrate. Electrical Specification Freq. Amplitude Balance Isolation Insertion Loss (MHz) max (db) min (db) max (db) ± VSWR Phase Characteristic Impedance Operating Temp. Max (degrees) (ohm) ( ) 1.4 ± to +15
3 3 / Mechanical Specification 3-1. Outline Dimension PROJECTION NO. DATE 1 3 REVISION & DESCRIPTION SIGNATURE _B NO. DESCRIPTION TITLE 3-. Weight Grams typical
4 4 / Port Configuration Port 4 Isolation Port 3 Isolation Port _B Isolation Isolation Port 5 Port 1 Port Port 1 Port 5 Configuration Port 1 Port Port 3 Port 4 Port 5 Output1 Output Output3 Output4 Input -6dB, 0-6dB, 90-6dB, 180-6dB, 70 Isolation pads are required to be terminated with 50ohm Resistor.
5 5 / Operation Temperature Curve (a) 0 Return Loss -4.4 Output Magnitude[dB] S11 S -40 S33 S44 S Frequency[MHz] Isolation 0 Magnitude[dB] Output1 Output Output3 Output Frequency[MHz] Insertion Loss 0.0 Magnitude[dB] Magnitude[dB] Isolation1 Isolation Isolation3 Isolation4-1.8 Insertion Loss Isolation5 Isolation Frequency[MHz] Frequency[MHz] Phase Balance 90 0 Phase[Deg] Phase1 Phase Phase3 Phase Frequency[MHz]
6 6 / Test Method - Refer to Port Configuration on page 4 - Have the network analyzer calibrated properly. - Measure the data of Output1 through port 1 to port. (S1) - Measure the data of Output through port 1 to port 3. (S31) - Measure the data of Output3 through port 1 to port 4. (S41) - Measure the data of Output4 through port 1 to port 5. (S51) - Measure the data of Isolation1~6 through port ~5 to port 3~5. (S3,S4,S5,S34,S35,S45) - Calculate the Insertion Loss and Amplitude Balance of coupler on the below power method formula. S-Parameter[dB] Power Method[dB] P Output1 S1 10 log Out 1 Pin Output S31 10 P log Out Pin Outpot3 S41 10 P log Out 3 Pin Output4 S51 10 P log Out 4 Pin Isolation Iso1(S3),Iso(S4),Iso3(S5), PIso 1~ 5 10 log Iso4(S34),Iso5(S35),Iso6(S45) Pin Insertion Loss Pin 10 log POut1 + POut + POut3 + P Amplitude Balance Phase Balance1(0 ) Phase Balance(90 ) Phase Balance3(180 ) Phase Balance4(70 ) Phase (S1) Phase (S31) Phase (S41) Phase (S51) P ( 10 log Out1~ Out 4) P Out1 + P Out + P 4 Out3 Out 4 + P Out 4 P in : Power of Input Port P out n : Power of Output Port(~5) P iso : Power of Isolated Port
7 7 / Measurement board layout PROJECTION No. 1 3 DATE REVISION & DESCRIPTION SIGNATURE REVIEWED CHECKED No. DESCRIPTION UNIT TOTAL QUANTITY PERUNIT TOTAL TITLE Quadrifilar-Measuremnet Board Outline RN DWG No. SCALE SIZE A4 DIMENSION mm
8 8 / Reflow profile Temp.[ ] T1 T T3 T4 t4 Air 100 Coolin 50 t1 t t Time [sec] Ramp Up Pre-Heating Peak Soaking Temp.[ ] T1:160±5 T:180±5 T4:60±5 T3:30±5 Time [sec] t1:60±5sec t:100±15sec t3:30±5sec t4:60±10sec
9 9 / Using note for LTCC Couplers I. Be careful when transporting A. Excessive stress or shock may make products broken or cracked due to the nature of ceramics structure. B. The products cracked or damaged on terminals may have their property changed. II. Be careful during storage A. Store the products in the temperature of -55 ~ 15 B. Keep the humidity at 45 ~ 75% around the products. C. Prevent corrosive gas (Cl, NH 3, SO X, NO X, etc.) from contacting the products. D. Use the products within 6 months of receipt. If the period exceeds 6 months, solder ability should be verified. III. Be careful when soldering A. All the ground terminals, IN and OUT pad of coupler should be soldered on the ground plane of the PCB. B. Products may be cracked or broken by uneven forces from a claw or suction device. C. Mechanical stress by any other devices may damage products when positioning them on PCB. D. A dropped product is recommended not to be used. E. Soldering must be carried out by the condition of specification sheet. F. Any couplers which are de-soldered from PCB should not be used again.
10 10 / Environmental Reliability ITEM PROCEDURE REQUIREMENTS/RESULT Temperature Cycle (Thermal Shock) Solderability Heat Resistance Low Temp. Resistance Vibration Resistance Humidity Resistance Drop Shock 1. One Cycle : Step1: 15 ± 5 C for 10sec Step: -55 ± 5 C for 10sec. Number of Cycles : Cycle time : 30 min 3. Normal Condition in 1 hour 1. Solder : 30 ± 5 C for 5± 1 sec. 1. Temperature : 100 ± C. Duration : 96 ± hours 1. Temperature : -55 ± 5 C. Duration : 4 ± hours 1. Frequency: 5~ 15MHz. Acceleration : 10g 3. Sweep Time: 0.1 oct/min, 15min/axis 4. Axis : X, Y and Z direction 1. One Cycle : Step1:increase Temperature -5~65 C for hours with humidity 85% Step:Maintain for 4 hour after increasing Humidity 90% to 95% Step3: Decrease Temperature 65 C to 5 C. Number of Cycles : Maintain for 3hour after decreasing temperature -10 C 1. Dropped onto hard wood from height of 50 cm for 5 times; each x, y and z direction except I/O direction. 1. Meet the electrical Specification 1. More than 85% of the I/O electrode pad shall be covered with solder. 1. Meet the electrical Specification 1. Meet the electrical Specification 1. No appearance damage. Meet the electrical Specification 1. Meet the electrical Specification 1. No appearance damage. Meet the electrical Specification
11 11 / RoHS test result - RN Technologies warrants and represents as follows.
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