Chip EMIFILr Inductor Type for GHz Noise Chip Ferrite Beads

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1 1 Chip EMIFILr Inductor Type for GHz Noise Chip Ferrite Beads BLM18H Series (63 Size) Dimension Equivalent Circuit.4±.2.8± ±.15.8±.15 (esistance element becomes dominant at high frequencies.) (in mm) Packaging Code Packaging Minimum Quantity D 18mm Paper Tape 4 J 33mm Paper Tape 1 B Bulk(Bag) 1 ated Value (p: packaging code) Part Number Impedance (at 1MHz/2 C) Impedance (at 1GHz/2 C) ated Current DC esistance(max.) Operating Temperature ange Number of Circuits BLM18HG471SN1p 47ohm±25% 6ohm(Typ.) 2mA.85ohm -55 C to +125 C 1 BLM18HG61SN1p 6ohm±25% 7ohm(Typ.) 2mA 1.ohm -55 C to +125 C 1 BLM18HG12SN1p 1ohm±25% 1ohm(Typ.) 1mA 1.6ohm -55 C to +125 C 1 BLM18HB121SN1p 12ohm±25% 5ohm±4% 2mA.5ohm -55 C to +125 C 1 BLM18HB221SN1p 22ohm±25% 11ohm±4% 1mA.8ohm -55 C to +125 C 1 BLM18HB331SN1p 33ohm±25% 16ohm±4% 5mA 1.2ohm -55 C to +125 C 1 BLM18HD471SN1p 47ohm±25% 1ohm(Typ.) 1mA 1.2ohm -55 C to +125 C 1 BLM18HD61SN1p 6ohm±25% 12ohm(Typ.) 1mA 1.5ohm -55 C to +125 C 1 BLM18HD12SN1p 1ohm±25% 17ohm(Typ.) 5mA 1.8ohm -55 C to +125 C 1 BLM18HE61SN1p 6ohm±25% 6ohm(Typ.) 8mA.25ohm -55 C to +125 C 1 BLM18HE12SN1p 1ohm±25% 1ohm(Typ.) 6mA.35ohm -55 C to +125 C 1 BLM18HE152SN1p 15ohm±25% 15ohm(Typ.) 5mA.5ohm -55 C to +125 C 1 BLM18HK331SN1p 33ohm±25% 4ohm±4% 2mA.5ohm -55 C to +125 C 1 BLM18HK471SN1p 47ohm±25% 6ohm±4% 2mA.7ohm -55 C to +125 C 1 BLM18HK61SN1p 6ohm±25% 7ohm±4% 1mA.9ohm -55 C to +125 C 1 BLM18HK12SN1p 1ohm±25% 12ohm±4% 5mA 1.5ohm -55 C to +125 C 1 o This data sheet is applied for CHIP FEITE BEAD used for General Electronics equipment for your design

2 2 Notice (ating) In operating temperature exceeding +85 C, derating of current is necessary for BLM18HE series. Please apply the derating curve shown in chart according to the operating temperature. Derating 8 BLM18HE61SN1 Derated Current (ma) BLM18HE12SN1 BLM18HE152SN Operating Temperature ( C) 8 BLM18HG471SN1 1 BLM18HG61SN BLM18HG12SN1 7 BLM18HB121SN o This data sheet is applied for CHIP FEITE BEAD used for General Electronics equipment for your design

3 3 1 BLM18HB221SN1 16 BLM18HB331SN BLM18HD471SN1 2 BLM18HD61SN BLM18HD12SN1 1 BLM18HE61SN o This data sheet is applied for CHIP FEITE BEAD used for General Electronics equipment for your design

4 4 BLM18HE12SN1 BLM18HE152SN BLM18HK331SN1 8 BLM18HK471SN BLM18HK61SN1 16 BLM18HK12SN o This data sheet is applied for CHIP FEITE BEAD used for General Electronics equipment for your design

5 5!Caution/Notice!Caution (ating) Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. o This data sheet is applied for CHIP FEITE BEAD used for General Electronics equipment for your design

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