ISL MMIC Silicon Bipolar Broadband Amplifier. Features. Ordering Information. Applications. Typical Application Circuit

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1 ISL55 Data Sheet August 25, 1 FN258.2 MMIC Silicon Bipolar Broadband Amplifier The ISL55 is a high performance gain block featuring a Darlington configuration using high f T transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. Other members of the family include: ISL55 and ISL5515 match a 75Ω source to a 5Ω load. ISL5513 and ISL551 match a 5Ω source to a 5Ω load. Ordering Information PART NUMBER (Note) PART MARKING PACKAGE (Pb-Free) PKG. DWG. NUMBER ISL55IEZ-T7 CCG Ld SC-7 P.9A * Please refer to TB37 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 1% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-. Features Input Impedance of 75Ω Output Impedance of 5Ω Gain of 1GHz Noise Figure 2GHz OIP3 of 1GHz Low Input and Output Return Losses Pb-Free Available (RoHS compliant) Applications LNB and LNB-T (HDTV) Amplifiers IF Gain Blocks for Satellite and Terrestrial STBs PA Driver Amplifier Wireless Data, Satellite Bluetooth/WiFi Satellite Locator and Signal Strength Meters Typical Application Circuit +5V Pinout ISL55 ( LD SC-7) TOP VIEW.1µF 1pF 2Ω 1pF.1µF GND 1 OUT 3 1nH GND IN GND VSP 8pF 1, 2, 5 8pF 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures INTERSIL or Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc., 7, 9. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.

2 ISL55 Absolute Maximum Ratings (T A = +25 C) Supply Voltage from VSP to GND V Input Voltage V S + +.3V to GND -.3V Ambient Operating Temperature C to +85 C Storage Temperature C to +5 C Operating Junction Temperature C ESD Rating Human Body Model (Per MIL-STD-883 Method 315.7)...V Machine Model (Per EIAJ ED-71 Method C-111) V Storage Temperature C to +5 C Operating Junction Temperature C Thermal Information Thermal Resistance (Typical, Note 1) θ JA ( C/W) Ld SC Pb-free reflow profile see link below CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.. 1. θ JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Electrical Specifications V SP = +5V, Z RSC = Z LOAD = 5Ω, T A = +25 C, 2Ω V SP to OUT, unless otherwise specified. PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT Vsp Supply Voltage To operate below 5V, the 2Ω resistor to supply should be reduced V Gt Small Signal Gain GHz db 1.5GHz db 2.GHz db P1dB Output Power at 1dB Compression GHz dbm 2.GHz dbm OIP3 Output Third Order Intercept Point GHz 3 dbm 2.GHz 27 dbm OIP2 Output Second Order Intercept Point Input tones at GHz and 1.1GHz, at Input Power = -15dBm, Output tone 2.1GHz.2 dbm BW 3dB Bandwidth 3dB below 5MHz 2. GHz IRL Input Return Loss GHz Z RSC = 75Ω, Z LOAD = 5Ω 23.5 db ORL Output Return Loss GHz Z RSC = 75Ω, Z LOAD = 5Ω 21.8 db RISOL Reverse Isolation 2.GHz 22. db NF Noise Figure 2.GHz.7 db ID Device Operating Current ma 2 FN258.2 August 25, 1

3 ISL55 Device Test Setup AGILENT _8753ES VNA 5Ω 5Ω CONNECTORLESS PLATFORM PICOSECOND LABS MODEL 552 5Ω PIN 3 PIN 5Ω DC BLOCK DUT BIAS TEE PICOSECOND LABS MODEL V 2Ω I 1 I 2 INPUT REFERENCE OUTPUT REFERENCE 5V POWER SUPPLY I DEVICE Typical Performance Curves Z SRC = 75Ω, Z LOAD = 5Ω 32 2 IRL (db) G G 1.5G 2.G 2.5G 3.G FIGURE 1. INPUT RETURN LOSS vs FREQUENCY ORL (db) 1 8.5G G 1.5G 2.G 2.5G 3.G FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY Typical Performance Curves 5Ω Environment S21 (db) G G 1.5G 2.G 2.5G 3.G FIGURE 3. S21 vs FREQUENCY S11 (db) G G 1.5G 2.G 2.5G 3.G FIGURE. S11 vs FREQUENCY 3 FN258.2 August 25, 1

4 ISL55 Typical Performance Curves 5Ω Environment (Continued) S (db) S22 (db) G G 1.5G 2.G 2.5G 3.G FIGURE 5. S vs FREQUENCY -2.5G G 1.5G 2.G 2.5G 3.G FIGURE. S22 vs FREQUENCY OIP3 (dbm) G G 1.5G 2.G 2.5G 3.G FREQUENCY (GHz) FIGURE 7. OIP3 vs FREQUENCY HD (dbm) 1 FUNDAMENTAL (1GHz) -1 FUNDAMENTAL (1.1GHz) IM2 (2.1GHz) INPUT POWER (dbm) FIGURE 8. IM2 vs INPUT POWER NOISE FIGURE (db) G G 1.5G 2.G 2.5G 3.G FIGURE 9. NOISE FIGURE vs FREQUENCY 1dB OUTPUT COMPRESSION POINT (dbm) G G 1.5G 2.G 2.5G 3.G FIGURE 1. P1dB vs FREQUENCY FN258.2 August 25, 1

5 Typical Performance Curves 5Ω Environment (Continued) ISL S GHz 3 GHz GHz S GHz RF Café 2 FIGURE 11. S11 AND S22 vs FREQUENCY 5 FN258.2 August 25, 1

6 Small Outline Transistor Plastic Packages (SC7-) A A2 SEATING b. (.8) M 5 e1 D e C X θ1 X θ1 WITH PLATING c C A1 E.1 (.) C BASE METAL L L1 b b1 R1 α SEATING R -C- c1 VIEW C GAUGE L2 E1 C P.9A LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A A A b b c c D E.8 BSC 2.1 BSC - E e.25 Ref 5 Ref - e1.5 Ref 1.3 Ref - L.1.18 L1.1 Ref. Ref. - L2. BSC.15 BSC - N 5 R α Rev. 7/5 NOTES: 1. Dimensioning and tolerance per ASME Y1.5M Package conforms to EIAJ SC7 and JEDEC MO3AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.. Footlength L measured at reference to gauge plane. 5. N is the number of terminal positions.. These Dimensions apply to the flat section of the lead between.8mm and.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only VIEW C All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9 quality systems. Intersil Corporation s quality certifications can be viewed at Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see FN258.2 August 25, 1

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