Product Focus Power Module - Thyristors and Diodes
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1 Distributed in the UK by: Power Component Distribution Product Focus Power Module - Thyristors and Diodes China s Leading Power Semiconductor Manufacturer. High Quality Products and attractive to higher cost base EU manufacturers. International Standards (IRIS, UL, IEC, RoHS etc.) and proactive QC system. Pressure contact provides improved reliability versus solder module technology Thyristor-Thyristor, Thyristor Diode, Diode Diode, Fast Diode Modules, Single and Three Phase Rectifier Bridge Modules. UK skilled technical support and cross reference service versus Semikron, IXYS and Infineon etc. Power Module Outlines and Topologies available as standard: Page 1 of 5
2 V V MTx26 26A X X MTx40 40A X X MTx55 55A X X MTx70 70A X X MTx90 90A X X MTx A X X MTx A X X MTx A X X MTx A X X MTx A X X MTx A X X X MTx A X X MTx A X X MTx A X X MTx A X X MTx A X X X MTx A X X X MTx A X X MTx A X X MTx A X X MTx A X X MTX A X X Dual Thyristor Power Module Portfolio MTx x denotes Phase Leg, common anode or Dual Diode Power Module Portfolio MDx x denotes Phase Leg, common anode or V V MDx26 26A X X MDx40 40A X X MDx55 55A X X MDx70 70A X X MDx90 90A X X MDx A X X MDx A X X MDx A X X MDx A X X MDx A X X X MDx A X X X MDx A X X X MDx A X X MDx A X MDx A X X X MDx A X X X MDx A X X MDx A X X X MDx A X X MDx A X X MDx A X X Page 2 of 5
3 V V MFx26 26A X X MFx40 40A X X MFx55 55A X X MFx70 70A X X MFx90 90A X X MFx A X X MFx A X X MFx A X X MFx A X X MFx A X X MFx A X X X MFx A X MFx A X X MFx A X MFx A X X MFx A X X X MFx A X X X MFx A X MFx A X X MFx A X X MFx A X X MFx A X X Thyristor / Diode Module MFx x denotes Phase Leg, common anode or Single Phase Rectifier Diode Module MDQ50 50A X MDQ75 75A X MDQ A X MDQ A X Three Phase Rectifier Diode Module per die MDS50 50A X MDS75 75A X MDS A X MDS A X MDS A X MDS A X Page 3 of 5
4 Three Phase Rectifier Diode Module with Thyristor MDST50 50A X MDST75 75A X MDST A X MDST A X MDST A X Fast Turn Off Thyristor and Fast Recovery Diode Module Part # It(av) V 2500V MHC55 55A X MKx/MHx75 75A X MKx/MHx A X MKx/MHx A X MKx/MHx A X MKx/MHx A X MKx/MHx A X MKx/MHx70 70A X Fast Recovery Diode Module Trr (usec) MZx75 75A X 1.5 MZx A X 2 MZx A X 3 MZx A X 4 MZx A X 4 MZx A X 5 MZx A X 5 Page 4 of 5
5 Product Focus Power Module - Thyristors and Diodes Why Pressure contact? What are the benefits? Pressure contact designs can: Eradicate the 2 main failure mechanisms of solder base modules wire bond fatigue and die solder cracking. have higher surge current ratings due to improved contact with the die and improved mechanical strength. have Thermal / Power Cycling improvements with longer Mean Time Between Failure (MTBF). Can provide higher voltage, higher current designs than solder base due to restrictions in solder die tech. Provide a solution for high power cycling applications (such as resistive welding) where Solder base technology fail.. Pressure contact design no wire bonds, no solder fixation Solder base design wire bond break and fixed soldered dies Power Module Part Number Designation and additional parts: Please note keyed connector gate leads are available upon request:. HEATSINKS Diamond Power also provide various Heatsink Solutions for Press Pack or Module Devices. Please send us your enquiry. And many more.. Page 5 of 5
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Bi-directional ESD Protection Diode
Bi-directional ESD Protection Diode FEATURES Meet IEC61-4-2 (ESD) ±15kV (air), ±8kV (contact) Meet IEC61-4-4 (EFT) rating. 4A (5/5ns) Protects one Bi-directional I/O line Moisture sensitivity level: level
NTC thermistors for inrush current limiting
NTC thermistors for inrush current limiting Summary NTC thermistors for inrush current limiting, as all NTCs, are made of polycrystalline mixed oxide ceramics. They suppress high inrush current surges,
MCX06C Programmable controller
Data sheet MCX06C Programmable controller MCX06C is an electronic controller that holds all the typical functionalities of MCX controllers in the 32x74 mm standard size: programmability connection to the
Embedded Power Dies for System-in-Package (SiP)
Embedded Power Dies for System-in-Package (SiP) D. Manessis, L. Boettcher, S. Karaszkiewicz, R.Patzelt, D. Schuetze, A. Podlasky, A. Ostmann Fraunhofer Institute for Reliability and Microintegration (IZM),
MPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry
MOTOR DRIVE AMPLIFIER
MOTOR DRIVE AMPLIFIER AMPEX UPGRADE ELECTRONICS Owner s Manual RTZ Professional Audio, LLC Alpharetta, GA USA Web: http://www.rtzaudio.com Email: rtzaudio@comcast.net COPYRIGHT 2018, RTZ PROFESSIONAL AUDIO,
RUC industrial relays of small dimensions
Contact data Number and type of contacts Contact material Rated / max. switching voltage Min. switching voltage Rated load Min. switching current Max. inrush current Rated current Max. breaking capacity