DC/DC Converters. TSM Series, 1 Watt. Features. Models

Transcription

1 TSM Series, Watt Features SMD package (SOIC-4/8) Construction in lead frame technology Isolated single and dual output I/O isolation 000 VDC High efficiency Operating temperature 40 C to +85 C Reflow solder temperature up to 245 C High accuracy of Pin co-planarity Available in tape and reel package Lead free design, RoHS compliant 3-year product warranty The TSM series are isolated DC/DC converters with W output power implemented in a molded plastic package with a pin accuracy suitable for automated SMDproduction. The devices can be soldered without any problems in a high temperature lead free solder process. With their small footprint these converters are the economical solution for point of load power conversion, ground loop elimination, noise reduction and digital interface applications. Models Ordercode Input voltage Output voltage Output current max. Efficiency typ. TSM 0505S 5 VDC 200 ma 80 % TSM 0509S 9 VDC 0 ma 78 % TSM 052S 2 VDC 80 ma 80 % TSM 055S 5 VDC ±0% 5 VDC 65 ma 8 % TSM 0505D ±5 VDC ±00 ma 75 % TSM 052D ±2 VDC ±40 ma 79 % TSM 055D ±5 VDC ±30 ma 79 % TSM 205S 5 VDC 200 ma 8 % TSM 209S 9 VDC 0 ma 78 % TSM 22S 2 VDC 80 ma 8 % TSM 25S 2 VDC ±0% 5 VDC 65 ma 82 % TSM 205D ±5 VDC ±00 ma 75 % TSM 22D ±2 VDC ±40 ma 80 % TSM 25D ±5 VDC ±30 ma 80 % TSM 2405S 5 VDC 200 ma 8 % TSM 2409S 9 VDC 0 ma 78 % TSM 242S 2 VDC 80 ma 8 % TSM 245S 24 VDC ±0% 5 VDC 65 ma 82 % TSM 2405D ±5 VDC ±00 ma 75 % TSM 242D ±2 VDC ±40 ma 80 % TSM 245D ±5 VDC ±30 ma 80 % Page of 5

2 Input Specifications Input current no load / full load 5 Vin models: 30 ma / 260 ma typ. 2 Vin models: 5 ma / 0 ma typ. 24 Vin models: 8 ma / 55 ma typ. Surge voltage ( sec. max.) 5 Vin models: 9 V max. 2 Vin models: 8 V max. 24 Vin models: 30 V max. Reverse voltage protection Reflected input ripple current Input filter Output Specifications Voltage set accuracy ±3 % Voltage balance (dual output models) 0.3 A max. DC/DC Converters TSM Series Watt can be reduced by ext. 2.2 µf polyester film capacitor internal capacitors ± % max. Regulation Input variation.2 % / % change Vin Load variation % 0 % max. Ripple and noise (20 MHz Bandwidth) Temperature coefficient Short circuit protection Capacitive load General Specifications 20 mvpk-pk max. ±0.02 %/ C limited sec. max. single output models: 22 µf max. dual output models: 0 µf max. Temperature ranges Operating (see also enclosed derating curve) 40 C to +85 C (no derating) Storage 55 C to +25 C Humidity (non condensing) Reliability, calculated MTBF (MIL-HDBK-27F, at+25 C, ground benign) 95 % rel H max. > h Isolation voltage (60 sec.) Input/Output 000 VDC Isolation capacity Input/Output 40 pf typ. Isolation resistance Input/Output > 000 Mohm Switching frequency Frequency change over line and load ±30 % 00 khz typ. (frequency modulation) Environmental compliance Reach RoHS RoHS directive 20/65/EU Physical Specifications Casing material Package weight Reflow soldering profile (IPC/JEDEC J-STD-020D) Packaging epoxy molding compound (flammability to UL 94V-0 rated) single output models:.2 g (0.04 oz) dual output models:.5 g (0.05 oz) 24Vin modes: tba peak temp. 245 C (0 sec. max.) 27 C for 90 sec. max. Convection reflow solder process is recommended All specifications valid at nominal input voltage, full load and +25 C after warm-up time unless otherwise stated. Page 2 of 5

3 TSM Series Watt Derating all TSM Models +85 C +05 C Output Power [%] % / C Output Power [%] Ambient Temperature [ C] Outline Dimensions TSM Single Output Models 6.5 (0.26) *8. (0.32) (0.27) S 7.62 (0.3) (0.27) (0.0) *7.8 (0.3) 0.25 (0.0) 7.0 (0.28) *7.4 (0.29) S ± 4 Seating Plane P 0.2 M S 9.2 (0.36) 0.6 (0.024) 2.54 (0.) 4 8. (0.44) NA NA NA +Vo (0.32) *8.3 (0.33) 2.5 (0.) 2.7 (0.5) 7 Vin +Vin NA 7 Vo * Dimensios for 24Vin models NA = not available for electrical connection Dimensions in [mm], () = Inch Pin pitch tolerances: ±0.3 (±0.005) Other tolerances: ±0.25 (±0.0) Page 3 of 5

4 TSM Series Watt Outline Dimensions TSM Dual Output Models 6.5 (0.26) *8. (0.32) 2.0 (0.27) * S 0.6 (0.4) (0.024) (0.) (0.32) (0.27) *7.8 (0.3) (0.0) *8.3 (0.33) 0.25 (0.0) S ± (0.28) *7.4 (0.29) 9.2 (0.36). (0.44) NA NA NA +Vo NA 8 0 Seating Plane P 0.2 M S 2.5 (0.) 5.24 (0.6) 9 Vin +Vin NA Com 9 Vo * Dimensios for 24Vin models NA = not available for electrical connection Dimensions in [mm], () = Inch Pin pitch tolerances: ±0.3 (±0.005) Other tolerances: ±0.25 (±0.0) Page 4 of 5

5 TSM Series Watt Solder Pad Dimensions mm (inches) TSM Single Output Models 7.62 (0.3) (0.) (0.) (0.).7 (0.067) 0.8 (0.425).0 Min. (0.039 Min.) TSM Dual Output Models 0.6 (0.4) (0.) (0.) (0.) (0.).7 (0.067) 0.8 (0.425).0 Min. (0.039 Min.) Specifications can be changed without notice! Make sure you are using the latest documentation, downloadable at Rev. January Page 5 of 5