Qualification of the AMD Alchemy Au1500 Processor

Transcription

1 Qualification of the AMD Alchemy Au1500 Processor 27364B March 2003

2 2002, 2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. ( AMD ) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Contacts pcs.support@amd.com Trademarks AMD, the AMD Arrow logo, Alchemy, and combinations thereof, and Au1500 are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

3 Qualification of the Alchemy Au1500 Processor from AMD 27364B March 2003 Table of Contents 1. Au1500 Product Qualification Levels of Qualification Institutional/Agency Qualifications Warranty Disclaimer Package Qualification A. Package Profile Process Qualification A. Device Level Process Qualification Component Qualification A. FIT Calculations B. Latch Up Stress Results Summary References

4 27364B March 2003 Qualification of the Alchemy Au1500 Processor from AMD Revision History Date Revision Description May Original document created by Sarah Bartaszewicz July Updated to reflect qualification status (Sarah Bartaszewicz) December 2002 A Updated to reflect qualification status (Jean Paul Somers), PID assigned March 2003 B Updated FIT information 2

5 27364B March 2003 Qualification of the Alchemy Au1500 Processor from AMD 1. Au1500 Product Qualification The Au1500 processor is a qualified product as defined by this document. 2. Levels of Qualification A preliminary qualification level will be awarded upon completion of the Early Fail Study (EFS). EFS is completed at three lots with an equivalent Field Effective Hours of The final qualification level is awarded upon completion of the High Temperature Operation Life (HTOL) and all other qualification stresses as outlined in this document. 3. Institutional/Agency Qualifications EIA Electronic Industries Association JEDEC Joint Electron Device Engineering Council 4. Warranty Disclaimer Data resulting from the qualification methodology described in this document is predictive only and does not create an express or implied warranty of product performance, merchantability, or fitness for a particular purpose. Applicable warranties for AMD devices are set forth in AMD's terms and conditions of sale. AMD provides qualification data "as is" and only as predictive guidelines to assist customers with their examination of an AMD device. 5. Package Qualification A qualified packaging technology is utilized in the Au1500 processor as provided by Advanced Semiconductor Engineering, Inc. (ASE). The package is a 424 ball, 0.8mm ball pitch, LFBGA. The package qualification meets all SME applications for assembly and packaging processes as listed in Table 1. 3

6 Qualification of the Alchemy Au1500 Processor from AMD 27364B March 2003 Table 1. Package Qualification Test Stress/ (Package Size) Sample Size Accept Criteria Test Condition Qualification Point Physical Dimensions Temperature Cycling HAST (No Bias) 5 0 Fails JEDEC 95-1 as applicable to BGAs with exemption superseded as outlined in the Package Outline Drawing 45/lot 0 Fails JEDEC 22-A104-B -65ºC 150ºC, 1000 Cycles 45/lot 0 Fails JEDEC 22-A ºC/85% RH, 33.5 PSIG, 100 Hours Pressure Cooker 45/lot 0 Fails JEDEC 22-A102-C 121ºC/100% RH, 15 PSIG, 168 Hours Temperature Humidity Test (No Bias) Moisture Sensitivity Marking Permanence 45/lot 0 Fails JEDEC 22-A101-B 85ºC /85%RH, 1000 Hours Fails JEDEC J-STD-020A MSL 3, 220C & 235C NA NA Laser Marking NA Qualified by AMD 1 st tooled substrate inspection No.: RT CR02 No.: RT CR02 No.: RT CR02 No.: RT CR02 No.: A. Package Profile Package type: LFBGA 424L Epoxy: Ablestik/8355F Mold Compound: Shinetsu/KMC 211AA-2 Solder Ball: 63Sn/37Pb 6. Process Qualification A qualified process manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) is utilized in the Au1500 processor. The qualified silicon process in use is the Low Voltage version of the 0.18 µm Low Voltage logic 1.5V/3.3V 1P6M process and is documented in TSMC document number: T-018-LO-QR-002. The procedure utilized by TSMC for process qualification is outlined in the Generic Process Qualification Procedure as defined in TSMC document number: AG The results of the Generic Process Qualification of the 0.18µm 1.5V/3.3V 1P6M process is documented in TSMC document number: T-018-LO-QR-001. The qualification of TSMC 0.18µm logic Low Voltage logic 1.5V/3.3V 1P6M process was achieved on passing results from the following tests: 4

7 27364B March 2003 Qualification of the Alchemy Au1500 Processor from AMD 1. Gate Oxide Integrity 2. Hot Carrier 3. Vt Stability (Vt Fluence) 4. Metal Step Coverage 5. Metal Integrity (Stress Migration/Voiding) 6. Via and Metal Line Electromigration 6A. Device Level Process Qualification A 2M 6T SRAM test vehicle was utilized by TSMC to supplement the process qualification with a device High Temperature Operations Life test (HTOL) qualification. Passing results based on a sample size consisting of 100 units each from 3 production lots. 1. HTOL per MIL STD 883E, method Component Qualification Component qualification awarded per the completion of requirements outlined in Table 2 with sample sizes equally divided from three process lots. Test/Stress Sample Size/Lot Table 2. Product Qualification at Component Level Accept/ Reject Results Test Condition Qualification Point ESD Human Body Model 3/stress 0 Fails Pass MIL-STD-883, Method 3015 JEDEC JESD22-A114-A Human Model stress at 500V, 1000V and 2000V ESD Machine Model 3/stress 0 Fails Pass MIL-STD-883, Method 3015 JEDEC JESD22-A115-A Machine Model stress at 100V, 200V and 400V. Latch Up 3 0 Fails Accept a JESD78 I-Test, Over-V Test High Temperature Operational Life (HTOL) 240 Reject if >150 FIT Accept b MIL-STD-883E, Method 1015 Tj = 125ºC Field Effective Hours (FEH) Early Fail Study (EFS) System Soft Error c (SSER) 720 Reject if >350 FIT Pass MIL-STD-883E, Method 1015 Tj = 125ºC 4000 Field Effective Hours (EFS) NA NA NA MIL-STD Not Required 5

8 Qualification of the Alchemy Au1500 Processor from AMD 27364B March 2003 Test/Stress Accelerated Soft Error (ASER) Sample Size/Lot Table 2. Product Qualification at Component Level Accept/ Reject Results Test Condition Qualification Point NA NA NA MIL-STD Not Required Power NA 0 Fails Pass AMD Internal Repeated Power Up Cycling Cycling d a.latch up results are summarized in section 7B. b.htol results are summarized in section 7A. c.sser, ASER: These tests are not necessary for qualification (cache limited). d.power Cycling: This test is not necessary for qualification, but power cycling schemes will be performed to emulate specific customer applications as needed. 7A. FIT Calculations The failure rate (FIT) calculation for three qualification lots was 85 at the Chi Square 60% Confidence Level for EFS, which corresponds to Defects per Million (DPM) of 339. Failure rate calculations performed on the four lots for HTOL resulted in a FIT rate of 18.5 at the Chi Square of 60% Confidence level, which corresponds to Mean Time to Failure (MTTF) of 54 x B. Latch Up Stress Results Summary Results of latch up testing performed to JEDEC standard 78 as performed by a contracted external laboratory are presented in Table 3. Table 3. Latch Up Stress Testing Results Type of Test Stress Level Test Results Over Voltage Low 150% VDD Nominal Pass Over Voltage High 150% VDD Nominal Pass Negative Current -100mA Trigger Pass Positive Current 100mA Trigger Acceptable. Failures observed but not verified. Preliminary positive current testing, both input low and high, performed by the external laboratory resulted in increased currents above the acceptable level on eight input pins for all sample units tested. It should be noted that the equipment utilized by the external laboratory is unable to program the latch up test system power supplies to meet the Au1500 processor power-up timing requirements as specified in the data sheet. AMD laboratory latch up analysis resulted in passing current levels when the correct power up timing requirements are used. 6

9 27364B March 2003 Qualification of the Alchemy Au1500 Processor from AMD References AG , Taiwan Semiconductor Manufacturing Co., Generic Process Qualification Procedure JEDEC Standard 22-A102, Highly Accelerated Moisture Resistance, Unbiased Autoclave JEDEC Standard 22-A103, High Temperature Storage Life JEDEC Standard 22-A110, Highly Accelerated Temperature and Humidity Stress Test (HAST) Military Standard 883, Microcircuits DH , Advanced Semiconductor Engineering, Inc., Reliability Test Report, Package Qualification T-018-LO-QR-001, Taiwan Semiconductor Manufacturing Co., LTD 0.18µm Logic 1p6M 1.5V/3.3V Reliability Qualification Report T-018-LO-QR-002, Taiwan Semiconductor Manufacturing Co., LTD 0.18µm Logic 1p6M 1.5V/3.3V Reliability Qualification Report (Low Voltage) 7