6. Thermal Performance Information

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Allison Chase
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1 6. Thermal Performance Information Simplified thermal management is one of the benefits of using Vicor converters. High operating efficiency minimizes heat loss, and the low-profile package features an easily accessible, electrically isolated thermal interface surface. Proper thermal management pays dividends in terms of improved converter and system MTBFs, smaller size, and lower product lifecycle costs. The following pages provide guidelines for achieving effective thermal management of Vicor converters. Consideration should be given to the module baseplate temperature during operation. The maximum baseplate temperature specification for Maxi, Mini, and Micro is 1 C. Enhanced module cooling can be achieved with free or forced convection by using the appropriate heat sink. The available Vicor heat sinks and thermal interface options are available on the Vicor website. The relevant nomenclature for the tabulated thermal information supplied in this section for the Maxi, Mini and Micro modules is defined as follows: T B = baseplate temperature T A = ambient temperature P OUT = module output power P IN = module input power h = module efficiency = P OUT / P IN P DISS = module power dissipation = P IN P OUT = (1/η 1) P OUT Supplied thermal resistance values: θ BS = baseplate-to-heatsink thermal resistance θ BA = baseplate-to-ambient thermal resistance Basis of output power versus ambient temperature derating curves: T AMAX = T BMAX θ BA P DISS = T BMAX θ BA (1/η 1) P OUT Additional Thermal Data The following pages contain temperature derating curves. For additional thermal data, see the following link: Maxi, Mini, Micro Design Guide Rev. Page 26 of 87 3/218

2 6. Thermal Performance Information Thermal Performance Curves (Maxi) Table Usage: The forced convection thermal impedance data shown in the tables on pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Maxi data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Maxi θ BA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θ BS =.7 C/W Baseplate.9in Longitudinal Fins.9in Transverse Fins.4in Longitudinal Fins.4in Transverse Fins Free Air LFM LFM LFM LFM ,LFM ,2LFM V Maxi Thermal Performance.41Curves - 4" Heat Sink.61. Maxi Output Power vs. Ambient Temperature De-rating Curves 2V Maxi Thermal Performance Curves - 9" Heat Sink Baseplate (No Heat Sink).4in [1,1mm] Heat Sink.9in [22,8 mm] Heat Sink V V Maxi Thermal Performance Curves - No Heat Sink V Maxi Thermal Performance Curves -.4" Heat Sink V Maxi Thermal Performance Curves -.9" Heat Sink V V Maxi Thermal Performance Curves - No Heat Sink 2 1 V Maxi Thermal Performance Curves -.4" Heat Sink V Maxi Thermal Performance Curves -.9" Heat Sink V V Maxi Thermal Performance Curves - No Heat Sink V Maxi Thermal Performance Curves -.4" Heat Sink V Maxi Thermal Performance Curves -.9" Heat Sink V Power Output (Watts) Power Output (Watts) Free Air 2LFM 4LFM 6LFM 8LFM 1LFM 12LFM Maxi, Mini, Micro Design Guide Rev. Page 27 of 87 3/218

3 6. Thermal Performance Information 2V Mini Thermal Performance Curves -.4" Heat Sink 2V Mini Thermal Performance Curves -.9" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.4" Heat Sink V Mini Thermal Performance Curves -.9" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.4" Heat Sink V Mini Thermal Performance Curves - No Heat Sink V Mini Thermal Performance Curves -.9" Heat Sink Thermal Performance Curves (Mini) Table Usage: The forced convection thermal impedance data shown in the tables on pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Mini data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Mini θ BA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θ BS =.14 C/W Baseplate.9in Longitudinal Fins.9in Transverse Fins.4in Longitudinal Fins.4in Transverse Fins Free Air LFM LFM LFM LFM ,LFM ,2LFM Mini Output Power vs. Ambient Temperature De-rating Curves Baseplate (No Heat Sink).4in [1,1mm] Heat Sink.9in [22,8 mm] Heat Sink 2V 3.3V V 12-48V Mini Thermal Performance Curves -.4" Heat Sink 12-48V Mini Thermal Performance Curves -.9" Heat Sink V Free Air 2LFM 4LFM 6LFM 8LFM 1LFM 12LFM Maxi, Mini, Micro Design Guide Rev. Page 28 of 87 3/218

4 6. Thermal Performance Information V Micro Thermal Performance Curves -.9" Heat Sink Thermal Performance Curves (Micro) Table Usage: The forced convection thermal impedance data shown in the tables on pages assumes airflow through the heat sink fins. Actual airflow through the fins should be verified. For purposes of heat sink calculation, assume efficiencies listed on Micro data sheets. Use as a design guide only. Verify final design by actual temperature measurement. Micro θ BA (Baseplate-to-Ambient Thermal Resistance Values) vs. Airflow θ BS =.21 C/W Baseplate.9in Longitudinal Fins.9in Transverse Fins.4in Longitudinal Fins.4in Transverse Fins Free Air LFM LFM LFM LFM ,LFM ,2LFM Micro Output Power vs. Ambient Temperature De-rating Curves Baseplate (No Heat Sink).4in [1,1mm] Heat Sink.9in [22,8 mm] Heat Sink 2V 3.3V Micro Thermal Performance Curves -.4" Heat Sink 3.3V Micro Thermal Performance Curves -.9 Heat Sink 3.3V Micro Thermal Performance Curves - No Heat Sink V V Micro Thermal Performance Curves - No Heat Sink V Micro Thermal Performance Curves -.9" Heat Sink V Micro Thermal Performance Curves -.4" Heat Sink V V Micro Thermal Performance Curves - No Heat Sink V Micro Thermal Performance Curves -.4" Heat Sink V Micro Thermal Performance Curves -.9" Heat Sink V Free Air 2LFM 4LFM 6LFM 8LFM 1LFM 12LFM Maxi, Mini, Micro Design Guide Rev. Page 29 of 87 3/218

5 6. Thermal Performance Information Typical Examples Thermal Equations (Maxi, Mini, Micro) Example 1 Determine the maximum output power for a Maxi module without a heat sink delivering V in 4LFM airflow at a maximum ambient temperature of 4ºC. Maximum output power = ( T BMAX T AMAX ) / [θ BA (1/η 1)] T BMAX = 1ºC T AMAX = 4ºC For Maxi module without a heat 4LFM, θ BA = 2.17ºC/W For the V Maxi module the typical value for η =.83 Maximum output power = (1 4) / [2.17 (1/.83 1)] ~13W Or, the same answer could be obtained by using the output power versus ambient temperature de-rating curves for the Maxi modules. For the case with no heat sink the baseplate chart for the V module would be used. At a 4ºC ambient and 4LFM airflow this chart indicates a maximum output power of approximately 13W. For full output power of 4W the required thermal resistance is; θ BA = (1 4) / [4 (1/.83 1)] =.73ºC/W What size heat sink would be necessary to operate at full output power (4W) under the same conditions? From the θba versus airflow charts for the Maxi, the thermal resistance at 4LFM airflow requires the use of a.9in [22,8mm] transverse fin heat sink. Example 2 Determine the maximum ambient for a Mini module with a.9in [22,8mm] heat sink in 4LFM of airflow delivering 2W at V. From the output power versus ambient temperature chart for the V OUT Mini with a.9in [22,8mm] heat sink, the 2W at 4LFM data point results in a T AMAX of approximately 48ºC Figure 6.1 V Mini with.9in [22,8mm] heat sink Maxi, Mini, Micro Design Guide Rev. Page 3 of 87 3/218

6. Thermal Performance Information Thermal Management Accessories All parts are RoHS compliant unless otherwise noted.

4in [1,1mm] Fin P/N 32188.4in [1,1mm] Fin P/N 319.4in [1,1mm] Fin P/N 32174.4in [1,1mm] Fin P/N 3719.9in [22,8mm] Fin P/N 3188.9in [22,8mm] Fin P/N 3181.9in [22,8mm] Fin P/N 3189.

4in [1,1mm] Fin P/N 32173.4in [1,1mm] Fin P/N 3722.9in [22,8mm] Fin P/N 3196.9in [22,8mm] Fin P/N 3723.9in [22,8mm] Fin P/N 3269.9in [22,8mm] Fin P/N 3724.9in [22,8mm] Fin P/N 327.

1in [3,17mm] above module baseplate [a] Standoffs and Screws Bulk and single-module kits compatible with all standard mounting configurations..in [13,97mm].

6 6. Thermal Performance Information Thermal Management Accessories All parts are RoHS compliant unless otherwise noted. Maxi Heat Sinks Mini Heat Sinks Micro Heat Sinks Threaded Through Hole Threaded Through Hole Threaded Through Hole Longitudinal Fins.4in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [1,1mm] Fin P/N 319.4in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N 319.9in [22,8mm] Fin P/N 3183 Transverse Fins.4in [1,1mm] Fin P/N in [1,1mm] Fin P/N 372.4in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [1,1mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N in [22,8mm] Fin P/N 327.9in [22,8mm] Fin P/N 37 Low-profile Side-fin Heat Sinks Height only.1in [3,17mm] above module baseplate [a] Standoffs and Screws Bulk and single-module kits compatible with all standard mounting configurations..in [13,97mm].in [13,97mm].in [13,97mm] Side Fins Side Fins Side Fins P/N 396 P/N 3219 P/N 39 See the specific products on the Vicor website for more information. ThermMate Thermal Pads 2263 For use with Vicor modules, ThermMate thermal pads are a dry alternative to thermal compound and are pre-cut to the outline dimensions of the module Thermal pad Part Number Thickness Maxi (1pc. pkg.) [,177mm] Mini (1pc. pkg.) [,177mm] Micro (1pc. pkg.) [,177mm] [a] For thermal curves of low-profile side-fin heat sinks and on-line capability for thermal curve calculations, see the following link: Maxi, Mini, Micro Design Guide Rev. Page 31 of 87 3/218

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink TO-220 and TO-218 Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)