STAMPED. HEAT SINKS for Low Power Devices

Transcription

1 STAMPED HEAT SINKS for Low Power Devices

2 INTRODUCTION Wakefield Thermal Solutions, Inc. offers a wide range of board level power semiconductor heat sinks for surface mount and thru hole devices, including JEDEC/EIA registered outlines TO-3, TO-218, TO-247, and TO-263 (D2PAK). Also covered are MULTIWATT and axial lead devices. These products are available in stamped aluminum, and selected stampings are manufactured from copper. A Full line catalog is also available. To receive your copy, please contact your local sales representative, phone our corporate headquarters, us at info@wakefield.com, or visit us on the web at DON T FORGET THE ACCESSORIES! Many of the heat sinks in this catalog are designed to attach to the component using Wakefield's SpeedClips, clips integral to the heat sink, or threaded fasteners from other suppliers. Check the individual product descriptions for the appropriate mounting method. Wakefield Thermal Solutions, Inc. thermal interface materials such as DeltaBOND, DeltaPAD, and 12/126 Series thermal joint compounds are designed to facilitate installation and improve thermal performance. Check the full line catalog or web site for more information. ABOUT WAKEFIELD THERMAL SOLUTIONS, INC. Thermal Management Solutions for Electronics Leadership in design Applications Engineering and sales support worldwide Aggressive implementation of world-class manufacturing concepts Wakefield Thermal Solutions, Inc. is recognized as the worldwide leader in innovative thermal management solutions for a diverse range of commercial, industrial, and military markets. More than 4 years of heat transfer design, analysis, manufacture, and fabrication expertise of components, systems, and assemblies is now joined with an aggressive commitment to customer support, product designs, and engineering services. Wakefield Thermal Solutions, Inc. offers components and system level thermal management solutions for utilization in business equipment, computers, consumer electronics, automotive, industrial controls, instrumentation, integrated circuits, medical, laser, power conversion, telecommunications, transportation, and welding applications. Wakefield Thermal Solutions believes that information provided in this product catalog is accurate as of publication date. Product testing for proper performance in customer applications is recommended for all component designs and adhesives. Obtain mechanical samples of all assembly components and test to determine suitability. The physical properties reported herein are representative of performance values obtained by standard predictive and testing methods and typically exclude the interface resistance of any adhesive or other interface material in heat sink data. Wakefield Thermal Solutions is a manufacturer of heat dissipation products and reserves the right to make changes to its products without notice to improve the design or performance characteristics. All trademarks and tradenames used in this publication are for identification purposes only and may be trademarks of their respective companies. All specifications subject to change without notice. Normally stocked 1

3 217 SERIES Surface Mount D 2 PAK, TO-22, SOT-223, SOL-2 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with tin-lead plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) CT6.36 (9.1).6 (15.2) x.74 (18.8) Bulk W LFM CTT6.36 (9.1).6 (15.2) x.74 (18.8) Tube W LFM CTR6.36 (9.1).6 (15.2) x.74 (18.8) Tape & Reel W LFM Material: Copper, Tin, Lead Plated 217 HEAT SINK WITH DDPAK DEVICE THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125 C LEAD, 4 C AMBIENT Device Tab dt, C CT6 Device Power Dissipation. W KEY: Device only, NC Device + HS, NC Device + HS, 1 lfm Device + HS, 2 lfm Device + HS, 3 lfm SECTION A-A NOTES 1. Material to be ESD 2. Approximately 6 Meters per Reel Pieces per Reel. TAPE DETAILS CTR6 REEL DETAILS Dimensions: in. 2 Normally stocked

4 217 SERIES Surface Mount D 2 PAK, TO-22, SOL SERIES BOARD LAYOUT RECOMMENDATIONS TUBE DETAILS TUBE: Inches Long, Min. ESD Material with Nail Stops 2 Pieces per Tube CTT6 SOL 2 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) CT6 Dimensions: in. 218 SERIES Surface Mount Heat Sink SMT Devices HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 218-4CT CT5 Solid line = 218-4CT5 Dashed Line = 218-4CT3 Normally stocked 3

5 26 SERIES Vertical Mount Heat Sink TO-22 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 23 AND 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking TO-22 Height Above Footprint Solderable Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Tab Mounting Natural Forced P/N in. (mm) in. (mm) Configuation Option Style Convection Convection) PATENT PENDING 23-75AB.75 (19.1).57 (14.5) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57 2W LFM 23-75AB-1.75 (19.1).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM 23-75AB-5.5 (12.7).75 (19.1) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 57 2W LFM 23-75AB (22.2).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM AB.79 (2.).57 (14.5) x.5 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57 2W LFM AB-1.79 (2.).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 57 2W LFM AB-5.5 (12.7).79 (2.) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 57 2W LFM 23-75AB AB-1 23 AND 234 SERIES 23-75AB-5 23 SERIES 234 SERIES AB AB AB SERIES 4 Normally stocked

6 241 SERIES Horizontal Mount Heat Sink TO-22 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 262 SERIES Horizontal and Vertical Mount Heat Sink TO-22 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) Normally stocked 5

7 233 AND 236 SERIES Self-Locking Wavesolderable TO-22 PATENT PENDING 233-6AB.6 (15.2).57 (14.5) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58 2W LFM 233-6AB-1.6 (15.2).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 58 2W LFM 233-6AB-5.5 (12.7).6 (15.2) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 58 2W LFM 233-6AB (18.4).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 58 2W LFM AB 1.5 (38.1).57 (14.5) x.5 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 58 2W LFM AB (38.1).57 (14.5) x.5 (12.7) Vertical 1 Clip/Mtg Hole 58 2W LFM AB-5.5 (12.7) 1.5 (38.1) x.57 (14.5) Horizontal 5 Clip/Mtg Hole 58 2W LFM AB (41.3).57 (14.5) x.57 (12.7) Vetrical 1 Clip/Mtg Hole 58 2W LFM 233 AND 236 SERIES 233-6AB AB AB AB AB AB AB 233-6AB 275 AND 231 SERIES Compact, Stress-Free Labor-Saving Locking-Tab TO-22 PATENT AB.75 (19.1).835 (21.2) x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 44 2W LFM AB-1.75 (19.1).835 (21.2) x.4 (12.7) Vertical 1 Clip/Mtg Hole 44 2W LFM AB (12.7).835 (21.2) x.4 (14.5) Vertical 1 Clip/Mtg Hole 44 2W LFM PAB.69 (18.4).835 (21.2) x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 45 2W 8 4 LFM PAB-13H.4 (38.1).69 (17.5) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 45 2W 8 4 LFM PAB-XXX.69 (38.1).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 45 2W 8 4 LFM PAB.75 (12.7).835 (21.2) x.4 (14.5) Vert./Horiz. No Tab Clip/Mtg Hole 43 2W LFM PAB-13H.4 (41.3).75 (19.1) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 43 2W LFM (14V ) PAB-XXX.75 (34.9).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 43 2W LFM PAB (1.2).835 (21.2 x.4 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 32 2W LFM PAB-13H.4 (1.2) (34.9) x.835 (12.7) Horizontal 13H Clip/Mtg Hole 32 2W LFM (15V ) PAB-XXX (1.2).835 (21.2) x.4 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 32 2W LFM Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) MECHANICAL DIMENSIONS 275 AND 231 SERIES TAB 13H All versions No Tab TAB 14V TAB 13V TAB 1 TAB 1 TAB 15V TAB 13H 6 Normally stocked

8 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab TO-22 PATENT AB.85 (21.6) 1. (25.4) x.5 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 4 2W LFM AB-1.85 (21.6) 1. (25.4) x.5 (12.7) Vertical 1 Clip/Mtg Hole 4 2W LFM AB-5.5 (12.7).85 (21.6) x 1. (25.4) Horizontal 5 Clip/Mtg Hole 4 2W LFM AB (24.8) 1. (25.4) x.5 (12.7) Vertical 1 Clip/Mtg Hole 4 2W LFM AB 235 SERIES AB AB AB SERIES Labor-Saving Clip-On TO PAB 1. (25.4).8 (2.3) x.27 (6.9) Vert./Horiz. No Tab Clip 5 C@ 2W LFM 243-3PAB.8 (2.3).8 (2.3) x.27 (6.9) Verl./Horiz. No Tab Clip 78 C@ 2W LFM Material: Aluminum, Pre-anodized Black 243 SERIES SECTION A-A VIEW B-B 239 SERIES Snap-Down Self-Locking TO-22 PATENT PENDING AB.75 (19.1) 1.12 (28.4) x.435 (11.) Vert./Horiz No Tab Clip/Mtg Hole 38 2W 6 4 LFM AB-3.75 (19.1) 1.12 (28.4) x.435 (11.) Vertical 3 Clip/Mtg Hole 38 2W 6 4 LFM AB-4.75 (19.1) 1.12 (28.4) x.435 (11.) Vertical 4 Clip/Mtg Hole 38 2W 6 4 LFM AB SECTION A-A 239 SERIES AB AB-4 Normally stocked 7

9 265 SERIES Vertical Mount Heat Sink TO-22 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 286DB SERIES Vertical Mount Heat Sink TO-22 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 8 Normally stocked

10 273 SERIES Low-Cost, Low-Height Wavesolderable TO-218, TO AB.375 (9.5).75 (19.1) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 49 2W LFM 273-AB (9.5).75 (19.1) x.75 (19.1) Vertical 1 Mtg Hole 49 2W LFM 273-AB (9.5).75 (19.1) x.75 (19.1) Vertical 2 Mtg Hole 49 2W LFM 273 SERIES 273-AB 273-AB AB-2 Material: Aluminum, Black Anodized 274 SERIES Low-Cost, Low-Height Wavesolderable TO AB.375 (9.5).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 56 2W 8. 4 LFM 274-1AB (9.5).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 56 2W 8. 4 LFM 274-1AB (9.5).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 56 2W 8. 4 LFM 274-2AB.5 (12.7).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 5 2W 7. 4 LFM 274-2AB-1.5 (12.7).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 5 2W 7. 4 LFM 274-2AB-2.5 (12.7).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 5 2W 7. 4 LFM 274-3AB.25 (6.4).52 (13.2) x.75 (19.1) Vert./Horiz. No Tab Mtg Hole 62 2W 9. 4 LFM 274-3AB-1.25 (6.4).52 (13.2) x.75 (19.1) Vertical 1 Mtg Hole 62 2W 9. 4 LFM 274-3AB-2.25 (6.4).52 (13.2) x.75 (19.1) Vertical 2 Mtg Hole 62 2W 9. 4 LFM 281-1AB.375 (9.5).52 (13.2) x.75 (19.1) Vertical No Tab Mtg Hole 56 2W 8. 4 LFM 281-2AB.5 (12.7).52 (13.2) x.75 (19.1) Vertical No Tab Mtg Hole 5 2W 7. 4 LFM 274 SERIES 274 SERIES 274-XAB XAB SERIES 24 SERIES Labor-Saving Twisted Fin TO ABH (3.) 1. (25.4) x.5 (12.7) Vertical 22 Clip/Mtg Hole 55 4W LFM ABS (3.) 1. (25.4) x.5 (12.7) Vertical 22 Clip/Mtg Slot 55 4W LFM 24 SERIES ABS ABH-22 Normally stocked 9

11 242 SERIES Low-Height, Low-Profile Twisted Fin TO AB (32.6).875 (22.2) x.25 (6.4) Vertical 22 Mtg Hole 48 2W LFM AB SERIES 232 AND 238 SERIES Staggered Fin for Vertical Mounting TO-22, TO-22 Material: Aluminum, Black Anodized 232-2AB 2. (5.8) 1.38 (35.1) x.5 (12.7) Vertical 2, Twisted Clip/Mtg Hole 48 4W LFM 232-2AB (5.8) 1.38 (35.1) x.5 (12.7) Vertical 2, Solderable Clip/Mtg Hole 48 4W LFM 238-2AB 2. (5.8) 1.38 (35.1) x.5 (12.7) Verlical 2, Twisted Mtg Slot 48 4W LFM 238-2AB (5.8) 1.38 (35.1) x.5 (12.7) Verlical 2, Solderable Mtg Slot 48 4W LFM 238-2AB 238-2AB AB 232-2AB SERIES 232 AND 238 SERIES 251 SERIES Slim-Profile With Integral Clips 15 Lead Multiwatt AB.62 (15.7).91 (23.1) x.38 (9.7) Vert./Horiz. No Tab Clip 66 3W 66 4 LFM 251-8AB.845 (21.5).91 (23.1) x.38 (9.7) Vert./Horiz. No Tab Clip 64 3W 66 4 LFM 251-8AB (22.2).91 (23.1) x.38 (9.7) Vertical 19 Clip 64 3W 66 4 LFM 251 SERIES AB 251-8AB 251-8AB-19 1 Normally stocked

12 BOARD LEVEL HEAT SINKS FOR TO-22, TO-218 AND MULTIWATT COMPONENTS 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.45 (36.8) 1.3 (33.) x 48 (12.1) Vert/Horiz, No Tab 44 4W LFM.16 (7.25) AB (41.9) 1.3 (33.) x 48 (12.1) Vertical W LFM.17 (7.2) 245 SERIES Low Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.45 (36.8) 1.75 (44.5) x.38 (9.7) Ver.t/Horiz. No Tab 38 4W LFM.16 (7.25) AB (41.9) 1.75 (44.5) x.38 (9.7) Vertical W LFM.17 (7.2) 246 SERIES Medium Height, Slim Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB (5.) (5.4) x 3.75 (9.5) Vert./Horiz. No Tab 35 4W LFM.24 (1.9) AB (55.1) (5.4) x 3.75 (9.5) Vertical W LFM.25 (11.4) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). Normally stocked 11

13 BOARD LEVEL HEAT SINKS FOR TO-22, TO-218 AND MULTIWATT COMPONENTS 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.95 (49.5) 1.9 (48.3) x.95 (24.1) Vert./Horiz. No Tab 25 4W LFM.33 (15.1) AB (49.5) 1.9 (48.3) x.95 (24.1) Vertical 5 25 C@ 4W LFM.34 (15.6) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). 248 SERIES Low Height, Medium Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.62 (41.1) 2. (5.8) x.75 (19.1) Vert/Horiz. No Tab 35 4w LFM.26 (11.6) AB (41.1) 2. (5.8) x.75 (19.1) Vertical w LFM.27 (12.2) Order SpeedClip 285SC or 33SC separately. Order SpeedClips separately for use with Series 246, 247, 248 or SERIES Medium Height, Deep Profile Wavesolderable Folded Fin MULTIWATT Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams) AB 1.13 (28.7) 1.9 (48.3) x.95 (24.1) Vert./Horiz, No Tab 35 C@ 4W LFM.2 (8.9) AB (28.7) 1.9 (48.3) x.95 (24.1) Vertical 5 35 C@ 4W LFM.21 (9.4) Order SpeedClip 285SC or 33SC separately. (See 248 Series section). 12 Normally stocked

14 288 SERIES Compact Wave-Solderable Low-Cost TO-22, TO-22 Height Above Maximum Thermal Performance at Typical Load Standard PC Board Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 288-1AB 1.25 (31.8).875 (22.2) x.215 (5.5) 85 4W 12 2 LFM.57 (2.59) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-22 and TO-22 semiconductor packages. These heat sinks are designed for use where minimum PC 288 SERIES board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. 271 SERIES Top-Mount Booster for Use with 27/272/28 Series TO-22 Horizontal Height Above Mounting Footprint Thermal Performance at Typical Load Standard Semiconductor Case Dimensions Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 271-AB.5 (12.7) 1.75 (44.5) x.7 (17.8) 62 4W (NOTE A) LFM.52 (2.36) 31 4W (NOTE B) 1.8 C/W 4 LFM (NOTE B) This top-hat style booster heat sink can be added to any of the 27, 272, or 28 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. 271 SERIES Normally stocked 13

15 27/272/28 SERIES Small Footprint Low-Cost TO-22, TO-22 Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Solderable Natural Forced Weight P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams) 27-AB.375 (9.4) 1.75 (44.5) x.7 (17.8) 7 4W 6. 4 LFM.52 (2.36) 272-AB.375 (9.4) 1.75 (44.5) x 1.45 (36.8) 1,2 42 4W LFM.15 (5.72) 28-AB.375 (9.4) 1.75 (44.5) x.7 (17.8) 7 4W 6. 4 LFM.48 (2.18) These exceptionally low-cost heat sinks can be mounted horizontally under a TO-22 or TO-22 case style with a maximum height of only.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. The 27-AB and 28-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix O1 or 2 to the standard part number (i.e. 272-AB1 or 272-AB2). 27 SERIES 28 SERIES 272 SERIES 272AB1 272AB2 289 AND 29 SERIES Low-Cost Single or Dual Package TO-218, TO-22, TO-22 Height Above Horizontal Mounting Thermal Performance at Typical Load Standard PC Board Maximum Footing Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 289-AB.5 (12.7) 1. (25.4) x.71 (18.1) 5 2W 9. 4 LFM.55 (2.49) 289-AP.5 (12.7) 1. (25.4) x.71 (18.1) 5 2W 9. 4 LFM.55 (2.49) 29-1AB.5 (12.7) 1. (25.4) x 1.18 (3.) 44 2W 7. 4 LFM.82 (3.72) 29-2AB.5 (12.7) 1. (25.4) x 1.18 (3.) 44 2W 7. 4 LFM.81 (3.67) Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate no finish (289-AP). Two semiconductors can be mounted to the 29-2AB style. one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with 289 SERIES 29 SERIES 14 Normally stocked

16 25 SERIES High-Performance Slim Profile With Integral Clips Multiwatt AB 1.22 (31.) 1. (25.4) x.5 (12.7) Vert./Horiz. No Tab Clip 5 4W LFM AB (31.) 1. (25.4) x.5 (12.7) Vertical 9 Clip 5 4W LFM AB (35.1) 1. (25.4) x.5 (12.7) Vertical 25 Clip 5 4W LFM 25 SERIES AB AB AB 237 AND 252 SERIES 237 AND 252 SERIES High-Performance, High-Power Vertical Mount TO AB (42.5) 1. (25-4) x 1. (25.4) Vertical 2, Twisted Clip/Mtg Slot 46 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 3, Twisted Clip/Mtg Slot 46 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Solderable Clip/Mtg Slot 46 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Twisted Clip/Mtg Slot 4 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 3, Twisted Clip/Mtg Slot 4 4W LFM AB (42.5) 1. (25.4) x 1. (25.4) Vertical 2, Solderable Clip/Mtg Slot 4 4W LFM Order SpeedClips 285SC or 33SC separately for rapid component installation, lowering manufacturing costs AB AB AB AB AB AB AB AB3 237 AND 252 SERIES 291 SERIES Labor-Saving Clip-on TO-22 Vertical Height Above Mounting Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Natural Forced Weight P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams) 291-C236AB.86 (21.)9 1.1 (27.) x.36 (9.1) TO-22 (Clip) 8 2W 24 6 LFM.26 (1.18) 291-H36AB.86 (21.9) 1.1 (27.) x.36 (9.1) TO-22 (Mtg. Hole) 68 2W 16 6 LFM.26 (1.18)) Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-22 case styles. One type is available with a locking clip and one with a.14 in. (3.6) diameter mounting hole only. 291 SERIES 291-C2 291-H Normally stocked 15

17 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable See also 286DB Series on Page 7. Height Above Thermal Performance at Typical Load Standard PC Board Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams) 286-AB 1.19 (3.2) 1. (25.4) x.5 (12.7) Aluminum, Anodized 58 4W LFM.85 (3.86) 286-CBT 1.19 (3.2) 1. (25.4) x.5 (12.7) Copper, Black 58 4W LFM.25 (11.34) 286-CT 1.19 (3.2) 1. (25.4) x.5 (12.7) Copper, Tinned 58 4W LFM.25 (11.34) TO-22 Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). 286 SERIES 287 SERIES Wave-Solderable Low-Cost TO-22 Height Above Maximum Thermal Performance at Typical Load Standard P/N PC Board Footprint A Natural Forced Weight Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams) 287-1AB 287-1ABH 1.18 (3.) 1. (25.4) x.5 (12.7) 65 4W LFM.9 (4.8) 287-2AB 287-2ABH 1.18 (3.) 1. (25.4) x 1. (25.4) 55 4W LFM.14 (6.35) Mount these cost-effective TO-22 heat sinks vertically into pre-drilled printed circuit boards. mounting slot allows for correct positioning of TO-22 and similar semiconductor packages. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A.375 in. (9.5 mm) 287 SERIES Standard P/N Dim. A 287-1AB.5 (12.7) 287-2AB 1. (25.4) 287-1ABH.5 (12.7) 287-2ABH 1. (25.4) 285 AND 33 SERIES 285 SC and 33 SC SpeedClips Zif Socket 8 And 387 SPGA LIF Standard Nominal Installed For Use Weight P/N Loading Force With Series Material lbs. (grams) 285 SC 1 lbs 232, 237, 24, 252, 667 Carbon Steel.53 (.24) 33 SC 4 lbs 232, 237, 24, 252, 667 Stainless Steel.74 (.34) SpeedClips employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClips with our 237, 24, and 252 Series heat sinks for the lowest production assembly time and cost. Order one SpeedClip for each heat sink purchased. Must be purchased with heat sinks. Speed Clip 33 SC 4 lb Nominal Force Installed Speed Clip 285 SC 1 lb Nominal Force Installed 16 Normally stocked

18 26 SERIES Cup Clips for TO-5 Case Style Semiconductors TO-5 Characteristics TO-5 Thermal Resistance Epoxy Insulated 14 C/W Breakdown Voltage Epoxy Type (VAC), 6 Hz 5 Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating 5 Dusty Conditions: % Hipot Rating 3 Dirty Conditions: % Hipot Rating 1 to 2 Temperature Range Continuous (C ) -73/+149 Depth of Model Tapped Base 26-4T5E.93 (2.36) 26-4TH5E.125 (3.18) Thread Size: 4 = #4-4 UNC Base Style: H = hex 6 = #6-32 UNC Semiconductor Mounting T = tapped Case Style: 5 = TO-5 Style: S = stud Insulation E = epoxy P = plain TO-5 CASE STYLE CUP CLIPS ORDERING GUIDE Outline Dimension Standard Insulation L x W x I.D. Weight Case P/N Type in. (mm) lbs. (grams) Style 26-4T5E Epoxy Insulated.37 (9.4) x.38 (9.7) dia. x.29 (7.4).24 (1.9) TO TH5E Epoxy Insulated.4 (1.2) x.37 (9.4) hex. x.29 (7.4).31 (1.41) TO SH5E Epoxy Insulated.557 (14.1) x.37 (9.4) hex. x.29 (7.4).37 (1.68) TO-5 Materials and Finish: Cups beryllium copper, black ebonol C ; Bases brass, black ebonol C Base Mounting Configurations TO-5 Plain Type Epoxy bonded, or used with #4 pan head screws. Tapped Base #4-4 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Epoxy Insulated For TO T5E 26-6SH5E Normally stocked 17

19 2 SERIES High-Efficiency for Small Metal Can Power Semiconductors Single-Level Star 21,22,24,25,211 Series Dual-Level Star 23,27,213 Series Dual-Level Sunburst 29, 215 Series Available Semiconductor Heat Sink Heat Sink Heat Sink Natural Applicable Standard P/N Case Diameter Inside Dia. Outside Dia. Height Convection Forced Power & Finish Min/Max A B C Case Rise Convection Semiconductor Types in. (mm) in. (mm) in. (mm) in. (mm) Above Ambient (ΘCA@2 LFM) Case Types 21AB.161 (4.1)/.24 (6.1).15 (3.8).64 (16.2).187 (4.8) 65 1W 31 C/W TO-18, TO-24, TO-28, TO-4, TO-44 24SB.275 (7.)/.37 (9.4).255 (6.5).55 (4.8).187 (4.8) 68 1W 35 C/W TO-5, TO-9, TO-11, 25SB.275 (7.)/.37 (9.4).255 (6.5).72 (18.3).187 (4.8) 59 1W 28 C/W TO-12, TO-26, TO-29, 25AB, 25AP,275 (7.)/.37 (9.4).255 (6.5).72 (18.3).187 (4.8) 68 1W 28 C/W TO-33, TO-43, TO-45 27SB.275 (7.)/.37 (9.4).255 (6,5).72 (18.3).375 (9.5) 46 1W 2 C/W 27AB, 27AP.275 (7.)/.37 (9.4).255 (6.5).72 (18.3).375 (9.5) 53 1W 2 C/W 29SB.275 (7.)/.37 (9.4).255 (6.5) 1.28 (32.5).437 (11.1) 3 1W 13 C/W 213SB.44 (11.2)/.544 (13.8).42 (1.7).83 (21.1).375 (9.5) 44 1W 19 C/W TO-8, TO AB, 213AP.44 (11.2)/.544 (13.8).42 (1.7).83 (21.1).375 (9.5) 51 1W 19 C/W 215AB.44 (11.2)/.544 (13.8).42 (1.7) 1.4 (35.6).437 (11.1) 28 1W 15 C/W 215AP.44 (11.2)/.544 (13.8).42 (1.7) 1.4 (35.6).437 (11.1) 32 1W 15 C/W Materials and Finishes Available for 2 Series: SB Silver-bearing copper; black ebonol "C" AB Aluminum, black anodized AP Aluminum, no finish applied 258 SERIES Thermal Links for Fused Glass Diodes DIODES Standard Dimensions Weight P/N in. (mm) Material Finish lbs. (grams) (12.7) x.25 (6.4) x.34 (8.6) Aluminum DeltaCoate 151 on all surfaces.18 (.82) except solder pads and base The thermal resistance from diode leads to chassis or heat sink is 12 C/watt, when unit is mounted with TYPE 12 Joint Compound. If a 1 C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 15 C/watt to 22 C/watt. 258 SERIES 292 SERIES Heat Sink for Single TO-92 TO-92 Height Above Overall Standard PC Board Fin Width Thermal Performance Weight P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams) 292-AB.75 (19.1). 6 (15.3).225 W Black Anodized.49 (.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized. MECHANICAL DIMENSIONS 292 SERIES 18 Normally stocked

20 69 SERIES HIghest Efficiency/Lowest Unit Cost TO-3, TO-66, TO-22 Height Above Thermal Performance at Typical Load Semiconductor Standard PC Board Outline Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) 69-3B 1.31 (33.3) 1.86 (47.2)-sq W 2. 4 LFM (1) TO-3.7 (31.75) 69-66B 1.31 (33.3) 1.86 (47.2)-sq W 2. 4 LFM (1) TO-66.7 (31.75) 69-22B 1.31 (33.3) 1.86 (47.2)-sq W 2. 4 LFM (2) TO-22.7 (31.75) These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-22 power semiconductor types. For higher power semiconductors, the 69 Series can dissipate up to 2 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91 C. SEMICONDUCTOR MOUNTING HOLES 69 SERIES TO-3 TO-66 *TWO TO-22 S 635 SERIES Space-Saving Low-Cost TO-3 Height Above Outline Thermal Performance at Typical Load Semiconductor Standard PC Board A Dimensions Natural Forced Mounting Weight P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams) 635-5B2.5 (12.7) 1.9 (48.3) x 1.42 (36.) 9 8.W 6. 3 LFM TO-3.2 (9.7) B2.75 (19.1) 1.9 (48.3) x 1.42 (36.) 77 8.W LFM TO-3.22 (9.98) 635-1B2 1. (25.4) 1.9 (48.3) x 1.42 (36.) 61 8.W LFM TO-3.24 (1.89) B (31.8) 1.9 (48.3) x 1.42 (36.) 53 8.W LFM T-3.28 (12.7) Material: Aluminum Alloy, Black Anodized Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is available for heat sinking. Four different heights are available, all with TO-3 mounting hole pattern in the base. Consult factory for TO-66, TO-22, and multilead IC hole patterns. 635 SERIES Normally stocked 19

21 NOTES: 2 Normally stocked

22 FAX: TRANSMITTAL Please copy and complete this form, then fax or mail to: 33 Bridge Street Pelham, NH 376 Phone: (63) Fax: (63) FROM: Total # pgs. being faxed Name Title Company Division/Department Mail Stop Address City State Zip Country Telephone ( ) Fax ( ) Product or project APPLICATION INFORMATION REQUIRED: 1. What type of electronic device will be cooled? 2. How many of these devices will be cooled? 3. How many watts of power must be dissipated from each device and in aggregate? Please specify: Each device Total Power A sketch of the heat distribution on the base is attached. Yes No A sketch of the component is also being faxed. Yes No 4. What is the maximum allowable junction temperature of the device? C (See the manufacturer's data sheet). If no junction temperature has been specified, what is the maximum case temperature? C 5. What is the thermal resistance of the semiconductor from junction to case - Θj - c? (See the manufacturer's data sheet). Θ j - c 6. Is electrical isolation required between the device case and the heat sink? At what voltage level? 7. What finish is required on the heat sink? Anodize Paint Chromate Special None What color? 8. What is the maximum ambient air temperature? C 9. What type of convection is required? Forced Natural 1. If forced convection have you chosen a fan? Yes No Fan Manufacturer/Part Number Fan Size Free Flow (CFM) Static Pressure (Inches H 2 ) 11. Will you shroud the air flow (i.e., direct the air through the heat sink)? Yes No If no, what is the cross-sectional size of the air space where the heat sink will be located? Width X Height 12. How much space is available for this heat sink? Length Width Height in. or cm Samples needed by: Prototype completion date: Pre-production target date: Production target date: Rate of usage: Estimated Annual Usage (EAU): Estimated program life expectancy: