BGA THERMAL SOLUTIONS MATRIX
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1 WTS_p- // : AM Page Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink evaluation kit. BGA Heat Sink Heat Sink Height Recommended Attachment Sizes (mm) Footprint (mm) (inches) Series # Method x. D Adhesive 9 9 x 9. Adhesive x. D8 Adhesive x.... Adhesive x.. Adhesive x. Adhesive x.... Adhesive 8 x Adhesive 9 x. Adhesive x 8. Adhesive x.8 Adhesive x.. Adhesive x. Adhesive x.... Adhesive x.... Adhesive. x. Adhesive. x. 9 Adhesive. x. x.8 Adhesive 8 x 8... Adhesive. 8 x 8.9 Adhesive x 8. Clip x.. Adhesive. x. Adhesive x Adhesive x. Adhesive. x.8 Adhesive x Adhesive x.. 8 Adhesive x.8 Adhesive x Adhesive x. Adhesive up to x.. 9 Clip up to x.9 9 Clip RoHS COMPLIANCE Please note that Wakefield part numbers designated with an E in this catalog denote new parts in compliance with the RoHS initiative, with the exception of our Precision Clamps. Wakefield will still continue to offer non-rohs compliant versions of these parts. Please be aware that many Wakefield Standard parts have always been compliant since their design inception and therefore will not carry the E designation. Wakefield requests that you refer to the RoHS compliance tool on our website at to verify RoHS compliance. If you require further clarification or information regarding RoHS, please contact the factory.
2 WTS_p- // : AM Page Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the T series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The S series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring electrical isolation from the electronic device. All options other than -T and -T are RoHS compliant. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a x piece of T has a resistance of. C-in^/W in^=. C/W T SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Manufacturer Thermal Impedance Thickness, Suffix Product C-in^/W Inches Package Surface, Comments -T Chomerics, T.. Metal/ceramic; aluminum carrier -TE Chomerics, TR.. RoHS-compliant version of -T -T Chomerics, T..9 Metal/ceramic; very good performance and conformity -T Chomerics, T.. Plastic -TE Chomerics, TR.. RoHS-compliant version of -T -T Chomerics, T.. Plastic; conforms to out-of-flat packages -T M, Metal/ceramic; very good adhesion and conformity -T Bergquist, BP Metal/ceramic; electrically insulating S SERIES THERMAL INTERFACE PADS Manufacturer Thermal Impedance Thickness, Suffix Product C-in^/W Inches Package Surface, Comments -S Berquist Softface.. All surfaces; requires mechanical fasteners ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To order the 8 Series heat sink at. tall with the T thermal interface material, specify part number: 8-AB - T From Catalog Page?? From Table on Page??
3 WTS_p- // : AM Page SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.8 (). (.) mm BGA.9 (.9) -AB.8 (). (8.9) mm BGA. (.99) -AB.8 (). (.) mm BGA. (.8) -AB.8 (). (.) mm BGA. (.8) The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W --T --T --T --T Approach Velocity, LFM Dimensions: in. SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.98 (). (.) mm BGA. (.) -AB.98 (). (8.9) mm BGA. (.) -AB.98 (). (.) mm BGA.8 (8.) -AB.98 (). (.) mm BGA. (.) The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W T --T --T --T Approach Velocity, LFM Dimensions: in.
4 WTS_p- // : AM Page 9 SERIES Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) 9-AB. (.8) sq. (.) mm BGA Black Anodized. (.8) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS SERIES Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Standard Base Dimensions Dimension A Dimension B Typical Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Applications Finish lbs. (grams) -AB. (.) sq. (.). (.) mm BGA Black Anodized.8 (.) -AB. (.) sq. (.). (.) mm BGA Black Anodized. (.8) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS 8 SERIES Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC Standard Base Dimensions Dimension A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 8-AB. (.9) sq. (.) mm BGA Black Anodized. (.) 8-AB. (.9) sq. (8.9) mm BGA Black Anodized. (.) 8-AB. (.9) sq. (.) mm BGA Black Anodized.9 (8.) 8-AB. (.9) sq. (.) mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS KEY: 8-AB +8-AB 8-AB 8-AB
5 WTS_p- // : AM Page SERIES Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Application Finish lbs. (grams) -9AB.SQ. (8.9)SQ..8 (.) mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SERIES Standard Base Dimensions Fin Height "A" Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.8 (). (.) mm BGA. (9.99) -AB.8 (). (8.9) mm BGA. (.) -AB.8 (). (.) mm BGA. (.) -AB.8 (). (.) mm BGA.9 (.) The Series is an unidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W 8 --T --T --T --T Approach Velocity, LFM Performance shown is with T thermal adhesive applied.
6 WTS_p- // : AM Page SERIES Omnidirectional Pin Fin Heat Sink for Limited Height BGAs Standard Base Dimensions Height Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) -AG. (.) sq. (.8) mm BGA Gold Iridite.9 (8.) -AB. (.) sq. (.8) mm BGA Black Anodized.9 (8.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL AND FORCED CONVECTION CHARACTERISTICS 8 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 8-AB. (.) x. (.). (.) mm BGA Black Anodized. (.) 8-AB. (.) x. (.). (.) mm BGA Black Anodized.8 (.) 8-AB. (.) x. (.). (8.9) mm BGA Black Anodized. (9.8) 8-AB. (.) x. (.). (.) mm BGA Black Anodized. (.8) 8-AB. (.) x. (.). (.) mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page NATURAL CONVECTION CHARACTERISTICS FORCED CONVECTION CHARACTERISTICS KEY: 8-AB 8-AB 8-AB 8-AB 8-AB
7 WTS_p- // : AM Page 8 SERIES Omnidirectional Pin Fin Heat Sink for BGAs Fin Height Standard Base Dimensions A Typical Weight P/N in. Sq. in. (mm) Applications lbs. (grams) -AB.8 (). (.) mm BGA.9 (.9) -AB.8 (). (8.9) mm BGA. (.99) -AB.8 (). (.) mm BGA. (.8) -AB.8 (). (.) mm BGA. (.8) The Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,. inch,. inch,. inch, and. inch. Available with pressure sensitive adhesives for quick and easy mounting. See Page SERIES THERMAL PERFORMANCE Dimensions: in. 98 SERIES Omnidirectional Pin Fin Heat Sink For BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized. (.) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized.9 (.8) 98-8AB. (.) sq..8 (.) sq. mm BGA Black Anodized. (.) 98-AB. (.) sq.. (.) sq. mm BGA Black Anodized. (.) Notes:. Optional factory preapplied pressure-sensitive adhesive. See Page FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) KEY: 98-AB 98-AB 98-8AB 98-AB 8
8 WTS_p- // : AM Page 9 98 SERIES Pin Fin Heat Sink for BGAs Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 98-AB. (.) x.8 (.). (.) mm BGA Black Anodized. (8.) 98-AB. (.) x.8 (.). (.) mm BGA Black Anodized. (8.9) 98-8AB. (.) x.8 (.).8 (.) mm BGA Black Anodized. (.) 98-AB. (.) x.8 (.). (.) mm BGA Black Anodized. (9.) FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) KEY: 98-AB 98-AB 98-8AB 98-AB Notes:. Heat sink mounting surface flatness:." TIR. Optional factory preapplied pressure-sensitive adhesive. See Page SERIES Omnidirectional Pin Fin Heat Sink for BGAs Standard Base Dimensions Fin Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) -AP. (.) x. (.9). (8.89) mm BGA. (.8) Material: Aluminum, Plain Finish The Series -AP is an omnidirectional pin fin heat sink for both natural and forced-convection applications designed to fit a mm BGA. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available with pressure sensitive adhesives to ensure good thermal performance. See page Can be ordered with the 89SC clip. Order clip separately. (Clip cannot be purchased without heat sink) -AP SERIES THERMAL PERFORMANCE Case-to-Ambient Thermal Resistance, C/W 9 8 Approach Air Velocity, LFM Performance shown is with S interface material applied. Dimensions: in. 9
9 WTS_p- // : AM Page DELTEM COMPOSITE HEAT SINKS FOR BGAs Deltem D- Pin Fin Heat Sink Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D-. (.) sq. (.). (.9) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page Deltem D8- Pin Fin Heat Sink Standard Base Dimensions Height Typical Weight P/N in. (mm) in. (mm) Applications lbs. (grams) D8-.8 (.) sq. (.) mm BGA. (.9) Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page DELTEM D- PIN FIN HEAT SINK DELTEM D8- PIN FIN HEAT SINK NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS 8 8 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS)
10 WTS_p- // : AM Page 9 SERIES Pin Fin Heat Sink/Clip Assembly for BGAs and PowerPC Packages Standard Base Dimensions Dimensions A Typical Heat Sink Weight P/N in. (mm) in. (mm) Applications Finish lbs. (grams) 9-AB.89 (.) x. (.8). (.) &mm BGA Black Anodized.9 (.) 9-AB.88 (.) x. (.). (.) &mm BGA Black Anodized. (9.) Note: Optional factory preapplied thermal interface material. S (Bergquist Q-Pad,. C in /w) S (Bergquist Softface,. C in /w).88 THERMAL RESISTANCE SINK TO AMBIENT ( C/WATT) FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) * 9-AB 9-AB (9-AB) A DIM. (9-AB) *Performance is for shrouded conditions. 9- will perform better than 9- in cases with bypass. 9-AB HEAT SINK AND CLIP ASSEMBLY Designed to fit a. thick PCB electronic package thickness of. 9 SERIES Fan Heat Sink for BGA and PowerPC Packages Standard Base Dimensions Height Typical Heat Sink Thermal Weight P/N in. (mm) in. (mm) Applications Finish Performance lbs. (grams) 99ABD.8 (.9) x.98 (.9).9 (.) &mm BGA Black Anodized. C/W. (8.) 99ABD.8 (.9) x.98 (.9).9 (.) &mm BGA Black Anodized. C/W. (8.) Note: Optional factory preapplied thermal interface material. See 9 series. FEATURES AND BENEFITS: Captivated clips for ease of assembly Low acoustic noise Impingement air flow Accommodates BGA packages up to mm in size Dimensions: in. See 9 Series for PCB hole layout for clip attachment
11 WTS_p- // : AM Page SERIES -AP. (9.) sq. (.) Plain. (9.9) Material: Aluminum, Plain Finish THERMAL PERFORMANCE SERIES Omnidirectional Pin Fin Heat Sink for BGAs -AB.8 (.) sq. (.) Black Anodized. (.) -AB.8 (.) sq. (.) Black Anodized. (.) THERMAL PERFORMANCE 8 -AB -AB
12 WTS_p- // : AM Page SERIES -AB.88 (.) sq. (9.) Black Anodized. (.) THERMAL PERFORMANCE 8 SERIES -AB.8 (.) sq. (9.) Black Anodized. (8.) THERMAL PERFORMANCE
13 WTS_p- // : AM Page SERIES -AB. (.) x. (8.). (.) Black Anodized. (8.) THERMAL PERFORMANCE SERIES Omnidirectional Pin Fin Heat Sink for BGAs -AB. (.) sq. (8.9) Black Anodized. (.) -AB. (.) sq. (.) Black Anodized. (.8) THERMAL PERFORMANCE 9 8 -AB -AB
14 WTS_p- // : AM Page SERIES -8AB. (.) sq.8 (.) Black Anodized. (.) THERMAL PERFORMANCE SERIES -AB.9 (.) sq. (.) Black Anodized. (.) THERMAL PERFORMANCE
15 WTS_p- // : AM Page SERIES -AB. (.8) sq. (.) Black Anodized. (.8) THERMAL PERFORMANCE SERIES -AB. (8.) sq. (.) Black Anodized. (.8) -AB. (8.) sq. (.) Black Anodized.8 (.8) -AP. (8.) sq. (.) Plain. (.9) or Plain THERMAL PERFORMANCE 8 -AB -AP (dashed) -AB
16 WTS_p- // : AM Page SERIES -AB. (.) sq. (.) Black Anodized. (.) THERMAL PERFORMANCE 8 SERIES -8AB.8 (.) sq.8 (.) Black Anodized. (.) THERMAL PERFORMANCE
17 WTS_p- // : AM Page 8 SERIES -8AB. (.8) x.8 (.).8 (.) Black Anodized.8 (.) THERMAL PERFORMANCE 8 SERIES 8-AB. (.8) sq. (.) Black Anodized. (.) 8-AP. (8.8) sq. (.) Plain. (.) or Plain 8 THERMAL PERFORMANCE 8-AB 8-AB 8
18 WTS_p- // : AM Page 9 SERIES -AB. (.) x. (.8). (.) Black Anodized. (8.) THERMAL PERFORMANCE SERIES -8AB. (.) x. (.8).8 (.) Black Anodized. (.) THERMAL PERFORMANCE 9
19 WTS_p- // : AM Page HEAT SINKS FOR MICROPROCESSORS AND ASICs 9, 9, 89, 99 SERIES & Clip for Intel s Pentium, Pentium MMX, AMD s K & K, CYRIX s x8 & Media GX, Centaur/IDT s WinChip C Fin Thermal Resistance Interface Standard Base Dimensions Height at LFM Material P/N in. (mm) in. (mm) ( C/W) Options 9-AK. (9.) x.8 (.9). (.). Pages 9-AK. (.) x.9 (9.). (8.). Pages 89-AK. (.) x. (8.). (8.). Pages 99X-AB.9 (9.8) x. (.9). (.).9 Pages PRODUCT FEATURES Compact design heat sinks can comfortably fit a variety of Robust Socket -based PC boxes Robust clip attachments Clips are not captive to sink To order heat sink with optional interface material pre-applied at the factory, add S or S suffix to the part number. (See Product Designation) AK SERIES Wakefield x9sc.8.. PRODUCT DESIGNATION 9 - XX - XX Dimensions: in. SPRING CLIP OPTION (SEE PRODUCT DES.) OPTIONAL THERMAL INTERFACE PAD (SEE PRODUCT DES.) MODEL NUMBER HEIGHT =." THERMAL INTERFACE S = DELTALINK IV BLANK = NO THERMAL PAD CLIP AK = SPRING CLIP / SERIES Low-Cost for DIPs and SRAMs - Pin DIPs Standard Length Width Height Typical Weight P/N in. (mm) in. (mm) in. (mm) Applications lbs. (grams) B. (.). (8.9). (.) -Pin, -Pin DIP. (.) B. (9.). (.). (.) -Pin, -Pin DIP. (.) These extruded heat sinks serve as low-cost heat dissipation solutions for DIPs with pin counts from to. Use an epoxy such as Wakefield Engineering DeltaBond or, or use Wakefield -part DeltaBond modified acrylic adhesive. The and are also available in natural aluminum finish. They can be ordered as P or P. NATURAL AND FORCED CONVECTION CHARACTERISTICS Notes:. Finish: black anodize. TIR: Total Indicator Reading. This is a measure of flatness across the greatest dimension of a surface. B B
20 WTS_p- // : AM Page HEAT SINKS FOR MICROPROCESSORS AND ASICs 9 SERIES SpiderClip Heat Sink Assembly for Motorola MC8, MC8 8 x 8 PGA Standard Base Dimensions Height Base Thickness Clip Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Color Finish lbs. (grams) 9-AB. (.) sq. (8.).9 (.) Gray Black Anodized. (9.8) 9-AB.8 (.) sq. (.).9 (.) Gray Black Anodized. (.) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 9-AB SPIDERCLIP ASSEMBLY 9-AB SPIDERCLIP ASSEMBLY 9 SERIES SpiderClip Heat Sink Assembly for IntelDX, AMD AM8DX, and AM8DX x SPGA SERIES Heat Sink without clip Dimensions A Base Standard Base Dimensions Height Thickness Clip Standard Weight P/N in. (mm) in. (mm) in. (mm) Color Finish lbs. (grams) 9-AG. (.) sq. (8.).9 (.) Black Gold Iridite. (9.8) 9-AB. (.) sq. (8.).9 (.) Black Black Anodized. (9.8) 9-AB. (.) sq. (.).9 (.) Black Black Anodized. (9.8) 9-AB. (.) sq. (.).9 (.) Black Black Anodized. (.8) -AG. (.) sq. (8.).9 (.) N/A Gold Iridite. (9.8) -AB. (.) sq. (8.).9 (.) N/A Black Anodized. (9.8) -AB. (.) sq. (.).9 (.) N/A Black Anodized. (9.8) -AB. (.) sq. (.).9 (.) N/A Black Anodized. (.8) 9 Series SpiderClip Heat Sink Assemblies may be applied to the following: Intel 88DX and 88DX (8 PGA) Intel 89 Cache Controller Intel DX (8 PGA) AMD AM 9 Microcontrollers Intel 88SX (8 PGA) and I8XR (8 PGA) AMD AM 8 Microprocessors AM8DX, AM8DX Intel I9CA, I9CF Enbedded Controllers MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 9-AG 9-AB 9-AB 9-AB 9-AG SPIDERCLIP ASSEMBLY 9-AB SPIDERCLIP ASSEMBLY Dielectric Breakdown (Nylon Clip Coating) Dimensions: in. (mm) Dielectric Strength: VDC/mil Breakdown Voltage: VDC (minimum) KEY: 9-AG 9-AB. (8.) Pin Height, low density pin pattern. (8.) Pin Height, high density pin pattern 9-AB. (.) Pin Height, high density pin pattern 9-AB. (.) Pin Height, high density pin pattern
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