Ebeam Advantest F7000+VD02 user manual

Transcription

1 Ebeam Advantest F7000+VD02 user manual Eric (Mita Lab) 2016/02/24 Please, leave this manual here. You can find an electronic version in the TakedaCR Wiki: (accessible only from inside Utokyo) 1. Specifications Resolution 1Xnm Exposure method: VSB (Variable Shaped Beam) and CP (Character Projection) CP use a stencil with fixed shapes like circles, triangles, parallelograms... It is possible to expose those shape in one shot, leading to high speed exposure of nice circles, triangles, etc...however, data preparation is difficult. Acceleration voltage: 50kV (fixed) Current density:100a/c m2 (fixed) Data resolution:0.25nm Beam size:variable with a maximum of 800x800nm Main field size:32x32μm Sub field size:4x4μm Supported samples (size and thickness) 2"279μm, 3"380μm, 4"525μm, 6"625μm, 8"725μm SEMI/JEITA standard 1 1~3 3cm chips with thickness 325μm, 425μm, 525μm 5009 size glass mask Maximum size Φ300m, thickness 2300μm (possible to make new adjuster) 2. Exposure data creation 2.1. Prepare the environment for data creation Get a CAD software for GDSII data creation Use soft provided by VDEC for educational purposes or, Use other soft like Klayout or LayoutEditor Klayout (free) LayoutEditor (low price, $69~) Get a software for file transfer Windows: WinSCP MacOS, UNIX, scp, sftp Get a X11 terminal Windows:Xming MacOS: Xquartz Create the GDSII data Don t fill out the entire surface with data! When making L/S (lines and spaces), make first a rectangle cell, then make an array of this cell, Don t make directly a huge array. Stratify by using sub-cells, If you plan to repeat the same pattern several times on a substrate, do it with the EB software, not the GDSII creation software Layer structure If you plan to pile up several exposure, user a different layer for each exposure If you do CP conversion, be careful of the pattern s shape separation and cell s name. It s not possible to convert connected polygons use separated polygons If you specify the CP structure by the cell name, the exposed structure s shape may be different than the one in the GDSII file Conversion and transfer of the data 1 / 6

2 Network structure Transfer the GDSII data to the workstation (WS) used for conversion (usr12) The conversion is done on a server called usr12. First you have to send your GDSII file to that server, for instance by using WinSCP (for windows). Host name: usr12.vdec.u-tokyo.ac.jp Port number: 22 File protocol: SFTP or scp User name & password (an account is issued for each lab) Data conversion (from usr12 shell) Connect to usr12 using X11 terminal Execute the conversion command (dsjobput) The simplest way to do this is by creating a script file including the name of the command and the parameters. A typical name for this file is conv.csh. It can be edited with any text editor (for instance $ emacs -nw conv.csh). Here is two examples of a conv.csh file: VSB only case #!/bin/csh dsjobput \ filename.gds \ --name labname_yourname_anyname.bef \ --log labname_yourname_anyname.log \ --root top \ --layno 1 CP or CP&VSB case #!/bin/csh dsjobput \ filename.gds \ --name labname_yourname_anyname.bef \ --log labname_yourname_anyname.log \ --root top \ --layno 1 \ --str2cp /home/share/18-siph.str \ --fcp-file /home/share/18-siph.fcp \ --field-import 0.6 Main command options: --name: specifies the name and the path of the output BEF file. Rule for the BEF file name: labname_yourname_filename.bef The BEF file will be saved in the directory root>labname>yourname. --log: specifies the path to a log file --root: specifies the name of the cell to be converted --layno: specifies the number of the layer to be converted 2 / 6

3 Options related to CP exposure: --str2cp: converts structures (GDSII) in design data directly into CP exposure patterns according to the description of the CPID definition file. --fcp-file: specifies the full CP definition file --field-import: specifies a threshold in order not to split the CP by field boundary. Execute the conv.csh file to start conversion: > conv.csh Remarks: The conversion might take a long time. You can interrupt the conversion by pressing CTRL+C You can kill the process with the command > ps ef grep username (to check the process ID) > kill process_id (to kill the process) After conversion, don't change the name of the bef file or there will be an error during exposure Check the job > dsjoblist Q = Queue, R = Running, Z = completed normally, E = Error If there is an error, you can check the job log by viewing the log file, or by using the following command: > more jobname Remark: in case of CP use, check that VSB=0 (if not, there will be a problem) Check the bef file > ebview beffilename Check the exposure time Use the command beftime. You can check the beftime command option by typing: > beftime For example: > beftime filename.bef -DOSE 120 -ASX 100 -ASY 100 -ANX 2 ANY 2 Parameters: -DOSE: dose in uc/cm -ASX and -ASX: define the exposed area in um -ANX and -ANY: define the number of time the pattern is repeated The estimated time is indicated after Total = Transfer the converted BEF file to the EB Transfer the BEF file to eb4: Host name: eb4.vdec.u-tokyo.ac.jp Port number: 22 File protocol: sftp or scp User name & password Transfer the BEF file to the EB machine Directly from the console login / password: eng / eng By the network login to eb4 by ssh: > ssh eb4 login to f7000s by sftp: copy the file: > sftp eng@f7000s (password = eng700) > put filename.bef 3 / 6

4 3. Exposure 3.1. Flow chart If you are the first user of the day, perform the daily check Import BEF data Edit WEC file Set the substrate Do alignment if necessary Exposure Unload substrate 3.2. Daily check The daily check takes about 35min Click Job in the Main menu screen Click Run tab in the Job window Start Mode Auto Type PeriodCheck Select Daily in the Check panel Click Entry button Importing BEF data Click Data button in the Main Menu screen Click BEF tab in the Job window. The Data(BEFLst) window is displayed File > Import > Select bef file > OK Silicon sample: select single path Glass sample: CAN: single path ZEP: field path with # of path = WEC data This is where you set parameters such as position and dose Click Data button in Main Menu window at the bottom side of the screen Click WEC tab in the Job window Data(WEC Edit) window is displayed Select a folder in the Folder List and a WEC file in the Record List The content of the WEC file is displayed in Data Area and Wafer Map windows Specify the parameters in each tabs: Wafer tab: set the following parameters: Wafer size (mm) Area pitch (Size of area) (μm) Offset (μm) Edge cut (μm) Placement (Inside edge / inside & on edge) Layout type (Odd / Even) Click Apply button BEF tab: set the following parameters BEF data Click Add to create a BEF group Double click in the BEF Group/ BEF Name column and select the BEF data It is possible to add up to 4 BEF data in a BEF group, and up to 20 BEF group in a WEC data Display the Wafer Map window If the Wafer Map window is hidden in another screen, select [Window] [Wafer] in the menu bar, then the Wafer Map window will appear. 4 / 6

5 Select a BEF group by clicking in the BEF Group / BEF name column In the Wafer Map window, select the area in which you want to put the BEF group by clicking or dragging on several areas with the mouse In the Wafer Map window, click the R button Resist recipe: set to normal If BEF data contains CP patterns, set the CP area # (arbitrary 11 digits) and set the area number to Dose tab: set nominal dose (μc/cm2) and press Enter Mode tab: set stage mode (always set OTF, because SR takes too long time) Focus tab: set the focus points file name (it depends on the sample size, for instance 4inch 80mm) User information: fill out he creator and comments if needed Coarse tab: If coarse alignment is not required, check that it is set to OFF. If coarse alignment is required, do the following: Set the Coarse Alignement ON/OFF pull down menu to ON Set the coarse alignment target recipe name Set the coordinate specification to Specify target [by Position] Set the position of coarse alignment targets (2 targets) relative to the wafer origin Fine tab: If fine alignment is not required, check that it is set to OFF. If fine alignment is required, do the following: Set the Fine Alignement ON/OFF pull down menu to ON Set the position of fine alignment targets (4 targets) relative to the area origin Save the WEC file: File Save as Input WEC name OK 3.5. Setting substrate on adjustor Set the Adjustor Set Table on a work bench Place the Adjustor on the Adjustor Set Table Wafer There are several kinds of adjustors for wafer. Please use an appropriate adjustor corresponding to the sample type (size and thickness) Place a wafer on the Adjustor and fix it Move the Wafer Contact Pin onto the wafer and tighten the screw. Caution: after taking back the wafer, be sure to tighten the screws Photomask Place the Photo Mask on the Adjustor using the Mask Hand Tool Push the photomask against the stoppers Push the fixing plates against the mask and tighten the screws Place the Contact Pin on the Photo Mask and tighten the screw to fix it. Caution: Please tighten the screws after removing the photomask Chip There are three locations to put chips, depending on the thickness of the chip (cf. fig ) The size of the chip can vary from 10x10mm to 30x30mm Place a chip and push it against the stoppers Fix the chip with copper tape. 5 / 6

6 3.6. Setting adjustor on load port Check that ON/OFF state of lamps on the loader operation panel is the following (cf. fig ) Press LOCK/UNLOCK button the button turns on and the door is unlocked Open the door and set/remove the adjustor on a BUF (1 or 2) Check that the lamp of the BUF where the adjustor is set turns off Close the door Press LOCK/UNLOCK button the door is locked and LOCK /UNLOCK button is flashing Exposure Click Job button in Main Menu window at the bottom side of the screen Click Run tab in Job window ExpJob window is displayed Job Name > selected automatically if Auto is selected at the right hand side of Job Name menu Start Mode > Auto Type > Exposure with Transfer WEC Name > Click Select button > select the WEC file > OK If the adjustor is not selected: Port > Select load port > Adjustor Check that the load port is ONLINE (door is locked) If OFFLINE (door is not locked), push the LOCK/UNLOCK button on the control panel of the adjustor transfer equipment BUF > select the Load port number (BUF) where the adjustor is set Adjustor-ID > select adjustor ID Click Entry exposure job is registered in the queue and exposure process starts automatically 3.8. Alignment (to do) 6 / 6