Standard mask fabrication process -> Mask Process. Follow links for more information on each topic (pdf format)

Transcription

1 Standard mask fabrication process -> Mask Process Follow links for more information on each topic (pdf format) Login CAE terminal in Zone 1 Login on PC in Zone 1, enable "Z01 Heidelberg DWL200 - Laser lithography system " Login on DWL200 menu 1. Click "Login" 2. Enter username=cmi, PW= Close terminal window only if "Access granted" Check configuration of DWL Change software configuration 2. Change writing lens (hardware) Download the data 1. Use "atrans" to download from linux server 2. Update&Optimize for writing speed Select your environment files, edit job file(s), edit batch file IMPORTANT: Verify current parameters in Easy Setup 1. Workspace as directory (Dio_mask), select Map 2. ** Select job 3. Edit job 4. Define slot in batch and save 5. To write a next job, repeat loop from ** Final check 1. Check the hardware configuration carefully (lens, filter) 2. Load masks or wafers in carrier 3. Check the feeder availability Start writing batch 1. Select slots 2. Double click on "Expose" 3. Wait and check for completed 2 scans Finish procedure 1. Remove written masks 2. Log out on CAE terminal Results and calibration -> Gallery

2 In case the interface application is not open, click on the desktop shortcut: User-interface will start and mini-terminal window opens automatically. On top the screen the user-interface window appears: Logon on the equipment as follows: Press "Login" on the top window. A mini terminal window opens. Enter the equipment login username and password: Username=cmi Password=*** Do not close terminal window before "Access Granted" confirmation appears in the bottom line. If access is denied, repeat previous step and retype correct login. Close the Mini Terminal window as soon as "Access Granted" is displayed. It takes a few seconds for this window to disappear.

3 Verify the last used configuration at the top-right corner of the graphical interface. «DWL_DIOX.YYN» reads as: Suffix = DWL_DIO X=Write speed (2 or 4) YY= Focal Distance (10 mm for low resolution or 04 mm for high resolution) N= Letter for substrate type (M for mask or W for wafer) If it is necessary to change the configuration, select [Configuration/Change configuration] from the menu. The dialog vindow points automatically to the available configuration files. Select item and confirm by OK. Note: list of available configurations may change according to the equipment status. The software will aoutomatically log out. New login is necessary. Open the mini terminal window, and proceed as in previous step. Light source is autodetected, and the following window opens: Correct answer is "Oui". Notes: Click on "Running Time" or "ReadOut Power" to check correct communication. 1. Both the software and hardware configuration must be consistent for correct data writing. 2. Converted data is compatible with any write speed (marked as X). Lens focal distance is fixed at the conversion on the linux station.

4 Writing head must match the conversion setup («DWL_DIOX.YYN») Changing the hardware configuration Open the large window on the front of the machine using the switch on the left side. Writing head: Unplug the two electrical cables (D-sub and coaxial). Unscrew (marked 3 screws, Allen screwdriver 3 mm) and release the writing head. Head will rest on two L shaped supports a few millimeters down. With TWO HANDS slide out the writing head, and place it upside down on the granite table in the storage area (indicated by large red stickers) on the right side. With TWO HANDS take the second writing head, return it and insert it on top of the two L shaped support. With one hand lifting up the writing head, fix it in place (3 screws, Allen screwdriver 3 mm), and apply uniform light tightening with two fingers. Plug the two electrical cables (D-sub and coaxial). Don t screw the D-sub connector more than 1/2 a turn. Filter (according to Easy Setup): 8. Unscrew (Allen wrench 2.5 mm) about two turns. 9. Remove the filter upwards. 10. If necessary, insert the new filter on the front optical bank (right side of the long cylinder). To support filter alignment, push with one finger from the back during tightening. 11. Vacuum switch: Vacuum switch (located on the XY table) needs to be in Auto position (downwards). 12. Close the large window as soon as possible.

5 Local disk contains previously downloaded layouts. Use the transfer utility to download from the linux server (outside cleanroom) called "atrans". From the menu, select [File/Designs]: The "Design Data Buffers" window opens and the list of locally downloaded layouts are shown. In case the layout name is in use, you must first erase it with the "Delete LIC Data" buttonbefore downloading a new version. To activate the "atrans" function, click on "Use atrans to transfer Lic Data". The Data Buffer window increase in size: Enter the linux user ID and password of your dropbox account (IP= login=cmi; PW = "..."), and the layout name (case sensitive!) Press "Get LIC Data" Status: will change to "transfer is running" for a few cycles (about 10s for each cycle). Standard layout needs at least two cycles. Also, no change in status for more than 10 cycles is an indication of incorrect transfer. Do not forget to refresh and erase an invalid LIC data buffer using "Delete Lic Data" before repeating. In case an error message shows: "No connection to PC", retry immediately. Wait for status back to no transfer running and press "Refresh". Note: periodic cleaning of storage is organized in order to maintain enough disk space for new designs. Locally downloaded layouts older than 2-3 weeks can be deleted.

6 IMPORTANT: Perform this step for newly downloaded layouts AND after each change of a configuration (within DWL_DIOX.YYN) Locate and select the layout in the list of downloaded items. Press "Convert.cfg " to open the menu used for the conversion on the linux server. Verify the contents: First line: your input file (cif, gdsii,...) Last line: The writing head which must match the actual configuration. Press Update + Optimize In the first line, the field "Beam mode=" refers to your choice: Exposure mode High speed (4 beam mode) Low speed (2 beam mode) Non-inverted $38 $34 Inverted $78 $74 Current layout will be ready for writing correctly with the actual configuration only: DWL_DIOX.YYN. Return to LIC Data Buffer list with "Cancel" Close window with "Cancel" IMPORTANT NOTE: In case of errors In case of a faulty transfer, errors or no messages can be returned at the end. Use "Delete Lic Data" to manually erase the incorrect layout. Verify the spelling (case sensitive) of the user ID, password and layout name. Replace forbidden caracters (space,/,*,-,+) by "_" in the LIC folder name. Try again to dowload with the updated name and login information. Tip: Use a terminal emulator (Putty) for checking the linux server from the cleanroom. Shortcut is available on the PC desktop:

7 DWL200: Edit job and batch file Workspaces are stored as environment files which are located on the windows PC. If necessray, repetitive work can be stored in a specific folder for easy and fast edition. Each workspace folder contains 4 types of files: Select Mandatory First Second (auto selection) (auto selection) File extension.map.dwl.wa.fa Use for Mapping: defines the number of fields and repetition. Default is 1x1 matrix for single field exposure Job: defines the exposure parameters for each field of the related map Global align macro for centring and initial focus Field alignment: optional direct writing only Workspaces are stored in../vbmenu/wafer directory Choose the "DIO_Mask" directory for mask writing Choose "Wafer first" for direct writing on wafers without alignment Choose your specific "user's project" for direct writing onto wafers with alignment (request for supplemental training) First: Select menu [File/Map file] Choose file path and filename for the mapping file. Usually map file and working directory have the same name At this point, the loop begins for assembling several jobs in one batch run. The restriction for building a batch is the use of one hardware configuration, and one type of substrate (1 to 10 Cr-blank, or 1 to 25 wafers). ** Second: As many substrates as necessary for exposure can be prepared as separated jobs. Each job will be stored as a separate job file with the name of the layout and the exposure parameters. This step has to be repeated for each job. [File/Job file] From the workspace folder, select any "job file name" (start from _1 normally): To open and edit the job file, select [Job/Make Job] from the main menu. Two windows are now opened:

8 Map file opened as single 1x1 exposure matrix Job file opened in spreadsheet representation (one line for each element of the exposure matrix) Enter parameters in the jobfile: Look at the "Easy setup Table" for updated exposure parameters. Do = -1 to enable exposure of the field Ali, Xoffset, Yoffset: remain empty for standard work LicBuffer: Enter your layout name from the available list of layouts using the line editor: Click Refresh Browse for your layout and select Press "Use Design" to copy into spreadsheet Defoc: Offset of autofocus. This value is optimized for sharp focus on substrate, take value from setup table. Energy: Energy for exposure depends on the resist type and thickness. Discrete values are accepted only: 40.dio, 50.dio, 55.dio, 60.dio, 70.dio, 80.dio, 90.dio,100.dio, 110.dio - pay attention to use the extension. Command: Specific command for OS9 external devices. Use Diode(N) to fix the finest beam shape for the light source. Finish the current job edition by closing and overwriting the job file: Batch: Jobs must be physically assigned to a slot position in the cassette. For simplicity use the same slot number and job identifier (slot N = Cr_MaskN) IMPORTANT: Slots containing substrates are considered as a private property. Do not touch or move substrates between slots! Consider that the current slot used for processing needs to stay empty. The substrate will be returned to this position at the end of the current job. Select menu [Job/Prepare and Run Batch File] to access the batch editor window.

9 Select your target slot and select [Edit/Use current environment] within this window (CR_mask2.dwl is the current job in this example). This command will assign the previous settings to this slot. Save the batch file with OK. Close the window after "overwrite confirmation message" To write multiple substrates, a next job can be edited by restarting the loop at the point **Second in this manual above.

10 1. Check your hardware configuration carefully (lens, filter) 2. Load the masks or wafers in the carrier 3. Check the feeder availability Click on the "toolbox" icon in the main window (the first on the left) Select the "Feeder" button in the tool list (left side) In case communication is OK, close window. In case communication is not working ("feeder NOT OK"): Press "Init feeder", and wait for "Feeder Ok" Confirm with "Ok"

11 From the menu, select [Job/Prepare and Run Batch File] Select slots to be written (by pressing Ctrl to choose multiple). Ignore slots to be skipped. Processing starts from bottom (lower slot number selected) No option box need to be checked Click on "Run" Start exposure with a! double click! on "Expose". Following dialog window will open. Confirm overwriting by responding "Oui". Automatic execution has been started, the mask is loaded and centered. After a short period, the exposure window (in the center of the screen) opens. As soon as the exposure window appears, the batch can be aborted by pressing the "Break" button. In the first 3 seconds no exposure will reach the substrate. Check for 2 to 3 movements (scan stripe) and move the mouse pointer away from the "break" bouton before leaving the system. Writing time can be estimated using the progress bar. Upon finish, the PC interface is logged off automatically (Login button is shown). Remove substrates from carriers as soon as possible. Do not forgot to release the equipment as soon as the batch is finished by logging out. IMPORTANT: Slots containing substrates are considered as a private property. Do not touch or move substrates between slots! Consider that the current slot under process needs to stay empty. Substrates will be moved to the same position at the end of the current job.