Printing Functional Materials
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- Lee Perkins
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1 Polymer inks! Printing Functional Materials Jennifer A. Lewis School of Engineering and Applied Sciences Wyss Institute for Biologically Inspired Engineering Harvard University NSF Additive Manufacturing Workshop ! harvard.edu
2 3D Printing Design, Print, Innovate Broad range of commercial printers and solidification schemes (photocuring,!t, laser sintering, drying, etc.) Stereolithography 3D Systems Laser Sintering 3D Systems Fused Deposition Stratasys PolyJet Process Objet 3D Printing Z Corp Robocasting Robocasting Enterprises Laser Net Shaping Optomec Electron Beam Melting Arcam
3 3D Printing Design, Print, Innovate Broad range of commercial printers and solidification schemes (photocuring,!t, laser sintering, drying, etc.) Stereolithography 3D Systems 3D Printing Z Corp Laser Sintering 3D Systems Robocasting Robocasting Enterprises Fused Deposition Stratasys Laser Net Shaping Optomec PolyJet Process Objet!!!!!!!!!!!!"#$%!&'!()*+%*+,!-.%/#0$!1234!#+.!#)!-#).!#5!%/.!!5#11#6*+,!2%%)*78%.$9! :;<"!"2%.)*21$!=.>*7*1*%?! :@<"!A7*1*%?!%#!(2%%.)+!B+.!5.2%8).$!:C!;DD!µ-<!! :&<"!E*,/!%/)#8,/(8%!! Electron Beam Melting Arcam
4 FG.5#).!%/*$!(.)$#+21! %8)*+,!).H#18%*#+!32+!%24.!(123.I!%/#8,/I!).$.2)3/.)$!6*11! +..0!%#!0.H.1#(!2!7)#20.)!2))2?!#5!)#78$%!()*+%*+,!-2%.)*21$JK!!!! FJ!)2(*01?!,)#6*+,!-2)4.%I!L;!G!$21.$J!!! 27#8%!MDN!#5!-2)4.%!*$!()#%#%?(*+,K!! Several advances needed for 3D printing of high performance, functional materials
5 Our research focus Ø Broaden materials palette for 3DP Ø Integration of multiple materials Ø Digitally specify form and function Ø Improve feature resolution by 100x Ø Improve throughput by 100x expedite transformation from rapid prototyping to manufacturing of functional materials
6 Custom stages designed for 3D printing Moderate Area, High Precision! Large Area, High Speed Stage! 10x10x5 cm 3 ± 50 nm!!!1m 2 x10 cm ± 5 µm! V = mm/s!!!!v = mm/s!! E*,/!().3*$*#+I!12),.!2).2I!! 2+0!/*,/!$(..0!$%2,.$! T!*+%.,)2%*+,!-81%*(1.!&'!()*+%/.20$!.U,UI!V'"!
7 Printing ink filaments (in and out of plane) Ink filament printing!! continuous filament! is extruded through! deposition nozzle! &D!-*3)#+!+#]]1.! Desired Ink Rheology: " Shear thinning behavior facilitates flow through fine nozzles without clogging " Viscoelastic behavior enables printing of self-supporting (spanning) features W*$3#$*%?I!!!:X2!$<! $/.2)! %/*++*+,! R.6%#+*2+! Y/.2)!Z2%.!:$ [; <! "#081*!:X2<! $#1*0[1*4.! =8*0!! "!! ""! Y/.2)!Y%).$$!:X2<! V*12-.+%2)?!()*+%*+,! \+271.!%#!).%2*+! B12-.+%2)?!$/2(.!
8 Viscoelastic inks designed for 3D printing Ink design and deposition ink must flow through nozzle without jamming ink filaments must form high integrity interfaces ink must solidify rapidly (via gelation, coagulation, or evaporation) concentrated inks minimize shrinkage during drying colloidal inks! fugitive inks! nanoparticle inks! polyelectrolyte inks! sol-gel inks! /01*µ2* /01*(2*!"#$"%&'()*+"%,-$"*&'."*
9 Reactive silver inks for integrated electronics a!bdn!7814!3#+083%*h*%?!2%!;ddco!!!
10 Silver particle inks for integrated
11 Silver particle inks for printed electronics Silver inks are highly conductive as-printed!
12 Solar panels - present design 100 µm interconnects 78$72)$! $ fk!xw!3.11! Rigid, costly, active materials* occupy large area *silicon PV cells and silver interconnects
13 Printing High Aspect Ratio Silver Microelectrodes! 1 µm nozzle 5 µm nozzle 10 µm nozzle 5 µm nozzle 30 µm nozzle 10 µm nozzle 5 µm nozzle 10 µm nozzle 30 µm nozzle A/+I!'8#$$I!R8]]#I!Z#,.)$I!_.6*$!.%!21U!&'()*')!:@DDb<U!!A/+I!'8#$$I!2+0!_.6*$I!\Y[X2%.+%!MIb@@Ib&b!!
14 Flexible photovoltaics Q>2-(1.9! Y*!-*3)#3.11$!T! _8-*+.$3.+%!12?.)! :\W[38)271.!2+0!#),2+*3!0?.<!!! W2$%!).083%*#+!*+!23%*H.!-2%.)*21$!8$.0!! X)*+%271.!-*3)#3.11$!P!*+%.)3#++.3%$! 3#-7*+.0!6*%/!3#+3.+%)2%#)!#(%*3$!!!
15 Printing interconnects and bus bars 610 µm nozzle f;d!µ-!! +#]]1.! G8$!72)$! g+%.)3#++.3%$! 30 µm nozzle g+x!3.11$! &D!µ-!! +#]]1.! 10 cmx10 cm Sparse array of PV cells; finer interconnects! g+%.)3#++.3%$! g+!3#1127#)2%*#+!6*%/!y.-()*8$!2+0!yago!
16 Flexible concentrator photovoltaics " ink ~1x10-5 # cm (after C) Sheet resistance = 30 m#/sq 6 polyimide substrate Printed interconnects are highly flexible and can withstand repeated bending (1000 s cycles) without performance loss Printed interconnects exhibit excellent I-V response g+!3#1127#)2%*#+!6*%/!y.-()*8$!2+0!yago!
17 Conformal printing of electrically small antennas 3#((.)[7234.0!$87$%)2%.! 3#+083%*H.!.(#>?! h[2)-!2+%.++2! $*1H.)! Q1.3%)#0.$! :;DD!µ-<! 5..0!(#*+%!,12$$!! 8,!i!DUS;!! 6*%/!G.)+/2)0!,)#8(!:QOQ!j!g11*+#*$<! k = 2"! 0 8,!C!DUd!*+0*32%.$!2+!.1.3%)*3211?!$-211! 2+%.++2!:QYA<!!*U.UI!,!9!" o :;<!! A02-$I!'8#$$I!"214#6$4*I!A/+I!R8]]#I!G.)+/2)0I!_.6*$I!$34,*')3!5,-)/(,67!:@D;;<!
18 Performance characteristics G^!k!;SU&N! Z.$#+2+%!2%! k;um!le]! O#+32H.!2+%.++2! Qm3*.+3?!kM;N! VSWR: a measure of signal reflected at component junctions Ideally, VSWR = 1 (no reflected power, no mismatch loss) A02-$I!'8#$$I!"214#6$4*I!A/+I!R8]]#I!G.)+/2)0I!_.6*$I!$34,*')3!5,-)/(,67!:@D;;<!
19 ! SDD!n-! +#]]1.! Embedded Electronics (carbon ink printed in polymer matrix) A$!()*+%.0! +#]]1.! DN!$%).%3/! &DDN!$%).%3/!!!!!"8%/!!!!!!!!!! 6*%/!%/.!^##0!,)#8(! o#1.$4?!!!!!!!!!!!!!
20 Embedded Electronics (carbon ink printed in polymer matrix) Strain Gage Length = 20 mm All printed sequentially in 1mm thick EcoFlex reservoir with the Wood group
21 6*%/!%/.!^##0!,)#8(! 3D Printed of Strain Gage Arrays
22 Printed Three-Layer Stretchable Sensors 6*%/!%/.!^##0!,)#8(!
23 Aim: Print Microbatteries w/ High Power & Energy Density For autonomous devices that: 1. Harvest energy - photovoltaic - thermoelectric - piezoelectric! Control! Energy! Emission! 2. Store energy - micro-batteries w/ high energy and power density 3. Perform function - Mechanical - Sensing - RF Energy! Harvesting! Energy! Storage!!0.H*3.! r8)!,#219! X)*+%!;!-- &!! &'!-*3)#72%%.)*.$! X! *U.UI!$*].!#5!2!$*+,1.!,)2*+!#5!$2+0!:s<!!72%%.)?! Lai et al., Adv. Mater. 2010! Warneke et al., Computer 2001!
24 A/+! Key Factors Influencing Power & Energy Density ^.*! ;U" "2%.)*21$!'.$*,+! t" E*,/!#8%(8%!H#1%2,.!%/)#8,/!0.$*,+! #5!%/.!%6#!/215!.1.3%)#0.!).23%*#+$! t" E*,/!*#+!0*u8$*#+!3#.m3*.+%$!:E T I!_* T! *+!/#$%!-2%.)*21$<! t" R.6!1*,/%[6.*,/%!/#$%!-2%.)*21$! t" Y%)83%8).!'.$*,+! t" &'!.1.3%)#0.!2)3/*%.3%8).! t" _2),.!$8)523.!2).2! t" v/*+!b1-!#5!23%*h.!-2%.)*21$! _*V.Xr S! r S! r8)!v#38$9!!! &'!*+%.)0*,*%2%.0!! -*3)#72%%.)*.$!
25 Printing 3D Interdigitated Microbatteries! a) b) Nozzle Current (30 µm)! collector (Au)! LTO! Glass! c) LTO! LFP! d) Packaging!
26 Ink Viscosity and Elastic Modulus LFP ink (cathode) Ink rheology tailored for 3D filamentary printing LTO ink (anode) K. Sun, Lewis, Dillon et al, Adv. Mater. 2013
27 Printing High Aspect Ratio Structures! ;!--! Y2+0!,)2*+$! [!!.23/!-*3)#72%%.)?!.p8*H21.+%!*+!$*].!%#!2!$*+,1.!,)2*+!#5!$2+0!
28 Printed 3D Interdigitated Microbattery 200 µm 300 µm K. Sun, Lewis, Dillon et al, Adv. Mater. 2013
29 Printed and Packaged 3D Microbattery 200 µm K. Sun, Lewis, Dillon et al, Adv. Mater. 2013
30 LFP-LTO Full Cell Properties K. Sun, Lewis, Dillon et al, Adv. Mater. 2013
31 Microbattery Performance! Z.5!&S9!O/*2+,!:"gv<!! &'[g"a!:_.6*$i!'*11#+<! Z.5!&M9!G)28+I!o*+,!:\g\O<!! 2).21!0.+$*%*.$!w!; $%!,.+!()*+%.0!72%%.)*.$!.>/*7*%!.>3.(%*#+21!(.)5#)-2+3.s!
32 High throughput 3D 3;! 5 mm <;! Multinozzle design based on Murray s law: 3 r parent 3 = " r branch _ generation 1 mm Hierarchical branching network Created by CNC milling 200 μm All 64 nozzles are 205±3 µm on a side
33 High throughput printing of 3D architectures Periodic 3D Interpenetrating polymer foam Architectures! '821!-81%*+#]]1.!()*+%/.20! <!&'!$%)83%8).$!()*+%.0!*+!-*+8%.$!8$*+,!-81%*+#]]1.!()*+%/.20$!
34 Summary!" Created model and functional inks with controlled flow behavior!" Printed flexible electronics, photovoltaics, and sensors from conductive inks!" Printed 3D Li-ion microbatteries!" Implemented new multimaterial 3D printing!" Designed and implemented microvascular nozzle arrays for high throughput printing.>(.0*%*+,!%)2+$5#)-2%*#+!5)#-!)2(*0!()#%#%?(*+,!! %#! %8)*+,!#5!20H2+3.0!-2%.)*21$!
35 Thank you! _.6*$!,)#8(!! harvard.edu
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