RER1715 for PCN10333 & PCN10544 TSMC Taiwan Fab14 additional source for STM32 products in M10/90nm technology
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1 RER1715 for PCN10333 & PCN10544 TSMC Taiwan Fab14 additional source for STM32 products in M10/90nm technology Reliability Evaluation Plan Dec 8 th, 2017 MMS MCD Quality & Reliability Department
2 RER1715 TSMC Fab14 for STM32 products in M10/90nm technology STM32 Die Test Vehicles 2 Die Vehicle Process Perimeter Assembly Line Package Number of Reliability Lots 413 ATP3 UFBGA10*10 176b 411 ATP3 UFBGA10*10 176b M ATP3 TFBGA13*13 216b 3 lots to qualify Process Perimeter Then 1 lot by Die 449 ATP3 TFBGA13*13 216b 458 JSCC LQFP10*10 64L 423 ATP1 LQFP14*14 100L 431 ATP1 LQFP14*14 100L 441 ATP3 UFBGA10*10 144b 433 ATP1 LQFP14*14 100L M10 ULP 421 ATP1 LQFP14*14 100L 3 lots to qualify Process Perimeter Then 1 lot by Die 452 ATP3 UFBGA10*10 176b 463 ATP3 UFBGA10*10 144b 434 ATP3 TFBGA13*13 216b 451 ATP3 TFBGA13*13 216b
3 RER1715 TSMC Fab14 for STM32 products in M10/90nm technology STM32 Die Reliability Trials 3 Reliability Trial & Standard Test Conditions Pass Criteria Lot Strategy Units per Lot ESD HBM ESD CDM JESD22-A114ANSI/ESDA JEDEC JS-001 ESD Charged Device Model ANSI/ESD STM C 2kV (class 2) 1 to 3 lots 3 Aligned with device datasheet 250V to 500V 1 lot 3 LU JESD C REG-ON Configuration 125 C REG-OFF Configuration No concern 1 to 3 lots 3 3 EDR + Bake JESD22-A117 JESD22-A C & 3.6V Cycling 150 C Bake 10k cycles 1500h 1000h 1 to 3 lots 1 st lot 2 nd & 3 rd if any 77 EDR + Bake JESD22-A117 JESD22-A C & 3.6V Cycling 150 C Bake 10k cycles 168h 1 to 3 lots 77 EDR + Bake JESD22-A117 JESD22-A C & 3.6V Cycling 150 C Bake 10k cycles 168h 1 to 3 lots 77 ELFR MIL-STD-883 Method 1005 JESD22-A108 JESD C & 3.6V 48h 3 lots by process perimeter 500 units min per lot Total of 2000 units HTOL MIL-STD-883 Method 1005 JESD22-A C & 3.6V 100MHz 1200h 600h 1 st lot 2 nd & 3 rd if any 77
4 RER1715 TSMC Fab14 for STM32 products in M10/90nm technology STM32 Package Test Vehicles 4 Package Line Assembly Line Package Wire Die Vehicle / Rawline (*) Number of Reliability Lots ATP1 LQFP10*10 64L Au 413 / 5W*413 JSCC LQFP10*10 64L Ag 413 / 5W*413 LQFP ATP1 LQFP14*14 100L Au 431 / 1L*431 ATP1 LQFP20*20 144L Au 413 / 1A*413 ASE LQFP24*24 176L Au 413 / 1T*413 ATP1 LQFP28*28 208L Au 419 / UH*419 QFN JSCC UQFN7*7 48L Ag 458 / MI*458 UFBGA ATP3 UFBGA10*10 176b Au 413 / MR*413 3 lots to qualify M10 Technology Then 1 lot by Package Assembly Line TFBGA ATP3 TFBGA8*8 100b Au 449 / DY*449 ATP3 TFBGA13*13 216b Au 419 / RM*419 ATT1 WLCSP 36b NA 458 / 8Q*458 WLCSP ATT1 WLCSP 90b NA 413 / RI*413 ATT1 WLCSP 143b NA 419 / VH*419 ATT1 WLCSP 180b NA 451 / 8Z*451 (*) Some dice may be replaced by equivalent one upon similarity rules
5 RER1715 TSMC Fab14 for STM32 products in M10/90nm technology STM32 Package Reliability Trials 5 Reliability Trial & Standard Test Conditions Pass Criteria Lot Strategy Units per Lot PC UHAST (*) (**) TC (*) Pre Conditioning: Moisture Sensitivity Jedec Level 3 J-STD-020/ JESD22-A113 Unbiased Highly Accelerated Temperature & Humidity Stress JESD22-A118 Thermal Cycling JESD22-A104 Bake (125 C / 24h) Soak (30 C / 60% RH / 192h) for level 3 Convection reflow: 3 passes with Jedec level 3 3 Passes MSL3 1 to 3 lots 231 to 308 (**) 130 C, 85%RH, 2 Atm 96h 1 to 3 lots C +150 C 500Cy 1 to 3 lots 77 THB (*) Temperature Humidity Bias JESD22-A C, 85% RH, bias 1000h 1 to 3 lots 77 HTSL (*) High Temperature Storage Life JESD22-A C - no bias 1000h 1 to 3 lots 77 Construction Analysis JESD22-B102 JESD22-B100/B108 Including Solderability & Physical Dimensions No concern 1 by package assembly line ESD CDM ESD Charged Device Model ANSI/ESD STM5.3.1 Aligned with device datasheet 250V to 500V 1 by package assembly line 3 (*) Tests performed after preconditioning (**) UHAST not done for BGA
6 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics International NV and/or its affiliates, registered in the U.S. and other countries 2017 STMicroelectronics International NV and/or its affiliates - All Rights Reserved
7 PRODUCT/PROCESS CHANGE NOTIFICATION PCN Additional information TSMC (Taiwan) additional source for STM32F401xB & STM32F401xC products in M10/90nm technology MDG - Microcontrollers Division (MCD) What are the changes? - Fab 14 TSMC is a fab already diffusing 90nm used for STM32L4 products. - Masks are identical to the mother fab ST Crolles CRL300 except few changes on dummy structures to adapt to fab equipments. - Design database remains the same. How can the change be seen? The standard marking is: WX code indicates the diffusion traceability plant code. Please refer to the DataSheet for marking details. The marking is changing as follows: Existing Additional WX code Fab WX code Fab VQ ST Crolles CRL300 (France) 9R TSMC Fab14 (Taiwan)
8 MCU DIVISION NOTE October 30 th, 2017 M10/90nm Additional Front-end Source MMS - Microcontrollers Division (MCD) Dear Customer, We are in the process to transfer ST M10/90nm envm technology, currently used to produce our STM32F2x, STM32F4x and STM32F7x product to TSMC Fab 14 located in Taiwan. Fab14 is currently producing STM32L4x products. Most of the STM32F2x, STM32F4x and STM32F7x volume production will be transferred to TSMC Fab 14. This letter is a pre-announcement. Formal PCN will follow in coming weeks. Why to add a source for M10 technology STM32F2x, STM32F4x and STM32F7x are experimenting a big success in the market and we are facing a growing and solid demand since months. Our two production sites ST Rousset R8 and ST Crolles CR300 fabs will not be able to absorb all future demand. Adding TSMC Fab14 as manufacturing source will provide the flexibility to cope with future demand and further growth. Products involved STM32F2x STM32F4x STM32F7x Timing: We intend to complete qualification of all part number by Q First PCN announcing the first part number batch of transfer will be published mid-november 2017 for delivery starting in March ST will do its best to support customers during the short transition time. Sincere regards. Veronique Barlatier WW Commercial Marketing Manager ST Microcontroller Division
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