SPECIFICATION. Messrs. Non Invasive Blood Pressure Monitors. DATE 21 April, 2014 No. V AP3xx-044KG-NIBP AG3xx-044KG-NIBP

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1 EH0714.pdf EH0714 DATE 21 April, 2014 No. V70002 Messrs. Non Invasive Blood Pressure Monitors SPECIFICATION AP3xx044KGNIBP AG3xx044KGNIBP Model: Project: Distributor: Reference: AP3xx050KGNIBP AG3xx050KGNIBP

2 EH0714.pdf EH0714 V70002 Table of Contents 1. General Principle Device lineup RoHS Block Diagram and Pin Connections Device Name Code Absolute Maximum Rating General Specifications Electrical Characteristics Output versus Input Pressure Transfer Function Single Point Pressure Threshold Detection Operating Sequence Device Marking Soldering Dimensions and Weights Ordering Information Tape & Reel Information Footprint for PCB (for Reference) Notes Appendix: Dimension Drawing APxxN APxxR AGxx AGxx Table shown below is revision records of this specification Rev. Est. 21 April, 2014 Y.Uchiumi Date Name Comment 1 of 20 Mark

3 EH0714.pdf EH0714 V General This document describes the specifications of Fujikura Pressure Sensors, Type of AP3xx044KGNIBP, AG3xx044KGNIBP, AP3xx050KGNIBP and AG3xx050KGNIBP. This product is modified for NonInvasive Blood Pressure Monitors. 2. Principle Fujikura Pressure Sensor is composed of a silicon piezoresistive pressure sensing chip and a signal conditioning integrated circuit. The lowlevel signal from the sensing chip is amplified, temperature compensated, calibrated, and finally converted to a highlevel output signal that is proportional to the applied pressure. 3. Device lineup This device has the following lineup. Pressure Range (kpa) Model Pressure Type Supply Voltage Accuracy AP3 or AG3 Gauge 5.0 Vdc or 3.3 Vdc ±2.5 mmhg kpa (330 mmhg) kpa (375 mmhg) Features Low Noise Single Point Pressure Threshold Detection 4. RoHS This device is compliant with the Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). 2 of 20

4 EH0714.pdf EH0714 V Block Diagram and Pin Connections 3.3 or 5.0 Vdc Regulator Temperature Sensor Offset Temp. Compensation Power On Reset Gain Temp. Compensation Pin 3 VDD Oscillator 1.0 µf Buffer Sensor Bridge Pin 2 VOUT Sample & Hold Gain Amplifier Pressure Threshold Detection EEPROM Pin 5 PDET Pin 6 PTH Vth 30 kω Pin 1 VSS Pin 4 VSS Pin Assignment AP3 AG Index Index Pipe Pipe Pin No. Pin Name I/O Type VSS VOUT VDD VSS PDET PTH O O I Analog Digital Analog Function Common voltage connection Analog output Power supply connection Common voltage connection Pressure threshold detection Pressure threshold input Notes: *1) Both Pin 1 and Pin 4 must be connected to VSS. *2) Put a 1.0 µf capacitor between Pin3 (VDD) and VSS. *3) Put a resistor in series with Pin6 (PTH), when inputting threshold voltage (Vth). The minimum resistance value is 30 kω. *4) If an application does not use Pressure Threshold Detection, put a pullup resistor between Pin6 (PTH) and VDD, or put a pulldown resistor between Pin6 (PTH) and VSS. The minimum resistance value is 30 kω. 3 of 20 *1 *2 *1 *3, 4

5 EH0714.pdf EH0714 V Device Name Code The Device name code is consisted of Sensor code, Pressure code, Custom ID and Packing style. For the exact ordering device number, please refer to Chapter 17 Ordering Information. Sensor Code Pressure Code AP3 0 N 044K G NIBP STICK Packing Style Custom ID NIBP: Noninvasive blood pressure monitor Pressure type Pressure value Blank: TP: Tape & Reel STICK: Stick G: Gauge / Positivepressure 044K: 44 kpa 050K: 50 kpa N: Normal R: Opposite Pin direction for AP3 3: 3 mm Port length for AG3 Supply voltage Model 6: 0: 1: AP3: AG3: 4 of 20 6 mm 5.0 Vdc 3.3 Vdc DIP / Full Analog Output SMD / Full Analog Output

6 EH0714.pdf EH0714 V Absolute Maximum Rating Item Symbol Load Pressure Rating ~ ~ +105 Pmax+ Supply Voltage Operating Temperature Storage Temperature VDDmax Topt Tstg Unit kpa mmhg Vdc deg. C deg. C Note: *1) Absolute maximum ratings are the limits that the device will withstand without damage. 8. General Specifications item Supply Voltage Condition Sensor Code Symbol AP30x, AG30x AP31x, AG31x Type of Pressure Pressure Range Pressure Media Compensated Temperature Operating Humidity Storage Humidity Dielectric Strength Insulation Resistance VDD Pressure Code 044KG Popt 050KG Hopt Hstg Noncondensing Noncondensing Rating Typ. Max Gauge pressure Noncorrosive gases Min Unit Vdc *2 kpa mmhg kpa mmhg deg. C %RH %RH ma MΩ Notes: *1) Output voltage (Vout) is not perfectly ratiometric with the power supply voltage (VDD). *2) Gauge pressure is defined as the difference between the pressure applied and atmospheric pressure. *3) 1 mmhg equals kpa. Pressure range (Popt) is defined as the measurable pressure range of the device. *4) Ensure the pressure media contains no particulates. The device is not compatible with liquids. *5) Please also refer to Chapter 11 Transfer Function. *6) Do not wet the device with dew. *7) Dielectric strength is defined as the leakage current between all pins and the package with AC500, 1 minute. *8) Insulation resistance is defined as the resistance value between all pins and the package with DC500V. 5 of 20 *1 *3 *4 *5 *6 *6 *7 *8

7 EH0714.pdf EH0714 V Electrical Characteristics Load Resistor RL=, Ambient temperature Ta=25deg. C Item Condition Sensor Code: AP30x, AG30x Rating Symbol Min. Typ. Max. Unit (VDD = 5Vdc) Offset Voltage Min. Popt Voff V *1, 2 Full Scale Voltage Max. Popt Vfs V *3 Span Voltage Min. to Max. Popt SV V *4 Ic 6 madc *5 Supply Current Sensor Code: AP31x, AG31x (VDD = 3.3Vdc) Offset Voltage Min. Popt Voff V *1, 2 Full Scale Voltage Max. Popt Vfs V *3 Span Voltage Supply Current Min. to Max. Popt SV Ic V madc *4 *5 0 to 60 deg. C, Min. Popt to 300mmHg Error mmhg 0 to 60 deg. C, >300mmHg Error mmhg Accuracy Temperature Offset Error 0 to 60 deg. C TSO Response Time Noise Floor for reference Min. Popt, with LPF & HPF tr NF Load Resistor VOUT VSS or VDD VOUT RL 9.5 Load Capacitance VOUT VSS CL fs 8.33 Sampling Frequency V kω *5 50 pf *12 khz *13 *2) Offset error is calibration error of offset voltage in production. It does not include Long term offset drift. It would be suggested that application has Autozeroing function. *3) Full scale voltage (Vfs) is defined as the output voltage at maximum Popt. *4) Output span voltage (SV) is defined as the voltage difference between Offset voltage (Voff) and Full scale voltage (Vfs). *5) Supply Current (Ic) is increased depending on the value of Load resistor (RL). *6) Accuracy consists of the following: Nonlinearity Pressure hysteresis Sensitivity calibration error Temperature errors of sensitivity over the temperature range 0 to 60 deg. C Exclude offset error and temperature errors of offset voltage over the temperature range 0 to 60 deg. C. *7) Output voltage per 1 mmhg is as below: SV (mv/mmhg) Max. Popt 044KG 050KG 4500(mV) 330(mmHg) = (mV/mmHg) 2700(mV) 330(mmHg) = 8.181(mV/mmHg) 4500(mV) 375(mmHg) = 12(mV/mmHg) 2700(mV) 375(mmHg) = 7.2(mV/mmHg) 6 of 20 *8 msec. *9 mmhg pp *10, 11 Notes: *1) Offset voltage (Voff) is defined as the output voltage at minimum Popt. Pressure Code Sensor Code AP30x, AG30x AP31x, AG31x *6, 7

8 EH0714.pdf EH0714 V70002 *8) Temperature offset error (TSO) is defined as the output voltage drift by temperature. *9) Response time (tr) is defined as the time for the change in output voltage from 10% to 90% or from 90% to10% of its final value when the input pressure makes a step change. Input Pressure 0 kpa ressure Final value 90% of Final value Output Voltage 10% of Final value Offset Voltage tr tr *10) Noise floor (NF) is defined as the output voltage at 0mmHg that is filtered by HPF and LPF. This test is not processed in production. 3.3 or 5.0 Vdc HPF LPF 0 mmhg mmhg Test sequence of Noise Floor *11) Noise floor (NF) is increased depending on input pressure. *12) Do not put Load capacitance (CL) that is over 50pF between VOUT and VSS. *13) Output voltage (Vout) is sampled and held by the internal sampling / hold block. Sampling frequency (fs) is 8.33 khz. The output voltage is changed stepwise every approximately 120 microseconds. Input pressure Output voltage fs = μsec 8.33 khz approx. 120 μsec 7 of 20

9 EH0714.pdf EH0714 V Output versus Input Pressure Pressure Code Sensor Code 044KG 050KG VDD = 5.0 Vdc Temp. = 0 to 60 Vfs: 4.7 V Error1: ±2.5 mmhg Error2: ±5.0 mmhg SV: 4.5 V Output AP30x AG30x Output Vfs: 4.7 V VDD = 5.0 Vdc Temp. = 0 to 60 Voff: 0.2 V Error1: ±2.5 mmhg Error2: ±5.0 mmhg Voff: 0.2 V Min. Popt: 0 mmhg 300 mmhg Max. Popt: 330 mmhg Min. Popt: 0 mmhg Input Pressure 300 mmhg Max. Popt: 375 mmhg Input Pressure VDD = 3.3 Vdc Temp. = 0 to 60 Vfs: 3.0 V Error1: ±2.5 mmhg Error2: ±5.0 mmhg SV: 2.7 V Voff: 0.3 V Min. Popt: 0 mmhg VDD = 3.3 Vdc Temp. = 0 to 60 Output AP31x AG31x Output Vfs: 3.0 V SV: 4.5 V Error1: ±2.5 mmhg Error2: ±5.0 mmhg Voff: 0.3 V 300 mmhg Max. Popt: 330 mmhg Min. Popt: 0 mmhg Input Pressure 300 mmhg Max. Popt: 375 mmhg Input Pressure 8 of 20 SV: 2.7 V

10 EH0714.pdf EH0714 V Transfer Function Vout = VDD ((P α) + β) ± (Pressure Error Temperature Error Multiplier α VDD) Parameters: Sensor Code AP30x AG30x AP31x AG31x Parameter Pressure Code 044KG 050KG 044KG 050KG VDD (*1) 5.0±0.25 V 3.3±0.165 V P α 0 ~ +330 mmhg 0 ~ +375 mmhg 0 ~ +330 mmhg 0 ~ +375 mmhg 3/1100 3/1250 3/1210 3/1375 β 1/ mmhg 1/11 Note: *1) Output voltage (Vout) is not perfectly ratiometric with the power supply voltage (VDD). Temperature Error Multiplier 5 Error Multiplier Temperature ( ) 9 of Pressure Error

11 EH0714.pdf EH0714 V Single Point Pressure Threshold Detection AP3 and AG3 have a voltage detector. Output voltage (VOUT) and threshold voltage from PTH are inputted into the detector. Detector s output will be changed when VOUT reaches a threshold voltage. Ambient temperature Ta=25 deg. C Item Condition Type of Output Rating Symbol Min. PDET Threshold Input voltage PTH Input Impedance PTH VOUT < Vth VOUT Vth Max. Unit CMOS output *2 0.1*VDD 0.9*VDD V Zin 1 MΩ VOH 0.9*VDD V VOL 0.1*VDD V Pressure Hysteresis Detection Time Phys Tdetr 0.05*VDD 150 V µsec *3 Non Detection Time Tdetf 150 µsec *3 Output voltage Vth Typ. Notes: *1) Do not control any device directly using this function. Because there is indeterminate status during the supply voltage rises. *2) Equivalent circuits of PDET and PTH are as below: VDD VDD VDD Buffer PTH PDET VSS VSS VSS *3) Please also refer to the following timing chart. Input Phys Vth Vout ressure Output ressure 0.9*VDD H H 0.5*VDD L 0.1*VDD Tdetr Tdetf 10 of 20

12 EH0714.pdf EH0714 V Operating Sequence Supply Voltage VDD 0.8*VDD 1 Volt VSS Rated pressure Input Pressure Popt Vth (Pressure Conversion) 0 kpa 1 msec Max. Sensor Status Operation Operation NonOperation Operation Initializing Output Voltage VOUT Full scale voltage Offset voltage VSS Indeterminate Pressure Threshold Detection PDET VDD H L L H L H L H VSS Notes: *1) Before supply voltage reaches 0.8*VDD, the status of VOUT, PDET and PTH are indeterminate. *2) After reaching 0.8*VDD, initializing process is started. At initializing process, PDET is fixed 0.9*VDD and over, and VOUT is fixed 0.1*VDD and under. 11 of 20

13 EH0714.pdf EH0714 V Device Marking AP3 AG3 Production Lot YMDD AP30 025K NIBP Sensor Code YMDD AG30 050K Pressure Code NIBP Custom ID Items Production Lot Y M DD Sensor Code Marking Last digit of Production year Production month Production date 0~9 1, 2, 3 ~ 8, 9, X=Oct., Y=Nov., Z=Dec. 01~31 *1 AP30x AP31x AG30x AG31x AP30 AP31 AG30 AG31 044KG 044K 050KG 050K NIBP Pressure Code Custom ID Note: *1) Pin direction of AP3 and Port length of AG3 is not marked on the face plate. 12 of 20

14 EH0714.pdf EH0714 V Soldering Process Sensor Code Hand soldering AP3xx Wave soldering AP3xR Reflow soldering AG3xx Condition *1, 2 Soldering iron temperature: 350 deg. C max. Soldering time: 3 seconds max. / each pin Soldering bath temperature: 260 deg. C max. Soldering time: 5 seconds max. *1, 2 *1, 2, 3, 4 Soldering Profile Temperature( ) A B C D E Time A Ramp up B Preheating C Ramp up D Heating E Ramp down 2 to 4 deg. C / sec. 150 to 180 deg. C 60 to 120 sec. 2 to 4 deg. C / sec. Above 230 deg. C, 45 sec. max. 245 deg. C max., 10 sec. max. 2 to 4 deg. C / sec. Notes: *1) NEVER wash the device with any washing liquid. NEVER wash the device with any ultrasonic washing machine. *2) Do not put the solder and flux on the device s package. *3) Temperature means Surface temperature of the device s package. *4) Reflow soldering is within two times. 16. Dimensions and Weights Refer to the following drawing as attached. Sensor Code Dimension Drawing AP3xN AP3xR AG3x approx. 0.3 grams AG3x approx. 0.4 grams 13 of 20 Weights approx. 1.4 grams

15 EH0714.pdf EH0714 V Ordering Information Model Package Pressure Range Supply voltage Pin direction Packing Stick Sticks Stick Stick Stick Stick Stick Stick Normal 5.0 Vdc Opposite 330 mmhg Normal 3.3 Vdc Opposite AP3 DIP Normal 5.0 Vdc Opposite 375 mmhg Normal 3.3 Vdc Opposite Ordering Device Number Qty./Packing AP30N044KGNIBP AP30N044KGNIBPSTICK AP30R044KGNIBP AP30R044KGNIBPSTICK AP31N044KGNIBP AP31N044KGNIBPSTICK AP31R044KGNIBP AP31R044KGNIBPSTICK AP30N050KGNIBP AP30N050KGNIBPSTICK AP30R050KGNIBP AP30R050KGNIBPSTICK AP31N050KGNIBP AP31N050KGNIBPSTICK AP31R050KGNIBP AP31R050KGNIBPSTICK Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick Pcs/ Pcs/Stick AG303044KGNIBP AG303044KGNIBPTP AG306044KGNIBP AG306044KGNIBPTP AG313044KGNIBP AG313044KGNIBPTP AG316044KGNIBP AG316044KGNIBPTP AG303050KGNIBP AG303050KGNIBPTP AG306050KGNIBP AG306050KGNIBP TP AG313050KGNIBP AG313050KGNIBP TP AG316050KGNIBP AG316050KGNIBP TP Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Pcs/ Pcs/Reel Port Length Tape & Reel Tape & Reel Tape & Reel Tape & Reel Tape & Reel Tape & Reel Tape & Reel Tape & Reel 3mm 5.0 Vdc 6mm 330 mmhg 3mm 3.3 Vdc 6mm AG3 SMD 3mm 5.0 Vdc 6mm 375 mmhg 3mm 3.3 Vdc 6mm 18. Tape & Reel Information Reel Pin 6 Embossed carrier tape Feed direction Pin 1 Index 14 of 20

16 EH0714.pdf EH0714 V Footprint for PCB (for Reference) Sensor Code Footprint Hole for Pressure Port Diameter is depending on your design. 6 φ1.8 mm AP3xN 2.54 mm 6 φ0.9 mm 2.54 mm Land pads 15.2 mm 6 φ1.8 mm 2.54 mm 6 φ0.9 mm AP3xR 2.54 mm Land pads 15.2 mm 1.7 mm 1.4 mm 2.54 mm AG3x mm Land pads 9.4 mm 1.7 mm 2 φ1.1 mm (Holes for Projections) 1.4 mm 2.54 mm 6.0 mm 2.54 mm AG3x6 Land pads 6.0 mm 9.4 mm Notes: *1) These footprints are for reference. Please evaluate well these footprints, before your mass production. *2) When designing your PCB, please also refer to the outline diagrams. 15 of 20

17 EH0714.pdf EH0714 V Notes Fujikura reserves all rights. This document has a possibility to be changed without notice. Limitation, usage, environment, standard warranty and so on are listed on Fujikura web site. Please refer to the latest specifications. 16 of 20

18 EH0714.pdf EH0714 Appendix: Dimension Drawing APxxN 17 of 20

19 EH0714.pdf EH APxxR 18 of 20

20 EH0714.pdf EH AGxx3 19 of 20

21 EH0714.pdf EH AGxx6 20 of 20

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