CLEARCLOCK POWER OPTIMIZED 0.12ps 5x7mm XO
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- Dominick Ferguson
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1 FEATURES APPLICATIONS 0.125ps typ jitter (150fs MAX f > 200MHz, 25 C Highest in-class frequency range from 50 to 2100MHz Excellent spurious suppresion 70mA MAX I DD (LVDS, any V DD Lowest in-class power consumption Supports LVPECL, HCSL, LVDS, CML Supports ±50ppm or ±100ppm all inclusive stability -40 C to 85 C or -20 C to 70 C operation Industry standard 5x7mm footprint Networking and communications RF systems, base stations (BTS Test and measurement Cloud, server and storage, Fibre Channel 100/400GbEthernet PCI Express OPTIONS AND PART IDENTIFICATION [Note 1] Note 1: Contact Abracon for part number requests with carrier frequency callouts up to 5 & 6 digit accuracy after the decimal. - (1: Output Type P: LVPECL D: LVDS H: HCSL (* M: CML (* Frequency range limited to: 50~700MHz (2: V DD A: 3.3V B: 2.5V C: 1.8V (* (* Excluding LVPECL output (3: Stability over OTR D: ±25ppm over -20 C to +70 C (4: OE Function 1: OE Pin 1; Active High 2: OE Pin 1; Active Low 3: OE Pin 2; Active High 4: OE Pin 2; Active Low (5: Output Frequency in MHz Please specify the Frequency in units of MHz out to 4 digit accuracy after the decimal. Example: = MHz (6: Packaging Blank: Bulk C: Cut Tape 50 units T: Tape & Reel 250 units E: ±50ppm over -20 C to +70 C F: ±25ppm over -40 C to +85 C G: ±50ppm over -40 C to +85 C Part Number Example: PAF C
2 COMMON KEY ELECTRICAL SPECIFICATIONS Power Supply Voltage (V DD [Note 1] Parameters Min. Typ. Max. Unit Notes LVPECL Option P Frequency Range LVDS Option D MHz HCSL Option H CML Option M V Option B Option A Option C LVPECL Current Consumption (I DD LVDS HCSL V DD CML 63 V DD =1.8V Set Tolerance (as 25 C ±3 C <± ppm Relative to carrier Operating Temperature Range (OTR C See Options Storage Temperature C Option D or F Frequency Stability over OTR ppm Option E or G Aging over 10-Year Product Life [Note 2] ppm All Inclusive Frequency Accuracy over 10-Year Product Life [Note 2] ppm Rise (Tr / Fall Time (Tf LVPECL/LVDS/CML 0.35 ns HCSL 0.40 Specific to freq. stability option D or F (±25ppm Specific to freq. stability option E or G (±50ppm 20% 80% waveform Duty Cycle % V DD Start-up Time [Note 2] < ms Output High Voltage (V OH Output Low Voltage (V OL Output Enable (OE Control LVPECL LVDS HCSL CML V OH V DD V DD -0.8 V OL V DD -2.0 V DD V OH V OL V OH VOL V OH V DD V DD =Max V OL V DD -0.6 V DD *(V DD 0.2*(V DD V V 50Ω into V DD 2.0V or thevenin equivalent 100Ω between OUT and OUTN 50Ω to V DD 50Ω into GND
3 COMMON KEY ELECTRICAL SPECIFICATIONS PARAMETERS MIN. TYP. MAX. UNIT NOTES Output Enable Time 2.5 ms Output Disable Time 10 µs Output Disable Current Consumption RMS Phase Jitter (12kHz -20MHz BW LVPECL LVDS HCSL V dd CML 62 V dd =1.8V MHz MHz MHz MHz Note 1: Supply Voltage (Vdd = 1.8V option not available with LVPECL output Note 2: Relative to initial measured 25 C ±3 C V dd [Note 2] TYPICAL PHASE NOISE AND JITTER CHARACTERISTICS (@25 C ± 3 C Frequency (MHz RF Output LVDS LVPECL LVPECL LVPECL HCSL LVPECL LVDS LVDS RMS Phase Jitter (fsec 12kHz-20MHz BW Phase Noise (dbc/hz 100Hz kHz kHz kHz MHz MHz MHz Frequency (MHz RF Output LVPECL HCSL LVPECL LVPECL LVDS LVDS LVDS LVPECL RMS Phase Jitter (fsec 12kHz-20MHz BW Phase Noise (dbc/hz Note 2: Refer to following Section for selected Phase Noise Plots 100Hz kHz kHz kHz MHz MHz MHz
4 SELECTED PHASE NOISE PLOTS C ± 3 C MHz LVPECL V DD MHz HCSL V DD =1.8V 200MHz LVPECL V DD 312.5MHz LVDS V DD
5 SELECTED PHASE NOISE PLOTS C ± 3 C MHz LVPECL V DD MHz HCSL V DD MHZ LVPECL V DD 2100MHZ LVPECL V DD
6 TYPICAL FREQUENCY Vs. TEMPERATURE CHARACTERISTICS TYPICAL CURRENT CONSUMPTION (I DD Vs. FREQUENCY CHARACTERISTICS 25ºC ± 3ºC MECHANICAL DIMENSIONS TOP VIEW Dimensions: mm BOTTOM VIEW RECOMMENDED LAND PATTERN PIN # # 1 # 2 # 3 GND # 4 Output FUNCTION Option 1 & 2: Output Enable/ Disable Option 3 & 4: No Connect Option 1 & 2: No Connect Option 3 & 4: Output Enable/ Disable # 5 Complementary output # 6 Supply Voltage (V DD # 7 No connect # 8 No connect *Compatible with industry standard 5x7mm footprint. Pin 7 and 8 are no connect solder pads, not required.
7 RECOMMENDED TEST CIRCUIT LVDS HCSL LVPECL CML DIFFERENTIAL OUTPUT WAVEFORM
![REFLOW PROFILE [NOTE 5] [NOTE 6] [NOTE 7] ZONE DESCRIPTION TEMPERATURE TIME 1 T Preheat / Soak SMIN ~ T SMAX 150 C ~ 200 C 60 ~ 180 sec. 2 T Reflow L 217 C 60 ~ 150 sec.](/docs-images/74/71228636/images/8-4.jpg "3 T Peak heat P 260 C±5 C 20 ~ 40 sec. Note 5: Ramp Up Rate (T L T P = 3 C / sec. MAX Note 6: Ramp Down Rate (T P T L = 6 C / sec.")
8 REFLOW PROFILE [NOTE 5] [NOTE 6] [NOTE 7] ZONE DESCRIPTION TEMPERATURE TIME 1 T Preheat / Soak SMIN ~ T SMAX 150 C ~ 200 C 60 ~ 180 sec. 2 T Reflow L 217 C 60 ~ 150 sec. 3 T Peak heat P 260 C±5 C 20 ~ 40 sec. Note 5: Ramp Up Rate (T L T P = 3 C / sec. MAX Note 6: Ramp Down Rate (T P T L = 6 C / sec. MAX Note 7: Time 25 C to Peak Temperature (25 C T P = 8 minutes MAX *Can withstand 2 times reflow *All temperatures refer to topside of the package, measured on the package body surface PACKAGING C = Cut Tape 50 units T = Tape & Reel 250 units/reel FEEDING (PULL DIRECTION Tape Dimensions A 16.0 B 7.2 C 5.4 D 8.0 E 1.8 Reel Dimensions F G 16.5 H 19.6 Dimensions: mm
ESD Sensitive. Parameters Minimum Typical Maximum Units Notes ppm. Parameters Minimum Typical Maximum Units Notes
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Description OUT0 1 OUTA1 OUTA1 2 OUTA2 3 OUTA3 OUTA4 OUTB1 6 OUTB2 7 OUTB2 OUTB3 OUTB4. All trademarks are property of their respective owners.
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1 of 10 E 1 OBJECTIVE...2 2 SCOPE...2 3 GENERAL...2 4 DRAWINGS AND APPLICABLE DOCUMENTS...2 5 APPLICATION REQUIREMENTS...2 5.1 PCB layout... 2 5.2 Keep-out zone... 2 5.3 Packaging... 2 5.4 Multiple connector
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