uclamp0511z Ultra Small μclamp 1-Line ESD protection PROTECTION PRODUCTS - Z-Pak TM Description Features Mechanical Characteristics Applications
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1 - Z-Pak TM Description μclamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace 020 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp 05Z is in a 2-pin SLP0603P2X3 package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads are finished with lead-free Niu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. uclamp05z Ultra Small μclamp -Line ESD protection Features High ESD withstand Voltage: ±5kV (air), ±8kV (contact) per IEC ble to withstand over 000 ESD strikes per IEC Level 4 Ultra-small 020 package age Protects one data or power line Low reverse current: <0n typical (VR=5V) Working voltage: +/- 5V Low capacitance: 4pF typical Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3 package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: Niu Molding compound flammability rating: UL 94V-0 Marking : Marking code + dot matrix date code Packaging : Tape and Reel pplications Cellular Handsets & ccessories Keypads, Side Keys, udio Ports Portable Instrumentation Digital Lines MP3 Players Dimensions Schematic & PIN Configuration BSC Nominal Dimensions (mm) SLP0603P2X3 (Bottom View) Revision /3/200
2 bsolute Maximum Rating Rating Symbol Value Units ESD per IEC ESD per IEC (ir) (Contact) V ESD +/- 5 +/- 8 kv Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V WM R in to 2 or 2 to P 5 V Reverse Breakdown Voltage V R B I t = m Pin to 2 or 2 to V Reverse Leakage Current I R V RWM = 5V, T=25 C Pin to 2 or 2 to Clamping Voltage V C I PP =, tp = 8/20μs Pin to 2 or 2 to 3 50 n 5 V Junction Capacitance C j V R = 0V, f = MHz 4 7 pf Note: Device is electrically symmetrical 200 Semtech Corp. 2
3 Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 4.0 Peak Pulse Power - P PP (kw) Pulse Duration - tp (us) Clamping Voltage - V C (V) Waveform Parameters: 2.0 tr = 8μs td = 20μs Peak Pulse Current - I PP () Normalized Junction Capacitance vs. Reverse Voltage Typical Insertion Loss (S2) f = MHz 0 db CH S2 LOG 6 db / REF 0 db 5 : db 800 MHz 2: db 900 MHz C j (V R ) / C j (V R =0V) Reverse Voltage - V R (V) -6 db -2 db -8 db -24 db -30 db -36 db MHz 0 MHz 00 MHz 2 GHz GHz 3: db.8 GHz 4: db 2.5 GHz ESD Clamping (+8kV Contact per IEC ) STRT. 030 MHz STOP MHz ESD Clamping (-8kV Contact per IEC ) Note: Data is taken with a 0x attenuator Note: Data is taken with a 0x attenuator 200 Semtech Corp. 3
4 pplications Information Device Connection Options This device is designed to protect one data, I/O, or power supply line. The device is bidirectional and may be used on lines where the signal polarity can go above and below ground. Circuit Diagram ssembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Recommended Mounting Pattern ssembly Solder Parameter Stencil Design perture shape Recommendation Laser cut, Electro-polishe d Rectangular with rounded corners Stencil perture Mounting Pad Package S older Stencil Thickness 0.00 mm (0.004") 0.75 Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD PCB PCB Solder Pad Design Pad Finish Non-Solder mask defined OSP OR Niu Semtech Corp. 4
5 Outline Drawing - SLP0603P2X3 aaa C D TOP VIEW B E C SETING PLNE DIMENSIONS DIM MILLIMETERS MIN NOM MX b D E e BSC L N 2 aaa 0.08 bbb 0.0 bbb bxn C B e 2xL BOTTOM VIEW NOTES:. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). Land Pattern - SLP0603P2X3 (C) G Z DIMENSIONS DIM MILLIMETERS C (0.425) G 0.75 X Y Z Y X NOTES:. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). 2. THIS LND PTTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MNUFCTURING GROUP TO ENSURE YOUR COMPNY'S MNUFCTURING GUIDELINES RE MET. 200 Semtech Corp. 5
6 Marking Code Ordering Information Notes: )Dots represent date code matrix Part Number Qty per Reel Reel Size uclamp05z.tnt 0,000 7 Inch Notes: MicroClamp, uclamp and μclamp are trademarks of Semtech Corporation Carrier Tape Specification Bo Max Ko o 0 B0 K0 Device Orientation in Tape /-0.05 mm 0.7 +/-0.05 mm /-0.05 mm Note: ll dimensions in mm unless otherwise specified Contact Information Date Code Location (way from Sprocket Holes) Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, C 9302 Phone: (805)498-2 FX (805) Semtech Corp. 6
7 Contact Information for Semtech International G Taiwan Branch Tel: Fax: Korea Branch Tel: Fax: Shanghai Office Tel: Fax: Semtech International G is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.. Semtech Switzerland GmbH Tel: Japan Branch Fax: Semtech Limited (U.K.) Tel: Fax: Semtech France SRL Tel: 33-(0) Fax: 33-(0) Semtech Germany GmbH Tel: 49-(0) Fax: 49-(0) Semtech Corp. 7
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