uclamp0801t Low Profile μclamp 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp Description Features Mechanical Characteristics Applications
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1 - MicroClamp Description The μclamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp080t is in a 2-pin, SLP006P2T package. It measures.0 x 0.6 with a nominal height of only 0.4. The leads are spaced at a pitch of 0.65 and are finished with lead-free NiPdAu. Each device will protect one line operating at 8 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD iunity requirements of IEC , Level 4 (±5kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. uclamp080t Low Profile μclamp -Line ESD protection Features Transient protection for data lines to IEC (ESD) ±5kV (air), ±8kV (contact) IEC (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (.0 x 0.6 x 0.4) Protects one data line Low clamping voltage Working voltage: 8V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP006P2T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions:.0 x 0.6 x 0.4 Lead Finish: NiPdAu Molding compound flaability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Dimensions Schematic & PIN Configuration Revision 03/30/20 Nominal Dimensions () SLP006P2T (Bottom View)
2 Absolute Maximum Rating Rating Symbol Value Units ESD per IEC ESD per IEC (Air) (Contact) V ESD +/- 20 +/- 5 kv Operating Temperature T J -55 to +25 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V RWM 8 V Reverse Breakdown Voltage B I t = ma V V R Reverse Leakage Current I R V RWM = 8V, T=25 C 0.25 μa Clamping Voltage VC I PP =.5A, tp = 8/20μs 7 V Forward Voltage V F I F = 0mA. 2 V Junction Capacitance C j V R = 0V, f = MHz 0 pf Junction Capacitance C j V R = 3.3V, f = MHz 4. 5 pf 20 Semtech Corp. 2
3 Typical Characteristics Typical Insertion Loss (S2) Normalized Junction Capacitance vs. Reverse Voltage CH S2 LOG 6 db / REF 0 db : db 800 MHz.2. 0 db : db 900 MHz db -2 db -8 db -24 db 2 3 2: -9.3 db.8 GHz 3: db 2.7 GHz C J (V R ) / C J (V R =0) db db 0. 0 f = MHz Reverse Voltage - V R (V) MHz 0 MHz 00 MHz GHz 3 GHz START. 030 MHz STOP MHz 20 8 Clamping Voltage vs. Peak Pulse Current Clamping Voltage - V C (V) Waveform 4 Parameters: 2 tr = 8μs td = 20μs Peak Pulse Current - I PP (A) ESD Clamping (+8kV Contact per IEC ) ESD Clamping (-8kV Contact per IEC ) Note: ESD data is taken with a 0x attenuator 20 Semtech Corp. 3
4 Applications Information Device Connection Options This device is designed to protect one data or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Diagram Circuit Board Layout Recoendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recoended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 20 Semtech Corp. 4
5 Applications Information - Spice Model uclamp080t Spice Model uclamp080t Spice Parameters Parameter IS BV VJ RS IBV CJO TT U nit D (TVS) Amp 3.87E- 3 Volt 0. 9 Volt 0.79 Ohm 2.7 Amp.0E-3 Farad 5.7E- 2 sec 2.54E- 9 M N --. EG ev. 20 Semtech Corp. 5
6 Outline Drawing - SLP006P2T A D B aaa C A TOP VIEW A E C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A b D E e.026 BSC 0.65 BSC L R N 2 2 aaa bbb PIN ID bxn bbb C A B R e 2x L BOTTOM VIEW NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP006P2T (C) G Z X Y DIMENSIONS DIM INCHES MILLIMETERS C (.033) (0.85) G X Y Z NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 20 Semtech Corp. 6
7 Marking Code Ordering Information Part Number Working Voltage Qty per Reel Reel Size 8T PIN ID uclamp080t.tct 8V 3,000 7 Inch Notes: ) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uclamp and μclamp are marks of Semtech Corporation Tape and Reel Specification Cathode Bar User Direction of feed Device Orientation in Tape A0 B0 K / / /-0.0 Tape Width B, (Max) D D E F P P0 P2 T W (.65) ( ) 0.4 ±0.25 (.03).750±.0 (.069±.004) 3.5±0.05 (.38±.002) 4.0±0.0 (.57±.00-4) 4.0±0. (.57±.00-4) 2.0±0.05 (.079±.002) 0.254±0.02 (.06) (.32±.02) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 9302 Phone: (805)498-2 FAX (805) Semtech Corp. 7
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