µclamp3321za Ultra Small µclamp 1-Line, 3.3V ESD Protection PROTECTION PRODUCTS - µclamp Description Features Mechanical Characteristics Applications

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1 - µclamp Description µclamp TVS diodes are designed to protect sensitive electronics from damage or latc-up due to ESD. Tey are designed to replace 1 size multilayer varistors (MLVs) in portable applications suc as cell pones, notebook computers, and oter portable electronics. Tey feature large cross-sectional area junctions for conducting ig transient currents. Tis device offers desirable caracteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. µclamp 331ZA features extremely good ESD protection caracteristics igligted by low typical dynamic resistance of.33 Oms, low peak ESD clamping voltage, and ig ESD witstand voltage (+/-1kV contact per IEC 61-4-). Low maximum capacitance (pf at VR=V) minimizes loading on sensitive cirucuits. Eac device will protect one data line operating at 3.3 Volts. µclamp331za is in a -pin SLP63PX3F package. It measures.6 x.3 mm wit a nominal eigt of only.mm. Leads are finised wit NiAu. Te small package gives te designer te flexibility to protect single lines in applications were arrays are not practical. Te combination of small size and ig ESD surge capability makes tem ideal for use in portable applications suc as cellular pones, digital cameras, and tablet PC s. Features µclamp331za Ultra Small µclamp 1-Line, 3.3V ESD Protection Hig ESD witstand Voltage: +/-1kV (Contact) and +/- 17kV (Air) per IEC Ultra-small package Protects one data line Low ESD clamping voltage Working voltage: 3.3V Low capacitance: pf maximum Low leakage current Extremely low dynamic resistance:.33 Oms (Typ) Solid-state silicon-avalance tecnology Mecanical Caracteristics SLP63PX3F package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions:.6 x.3 x. mm Lead Finis: NiAu Marking: Marking code Packaging: Tape and Reel Applications Cellular Handsets & Accessories Notebook Computers Tablet PC Portable Instrumentation Periperals Package Dimensions Scematic & Pin Configuration BSC. Nominal Dimensions in mm SLP63PX3F (Bottom View) 1/8/1 1

2 Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/µs) P PK 4 W Peak Pulse Current (tp = 8/µs) I PP 4 A ESD per IEC (Air) (1) ±17 V ESD per IEC (Contact) (1) ESD ±1 Operating Temperature T J -4 to +1 O C Storage Temperature T STG - to +1 O C kv Electrical Caracteristics (T= O C unless oterwise specified) Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM Pin 1 to or Pin to V Punc-Troug Voltage V PT I PT = µa Pin 1 to or Pin to 1 Reverse Leakage Current I R V RWM = 3.3V Pin 1 to or Pin to V 1 na Clamping Voltage V C I PP = 4A, tp = 8/µs 8. V ESD Clamping Voltage V C I PP = 4A tp =./1ns ESD Clamping Voltage V C I PP = 16A tp =./1ns 6. V 1. V Dynamic Resistance, 3 R DYN tp = 1ns.33 Oms Junction Capacitance C J I/O pin to GND f = 1MHz V R = V 4. pf Notes 1)Measured wit a db attenuator, Om scope input impedance, GHz bandwidt. ESD gun return pat connected to ESD ground plane. )Transmission Line Pulse Test (TLP) Settings: tp = 1ns, tr =.ns, I TLP and V TLP averaging window: t1 = 7ns to t = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 16A 1 Semtec Corporation.

3 Typical Caracteristics ESD Clamping (8kV Contact per IEC 61-4-) ESD Clamping (-8kV Contact per IEC 61-4-) Measured wit Om scope input impedance, GHz bandwidt. Corrected for Om, db attenuator. ESD gun return pat connected to ESD ground plane. - Clamping Voltage - V C (V) Time (ns) Clamping Voltage - V C (V) Measured wit Om scope input impedance, GHz bandwidt. Corrected for Om, db attenuator. ESD gun return pat connected to ESD ground plane Time (ns) TLP Current (A) TLP Caracteristic (Positive Pulse) Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.ns, I TLP and V TLP averaging window: t 1 = 7ns to t = 9ns Clamping Voltage (V) TLP Current (A) TLP Caracteristic (Negative Pulse) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.ns, I TLP and V TLP averaging window: t 1 = 7ns to t = 9ns Clamping Voltage vs. Peak Pulse Current (tp=8/us) 1 6 Junction Capacitance vs. Reverse Voltage Peak Clamping Voltage - V C (V) T A = O C Waveform: tp= 8xus Peak Pulse Current - I PP (A) Junction Capacitance - C J (pf) f = 1MHz T= o C Voltage (V) 1 Semtec Corporation. 3

4 Applications Information Assembly Guidelines Te small size of tis device means tat some care must be taken during te mounting process to insure reliable solder joint. Te table below provides Semtec s recommended assembly guidelines for mounting tis device. Te figure at te rigt details Semtec s recommended aperture based on te below recommendations. Note tat tese are only recommendations and sould serve only as a starting point for design since tere are many factors tat affect te assembly process. Te exact manufacturing parameters will require some experimentation to get te desired solder application..7 Stencil Aperture Mounting Pad Package.17. Assembly Parameter Solder Stencil Design Aperture sape Recommendation Laser cut, Electro-polised Rectangular wit rounded corners.98.7 Recommended Mounting Pattern Solder Stencil Tickness.1 mm (.4") Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finis Type 4 size spere or smaller Per JEDEC J-STD- Non-Solder mask defined OSP OR NiAu 1 Semtec Corporation. 4

5 Outline Drawing - SLP63PX3F A aaa C A1 D TOP VIEW e/ B E A C R. TYP SEATING PLANE DIMENSIONS DIM MILLIMETERS MIN NOM MAX A.3..6 A1..1. b...4 D E e.3 BSC L N aaa.8 bbb.1 bbb bxn C A B X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP63PX3F G Z DIMENSIONS DIM MILLIMETERS G.177 X.7 Y.47 Z.671 Y X NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1 Semtec Corporation.

6 Marking Notes: Device is Electrically Symmetrical Ordering Information Part Number Qty per Reel Reel Size µclamp331zatft 1 7 Notes: 1) MicroClamp, uclamp and µclamp are trademarks of Semtec Corporation. Tape and Reel Specification Contact Information Semtec Corporation Protection Products Division Flynn Rd., Camarillo, CA 931 Pone: (8) FAX (8) Semtec Corporation. 6

RClamp5011ZA. Ultra Small RClamp 1-Line, 5V ESD Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

RClamp5011ZA. Ultra Small RClamp 1-Line, 5V ESD Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics - RailClamp Description RClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 21 size multilayer varistors (MLVs) in portable