RClamp5011ZA. Ultra Small RClamp 1-Line, 5V ESD Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics
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1 - RailClamp Description RClamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. They are designed to replace 21 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp 511ZA features extremely good ESD protection characteristics highlighted by low typical dynamic resistance of.25 Ohms, low peak ESD clamping voltage, and high ESD withstand voltage (+/-15kV contact per IEC ). Low maximum capacitance (.45pF at VR=V) minimizes loading on sensitive cirucuits. Each device will protect one high-speed data line operating at 5 Volts. RClamp511ZA is in a 2-pin SLP63P2X3F package measuring.6 x.3 mm with a nominal height of only - lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and tablet PC s. Features RClamp511ZA Ultra Small RClamp 1-Line, 5V ESD Protection High ESD withstand Voltage: +/-15kV (Contact) and +/- 18kV (Air) per IEC Ultra-small package Protects one data line Low ESD clamping voltage Working voltage: 5V Low capacitance:.45pf maximum Low leakage current Extremely low dynamic resistance:.25 Ohms (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP63P2X3F package Pb-Free, Halogen Free, RoHS/WEEE Compliant Marking: Marking code Packaging: Tape and Reel Applications HDMI USB 3. MiPi / MDDI MHL FM Antenna Package Dimensions BSC.25 Nominal Dimensions in mm SLP63P2X3F (Bottom View) 12/11/214 1
2 Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/2μs) P PK 5 W Peak Pulse Current (tp = 8/2μs) 4 A ESD per IEC (Air) (1) ±18 V ESD per IEC (Contact) (1) ESD ±15 kv Operating Temperature T J -4 to +85 O C Storage Temperature T STG -55 to +15 O C Electrical Characteristics (T=25 O Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM T = -4 to +85 O C 5 V Punch-Through Voltage V BR I PT = 1mA V Reverse Leakage Current I R V RWM = 5V <5 5 na Clamping Voltage V C = 2A, t P = 8/2μs 11.5 V = 4A, t P = 8/2μs 12.5 V ESD Clamping Voltage 2 V C = 4A tp =.2/1ns 8.5 V ESD Clamping Voltage 2 V C = 16A tp =.2/1ns 11.5 V Dynamic Resistance 2, 3 R tp =.2/1ns.25 Ohms Junction Capacitance C J VR = V; f = 1MHz.4.45 pf 1)Measured with a 4dB attenuator, 5 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 1ns, tr =.2ns, I TLP and V TLP averaging window: t1 = 7ns to t2 = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 16A 2
3 Typical Characteristics ESD Clamping (8kV Contact per IEC ) ESD Clamping (-8kV Contact per IEC ) Clamping Voltage - V C (V) Time (ns) Clamping Voltage - V C (V) Time (ns) 25 2 TLP Characteristic Clamping Voltage vs. Peak Pulse Current (tp=8/2us) TLP Current (A) Clamping Voltage (V) Peak Clamping Voltage - V C (V) T A = 25 O C Waveform: tp= 8x2us Peak Pulse Current - (A) Capacitance vs. Reverse Voltage Insertion Loss - S21 (db) Junction Capacitance - C J (pf) Voltage (V) f = 1MHz Any I/O to GND Insertion Loss (db) Frequency (GHz) 3
4 Typical Characteristics USB 3. Eye Pattern Without RClamp511ZA USB 3. Eye Pattern with RClamp511ZA HDMI 1.4 Eye Pattern Without RClamp511ZA HDMI 1.4 Eye Pattern With RClamp511ZA 4
5 Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech s recommended assembly guidelines for mounting this device. that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application..272 Stencil Aperture Mounting Pad Package Assembly Parameter Solder Stencil Design Aperture shape Recommendation Laser cut, Electro-polished Rectangular with rounded corners Recommended Mounting Pattern Solder Stencil Thickness.1 mm (.4") Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish Type 4 size sphere or smaller Per JEDEC J-STD-2 5
6 Outline Drawing - SLP63P2X3F A aaa C A1 D TOP VIEW e/2 B E A C R.25 TYP SEATING PLANE DIMENSIONS DIM MILLIMETERS MIN NOM MAX A A b D E e.355 BSC L N 2 aaa.8 bbb.1 bbb bxn C A B 2X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). G Z DIMENSIONS DIM MILLIMETERS G.177 X.272 Y.247 Z.671 Y X NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6
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