Optoelectronic packaging: from challenges to solutions
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1 Optoelectronic packaging: from challenges to solutions Seminar on Optical Packaging Alpnach Dorf Mai 16, 2012 Christian Bosshard CSEM Center Central Switzerland
2 Challenges in optoelectronic packaging General challenges Multidisciplinarity Components Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 1
3 Challenges in optoelectronic packaging General challenges Multidisciplinarity Modelling and simulation laser carrier Optical design Thermal modelling Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 2
4 Challenges in optoelectronic packaging General challenges Multidisciplinarity Bonding Optical fiber Laser Flip-chip 800 um Adhesive fixing 200 nm alignment Optical fiber assembly Automation yes/no Assembly costs: chinamation Quality assurance/yield Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 3
5 Challenges in optoelectronic packaging Beam waist change due to axial shift of lens -2.5 µm +2 µm Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 4
6 Challenges in optoelectronic packaging Influence of lateral shift of lens on beam pointing 5 µm Displacement of Collimation lens Image plane 0.35 mm 400 mm 1mm Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 5
7 Challenges in optoelectronic packaging Component fixing lens cure UV curable adhesive Effect of adhesive shrinkage due to curing has to be minimized through: amount of adhesive position of adhesive mechanical design curing procedure high repeatable processes pre-cure offset to be realized Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 6
8 Optoelectronic packaging Development and manufacturing approach Concept Design (for assembly) Optical modelling (Thermal & thermomechanical modelling) Assembly strategy Process development Testing Prototyping (Small) series production Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 7
9 Case: Multifiber connector Ultracompact multifiber connector V-groove platform containing two microlens arrays (inside adaptor housing) Laser Multi-fiber connector Adaptor housing Multi-fiber connector Insertion loss fiber-to-fiber: MMF < , 1300, 1550nm SMF , 1550nm Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 8
10 Case: Multifiber connector Folded ultracompact multifiber connector Laser Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 9
11 Case: Fiber pigtailing High-precision adhesive bonding: fiber pigtailing Passive/active alignment of optical fibers Adhesive bonding of optical fibers Optical fiber Laser 400 m Optical fiber laser 200 nm alignment accuracy Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 10
12 Case: High power laser diodes Direct diode approaches Single Mode Diode Laser Bars Multimode Single Emitter Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 11
13 Case: High power laser diodes Single Mode Diode Laser Bars 150 W (@ =980nm) small volume: 26mm x 36mm x 35mm low cost package solution Place a FAC and SAC lens in front of typ. 4 x 50 single - mode laser diodes Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 12
14 Case: High power laser diodes 150W CW single mode laser diode stack Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 13
15 Case: High power laser diodes Multimode single emitter laser diode modules 12 multi mode single emitters in one module coupled to 105 µm / NA 0.15 fiber 2 groups of 6 lasers vertically stacked Laser both combined by polarization multiplexing 100 W out of fiber 300 um Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 14
16 Case: High power laser diodes Fast axis collimation lens alignment Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 15
17 Case: High power laser diodes Multimode single emitter laser diode modules Semiautomated assembly tools Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 16
18 Case: High power laser diodes Semi-automated assembly of 100 W demonstrated highly repeatable processes very fast assembly (more than 40 optical components in less than 2 hours) easy process adaptation to different product lines miniaturized modules Laser Demonstrator footprint in housing 300 um high yield rates reliable products Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 17
19 Case: Infrared diode laser modules Full device development Assembly and packaging concept Process development Fabrication and testing of first prototypes LaserFocus World, Jan Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 18
20 Case: Atomic clocks Miniature atomic clock: general Optical Pumping Coherent Population Trapping (CPT) Laser Applications GPS Mobile base stations Time signal radio transmitters Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 19
21 Case: Atomic clocks Miniature atomic clock: optical assembly Laser Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 20
22 Case: Atomic clocks Miniature atomic clock: next level of integration 3D integration Highly accurate optical assembly, adhesive and solder bonding 15mm 15mm Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 21
23 Technologies Microsystems Packaging Design, Simulation, Prototyping, Small Series Production Chip/Wafer Bonding (Vacuum Encapsulation, Controlled Atmosphere): Eutectic, Adhesive Bonding, Die and Flip-Chip Bonding (AuSn, ) 800 um Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 22
24 Technologies Microsystems Packaging High-Precision Assembly Automated Assembly / Manufacturing Reliability & Functional Testing Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 23
25 Technologies Packaging infrastructure Class Temperature controlled Humidity controlled Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 24
26 Small series production Flip-chip, die-bonding, optical component bonding Flip-chip bonding of laser dies High-precision adhesive fixing of optical elements Copyright 2012 CSEM Optical Packaging Christian Bosshard Page 25
27 Thank you for your attention! Project support by the CTI, the Swiss innovation promotion agency, is gratefully acknowledged
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