Safe Harbor. February 21, Micron Technology, Inc. 2

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2 Safe Harbor During the course of this meeting, we may make projections or other forward-looking statements regarding future events or the future financial performance of the Company and the industry. We wish to caution you that such statements are predictions and that actual events or results may differ materially. We refer you to the documents the Company files on a consolidated basis from time to time with Securities and Exchange Commission, specifically the Company s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our projections or forward-looking statements. These certain factors can be found at Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of the presentation to conform these statements to actual results Micron Technology, Inc. 2

3 2011 Micron Winter Analyst Conference Steve Appleton Chairman and CEO 2011 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an AS IS basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners Micron Technology, Inc. 3

4 Micron Evolution Recognized Need for Strategic Shift Leverage Technology Expertise Pursue Efficient Capital Deployment (cheap assets with scale & partnerships) Product Portfolio Expansion All NOR Resources to NAND Photobit (Aptina) Toshiba DRAM IMFT FY2006 Revenue $5.3B Income $408M E.P.S. $0.57 Lexar MeiYa / Inotera FY2010 Revenue $8.4B Income $1.85B Cash Flow $3.0B E.P.S. $1.85 Numonyx Decrease in Long Term DRAM Annual Bit Growth to < 50% year First Bankruptcy and Liquidation of a DRAM Company in History Customer Consolidation in Computing Government Subsidized Companies 2011 Micron Technology, Inc. 4

5 Application Revenue Diversification 100% 4% 5% 4% 2% 90% 9% 11% 11% 17% 80% 70% 23% 18% 15% 15% AIMM 60% 50% 26% 26% 20% 15% Networking & Storage Server 10% Consumer 40% 5% 6% 24% Mobile 30% 20% 10% 33% 34% 40% 27% Personal Systems 0% FY08 FY09 FY10 FY11 Includes DRAM, NAND, and NOR; NOR does not include purchase accounting adjustments 2011 Micron Technology, Inc. 5

6 % of Micron Total Revenues Segment Revenue Diversification DRAM NAND NOR Imager 100% 17% 12% 11% 11% 4% 3% 5% 19% 80% 6% 23% 35% 39% 34% 60% 31% 40% 77% 65% 20% 54% 50% 57% 47% 0% FY 2006 FY 2007 FY 2008 FY 2009 FY 2010 FQ Micron Technology, Inc. 6

7 Organization Structure Chairman & CEO President & COO DRAM Solutions NAND Solutions Embedded Solutions Wireless Solutions WW Sales WW Operations, Procurement Memory Architecture, Process R&D, Engineering Corp. Dev., Finance, HR, Integration, Legal 2011 Micron Technology, Inc. 7

9 DRAM Solutions Group Brian Shirley Vice President 2011 Micron Technology, Inc. 9

DRAM Solutions Group - DSG Server Networking & Storage Graphics Personal Computing Cloud computing and virtualization

DRAM needs PC s converted to DDR3 and up to 4GB Further drives DRAM density, performance needs, and power concerns Intel s

console planning underway with unparalleled speed needs Speed requirements increasing to 2Gbps + Tablets using DDR2 today,

10 DRAM Solutions Group - DSG Server Networking & Storage Graphics Personal Computing Cloud computing and virtualization driving need for more cores High-end routers running past traditional DRAM limits Visual enhancements are driving increased DRAM needs PC s converted to DDR3 and up to 4GB Further drives DRAM density, performance needs, and power concerns Intel s Romley launch in 2H 11 Customer premise equipment market exploding (CPE) Exploding demand from Storage market New game console planning underway with unparalleled speed needs Speed requirements increasing to 2Gbps + Tablets using DDR2 today, soon DDR3 and early DDR4 due to power Sandy Bridge integrates GPU on to CPU, pushing up main memory needs 2011 Micron Technology, Inc. 10

11 DRAM Solutions Group - DSG Server Networking & Storage Graphics Personal Computing Cloud computing and virtualization driving need for more cores High-end routers running past traditional DRAM limits Visual enhancements are driving increased DRAM needs PC s converted to DDR3 and up to 4GB Further drives DRAM density, performance needs, and power concerns Intel s Romley launch in 2H 11 Customer premise equipment market exploding (CPE) Exploding demand from Storage market New game console planning underway with unparalleled speed needs Speed requirements increasing to 2Gbps + Tablets using DDR2 today, soon DDR3 and early DDR4 due to power Sandy Bridge integrates GPU on to CPU, pushing up main memory needs Increasing need for high density, high speed, low power DRAM solutions: Micron s DRAM portfolio drives the world s infrastructure 2011 Micron Technology, Inc. 11

Millions Systems Shipped MB/System Leading in New Applications: Tablets Tablet Shipment Growth One of the Hottest Items at CES 2011 250 3,000 200 2,400 2011 Tablet shipments projected to grow 3x 150

12 Millions Systems Shipped MB/System Leading in New Applications: Tablets Tablet Shipment Growth One of the Hottest Items at CES , , Tablet shipments projected to grow 3x 150 1,800 Projected to out-ship desktops by ,200 Utilize a wide range of DRAM Power is Key for Tablets Tablet Systems Shipped Tablet Memory Content Source: Gartner 4Q 10; Micron Market Research 2011 Micron Technology, Inc. 12

Leading with New Interfaces: DDR4 optimized for power and performance DDR4 Market Introduction The next major standard 100% 80% 60% 40% 20% 0% 2009 2010 2011 2012 2013 2014 SDR DDR DDR2 DDR3 DDR4

13 Leading with New Interfaces: DDR4 optimized for power and performance DDR4 Market Introduction The next major standard 100% 80% 60% 40% 20% 0% SDR DDR DDR2 DDR3 DDR4 Potential DDR4 Lead Applications DDR4 introduction expected in 2012 Main interest in power sensitive applications Key improvements over DDR3 Higher Bandwidth: Up to 3.2 Gbps Power Consumption: 1.2V drives big improvement High Density: 128Gb in single-stack, single-load Ideal Memory for variety of applications Server ideal due to power & performance benefits Tablet PC benefit from low voltage Fast introduction in Notebooks expected Servers Best solution for high density DIMMs Significant power reduction Notebooks Further power saving due to 1.2V Performance increase to address future applications Tablet PCs Ideal application to use low power features Fast adoption due to variety of controller vendors Micron fully committed to DDR4 introduction Driving JEDEC standardization Early development of DDR4 with introduction in 1H 2012 Source: Gartner 4Q Micron Technology, Inc. 13

Leading with New Technology: 3x nm Improved Performance, Power-efficiency and Cost High-performance 1Gb, 2Gb and 4Gb DDR3 products for broad range of applications across

2V ~50% more 4Gb chips per wafer versus 42nm Enabling standard module densities of up to 64GB Lead Technology for DDR4 Introduction Key Features and Portfolio Roll-out

14 Leading with New Technology: 3x nm Improved Performance, Power-efficiency and Cost High-performance 1Gb, 2Gb and 4Gb DDR3 products for broad range of applications across all market segments Further power reductions and functionality down to 1.2V ~50% more 4Gb chips per wafer versus 42nm Enabling standard module densities of up to 64GB Lead Technology for DDR4 Introduction Key Features and Portfolio Roll-out Key features: High speed operation up to 1866 Gbps DDR3 and 2400 Gbps DDR4 Fully 1.50V and 1.35V compatible DDR3 and 1.20V on DDR4 Technology and circuit design related power improvements for best-in-class power First samples available now 2011 Micron Technology, Inc. 14

Leading with New Form Factors: LRDIMM Fully Populated System 67% Higher Bandwidth Higher-density modules at improved performance IT, virtualization, and

1333 Mbps Micron LRDIMM Micron s new LRDIMM technology delivers a high performance, cost effective solution to address today s IT system challenges

15 Leading with New Form Factors: LRDIMM Fully Populated System 67% Higher Bandwidth Higher-density modules at improved performance IT, virtualization, and datacenters need for higher density 50% Higher System Capacity Standard DIMMS limit scaling of capacity and performance 512GB 800 Mbps Standard DIMM 768GB 1333 Mbps Micron LRDIMM Micron s new LRDIMM technology delivers a high performance, cost effective solution to address today s IT system challenges Happening Now Roll-out of Portfolio Roll-out of Portfolio Broad Standard and VLP Portfolio Module Densities up to 64GB Samples available now 2011 Micron Technology, Inc. 15

Leading with New Products: RLDRAM3 The best low-latency DRAM gets better Unprecedented performance for high-end networking Comparable to SRAM access time

Improved performance: random access time down to 10ns write and 2.

16 Leading with New Products: RLDRAM3 The best low-latency DRAM gets better Unprecedented performance for high-end networking Comparable to SRAM access time at superior cost and density Easy transition path from RL2 platforms High interest of customers and key enablers Extended success of RLDRAM2 with RLDRAM3 Improved performance: random access time down to 10ns write and 2.5ns read doubled sustainable bandwidth of 2133 Gbps power-efficiency and high memory density Memory densities of 576Mb and 1.1Gb Samples available mid 2011, production in 2H nd source partner identified 2011 Micron Technology, Inc. 16

Leading with New Innovations Revolutionary Approach to Break Through the Memory Wall Evolutionary DRAM roadmaps hit limitations of bandwidth and power efficiency Micron introduces a new class of

Micron-designed logic controller High speed link to CPU Massively parallel Through Silicon Via connection to DRAM TSV connections Unparalleled performance: Up to 20X the bandwidth of a full DDR3

17 Leading with New Innovations Revolutionary Approach to Break Through the Memory Wall Evolutionary DRAM roadmaps hit limitations of bandwidth and power efficiency Micron introduces a new class of memory: Hybrid Memory Cube Unique combination of DRAMs on Logic smashes through the wall Key Features and Roll-Out How did we do it? Micron-designed logic controller High speed link to CPU Massively parallel Through Silicon Via connection to DRAM TSV connections Unparalleled performance: Up to 20X the bandwidth of a full DDR3 DIMM Using a 10th of the power per bit Occupying an 8th of the space of an RDIMM Targeting high performance computing and networking, eventually migrating into computing and consumer Full silicon prototypes in silicon TODAY 2011 Micron Technology, Inc. 17

18 Hybrid Memory Cube Prototype Micron Technology, Inc. 18

19 DRAM Solutions Group Focus on segments driven by exploding bandwidth and computing needs Broad product portfolio focused on optimal solutions across performance, power, and density Leadership in next generation solutions, driving enhanced margin opportunities 2011 Micron Technology, Inc. 19

21 NAND Solutions Group Glen Hawk Vice President 2011 Micron Technology, Inc. 21

GB (M) NAND Market Diversity 100% 2010 2014 NAND Bit CAGR 90% Tablets 140% 80% 70% SSD 118% 60% MP3/PMP USB 36% 59% 50% DSC/VIDEO 46% 40% 30% Mobile 71% 20% 10%

22 GB (M) NAND Market Diversity 100% NAND Bit CAGR 90% Tablets 140% 80% 70% SSD 118% 60% MP3/PMP USB 36% 59% 50% DSC/VIDEO 46% 40% 30% Mobile 71% 20% 10% PC/Comp (Non-SSD) 97% 0% Embedded, AIMM' % Source: Gartner 4Q10; Cards included in Mobile and DSC 2011 Micron Technology, Inc. 22

GB (M) Micron s Business Units focused on NAND 100% 90% Tablets 80%

5B market in 2011 going to $7B+ in 2014 70% 60% NAND Solutions Group

Mobile 10% 0% Embedded Solutions Group PC/Comp (Non-SSD) Embedded,

23 GB (M) Micron s Business Units focused on NAND 100% 90% Tablets 80% SSDs $2.5B market in 2011 going to $7B+ in % 60% NAND Solutions Group SSD MP3/PMP USB 50% DSC/VIDEO 40% 30% 20% Wireless Solutions Group Mobile 10% 0% Embedded Solutions Group PC/Comp (Non-SSD) Embedded, AIMM' Source: Gartner 4Q10; Cards included in Mobile and DSC 2011 Micron Technology, Inc. 23

24 Digitization of Photography 2011 Micron Technology, Inc. 24

25 Digitization of Photography 2011 Micron Technology, Inc. 25

26 Transformation of File Storage 2011 Micron Technology, Inc. 26

27 Transformation of File Storage 2011 Micron Technology, Inc. 27

28 Revolution of Music 2011 Micron Technology, Inc. 28

29 Revolution of Music 2011 Micron Technology, Inc. 29

30 The Next Revolution: Computing 2011 Micron Technology, Inc. 30

31 The Next Revolution: Computing Micron ReadlSSD TM C400 for Client P300 for Enterprise 2011 Micron Technology, Inc. 31

GB (M) NAND in New Applications 120.0 2010 2014 NAND Bit CAGR 100.0 Tablets 140% 80.0 SSD 118% 60.0 2010 2014 Total NAND Bit CAGR: 78% MP3/PMP USB DSC/VIDEO 36% 59% 46% 40.

32 GB (M) NAND in New Applications NAND Bit CAGR Tablets 140% 80.0 SSD 118% Total NAND Bit CAGR: 78% MP3/PMP USB DSC/VIDEO 36% 59% 46% 40.0 Mobile 71% 20.0 PC/Comp (Non-SSD) 97% 0.0 Embedded, AIMM' % Source: Gartner 4Q10; Cards included in Mobile and DSC 2011 Micron Technology, Inc. 32

33 SSD Revenue ($B) 1GB EU SSD ASP 1GB EU SSD Shipments (M) Enterprise Commands Significant ASP Upside 8,000 7,000 Enterprise PC $25 Enterprise SSD PC SSD 6,000 5,000 $ ,000 3,000 $20 2,000 1, $15 $14.76 Enterprise PC $3.5 $3.0 $10 $2.5 $8.41 $2.0 $1.5 $5 $5.29 $1.0 $0.5 $2.47 $1.53 $3.32 $2.26 $ $0 $1.07 $0.86 $0.63 $ Source: IDC 3Q Micron Technology, Inc. 33

34 Process Node (nm) NAND Silicon Leadership 60 Company A Micron Company B Company C 50 5x nm x nm 2x nm C1Q07 C1Q08 C1Q09 C1Q10 Volume Production Dates Data based on publically available information 2011 Micron Technology, Inc. 34

35 NAND System Solution Leadership Client SSD Accolades C300/C400 Enterprise SSD Accolades P300 Dubbed RealSSD P300, this new series comes out of the gates with SATA 6Gbps support -- a first ever for the enterprise market delivering 44,000 IOPS for random reads and 16,000 IOPS for random writes to target demanding enterprise applications. enterprise SSD suppliers lacking a fab partnership, who buy flash chips on the general market, may be at a disadvantage All in all, the P300 deserves a strong look when trying to improve server performance. Memory & Storage: Micron Technology C300 and P300 solid-state drives Micron Technology, Inc. 35

36 Enterprise Revenue ($B) Enterprise HDD and SSD Revenue $6.00 Enterprise SSD (NAND Producers) Enterprise SSD (3 rd Parties) Enterprise HDD $ $5.2 $5.8 $6.08 $2.00 $0.70 $4.80 $5.13 $2.5 - $3.1 $0.49 $0.35 $0.39 $0.16 $0.00 $ Sources: isuppli 4Q10; IDC 3Q10; Micron Market Research 2011 Micron Technology, Inc. 36

37 NAND Solutions Group Business unit dedicated to the rapidly growing NAND data storage market Exploiting technology leadership, from Silicon to Systems Targeting incremental margin opportunities in premium segments, as a complete storage system provider 2011 Micron Technology, Inc. 37

39 Wireless Solutions Group Mario Licciardello Vice President 2011 Micron Technology, Inc. 39

40 Flash DRAM Flash DRAM Flash DRAM Flash DRAM Flash DRAM Flash DRAM Units (M) Units (M) Market Dynamics Smart Phone Non Smart Phone NOR PCM NAND mdram psram 1,200 1,800 1,600 1, ,400 1,200 1, Segmentation Technology Trends SmartPhone & Premium ASP >$150 Entry ASP < 150$ Growth accelerator for both NAND and DRAM (LPDDR1 LPDDR2) High Volume, long term market for NOR/PSRAM & Growth Driver for PCM & Low Density LPDDR2 Source: isuppli 4Q10; Flash memory forecast 2012 and beyond and DRAM forecast from Micron WSG Q Micron Technology, Inc. 40

41 Mobile Memory Revenue ($B) Mobile Memory Market $20.0 NAND Market strong growth $18.0 $16.0 Density (GB) growing faster than litho migration $14.0 mdram DRAM Market sustained $12.0 $ $B psram NOR LPDDR1 LPDDR2 LPDDR3 / Wide I/O Density Growth per Handset 128Mb 8Gb $8.0 $6.0 $4.0 $2.0 $0.0 6$B 1$B 2$B Source: Isuppli Q NAND NOR + PCM Market stable PCM compensating NOR Market erosion starting early 2012 PSRAM Market declining Strongly associated to low Density NOR PSRAM LPDDR Source: isuppli, 4Q Micron Technology, Inc. 41

42 Leading Wireless Memory Supplier Micron memory present in more than 550 million phones in 2010 Key memory supplier of all top leading phone manufacturers Well positioned to capitalize on SmartPhone market growth Full range of optimized Memory Solutions Driving and committed to next generation standards 2011 Micron Technology, Inc. 42

Micron Addresses All Mobile Market Sub-Segments Entry /

+LPDDR MCP OneNAND + LPDDR MCP NAND + LPDDR MCP PCM+LPDDR2MCP*

mmc Discrete LP DDR1/LP DDR2 PoP LP DDR3* Wide I/O* e.

43 Micron Addresses All Mobile Market Sub-Segments Entry / Connectivity Smart Phones Media Tablet NOR+ PSRAM MCP NOR +LPDDR MCP OneNAND + LPDDR MCP NAND + LPDDR MCP PCM+LPDDR2MCP* NAND + LP DDR MCP e.mmc + LP DDR2 MCP e.mmc Discrete LP DDR1/LP DDR2 PoP LP DDR3* Wide I/O* e.mmc Discrete LP DDR1 LP DDR2 LP DDR3* Wide I/O* *In Design and/or Development 2011 Micron Technology, Inc. 43

44 Industry s Most Advanced Mobile Memory Solutions 34 / 25 nm NAND (SLC) 50 / 42 nm Mobile DRAM (LPDDR1 or LPDDR2) 25 nm e.mmc4.41 NAND MCP Packaging Options 1Gb 2Gb 256Mb 1Gb 512MB - 2GB (SLC) 4Gb 16Gb 2Gb 4Gb 4GB - 32GB (MLC) SLC NAND + LPDDR1/2 e.mmc LPDDR1/2 65 / 45 nm NOR 50 nm Mobile RAM NOR MCP Packaging Options 32 Mb 256Mb 16Mb 128Mb PSRAM 512 Mb 1Gb 128Mb 512Mb LPDDR NOR + PSRAM NOR + LPDDR Mobile DRAM Discrete LPDDR1 or LPDDR2 (POP) e.mmc 4.41 Discrete (BGA) 2011 Micron Technology, Inc. 44

Entry Segment - Convergence to PCM 512Mb 1Gb 2Gb DDR800 x16 LOW MAINSTREAM

Chipset DDR800, x32 PCM-LPDDR2N + LP-DDR2 SHARED BUS PCM LPDDR2 SDRAM 1Gb

Endurance Long term cost reduction path Improved System performances Lower

45 Entry Segment - Convergence to PCM 512Mb 1Gb 2Gb DDR800 x16 LOW MAINSTREAM Low Cost 3G OneNAND + DDR SLCNAND + SDR/DDR NOR + SDR/DDR NOR ADMUX + PSRAM Chipset DDR800, x32 PCM-LPDDR2N + LP-DDR2 SHARED BUS PCM LPDDR2 SDRAM 1Gb PCM 45nm Benefits Reduces PCB complexity & cost Improved Reliability & Endurance Long term cost reduction path Improved System performances Lower BOM Cost Improved User experience Lower Power Consumption 2011 Micron Technology, Inc. 45

46 Smart Phone s Dependence on NAND Leverages Micron s Strengths Category / 2011 needs Density Raw NAND LP-DRAM e.mmc High-end Smartphone 4-16Gb 4Gb GB Low-end Smartphone 4Gb 2Gb 4-16GB Feature Phone 1-2Gb 512-1Gb 2-8GB 2011 Micron Technology, Inc. 46

PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless Unit Shipments (M) Tablets, the Next Major Opportunity Strong Market Reaction Expected 57Mu Tablet in 11, > 100Mu

47 PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless PC Wireless Unit Shipments (M) Tablets, the Next Major Opportunity Strong Market Reaction Expected 57Mu Tablet in 11, > 100Mu expected in Desktop PC Mobile PC Smartphone Tablet Total Convergence between Computing & Consumer in Mobile Environment Connectivity & Mobility are the Key success factors Mobile BOM fully supported by Micron s Memory Portfolio: LPDDR1/2: 4Gb+ LPDDR3, Wide I/O e.mmc: 32GB+ UFS System Memory for 3G+ modem NAND / NOR PCM Source: isuppli, 4Q Micron Technology, Inc. 47

48 Wireless Solutions Group Industry s broadest portfolio of DRAM, NAND, and NOR products to address the wireless market Targeting growth and market share opportunities in smart phones and tablets Focusing on technology leadership, customer satisfaction, and execution excellence for margin optimization across the spectrum of wireless markets 2011 Micron Technology, Inc. 48

50 Embedded Solutions Group Tom Eby Vice President 2011 Micron Technology, Inc. 50

51 The Embedded Memory Market Segment Diversity PC (NOR) Consumer Automotive IMM* Networking 2011 $9.5B Opportunity Technology Diversity NOR DRAM NAND Customer Diversity Customers Top 50 Customers Sources: isuppli, Micron Market Research *IMM: Industrial, Medical, Mil/Aero 2011 Micron Technology, Inc. 51

K Wafers Need for Leading Edge Technology AND Longevity Mainstream Products ESG: Consumer, PC DSG: Server, Networking NSG: Storage, SSD WSG: Smart Phones Leading Edge Products Initial Ramp DSG: PC

52 K Wafers Need for Leading Edge Technology AND Longevity Mainstream Products ESG: Consumer, PC DSG: Server, Networking NSG: Storage, SSD WSG: Smart Phones Leading Edge Products Initial Ramp DSG: PC NSG: Storage, Removable, PMP Legacy Products Long Lifecycles ESG: Automotive, IMM, Networking Ramp Next Node Leading Lithos ESG Outlook Legacy Lithos Micron estimates Normalized to 300mm wafers 2011 Micron Technology, Inc. 52

53 Micron s Competitive Advantage in the Embedded Markets Competitor Ranking Product Line Breadth Segment Focus Leading Edge Technology Longevity Cost 2011 Micron Technology, Inc. 53

Mil/Aero Industrial Networking: Wireless

54 $M Millions of MB Embedded Applications $M Millions of MB $1,300 Automotive: Infotainment Drives Growth $2,500 IMM: $2B Market, New Focus for Micron $ Infotainment Other Automotive Segments $ Medical Mil/Aero Industrial Networking: Wireless Data Drives Bit Growth Consumer: Explosive NAND/DRAM Bit Growth 90 1, DRAM NAND NOR NAND DRAM NOR Sources: isuppli, Infonetics, Micron Market Research 2011 Micron Technology, Inc. 54

55 Micron s Strategy to Win in Embedded Product Breadth 2011 Micron Technology, Inc. 55

56 Micron s Strategy to Win in Embedded Technology Leadership 2011 Micron Technology, Inc. 56

57 Micron s Strategy to Win in Embedded Stability 2011 Micron Technology, Inc. 57

58 Micron s Strategy to Win in Embedded Trusted Memory Advisor 2011 Micron Technology, Inc. 58

59 Embedded Solutions Group Targeting growth opportunities in this highmargin segment addressing a large and diverse customer base Broad product portfolio and technology leadership across DRAM, NAND, and NOR Strong customer support capabilities with supply stability and world-class service for direct and indirect sales 2011 Micron Technology, Inc. 59

61 Efficient Operating Model Mark Durcan President and COO 2011 Micron Technology, Inc. 61

62 Organization Structure Chairman & CEO President & COO DRAM Solutions NAND Solutions Embedded Solutions Wireless Solutions WW Sales WW Operations, Procurement Memory Architecture, Process R&D, Engineering Corp. Dev., Finance, HR, Integration, Legal 2011 Micron Technology, Inc. 62

63 Efficient and Effective Partnerships MP MASK 2011 Micron Technology, Inc. 63

64 Global Scale, Resources, and Capital Scotland California Idaho Minnesota Utah Colorado Virginia Texas England Switzerland Italy Israel China S. Korea Japan Puerto Rico India Malaysia Singapore Taiwan Philippines Idaho Utah Virginia Puerto Rico Italy Singapore Japan California Israel Italy Singapore Taiwan China Malaysia 2011 Micron Technology, Inc. 64

65 IM Flash Singapore 2011 Micron Technology, Inc. 65

Wafer Outs Per Month (300mm EU) IM Flash Singapore Update 120,000 Today 1Q 11 100,000 80,000 60,000 Additional capacity is

66 Wafer Outs Per Month (300mm EU) IM Flash Singapore Update 120,000 Today 1Q ,000 80,000 60,000 Additional capacity is dependant on market conditions 40, nm 20, nm Source: Micron LPI WW Micron Technology, Inc. 66

67 25nm NAND Prime Die Wafer Map IMFS 97% Yield 25nm Wafer 2011 Micron Technology, Inc. 67

68 Wafer Start Per Month Inotera Update 140,000 Today 1Q11 120, ,000 80,000 Trench 60, nm 40, nm 20,000-3x nm x nm Source: Company Data 2011 Micron Technology, Inc. 68

69 Manassas Fab 2011 Micron Technology, Inc. 69

Wafer Outs Per Month (300mm EU) MTV Capacity

50,000 25 nm (NAND) 20 nm (NAND) 40,000 30,000

(DRAM) - 2010 2012 200mm includes DRAM and NOR

70 Wafer Outs Per Month (300mm EU) MTV Capacity 80,000 Today 1Q 11 70,000 60, nm (NAND) 50, nm (NAND) 20 nm (NAND) 40,000 30, nm (DRAM) 20, nm (DRAM) 10,000 3x nm (DRAM) mm includes DRAM and NOR 200mm Capacity 2011 Micron Technology, Inc. 70

71 Wafer Outs Per Month (300mm EU) 450, ,000 Micron Fab Capacity Today 1Q 11 IMFS (based on market) 350,000 IMFS 300, ,000 Inotera 200,000 TECH 150,000 MTV 100,000 50,000 IMFT - 200mm mm includes DRAM and NOR 200mm Capacity 2011 Micron Technology, Inc. 71

72 Industry-Leading Advanced Memory Products Micron 64Gb 20nm NAND 1XYmm 2 Micron 4Gb 3x nm DRAM 38mm 2 Micron 4Gb 45 nm NOR 8Xmm 2 Images have been intentionally altered for IP protection 2011 Micron Technology, Inc. 72

73 Emerging Memory Strategy A very large number of emerging memory technologies with different strengths (table below) Careful evaluation, strategic partnerships, and internal evaluations to achieve successful positioning RISK Low Medium High Extreme Data Retention NAND PCM PCMS MVO CBRAM STT-RAM FeRAM MRAM Molecular Bit Density (Cost) Endurance Power Per Bit Manufacturability 2011 Micron Technology, Inc. 73

74 Micron Global Sales Channels Micron Sales Channels OEM Retail E-commerce Distribution Optimized to support four business units Support diverse and differentiated businesses Covering the full spectrum of available sales channels 2011 Micron Technology, Inc. 74

75 Operations Scaling and technology development through partnerships Cost reduction runway Advanced technology leadership Sales channels optimized to support diverse and differentiated businesses 2011 Micron Technology, Inc. 75

77 Financial Strength and Leverage Ron Foster CFO 2011 Micron Technology, Inc. 77

Micron Business Model Actions Competitive Position

Increased Capital Efficiency & Scale Accelerated

78 Micron Business Model Actions Competitive Position Results Product Line Expansion Business Unit Focus JV Operating Model Broader Market Access & Diversification Accelerated Technology Deployment Increased Capital Efficiency & Scale Accelerated Growth Expanded Margins Broader Customer Engagement 2011 Micron Technology, Inc. 78

79 Micron s Business Unit Structure Business Units by Market DRAM Solutions Group NAND Solutions Group Embedded Solutions Group Wireless Solutions Group DRAM only High-volume DRAM sold to: PC Consumer Electronics Networking Server NAND only High-volume NAND sold to: Data Storage Personal Music Players Foundry sales to Intel (IMFT) DRAM, NAND, NOR Sold to: Automotive Industrial Networking Server NOR, NAND to: Consumer Electronics DRAM, NAND, NOR Sold to: Mobile Networking PC, Server 2011 Micron Technology, Inc. 79

80 FQ1 11 by Business Unit (Estimate) 23% 22% 12% 3% 40% Revenue 2011 Micron Technology, Inc. 80

Nanya 30% 50% 3 50% 1 With delay of 12 months following change in

81 Manufacturing and Technology JVs Ownership Output Share Output Share NAND Micron Micron Intel 51% 51% 49% 78% 2 78% 1 22% 1 DRAM Micron Micron Nanya 30% 50% 3 50% 1 With delay of 12 months following change in ownership 2 As of December Not tied to Ownership 2011 Micron Technology, Inc. 81

82 Joint Venture Strategy Leverage through Scale and Shared Investment R&D 2010 DRAM Partner Funding* $135M NAND Partner Funding $104M Micron R&D $624M * DRAM partner funding includes $84M for royalties and other R&D services recorded as 2010 revenue 2011 Micron Technology, Inc. 82

83 TECH Buyout Canon 10% HP 3% Micron 87% Micron 100% Balance Sheet Impact Assets Cash $(159) Equity Small Impact to P&L (Minority Interest) Q1 10 Q2 10 Q3 10 Q Q1 11 Non-controlling Interest $224 Additional Paid in Capital $(65) $(2) $14 $21 $17 $50 $17 Total $M $(159) $ Micron Technology, Inc. 83

84 Debt to Capital 90% Debt to Capital Ratio (Most Recent Quarter) Debt to Capital = (LT Debt + Current Portion of LT Debt + ST Borrowings) / (LT Debt + Current Portion of LT Debt + ST Borrowings + Balance Sheet Equity + Minority Interest) 80% 82% 70% 60% 50% 56% 57% 60% 66% 40% 42% 30% 35% 20% 10% 15% 0% Micron FQ1-11 Winbond CQ4-10 Hynix CQ4-10 Elpida CQ4-10 Inotera CQ4-10 Powerchip CQ3-10 Nanya CQ3-10 ProMOS CQ3-10 Source: Company Data, Micron Market Research 2011 Micron Technology, Inc. 84

Millions of US$ Net Cash Position (Most Recent Quarter) $1,000 Net Cash = Gross Cash - (Long-term Debt + Short-term Borrowings + Current Portion of LT Debt) $500 $595 $0 -$500 -$510 -$1,000 -$1,500

85 Millions of US$ Net Cash Position (Most Recent Quarter) $1,000 Net Cash = Gross Cash - (Long-term Debt + Short-term Borrowings + Current Portion of LT Debt) $500 $595 $0 -$500 -$510 -$1,000 -$1,500 -$1,771 -$1,825 -$1,856 -$2,000 -$2,077 -$2,500 -$3,000 -$3,190 -$3,215 -$3,500 Micron FQ1-11 Winbond CQ4-10 Powerchip CQ3-10 ProMOS CQ3-10 Nanya CQ3-10 Inotera CQ4-10 Elpida CQ4-10 Hynix CQ4-10 Source: Company Data, Micron Market Research 2011 Micron Technology, Inc. 85

86 Cash to Short-term Debt Cash to Short-Term Debt (Most Recent Quarter) 6.0x Cash to ST Debt = Cash / (Short-term Borrowings + Current Portion of LT Debt) 5.0x 5.2x 4.0x 3.0x 2.0x 1.0x 1.3x 0.9x 0.6x 0.0x Micron FQ1-11 Elpida CQ4-10 Hynix CQ4-10 Winbond CQ x 0.2x 0.2x 0.1x Inotera CQ4-10 Nanya CQ3-10 Powerchip CQ3-10 ProMOS CQ3-10 Source: Company Data, Micron Market Research Note: Short-term debt includes lease obligations 2011 Micron Technology, Inc. 86

87 Revenue by Geography Micron FY 10 Sales Revenue Asia 1 Americas 2 Europe Source: Micron Technology, Inc Form 10-K 1 Asia includes China, Asia Pacific, Malaysia, and Taiwan 2 Americas includes United States and Other 2011 Micron Technology, Inc. 87

88 Micron s Total Wafer Production by Geography 0 0% 0 0% Americas 37% Asia/Pac 56% Japan 4% Europe 3% CY2008 CY2012F 2011 Micron Technology, Inc. 88

89 FY2011 CapEx Guidance NOR & Other DRAM NAND $2.4B - $2.9B 2011 Micron Technology, Inc. 89

90 Financial Strength and Leverage Cost and growth leverage with partnership models and increasingly low-cost manufacturing base Capital deployment focused on high growth NAND market with positive P&L implications going forward Strong financial position versus competitors 2011 Micron Technology, Inc. 90

92 Memory Leadership Steve Appleton Chairman and CEO 2011 Micron Technology, Inc. 92

93 $B DRAM vs NAND Market Development $30 DRAM Revenue: NAND Revenue: E $25 $20 $15 $10 $5 $ Year Source: Gartner 4Q Micron Technology, Inc. 93

94 Millions of $US Memory Industry CapEx $40,000 $35,000 1,950 NOR NAND DRAM $30,000 11,783 $25,000 2,165 $20,000 8,707 1, ,856 7,111 $15,000 5,371 7,177 9,638 $10,000 $5,000 $ ,843 18, ,862 16,395 12,962 2,669 13,332 11,486 11,527 11,669 11,752 9,970 7,730 6,583 6,229 6,533 6,066 5,351 3,870 4, Source: Gartner 4Q Micron Technology, Inc. 94

DRAM Bit Supply Growth Forecasts Point to Technology as the Main DRAM Industry Supply Growth Driver Utilization Capacity Technology Supply Growth 90% 87% 70% 37% 63% 50% 52% 25% 50% 46% 50% 48% 30%

95 DRAM Bit Supply Growth Forecasts Point to Technology as the Main DRAM Industry Supply Growth Driver Utilization Capacity Technology Supply Growth 90% 87% 70% 37% 63% 50% 52% 25% 50% 46% 50% 48% 30% 46% 22% 31% 49% 41% 10% 26% 1% 3% 36% 20% -7% -8% 0% 14% 2% 0% 5% 2% -10% -6% -30% Sources: Gartner, IDC, isuppli, Merrill Lynch, and Credit Suisse from ; Average of Gartner, IDC, and isuppli , Micron Forecast, Finance Strategy Group drivers split 2011 Micron Technology, Inc. 95

96 NAND Bit Supply Growth Forecasts see Technology as the Main NAND Industry Supply Growth Driver Utilization Capacity Technology Supply Growth 250% 213% 200% 174% 150% 125% 130% 111% 100% 103% 70% 82% 80% 50% 0% 40% 55% 86% 71% 56% 64% 43% 32% 8% 24% 12% -4% 2% -1% -5% 0% 6% 0% 1% -50% Sources: Gartner, IDC, isuppli, Merrill Lynch, and Credit Suisse from ; Average of Gartner, IDC, and isuppli , Finance Strategy Group drivers split 2011 Micron Technology, Inc. 96

Today s Memory Industry DRAM + NAND + NOR Developers Samsung Last Twelve Months Memory

Developers DRAM NAND NOR Toshiba/SanDisk Elpida 11% 10% PSC 4% JV Producers Producers Nanya

Micron Market Research Estimates Note: Micron includes Numonyx revenue and NAND sold to

97 Today s Memory Industry DRAM + NAND + NOR Developers Samsung Last Twelve Months Memory Revenue (% of Group Total) 35% DRAM + NAND Developers Hynix Micron 17% 16% Single Memory Developers DRAM NAND NOR Toshiba/SanDisk Elpida 11% 10% PSC 4% JV Producers Producers Nanya 3% Spansion 2% Winbond 2% ProMOS 1% Macronix 1% 0% 10% 20% 30% 40% Source: Company Data, Micron Market Research Estimates Note: Micron includes Numonyx revenue and NAND sold to Intel from IM Flash; data from FQ2 10 FQ1 11 Competitors data from CQ1 10 CQ Micron Technology, Inc. 97

99 Q&A 2011 Micron Technology, Inc. 99

100

Safe Harbor. August 29, Micron Technology, Inc. 2

Safe Harbor. August 29, Micron Technology, Inc. 2 Safe Harbor During the course of this meeting, we may make projections or other forward-looking statements regarding future events or the future financial performance of the Company and the industry. We