Using ARM CPU Modules in Embedded Applications. September 2011
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1 Using ARM CPU Modules in Embedded Applications September
2 What is a CPU Module A software and hardware supported complete system containing the following core components: An embedded CPU Power management IC (PMIC) Memory + Storage (DDR + NAND) Optional interfaces and features 2
3 Why CPU Modules Off-the-shelf commercially available in small quantities Reduce R&D requirements and upfront investments Skip the hardware debug cycle Start development on a booting system from day ONE Focus on key features in your products that ADD VALUE while leverage on an optimized system Shorten your development cycle Short product lead times Unload purchasing department workload 3
4 What to Look for when choosing a CPU Module Documentation in the form of : Hardware guides. Software programming and user guides Software > SOURCECODE Linux /Android source code WIN CE BSP source files Programming guides Availability Development kits Software demo images Mass produced products Distribution Partners Software Support and Partners 4
5 When partnering with TechNexion: 100% function tested products. European style documentation in the form of hardware manuals and software user guides. Allegro Orcad schematic files and Allegro board routing files to create your own baseboard. 2D Autocad and 3D.STP files for system integration Source code Linux Source code Android Source code BSP WIN CE A full range of binary runtime demo images from TechNexion and 3 rd party software partners. (Q4 2011) 5
6 About TechNexion Founded in 1999 in Taiwan with strong footprint in x86 and ARM technology with main focus on high demanding graphic, flat panel and systems without moving parts. 55 office staff of which 70% is related to R&D. Senior R&D engineers have experience 10+ years Own manufacturing facilities to carry out complete turnkey solutions ISO9001:2008 and ISO14001:2004 certified. 6
7 TechNexion Product Portfolio... TI Sitara AM3517 TI OMAP3530 TI DM3730 ARM HMI Systems 7
8 CPU Module Roadmap Freescale TI Next Generation Performance TAO-3530 TDM-3730 With Multimedia Accelerator and DSP TMX-536 First Dual Display Automotive TAM-3517 Industrial Automation TAM-335x NOW FEB 2012 SUMMER
9 Development Kits They just work. Out of the box. Demo s in seconds. Not days. 9
10 Support Sourcecode, Documentation and many more. Just a click away 10
11 Longevity TAO-3530 Launched Oct 2009 Last Buy 2017H Last Ship 2018H TAM-3517 TDM-3730 Launched Oct 2010 Launched May 2011 Last Buy 2017E Last Ship 2018E Last Buy 2017E Last Ship 2018E TAM-335x Summer 2012 Last Buy 2019E Last Ship 2020E TMX-536 Expected Feb 2012 Last Buy 2019E Last Ship 2020E Next generation TI 2012E Last Buy 2019E Last Ship 2020E 2012E Last Buy 2019E Last Ship 2020E Next generation Freescale Timeline 11
12 ODM/OEM Engineering Services Flexibility and expandable solutions from board level to complete systems. Tailored boards or complete system design Software porting and programming services Extensive environmental testing and certification services Product safety certification assistance (CE/FCC/UL/LVD) Mass production manufacturing facilities 12
13 Let us help you 13
14 Questionnaire & Thank You 14
15 Contact Information TechNexion Ltd 17F-1, No. 16, Jian Ba Road, Chung Ho City, 23511, Taipei, Taiwan TEL : FAX : sales@technexion.com WEB : 15
16 16
The TechNexion Difference
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