IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).

Transcription

1 IPC-7351B Compliance Old Content - visit altium.com/documentation Modified by Jason Howie on Nov 13, 2014 Altium Designer 14.3 incorporates a number of additions and enhancements to both the IPC Compliant Footprint Wizard, and the IPC -Compliant Footprints Batch Generator. These changes are aimed at making both truly compliant with Revision B of the IPC standard Generic Requirements for Surface Mount Design and Land Pattern Standard. IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007). The following additional packages are now supported: CAPAE, CHIP ARRAY, DFN, LGA, PQFN, PSON, SODFL, SON, and SOTFL. In addition, existing packages have been reviewed and modified with respect to data required and/or terminology, with graphics enhanced to better illustrate the application of that data. Three further beneficial enhancements have also been added in this release: Splitting of the paste mask into small fills, for packages with a large thermal pad (sized 2.1mm x 1.6mm, or larger). For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending under the package's body. For small packages having a large central thermal pad (PQFP, QFN, SOIC, SOP), the peripheral pads are trimmed to ensure required clearance between the pads, in accordance with the IPC Standard. Where pad trimming is applied, a warning is displayed in the IPC -Compliant Footprint Wizard, or in the report generated from the IPC -Compliant Footprints Batch Generator.

2 Create PCB library components compliant with IPC standard 7351B - individually, or en-masse - using the enhanced IPC -Compliant Footprint Wizard and IPC -Compliant Footprints Batch Generator. Newly Supported Packages The following sections detail the new packages introduced in Altium Designer 14.3, and supported in both the IPC-Compliant Footprint Wizard and the IPC-Compliant Footprints Batch Generator. Previously existing packages have been modified, where necessary, to comply with the IPC-7351B standard. Consult the legends in the underlying Excel templates (accessed from the Open Template menu in the IPC-Compliant Footprints Batch Generator dialog), for the current data sets for each of those packages. CAPAE Description: Electrolytic Aluminum Capacitor Included Packages: CAPAE

3 Support for CAPAE packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the CAPAE package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to CAPAE Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Lmin, Lmax Minimum and maximum lead span Wmin, Wmax Minimum and maximum body width Footprint

4 Tmin, Tmax Minimum and maximum length of lead Twmin, Twmax Minimum and maximum width of lead Amin Minimum component height Amax Maximum component height L1min, L1max Minimum and maximum body length Dmax,Dmin Diameter of Body DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) JHmin Minimum value for heel fillet JSmin Minimum value for side fillet JTmin Minimum value for toe fillet DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to CAPAE Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges G Distance between pads. Measured from inside edges X Pad width Y Pad length C Row spacing. Distance between pad centers A Assembly width B Assembly length V1 Courtyard width V2 Courtyard length R1 Silkscreen width R2 Silkscreen length Chip Array Description: Chip Array Included Packages: Chip Array, Chip Array Exposed Pad

5 Support for Chip Array packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the Chip Array package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to Chip Array Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is autogenerated Footprint Description (Dimensions in mm)

6 Emin, Emax Minimum and maximum body width Dmin, Dmax Minimum and maximum body length (side containing pin 1) Bmin, Bmax Minimum and maximum lead width B1min, B1max Minimum and maximum corner lead width Lmin, Lmax Minimum and maximum lead length Amax Maximum height Amin Minimum height PinCount Total number of pin positions (including absent pins) Pitch Pitch (e) PackageType Flat,Concave,ConvexE, ConvexS Type of packge DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) JHmin Minimum value for heel fillet. JSmin Minimum value for side fillet. JTmin Minimum value for toe fillet. DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to Chip Array Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges C Row spacing. Distance between pad centers G Distance between pads. Measured from inside edges X Pad width X1 Corner pad width Y Pad length A Assembly width (E side) B Assembly length (D side) V1 Courtyard width (E side) V2 Courtyard length (D side)

7 R1 Silkscreen width (E side) R2 Silkscreen length (D side) DFN Description: Dual Flat No-lead Included Packages: DFN Support for DFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the DFN package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.

8 Table of data related to DFN Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Emin, Emax Minimum and maximum body width Dmin, Dmax Minimum and maximum body length (side containing pin 1) b1min, b1max Minimum and maximum lead width (small lead) L1min, L1 max Minimum and maximum lead length (small lead) Amax Maximum height Amin Minimum height A1max Maximum standoff height A1min Minimum standoff height PinCount Total number of pin positions (2,3,4) e1 Pitch (e1) e2 Pitch (e2) e Pitch (e) b2min, b2max Minimum and maximum lead width (big lead) L2min, L2max Minimum and maximum lead length (big lead) Footprint DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to DFN Footprint Specifications. Value Required A Assemble width (D side) B Assemble length (E side) C pads span betwen small one C1 pads span between big and samll one C2 distance from package center to center of big pad R1 Silkscreen width (D side) R2 Silkscreen length (E side) V1 Courtyard width (D side) V2 Courtyard length (E side) X1 Small pad width

9 Y1 Small pad length X2 Big pad width Y2 Big pad length LGA Description: Land Grid Array Included Packages: LGA Support for LGA packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the LGA package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will

10 be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to LGA Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Dmin, Dmax Minimum and maximum body length along D side (A, B, C,...) D1ave Average length of grid along D side Emin, Emax Minimum and maximum body length along E side (1, 2, 3,...) E1ave Average length of grid along E side A1min Minimum standoff height A1max Maximum standoff height A2min, A2max Minimum and maximum body height Amin Minimum overall height Amax Maximum overall height Bnom Average lead size LeadShape R,S Lead shape, round or square PitchD, PitchE Distance between ball centres, in "D" and "E" directions GridType P, S P = Plain Grid, S = Staggered Grid MatrixType F, P, SD, TE F = Full Matrix, P = Perimeter, SD = Selectively Depopulated, TE = Thermally Enhanced Rows Number of balls along D side (A, B, C,...) Columns Number of balls along E side (1, 2, 3,...) Nmax Maximum number of ball positions (Rows x Columns) PinCount Number of actual balls present DepopulateBalls Ball positions removed from matrix. Example: C5-H10,B6-B9,A1 RepopulateBalls Ball positions added back into depopulated matrix. Example: C8,D6-F9 DrawingNote If package has other features that will affect the footprint, then enter details. Footprint Table of data related to LGA Footprint Specifications. Value Required

11 Diameter of pad. If specified this overrides the calculated value. This can be used to specify a manufacturer's recommended pad size. X C1 C2 A Assembly width B Assembly length V1 Courtyard width V2 Courtyard length R1 Silkscreen width R2 Silkscreen length PQFN Description: Pulback Quad Flat No-lead Included Packages: PQFN

12 Support for PQFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the PQFN package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to PQFN Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Dmin, Dmax Minimum and maximum body span on side D Footprint

13 Emin, Emax Minimum and maximum body span on side E Bmin, Bmax Minimum and maximum lead width Lmin, Lmax Minimum and maximum lead length Amin Minimum height Amax Maximum height A1min Minimum standoff height A1max Maximum standoff height L1min, L1max Lead pull-back length PinCountD Number of pins on D side of package PinCountE Number of pins on E side of package PitchD Distance between two adjacent pins on side D PitchE Distance between two adjacent pins on side E Pin1 S2, C1 Location of pin 1; S2 = corner of package. C1 = center of package side D2min, D2max Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank E2min, E2max Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) Periphery Land Periphery DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to PQFN Footprint Specifications. Value Required ZE Distance between pads. Measured from outside edges ZD Distance between pads. Measured from outside edges GE Distance between pads. Measured from inside edges GD Distance between pads. Measured from inside edges X Pad width Y Pad length CE Row spacing. Distance between pad centers CD Row spacing. Distance between pad centers E2t Thermal Pad width D2t Thermal Pad length

14 L2 Power Bar width. B2, B3, B4, B5, G3, G4, G5, G6 Power Bar length. If all are blank, no power bars are drawn. A Assembly width (E side) B Assembly length (D side) V1 Courtyard width (E side) V2 Courtyard length (D side) R1 Silkscreen width (E side) R2 Silkscreen length (D side) PSON Description: Pulback Small Outline No-lead Included Packages: PSON

15 Support for PSON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the PSON package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to PSON Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Footprint

16 Emin, Emax Minimum and maximum body width Dmin, Dmax Minimum and maximum body length (side containing pin 1) D2min, D2max Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank E2min, E2max Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank Bmin, Bmax Minimum and maximum lead width cmin, cmax Minimum and maximum lead height Lmin, Lmax Minimum and maximum lead length L1min, L1max Minimum and maximum lead pullback Amax Maximum height Amin Minimum height A1max Maximum standoff height A1min Minimum standoff height PinCount Total number of pin positions (including absent pins) Pitch Pitch (e) AbsentPins Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present PinOrder Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) Periphery DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to PSON Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges C Row spacing. Distance between pad centers G Distance between pads. Measured from inside edges X Pad width Y Pad length

17 E2t Thermal Pad width (X2) D2t Thermal Pad length (Y2) A Assembly width (E side) B Assembly length (D side) V1 Courtyard width (E side) V2 Courtyard length (D side) R1 Silkscreen width (E side) R2 Silkscreen length (D side) ViaCountE Number of thermal vias in the E direction ViaCountD Number of thermal vias in the D direction ViaPitchE Thermal Via Pitch in the E direction ViaPitchD Thermal Via Pitch in the D direction Peripheral Pads - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank X2Y2_Solder Thermal Pad - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank XY_Paste Peripheral Pads - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank. X2Y2_Paste Thermal Pad - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank. X_Paste Peripheral Pads - Fill on Top Paste Layer. Value in X direction. Y_Paste Peripheral Pads - Fill on Top Paste Layer. Value in Y direction. X2_Paste Thermal Pad- Fill on Top Paste Layer. Value in X direction. Y2_Paste Thermal Pad- Fill on Top Paste Layer. Value in Y direction. FillCountE Number of Top Paste fills placed on the thermal pad in the E direction (No Paste Mask fills placed if blank) FillCountD Number of Top Paste fills placed on the thermal pad in the D direction (No Paste Mask fills placed if blank) Fill_Gap Gap between Top Paste fills placed on the thermal pad (0.2mm if blank) XY_Solder SODFL Description: Small Outline Diode, Flat Lead Included Packages: SODFL

18 Support for SODFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the SODFL package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to SODFL Package Specifications. Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Footprint

19 Dmin, Dmax Minimum and maximum body length Emin, Emax Minimum and maximum lead span E1min, E1max Minimum and maximum body width Bmin, Bmax Minimum and maximum width Lmin, Lmax Minimum and maximum lead length Amin, Amax Minimum height DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) JHmin Minimum value for heel fillet JSmin Minimum value of side fillet JTmin Minimum value for toe fillet DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to SODFL Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges C Distance between pads. Measured from pad centre G Distance between pads. Measured from inside edges X Pad width Y Pad length X1 Pad width (large pad) A Assembly width B Assembly length V1 Courtyard width V2 Courtyard length R1 Silkscreen width R2 Silkscreen length SON Description: Small Outline No-lead Included Packages: SON, SON Exposed Pad

20 Support for SON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the SON package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to SON Package Specifications. Footprint Value Required If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Emin, Emax Minimum and maximum body width Dmin, Dmax Minimum and maximum body length (side containing pin 1) D2min, D2max Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank

21 E2min, E2max Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank Bmin, Bmax Minimum and maximum lead width cmin, cmax Minimum and maximum lead height Lmin, Lmax Minimum and maximum lead length L1min, L1max Minimum and maximum lead pullback Amax Maximum height Amin Minimum height A1max Maximum standoff height A1min Minimum standoff height PinCount Total number of pin positions (including absent pins) Pitch Pitch (e) AbsentPins Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present PinOrder Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) JHmin Minimum value for heel fillet. JSmin Minimum value for side fillet. JTmin Minimum value for toe fillet. DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to SON Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges C Row spacing. Distance between pad centers G Distance between pads. Measured from inside edges X Pad width Y Pad length E2t Thermal Pad width (X2) D2t Thermal Pad length (Y2) A Assembly width (E side) B Assembly length (D side) V1 Courtyard width (E side) V2 Courtyard length (D side) R1 Silkscreen width (E side) R2 Silkscreen length (D side) ViaCountE Number of thermal vias in the E direction ViaCountD Number of thermal vias in the D direction ViaPitchE Thermal Via Pitch in the E direction ViaPitchD Thermal Via Pitch in the D direction XY_Solder Peripheral Pads - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank X2Y2_Solder Thermal Pad - Top Solder Layer. Enter expansion value for Solder Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank

22 XY_Paste Peripheral Pads - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank. X2Y2_Paste Thermal Pad - Top Paste Layer. Enter expansion value for Paste Mask. Only enter value if following manufacturer recommendation. Otherwise leave blank. X_Paste Peripheral Pads - Fill on Top Paste Layer. Value in X direction. Y_Paste Peripheral Pads - Fill on Top Paste Layer. Value in Y direction. X2_Paste Thermal Pad- Fill on Top Paste Layer. Value in X direction. Y2_Paste Thermal Pad- Fill on Top Paste Layer. Value in Y direction. FillCountE Number of Top Paste fills placed on the thermal pad in the E direction (No Paste Mask fills placed if blank) FillCountD Number of Top Paste fills placed on the thermal pad in the D direction (No Paste Mask fills placed if blank) Fill_Gap Gap between Top Paste fills placed on the thermal pad (0.2mm if blank) SOTFL Description: Small Outline Transistor, Flat Lead Included Packages: 3-Leads, 5-Leads, 6-Leads

23 Support for SOTFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator. The following tables list the information (required and optional) when defining the SOTFL package in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard. Table of data related to SOTFL Package Specifications. Value Required

24 If blank, then auto-generated IPC naming will be used FootprintDescription If blank, then description is auto-generated Dmin, Dmax Minimum and maximum body length Emin, Emax Minimum and maximum lead span E1min, E1max Minimum and maximum body width PinCount 3,5 Total number of pin positions, not including tab Footprint PinOrder Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse the pin order of an 8 pin package AbsentPins Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present Bmin, Bmax Minimum and maximum width of narrow leads B1min, B1max Minimum and maximum width of wide lead (3 pin packages only) cmin, cmax Minimum and maximum lead thickness L1min, L1max Minimum and maximum lead length (from body to end of lead) LPmin, LPmax Minimum and maximum lead length Pitch Pitch (e) Amin, Amax Minimum height DensityLevel L, M, N M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level C) JHmin Minimum value for heel fillet JSmin Minimum value of side fillet JTmin Minimum value for toe fillet DrawingNote If package has other features that will affect the footprint, then enter details. Table of data related to SOTFL Footprint Specifications. Value Required Z Distance between pads. Measured from outside edges C Distance between pads. Measured from pad centre G Distance between pads. Measured from inside edges X Pad width Y Pad length X1 Pad width (large pad) A Assembly width

25 B Assembly length V1 Courtyard width V2 Courtyard length R1 Silkscreen width R2 Silkscreen length

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