Characteristics Symbol Limit Unit IF = 1.5A V F -- IF = 3.0A V F -- VR = 800V I R -- --

Transcription

1 GLASS PASSIVATED SURFACE MOUNT BRIDGE RECTIFIERS REVERSE VOLTAGE 800 Volts FORWARD CURRENT 3.0 Ampere GENERAL DESCRIPTION Suitable for AC-to-DC bridge full wave rectification for SMPS, LED lighting, adapter, battery charger, home appliances, office equipment, and telecommunication applications. FEATURES Rated at 800V PRV Compact, thin profile package design Ideal for SMT manufacturing Reliable robust construction UL recognized file#e Pin Assignment MECHANICAL DATA Molding compound meets UL 94 V-0 flammability rating, Halogen-free, RoHS-compliant, and commercial grade Polarity indicator: As marked on body Marking:MB30KH Weight: 216 mg Maximum Ratings & Thermal T A = 25 C unless otherwise specified Characteristics Symbol Limit Unit Maximum Repetitive Peak Reverse Voltage V RRM 800 V Maximum DC Blocking Voltage V DC 800 V Maximum Average Forward Rectified = 125 Peak Forward Surge Current J=25 single half J=125 Peak Forward Surge Current J=25 single half J=125 I (AV) 3.0 A I FSM I FSM I 2 t Rating for fusing (1ms < t < 8.3ms) I 2 t A 2 S Operating and Storage Temperature Range T J, T STG -55 to +150 C A A Electrical T A = 25 C unless otherwise specified Test Characteristics Symbol Min Typ. Max Unit Condition Maximum Forward Voltage Maximum Forward Voltage Maximum DC Reverse Current at Rated DC Blocking C IF = 1.5A V F IF = 3.0A V F VR = 800V I R Typical junction capacitance per element Note(1) C J 45 pf V V ua Thermal Characteristics Characteristics Symbol Min Typ. Max Unit Typical thermal resistance (Note 2) RΘ JC RΘ JL RΘ JA Note : (1) Measured at 1.0MHz and applied reverse voltage of 4.0V DC. (2) Thermal Resistance test performed in accordance with JESD-51. Unit mounted on glass-epoxy substrate with 1oz/ft2_50mm x 50mm copper pad per pin REV.4, Sep-2017, KBDA42 C/W

2 Mechanical Information Package Dimension MSBL Dim. Min. Typ. Max. A A C D D E E E L b e K All dimensions in millimeter

3 RATING AND CHARACTERISTIC CURVES FIG.1-FORWARD CURRENT DERATING CURVE FIG. 2- MAXIMUM NON-REPETITIVE SURGE CURRENT AVERAGE FORWARD CURRENT, (A) O CASE TEMPERATURE, ( ) PEAK FORWARD SURGE CURRENT, (A) Pulse width 8.3ms Single Half Sine-Wave 1 NUMBER OF CYCLES AT 60Hz FIG.3- TYPICAL FORWORD CHARACTERISTICS FIG.4- TYPICAL JUNCTION CAPACITANCE 90 INSTANTANEOUS FORWARD CURRENT, (A) 1 Tj=125 C Tj=25 C CAPAC ITANCE, (pf) INSTANTANEOUS FORWARD VOLTAGE, (V) Tj=25 C, f=1mhz, Level=1V 0 1 REVERSE VOLTAGE, (V) FIG.5- TYPICAL REVERSE CHARACTERISTICS FIG.6- NON-REPETITIVE SURGE CURRENT 0 INSTANTANEOUS REVERSE CURRENT, (ua) Tj=125 C Tj=75 C Tj=25 C PEAK FORWARD SURGE CURRENT, (A) Tj=125 C Single Half Sine-Wave Tj=25 C RATED PEAK REVERSE VOLTAGE, (V) 1 tp,(ms)

4 PACKING INFORMAITON Packaging Information DEVICE Q'TY/REEL (PCS) REEL DIA. (mm) Liner (mm) CARTON SIZE (mm) Q'TY/CARTON (PCS) MOQ x x245x350 25K 25K Embossed Carrier Dimension K t D P0 P2 pitches cumulative tolerance on tape +/-0.2 TOP cover tape A0 E F B1 K0 See Note 1 Table 1 B0 P W For Machine Reference Only Including Draft and Radil Concentric Around B0 Embossment User Direction of Feed Center lines of cavity D1 TAPE SIZE 16 Unit:mm D E PO t (MAX) A0 B0 K / / / / / /-0.1 B1 B2 K F (MAX) (MAX) (MAX) P2 W P / / / /-.1

5 IR REFLOW INFORMATION Typical IR Reflow Soldering Thermal Profile T p t p Ramp up T L t L Ramp down Temperature Ts max Ts min t s Preheat t 25 C to Peak Time Table 1- Reflow profile Reflow condition Sn-Pb assembly Pb-free assembly Average ramp-up rate (Liquidus Temperautre (TL) to Peak) 3 C/second max. 3 C/second max. Preheat Tempautre Min, Ts (Min) C 150 C Temperature Max, Ts (Max) 150 C 200 C Time (min to max, ts) seconds seconds Ts(max) to TL - Ramp-up Rate 3 C/second max. Time maintained above: Temperature(TL) 183 C 217 C Time(tL) seconds seconds Peak Temperature (Tp) /-5 C /-5 C Time within 5 C of actual Peak Temperature(tp) -30 seconds seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature. 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface

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