Low Capacitance ESD Protection - SP3002 Series. Description. Features I/O 4 I/O 3. Applications

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1 SP3002 Series 0.85pF Diode Array RoHS Pb GREEN Description The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE Pinout Features I/O 1 I/O 4 GND I/O 2 I/O 3 SC70-6 and SOT23-6 I/O 1 NC 1 2 I/O I/O μdfn-6 (1.6x1.6x0.5mm) I/O 4 Low capacitance of 0.85 pf (TYP) per I/O ESD protection of ±12kV contact discharge, ±15kV air discharge, (IEC ) EFT protection, IEC , 40A (5/50ns) Low leakage current of 0.5μA (MAX) at 5V Small packaging options saves board space Lightning Protection, IEC , 2nd edition 4.5A (8/20µs) RoHS compliant and lead-free Functional Block Diagram Applications I/O2 I/O4 Computer Peripherals Mobile Phones PDA s Digital Cameras Network Hardware/Ports Test Equipment Medical Equipment Application Example I/O1 GND I/O3 Additional Information Datasheet Resources Samples D2+ D1+ Clk+ D0+ D0- D0- D1- HDMI or DVI Interface IC D0+ D2- Clk- +5V SP300x-04 SP300x-04 D2+ D2- D1+ D1- HDMI or DVI Connector Clk+ Clk- A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the + pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the + of the SP300x-04 can be floated or NC. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 I/O Capacitance (pf) TVS Diode Arrays (SPA Diodes) Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Current (t p =8/20μs) 4.5 A T OP Operating Temperature 40 to 125 C T STOR Storage Temperature 55 to 150 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Storage Temperature Range 55 to C 150 Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20-40s) 260 C Electrical Characteristics (T OP =25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM I R 1µA 6.0 V Reverse Leakage Current I LEAK V R =5V 0.5 µa Clamp Voltage 1 V C I PP =1A, t p =8/20µs, Fwd V I PP =2A, t p =8/20µs, Fwd V ESD Withstand Voltage 1 IEC (Contact) ±12 kv V ESD IEC (Air) ±15 kv Diode Capacitance 1 Reverse Bias=0V pf C I/O-GND Reverse Bias=1.65V pf Diode Capacitance 1 C I/O-I/O Reverse Bias=0V 0.5 pf Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage Insertion Loss [db] = Float = 3.3V = 5V E+06 1.E+07 1.E+08 1.E+09 1.E+10 Frequency [Hz] I/O DC Bias (V)

3 Temperature TVS Diode Arrays (SPA Diodes) Capacitance vs. Frequency Product Characteristics 2E E E-12 Lead Plating Lead Material SC70 & SOT23: Matte Tin μdfn: Pre-Plated Frame Copper Alloy Capacitance [F] 1.4E E-12 1E-12 8E-13 6E-13 4E-13 2E E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Lead Coplanarity Substitute Material Body Material inches (0.102mm) Silicon Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. surface matte finish VDI Soldering Parameters Reflow Condition - Temperature Min (T s(min) ) 150 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak T S(max) to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max) T S(min) t S Preheat t L Ramp-down Reflow - Temperature (T L ) (Liquidus) 217 C - Temperature (t L ) seconds 25 time to peak temperature Time Peak Temperature (T P ) /-5 C Time within 5 C of actual peak Temperature (t p ) seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260 C

4 Dimensions SC70-6 e e SC70-6 Pins 6 JEDEC MO-203 E HE Millimeters A B A D A B A2 A c D A1 E C L Solder Pad Layout e 0.65 BSC BSC HE L Dimensions SOT23-6 SOT23-6 Pins 6 Recommended Solder Pad Layout JEDEC MO-178 Millimeters Notes A A A b C D E E e 0.95 Ref Ref - e1 1.9 Ref Ref - L ,5 N a 0º 10º 0º 10º - M O TYP - P TYP - R P M Notes: 1. Dimensioning and tolerances per ANSI 14.5M conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. L is the length of flat foot surface for soldering to substrate. 6. N is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. R O

5 Dimensions μdfn-6 (1.6x1.6x0.5mm) Top View D A L Bottom View D C 0.05 C JEDEC Symbol μdfn-6 (1.6x1.6x0.5mm) MO-229 Millimeters E A Pin 1 Index Area B E Pin 1 chamfer 0.10 x 45 A A Ref Ref b D Side View D C A A1 A3 Seating plane E E e 0.50 Ref Ref C L b 0.10 M C A B 0.05 M C Part Numbering System TVS Diode Arrays (SPA Diodes) Series Number of Channels -04 = 4 channel SP * TG G= Green T= Tape & Reel H = SOT23-6 J = SC70-6 U = μdfn-6 Ordering Information Part Number Marking Min. Order Qty. SP HTG SOT23-6 E* SP JTG SC70-6 E* SP UTG μdfn-6 (1.6x1.6x0.5mm) E* Part Marking System E * 4 E*4 Product Series Number of Channels E = SP3002 series Assembly Site (varies)

6 Embossed Carrier Tape & Reel Specification SC70-6 Symbol Millimetres E F P D D P P0 40.0± ±0.008 W P A B K t 0.27 Max Max Embossed Carrier Tape & Reel Specification SOT23-6 8mm TAPE AND REEL ACCESS HOLE 1.5mm DIA. HOLE 4.0mm 2.0mm 1.75mm 14.4mm 8mm C L 4.0mm 180mm 13mm 60mm SOT-23 (8mm POCKET PITCH) GENERAL INFORMATION PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED PIN 1 Embossed Carrier Tape & Reel Specification μdfn-6 (1.6x1.6x0.5mm) P2 K0 D1 A0 D P0 F E W B0 t Symbol Millimetres COVER TAPE Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at E F D D 1.50 MIN 0.06 MIN P P0 40.0± ±0.01 W P A B K t 0.25 TYP 0.01 TYP