Parameter Value Unit. Contact Discharge Voltage Per IEC KV. Air Discharge Voltage Per IEC KV. Operating Temperature -55 to +125

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1 1 Feature Ultra-Low capacitance:0.05pf(typ.) Fast response time(<1ns) Low leakage current(<10na) IEC (Contact): 8KV IEC (Air) :15KV Bi-directional, single line protection 3 Application HDTV/Smart TV Set-Top Box Laptop/Desktop Computer HDMI USB 3.0 USB3.1 Lightning Thunderbolt 5 Pin Description 2 Description The polymer ESD suppressor provide ESD protection for high-speed interfaces. This protection is a result of its ultralow capacitance (0.05pF) that is well suited for HDMI1.3/1.4 USB3.0 USB3.1 ESD protection applications, and it can be used to meet the ESD immunity requirements of IEC (15KV air, 8KV contact discharge) Caution: This component is designed for signal line protection only, not intended to be used on power lines or for power bus applications. 4 Device Information Single-Channel ESD Protection Diode in 0402 Package Model Package Size mm 0.52 mm 0.38 mm 6 General Characteristics Parameter Value Unit Contact Discharge Voltage Per IEC KV Air Discharge Voltage Per IEC KV Operating Temperature -55 to +125 Storage Temperature -40 to Electrical Characteristics(TA =25 C) Parameter Symbol Conditions Min. Typ. Max. Units Continuous Operating Voltage V DC V Trigger Voltage V T IEC KV contact discharge V Clamping Voltage V C IEC KV contact discharge V Leakage Current I L DC 5V shall be applied on component na Capacitance C P Measured at 10MHz pf ESD Pulse Withstand Pulses IEC KV contact discharge Notes: 1.Trigger and clamping voltage are measured per IEC , 8KV contact discharge method. 2.After reliability tests such as high Temp storage, Temp cycles, continuous ESD strike etc, the maximum leakage current is less than 1uAmaximum leakage current is less than 1uA. Rev : /7

2 8 Typical ESD Response(IEC , 8KV contact discharge) 9 Typical ESD Response(IEC , 8KV contact discharge) Voltage ( V ) Time(ns) 10 Typical Device Capacitance VS. Frequency Capacitance(pF) E E E E+10 Frequency(Hz) Rev : /7

3 11 Eye Diagram Measurement HDMI Mask at 3.4 Gbps USB3.0 Mask at 5.0 Gbps 12 ESD Protection for HDMI HDMI Port HDMI Chipset D2+ D2- D1+ D1- D0+ D0- CLK+ CLK- Rev : /7

4 13 Soldering Parameters Profile Feature Pre Heat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (ts) from (Tsmin to Tsmax) Ramp-up Rate (TL to Tp) Liquidus temperature (TL) Time (tl) maintained above TL Pb-Free Assembly 150 C 200 C seconds 3 C/second max. 217 C seconds Peak package body temperature (Tp) /-5 C Time (tp)* within 5 C of the specified classification temperature (Tc) Ramp-down Rate (Tp to TL) Time 25 C to peak temperature 30* seconds 6 C/second max. 8 minutes max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. Rev : /7

5 14 Package Dimension W L R Recommended Solder Pad Footprint H P 0.90 *Sizes in mm Notes: This solder pad layout is for reference purposes only. Unit: Millimeters Dimension Min. Typ. Max. L W P H R Rev : /7

6 15 Taping Specification Unit: Millimeters A0 B0 W F E P1 P2 P0 D0 T 0.68± ± ± ± ± ± ± ± ± ±0.03 Reel Dimension Unit: Millimeters W2 W1 C N A A N Min. C W2 Max. W1 Min. W1 Max ± ± Rev : /7

7 16 Ordering & Contact Information Ordering Code Package Net Weight Delivery Form Delivery Quantity mg / 1 pce Mini T&R (7 ) 10,000 pcs/reel Shanghai Leiditech Electronic Co.,Ltd sale1@leiditech.com Tel : Fax : Rev : /7