HIGH SPEED 1K X 8 DUAL-PORT STATIC SRAM

Transcription

1 HIGH SPEED 1K X 8 DUAL-PORT STATIC SRAM IDT713/ IDT714/ Features High-speed access Commercial: //35/55/1 (max.) Industrial: /55/1 (max.) Military: /35/55/1 (max.) Low-power operation IDT713/IDT714 Active: 55mW (typ.) Standby: 5mW (typ.) IDT713/IDT714 Active: 55mW (typ.) Standby: 1mW (typ.) MASTER IDT713 easily expands data bus width to 16-ormore-bits using SVE IDT714 On-chip port arbitration logic (IDT713 Only) BUSY output flag on IDT713; BUSY input on IDT714 INT flag for port-to-port communication Fully asynchronous operation from either port Battery backup operation 2V data retention ( only) TTL-compatible, single 5V ±1% power supply Military product compliant to MIL-PRF QML Industrial temperature range ( 4 C to +85 C) is available for selected speeds Available in 48-pin DIP, LCC and Ceramic Flatpack, 52-pin PLCC, and 64-pin STQFP and TQFP Green parts available, see ordering information Functional Block Diagram OEL OER CEL R/WL CER R/WR I/OL- I/O7L I/O Control I/O Control I/OR-I/O7R, (1,2) (1,2) A9L AL Address Decoder MEMORY ARRAY Address Decoder A9R AR 1 1 CEL OEL R/WL ARBITRATION and INTERRUPT LOGIC CER OER R/WR INTL (2) 1. IDT713 (MASTER): BUSY is open drain output and requires pullup resistor. IDT714 (SVE): BUSY is input. 2. Open drain output: requires pullup resistor. 16 Integrated Device Technology, Inc drw 1 INTR (2) MAY 16 DSC-2689/16

2 IDT713/ and IDT714/ Description The IDT713/IDT714 are high-speed 1K x 8 Dual-Port Static RAMs. The IDT713 is designed to be used as a stand-alone 8-bit Dual-Port RAM or as a "MASTER" Dual-Port RAM together with the IDT714 "SVE" Dual-Port in 16-bit-or-more word width systems. Using the IDT MASTER/SVE Dual-Port RAM approach in 16-ormore-bit memory system applicatio results in full-speed, errorfree operation without the need for additional discrete logic. Both devices provide two independent ports with separate control, address, and I/O pi that permit independent asynchronous access for reads or writes to any location in memory. An automatic power down feature, controlled by CE, permits the on chip circuitry Pin Configuratio (1,2,3) AR A1R A2R A3R A4R A5R A6R A7R A8R A9R of each port to enter a very low standby power mode. Fabricated using CMOS high-performance technology, these devices typically operate on only 55mW of power. Low-power () versio offer battery backup data retention capability, with each Dual- Port typically couming µw from a 2V battery. The IDT713/IDT714 devices are packaged in 48-pin sidebraze or plastic DIPs, LCCs, flatpacks, 52-pin PLCC, and 64-pin TQFP and STQFP. Military grade products are manufactured in compliance with the latest revision of MIL-PRF QML, making it ideally suited to military temperature applicatio demanding the highest level of performance and reliability. OER INTR R/WR CER CEL R/WL INTL OEL AL I/O5R I/O4R I/O3R I/O2R I/O1R I/OR GND I/O7L I/O6L I/O5L I/O4L I/O3L INDEX 2689 drw 3F I/O2L I/O1L I/OL A9L A8L A7L A6L I/O7R A5L A4L A3L A2L A1L I/O6R VCC 713/4 F48 (4) A1L A2L A3L A4L A5L A6L A7L A8L A9L I/OL I/O1L I/O2L 1. All VCC pi must be connected to power supply. 2. All GND pi must be connected to ground supply. 3. L48 package body is approximately.57 in x.57 in x.68 in. F48 package body is approximately.75 in x.75 in x.11 in. 4. This package code is used to reference the package diagram. I/O3L I/O4L I/O5L I/O6L I/O7L GND I/OR I/O1R I/O2R I/O3R I/O4R I/O5R /4 L48 (4) I/O6R I/O7R A9R A8R A7R A6R A5R A4R A3R A2R A1R AR AL OEL INTL R/WL CEL VCC CER R/WR INTR OER 2689 drw 3L 2

3 IDT713/ and IDT714/ Pin Configuratio (1,2,3) (con't.) CEL R/WL INTL OEL AL A1L A2L A3L A4L A5L A6L A7L A8L A9L I/OL I/O1L I/O2L I/O3L I/O4L I/O5L I/O6L I/O7L GND IDT713/4 41 P or C P48 (4,5) & C48 (4,5) VCC CER R/WR INTR OER AR A1R A2R A3R A4R A5R A6R A7R A8R A9R I/O7R I/O6R I/O5R I/O4R I/O3R I/O2R I/O1R I/OR 2689 drw 2, 1. All VCC pi must be connected to power supply. 2. All GND pi must be connected to ground supply. 3. P48 package body is approximately.55 in x.61 in x.19 in. C48 package body is approximately.62 in x 2.43 in x.15 in. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part-marking. 3

4 IDT713/ and IDT714/ Pin Configuratio (1,2,3) (con't.) I/O3L I/O2L I/O1L I/OL A9L A8L A7L A6L A5L A4L A3L A2L A1L I/O4L I/O5L I/O6L I/O7L GND I/OR I/O1R I/O2R I/O3R I/O4R I/O5R I/O6R /4 J52 (4) AL OEL INTL R/WL CEL VCC CER R/WR INTR I/O7R A9R A8R A7R A6R A5R A4R A3R A2R A1R AR OER 2689 drw 4 1. All VCC pi must be connected to power supply. 2. All GND pi must be connected to ground supply. 3. J52-1 package body is approximately.75 in x.75 in x.17 in. 4. This package code is used to reference the package diagram. 4

5 IDT713/ and IDT714/ Pin Configuratio (1,2,3) (con't.) OEL AL A1L A2L A3L A4L A5L A6L A7L A8L A9L I/OL I/O1L I/O2L OER AR A1R A2R A3R A4R A5R A6R A7R A8R A9R I/O7R I/O6R INTR R/WR CER VCC VCC CEL R/WL INTL /4 PP64 & PN64 (4) I/O5R I/O4R I/O3R I/O2R I/O1R I/OR GND GND I/O7L I/O6L I/O5L I/O4L I/O3L 2689 drw 5 1. All VCC pi must be connected to power supply. 2. All GND pi must be connected to ground supply. 3. PP64 package body is approximately 1 mm x 1 mm x 1.4mm. PN64 package body is approximately 14mm x 14mm x 1.4mm. 4. This package code is used to reference the package diagram 5

6 IDT713/ and IDT714/ Absolute Maximum Ratings (1) Symbol Rating Commercial & Industrial VTERM (2) TBIAS TSTG IOUT Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature DC Output Current Military Unit -.5 to to +7. V -55 to +1 - to +135 o C - to to +15 o C 5 5 ma 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditio above those indicated in the operational sectio of the specification is not implied. Exposure to absolute maximum rating conditio for extended periods may affect reliability. 2. VTERM must not exceed Vcc + 1% for more than % of the cycle time or 1 maximum, and is limited to < ma for the period of VTERM > Vcc + 1%. Capacitance (TA = + C, f = 1.MHz) STQFP and TQFP Packages Only 2689 tbl 1 Symbol Parameter (1) Conditio Max. Unit CIN Input Capacitance VIN = 3dV 9 pf Recommended DC Operating Conditio Symbol Parameter Min. Typ. Max. Unit VCC Supply Voltage V GND Ground V VIH Input High Voltage (2) V VIL Input Low Voltage -.5 (1).8 V 1. VIL (min.) > -1.5V for pulse width less than VTERM must not exceed Vcc + 1% tbl 2 Recommended Operating Temperature and Supply Voltage (1) Grade Ambient Temperature GND Vcc Military -55 O C to +1 O C V 5.V + 1% Commercial O C to +7 O C V 5.V + 1% Industrial -4 O C to +85 O C V 5.V + 1% 1. This is the parameter TA. This is the "itant on" case temperature tbl 3 COUT Output Capacitance VOUT = 3dV 1 pf 2689 tbl 5 1. This parameter is determined by device characterization but is not production tested. 2. 3dV references the interpolated capacitance when the input and output signals switch from V to 3V or from 3V to V. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VCC = 5.V ± 1%) Symbol Parameter Test Conditio Min. Max. Min. Max. Unit ILI Input Leakage Current (1) VCC = 5.5V, VIN = V to VCC ILO Output Leakage Current (1) VCC - 5.5V, CE = VIH, VOUT = V to VCC 1 5 µa 1 5 µa VOL Output Low Voltage (I/O-I/O7) IOL = 4mA.4.4 V VOL Open Drain Output Low Voltage (BUSY, INT) IOL = 16mA.5.5 V VOH Output High Voltage IOH = -4mA V NOTE: 1. At Vcc < 2.V leakages are undefined tbl 4 6

7 IDT713/ and IDT714/ DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (1,5) (VCC = 5.V ± 1%) 713X (2) 714X (2) Com'l Only 713X 714X 713X35 714X35 Com'l Symbol Parameter Test Condition Version Typ. Max. Typ. Max. Typ. Max. Unit ICC ISB1 ISB2 ISB3 Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports - CMOS Level Inputs) CEL and CER = VIL, Outputs Disabled f = fmax (3) COM'L MIL & IND CEL and CER = VIH COM'L f = fmax (3) CE"A" = VIL and CE"B" = VIH (6) Active Port OutputsDisabled, f=fmax (3) CEL and CER > VCC -.2V, VIN > VCC -.2V or VIN <.2V, f = (4) MIL & IND COM'L MIL & IND COM'L MIL & IND ma ma ma ma ISB4 Full Standby Current (One Port - CMOS Level Inputs) CE"A" <.2V and CE"B" > VCC -.2V (6) VIN > VCC -.2V or VIN <.2V Active Port Outputs Disabled, f = fmax (3) COM'L MIL & IND ma 2689 tbl 6a 713X55 714X55 713X1 714X1 Symbol Parameter Test Condition Version Typ. Max. Typ. Max. Unit ICC ISB1 ISB2 ISB3 Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports - CMOS Level Inputs) CEL and CER = VIL, Outputs Disabled f = fmax (3) COM'L MIL & IND CEL and CER = VIH COM'L f = fmax (3) CE"A" = VIL and CE"B" = VIH (6) Active Port Outputs Disabled, f=fmax (3) CEL and CER > VCC -.2V, VIN > VCC -.2V or VIN <.2V, f = (4) MIL & IND COM'L MIL & IND COM'L MIL & IND ma ma ma ma ISB4 Full Standby Current (One Port - CMOS Level Inputs) CE"A" <.2V and CE"B" > VCC -.2V (6) VIN > VCC -.2V or VIN <.2V Active Port Outputs Disabled, f = fmax (3) COM'L MIL & IND ma 2689 tbl 6b 1. 'X' in part numbers indicates power rating ( or ). 2. PLCC, TQFP and STQFP packages only. 3. At f = fmax, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tCYC, and using AC TEST CONDITIONS of input levels of GND to 3V. 4. f = mea no address or control lines change. Applies only to inputs at CMOS level standby. 5. Vcc = 5V, TA=+ C for Typ and is not production tested. Vcc DC = 1 ma (Typ) 6. Port "A" may be either left or right port. Port "B" is opposite from port "A". 7

8 IDT713/ and IDT714/ Data Retention Characteristics ( Version Only) 713/714 Symbol Parameter Test Condition Min. Typ. (1) Max. Unit VDR VCC for Data Retention 2. V ICCDR Data Retention Current MIL. & IND. 1 4 µa VCC = 2.V, CE > VCC -.2V COM'L tcdr (3) Chip Deselect to Data Retention Time VIN > VCC -.2V or VIN <.2V tr (3) Operation Recovery Time trc (2) 1. VCC = 2V, TA = + C, and is not production tested. 2. trc = Read Cycle Time 3. This parameter is guaranteed but not production tested tbl 7 Data Retention Waveform DATA RETENTION MODE VCC VDR 4.5V 2.V 4.5V tcdr tr CE VIH VDR VIH 2692 drw 6, 8

9 IDT713/ and IDT714/ AC Test Conditio Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.V 5 1.5V 1.5V Figures 1,2 and tbl 8 5V 5V 1Ω 1Ω DATAOUT 775Ω 3pF* DATAOUT 775Ω 5pF* *1pF for 55 and 1 versio Figure 1. Output Test Load 5V Figure 2. Output Test Load (for thz, tlz, twz, and tow) * including scope and jig BUSY or INT 27Ω 3pF* *1pF for 55 and 1 versio 2689 drw 7 Figure 3. BUSY and INT AC Output Test Load 9

10 IDT713/ and IDT714/ AC Electrical Characteristics Over the Operating Temperature Supply Voltage Range (3) 713X (2) 714X (2) Com'l Only 713X 714X 713X35 714X35 Com'l Symbol Parameter Min. Max. Min. Max. Min. Max. Unit READ CYCLE trc Read Cycle Time 35 taa Address Access Time 35 tace Chip Enable Access Time 35 taoe Output Enable Access Time toh Output Hold from Address Change tlz Output Low-Z Time (1,4) thz Output High-Z Time (1,4) tpu Chip Enable to Power Up Time (4) tpd Chip Disable to Power Down Time (4) tbl 9a 713X55 714X55 713X1 714X1 Symbol Parameter Min. Max. Min. Max. Unit READ CYCLE trc Read Cycle Time 55 1 taa Address Access Time 55 1 tace Chip Enable Access Time 55 1 taoe Output Enable Access Time 4 toh Output Hold from Address Change 3 1 tlz Output Low-Z Time (1,4) 5 5 thz Output High-Z Time (1,4) 4 tpu Chip Enable to Power Up Time (4) tpd Chip Disable to Power Down Time (4) Traition is measured mv from Low or High-impedance voltage Output Test Load (Figure 2). 2. PLCC, TQFP and STQFP packages only. 3. 'X' in part numbers indicates power rating ( or ). 4. This parameter is guaranteed by device characterization, but is not production tested tbl 9b 1

11 IDT713/ and IDT714/ Timing Waveform of Read Cycle No. 1, Either Side (1) ADDRESS trc toh taa toh DATAOUT BUSYOUT PREVIOUS DATA VALID DATA VALID tbddh (2,3) 2689 drw 8 1. R/W = VIH, CE = VIL, and is OE = VIL. Address is valid prior to the coincidental with CE traition LOW. 2. tbdd delay is required only in the case where the opposite port is completing a write operation to the same the address location. For simultaneous read operatio, BUSY has no relatiohip to valid output data. 3. Start of valid data depends on which timing becomes effective last taoe, tace, taa, and tbdd. Timing Waveform of Read Cycle No. 2, Either Side (3) CE tace OE (4) taoe (2) thz (1) (2) tlz thz DATAOUT ICC CURRENT ISS tpu 5% (1) tlz VALID DATA (4) tpd 5% 2689 drw 9 1. Timing depends on which signal is asserted last, OE or CE. 2. Timing depends on which signal is deaserted first, OE or CE. 3. R/W = VIH and OE = VIL, and the address is valid prior to or coincidental with CE traition LOW. 4. Start of valid data depends on which timing becomes effective last taoe, tace, taa, and tbdd. 11

12 IDT713/ and IDT714/ AC Electrical Characteristics Over the Operating Temperature Supply Voltage Range (5) 713X (2) 714X (2) Com'l Only 713X 714X 713X35 714X35 Com'l Symbol Parameter Min. Max. Min. Max. Min. Max. Unit WRITE CYCLE twc Write Cycle Time (3) 35 tew Chip Enable to End-of-Write 15 3 taw Address Valid to End-of-Write 15 3 tas Address Set-up Time twp Write Pulse Width (4) twr Write Recovery Time tdw Data Valid to End-of-Write thz Output High-Z Time (1) tdh Data Hold Time twz Write Enable to Output in High-Z (1) tow Output Active from End-of-Write (1) 2689 tbl 1a 713X55 714X55 713X1 714X1 Symbol Parameter Min. Max. Min. Max. Unit WRITE CYCLE twc Write Cycle Time (3) 55 1 tew Chip Enable to End-of-Write 4 9 taw Address Valid to End-of-Write 4 9 tas Address Set-up Time twp Write Pulse Width (4) 3 55 twr Write Recovery Time tdw Data Valid to End-of-Write 4 thz Output High-Z Time (1) 4 tdh Data Hold Time twz Write Enable to Output in High-Z (1) 4 tow Output Active from End-of-Write (1) 2689 tbl 1b 1. Traition is measured mv from Low or High-impedance voltage with Output Test Load (Figure 2). This parameter is guaranteed by device characterization but is not production tested. 2. PLCC, TQFP and STQFP packages only. 3. For MASTER/SVE combination, twc = tbaa + twp, since R/W = VIL must occur after tbaa. 4. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of twp or (twz + tdw) to allow the I/O drivers to turn off data to be placed on the bus for the required tdw. If OE is HIGH during a R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified twp. 5. 'X' in part numbers indicates power rating ( or ). 12

13 IDT713/ and IDT714/ Timing Waveform of Write Cycle No. 1, (R/W Controlled Timing) (1,5,8) twc ADDRESS thz (7) OE taw CE tas (6) twp (2) twr (3) thz (7) R/W twz (7) tow DATA OUT (4) (4) tdw tdh DATA IN 2689 drw 1 Timing Waveform of Write Cycle No. 2, (CE Controlled Timing) (1,5) ADDRESS taw twc CE tas (6) tew (2) twr (3) R/W tdw tdh DATA IN 2689 drw R/W or CE must be HIGH during all address traitio. 2. A write occurs during the overlap (tew or twp) of CE = VIL and R/W = VIL. 3. twr is measured from the earlier of CE or R/W going HIGH to the end of the write cycle. 4. During this period, the l/o pi are in the output state and input signals must not be applied. 5. If the CE LOW traition occurs simultaneously with or after the R/W LOW traition, the outputs remain in the HIGH impedance state. 6. Timing depends on which enable signal (CE or R/W) is asserted last. 7. This parameter is determined by device characterization, but is not production tested. Traition is measured mv from steady state with the Output Test Load (Figure 2). 8. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of twp or (twz + tdw) to allow the I/O drivers to turn off data to be placed on the bus for the required tdw. If OE is HIGH during a R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified twp. 13

14 IDT713/ and IDT714/ AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (7) 713X (1) 714X (1) Com'l Only 713X 714X 713X35 714X35 Com'l Symbol Parameter Min. Max. Min. Max. Min. Max. Unit BUSY TIMING (For MASTER IDT 713) tbaa BUSY Access Time from Address tbda BUSY Disable Time from Address tbac BUSY Access Time from Chip Enable tbdc BUSY Disable Time from Chip Enable twh Write Hold After BUSY (6) twdd Write Pulse to Data Delay (2) tddd Write Data Valid to Read Data Delay (2) taps Arbitration Priority Set-up Time (3) tbdd BUSY Disable to Valid Data (4) BUSY INPUT TIMING (For SVE IDT 714) twb Write to BUSY Input (5) twh Write Hold After BUSY (6) twdd Write Pulse to Data Delay (2) tddd Write Data Valid to Read Data Delay (2) X55 714X55 713X1 714X1 Symbol Parameter Min. Max. Min. Max. Unit BUSY TIMING (For MASTER IDT 713) tbaa BUSY Access Time from Address] 2689 tbl 11a 3 5 tbda BUSY Disable Time from Address 3 5 tbac BUSY Access Time from Chip Enable 3 5 tbdc BUSY Disable Time from Chip Enable 3 5 twh Write Hold After BUSY (6) twdd Write Pulse to Data Delay (2) 8 1 tddd Write Data Valid to Read Data Delay (2) 55 1 taps Arbitration Priority Set-up Time (3) 5 5 tbdd BUSY Disable to Valid Data (4) 55 BUSY INPUT TIMING (For SVE IDT 714) twb Write to BUSY Input (5) twh Write Hold After BUSY (6) twdd Write Pulse to Data Delay (2) 8 1 tddd Write Data Valid to Read Data Delay (2) PLCC, TQFP and STQFP packages only. 2. Port-to-port delay through RAM cells from the writing port to the reading port, refer to Timing Waveform of Write with Port -to-port Read and BUSY." 3. To eure that the earlier of the two ports wi. 4. tbdd is a calculated parameter and is the greater of, twdd twp (actual) or tddd tdw (actual). 5. To eure that a write cycle is inhibited on port 'B' during contention on port 'A'. 6. To eure that a write cycle is completed on port 'B' after contention on port 'A'. 7. 'X' in part numbers indicates power rating (S or L) tbl 11b 14

15 IDT713/ and IDT714/ Timing Waveform of Write with Port-to-Port Read and BUSY (2,3,4) twc ADDR"A" MATCH twp R/W"A" tdw tdh DATAIN"A" ADDR"B" taps (1) VALID MATCH tbaa tbda tbdd BUSY"B" twdd DATAOUT"B" 1. To eure that the earlier of the two ports wi. tbdd is ignored for slave (IDT714). 2. CEL = CER = VIL 3. OE = VIL for the reading port. 4. All timing is the same for the left and right ports. Port 'A' may be either the left or right port. Port "B" is opposite from port "A". tddd VALID 2689 drw 12 Timing Waveform of Write with BUSY (3) twp R/W"A" BUSY"B" twb R/W"B" (2) (1) twh, 2689 drw twh must be met for both BUSY Input (IDT714, slave) or Output (IDT713 master). 2. BUSY is asserted on port "B" blocking R/W"B", until BUSY"B" goes HIGH. 3. All timing is the same for the left and right ports. Port "A" may be either the left or right port. Port "B" is oppsite from port "A". 15

16 IDT713/ and IDT714/ Timing Waveform of BUSY Arbitration Controlled by CE Timing (1) ADDR 'A' AND 'B' ADDRESSES MATCH CE'B' (2) taps CE'A' tbac tbdc BUSY'A' 2689 drw 14 Timing Waveform by BUSY Arbitration Controlled by Address Match Timing (1) trc OR twc ADDR'A' ADDR'B' BUSY'B' (2) taps ADDRESSES MATCH tbaa ADDRESSES DO NOT MATCH tbda 2689 drw All timing is the same for left and right ports. Port A may be either left or right port. Port B is the opposite from port A. 2. If taps is not satisified, the BUSY will be asserted on one side or the other, but there is no guarantee on which side BUSY will be asserted (713 only). AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (2) 713X (1) 714X (1) Com'l Only 713X 714X 713X35 714X35 Com'l Symbol Parameter Min. Max. Min. Max. Min. Max. Unit INTERRUPT TIMING tas Address Set-up Time twr Write Recovery Time tins Interrupt Set Time tinr Interrupt Reset Time 1. PLCC, TQFP and STQFP package only. 2. 'X' in part numbers indicates power rating ( or ) tbl 12a 16

17 IDT713/ and IDT714/ AC Electrical characteristics Over the Operating Temperature and Supply Voltage Range (1) 713X55 714X55 713X1 714X1 Symbol Parameter Min. Max. Min. Max. Unit INTERRUPT TIMING tas Address Set-up Time twr Write Recovery Time tins Interrupt Set Time 6 tinr Interrupt Reset Time 6 1. 'X' in part numbers indicates power rating ( or ) tbl 12b Timing Waveform of Interrupt Mode (1) INT Set: ADDR'A' R/W'A' INT'B' twc INTERRUPT ADDRESS (3) tas (3) tins (2) (4) twr 2689 drw 16 INT Clear: trc ADDR'B' tas (3) INTERRUPT CLEAR ADDRESS OE'B' (3) tinr INT'A' 2689 drw All timing is the same for left and right ports. Port A may be either left or right port. Port B is the opposite from port A. 2. See Interrupt Truth Table II. 3. Timing depends on which enable signal (CE or R/W) is asserted last. 4. Timing depends on which enable signal (CE or R/W) is de-asserted first. 17

18 IDT713/ and IDT714/ Truth Tables Truth Table I Non-Contention Read/Write Control (4) Inputs (1) R/W CE OE D-7 Function X H X Z Port Disabled and in Power-Down Mode, ISB2 or ISB4 X H X Z CER = CEL = VIH, Power-Down Mode, ISB1 or ISB3 L L X DATAIN Data on Port Written into Memory (2) H L L DATAOUT Data in Memory Output on Port (3) H L H Z High Impedance Outputs 1. AL A1L AR A1R. 2. If BUSY = L, data is not written. 3. If BUSY = L, data may not be valid, see twdd and tddd timing. 4. 'H' = VIH, 'L' = VIL, 'X' = DON T CARE, 'Z' = HIGH IMPEDANCE 2689 tbl 13 Truth Table II Interrupt Flag (1,4) Left Port Right Port R/WL CEL OEL A9L-AL INTL R/WR CER OER A9R-AR INTR Function L L X 3FF X X X X X L (2) Set Right INTR Flag X X X X X X L L 3FF H (3) Reset Right INTR Flag X X X X L (3) L L X 3FE X Set Left INTL Flag X L L 3FE H (2) X X X X X Reset Left INTL Flag 1. Assumes = = VIH 2. If = VIL, then No Change. 3. If = VIL, then No Change. 4. 'H' = HIGH,' L' = LOW,' X' = DON T CARE 2689 tbl 14 Truth Table III Address BUSY Arbitration CEL CER Inputs Outputs AL-A9L AR-A9R (1) (1) Function X X NO MATCH H H Normal H X MATCH H H Normal X H MATCH H H Normal L L MATCH (2) (2) Write Inhibit (3) 2689 tbl Pi and are both outputs for IDT713 (master). Both are inputs for IDT714 (slave). BUSYX outputs on the IDT713 are open drain, not push-pull outputs. On slaves the BUSYX input internally inhibits writes. 2. 'L' if the inputs to the opposite port were stable prior to the address and enable inputs of this port. 'H' if the inputs to the opposite port became stable after the address and enable inputs of this port. If taps is not met, either or = LOW will result. and outputs can not be LOW simultaneously. 3. Writes to the left port are internally ignored when outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored when outputs are driving LOW regardless of actual logic level on the pin. 18

19 IDT713/ and IDT714/ Functional Description The IDT713/IDT714 provides two ports with separate control, address and I/O pi that permit independent access for reads or writes to any location in memory. The IDT713/IDT714 has an automatic power down feature controlled by CE. The CE controls onchip power down circuitry that permits the respective port to go into a standby mode when not selected (CE = VIH). When a port is enabled, access to the entire memory array is permitted. Interrupts If the user chooses the interrupt function, a memory location (mail box or message center) is assigned to each port. The left port interrupt flag (INTL) is asserted when the right port writes to memory location 3FE (HEX), where a write is defined as the CER = R/WR = VIL per Truth Table II. The left port clears the interrupt by accessing address location 3FE when CEL = OEL = VIL, R/W is a "don't care". Likewise, the right port interrupt flag (INTR) is asserted when the left port writes to memory location 3FF (HEX) and to clear the interrupt flag (INTR), the right port must access the memory location 3FF. The message (8 bits) at 3FE or 3FF is userdefined, since it is an addressable SRAM location. If the interrupt function is not used, address locatio 3FE and 3FF are not used as mail boxes, but as part of the random access memory. Refer to Truth Table II for the interrupt operation. Busy Logic Busy Logic provides a hardware indication that both ports of the RAM have accessed the same location at the same time. It also allows one of the two accesses to proceed and signals the other side that the RAM is Busy. The BUSY pin can then be used to stall the access until the operation on the other side is completed. If a write operation has been attempted from the side that receives a BUSY indication, the write signal is gated internally to prevent the write from proceeding. The use of BUSY logic is not required or desirable for all applicatio. In some cases it may be useful to logically OR the BUSY outputs together and use any BUSY indication as an interrupt source to flag the event of an illegal or illogical operation. In slave mode the BUSY pin operates solely as a write inhibit input pin. Normal operation can be programmed by tying the BUSY pi HIGH. If desired, unintended write operatio can be prevented to a port by tying the BUSY pin for that port LOW. The BUSY outputs on the IDT713 RAM (Master) are open drain type outputs and require open drain resistors to operate. If these RAMs are being expanded in depth, then the BUSY indication for the resulting array does not require the use of an external AND gate. Width Expaion with Busy Logic Master/Slave Arrays When expanding an RAM array in width while using busy logic, one master part is used to decide which side of the RAM array will receive a busy indication, and to output that indication. Any number of slaves to be addressed in the same address range as the master, use the busy signal as a write inhibit signal. Thus on the IDT713/IDT714 RAMs the BUSY pin is an output if the part is Master (IDT713), and the BUSY pin is an input if the part is a Slave (IDT714) as shown in Figure 3. 27Ω 5V MASTER Dual Port RAM MASTER Dual Port RAM CE CE SVE Dual Port RAM SVE Dual Port RAM 2689 drw 18 Figure 3. Busy and chip enable routing for both width and depth expaion with IDT713 (Master) and IDT714 (Slave)RAMs. If two or more master parts were used when expanding in width, a split decision could result with one master indicating busy on one side of the array and another master indicating busy on one other side of the array. This would inhibit the write operatio from one port for part of a word and inhibit the write operatio from the other port for the other part of the word. The BUSY arbitration, on a Master, is based on the chip enable and address signals only. It ignores whether an access is a read or write. In a master/slave array, both address and chip enable must be valid long enough for a BUSY flag to be output from the master before the actual write pulse can be initiated with either the R/W signal or the byte enables. Failure to observe this timing can result in a glitched internal write inhibit signal and corrupted data in the slave. CE CE DECODER 5V 27Ω 19

20 IDT713/ and IDT714/ Ordering Information XXXX Device Type A 999 A A A Power Speed Package Process/ Temperature Range A Blank 8 Tube or Tray Tape and Reel Blank I (1) B Commercial ( C to +7 C) Industrial (-4 C to +85 C) Military (-55 C to +1 C) Compliant to MIL-PRF QML G (2) Green (3) P C J L F PF TF 48-pin Plastic DIP (P48) 48-pin Sidebraze DIP (C48) 52-pin PLCC (J52) 48-pin LCC (L48) 48-pin Ceramic Flatpack (F48) 64-pin TQFP (PN64) 64-pin STQFP (PP64) Commercial PLCC, TQFP and STQFP Only Commercial, Industrial Commercial Commercial, Industrial Commercial, Industrial Speed in nanoseconds Low Power Standard Power K (1K x 8-Bit) MASTER Dual-Port RAM 8K (1K x 8-Bit) SVE Dual-Port RAM 2689 drw Contact your local sales office for industrial temp range for other speeds, packages and powers. 2. Green parts available. For specific speeds, packages and powers contact your local sales office. 3. For "P", plastic DIP, when ordering green package the suffix is "PDG". Datasheet Document History 3/15/99: Initiated datasheet document history Converted to new format Cosmetic and typographical correctio Pages 2 and 3 Added additional notes to pin configuratio 6/8/99: Changed drawing format 8/2/99: Page 2 Corrected package number in note 3 9/29/99: Page 2 Fixed pin 1 in DIP pin configuration 11/1/99: Page 1 & 18 Replaced IDT logo 6/23/: Page 4 Increased storage temperature parameters Clarified TA parameter Page 5 DC Electrical parameters changed wording from "open" to "disabled" Page 1 Changed ±5mV to mv in notes 1/8/2: Page 1 Added Ceramic Flatpack to 48-pin package offerings Page 2 & 3 Added date revision to pin configuratio Page 4, 5, 8, 1, Removed industrial temp option footnote from all tables 12,14 & 15

21 IDT713/ and IDT714/ Datasheet Document History (cont'd) 1/8/2: Page 5, 8, 1, 12, & 14 Added industrial temp for to DC & AC Electrical Characteristics Page 5, 8, 1, 12, & 14 Removed industrial temp for 35 to DC & AC Electrical Characteristics Page 18 Added industrial temp for and removed industrial temp for 35 in ordering information Updated industrial temp option footnote Page 1 & 19 Replaced IDT TM logo with IDT logo 1/11/6: Page 1 Added green availability to features Page 18 Added green indicator to ordering information Page 1 & 19 Replaced old IDT TM with new IDT TM logo 4/14/6: Page 18 Added "PDG" footnote to the ordering information 1/21/8: Page 18 Removed "IDT" from orderable part number 1/21/13: Page 2 Added L48-1 package and F48-1 package pin configuratio with corresponding foot notes Page 13, 18, 19 & Typo/correctio Page Added T & Reel indicator to ordering information 5//16: Page 2 Split the F48 and L48 pin configuration, creating two separate pin configuratio: F48 pin ceramic flatpack rotated 9 degrees counterclockwise, removed footnote 5 reference and L48 LCC rotated 9 degrees clockwise to reflect pin 1 orientation and added dot at pin 1, removed footnote 5 reference Page 3 P48 plastic DIP and C48 sidebrazed DIP, removed half moon and to reflect pin 1 orientation added dot at pin 1 Page 4 J52 PLCC rotated 9 degrees clockwise to reflect pin 1 orientation added dot at pin 1, removed footnote 5 reference Page 5 PN64 TQFP and PP64 STQFP, chamfer removed, rotated 9 degrees counterclockwise to reflect pin 1 orientation and added dot at pin 1, removed footnote 5 reference Page All incidences of -1, -2 have been removed from the datasheet CORPORATE HEADQUARTERS for LES: for Tech Support: 624 Silver Creek Valley Road or San Jose, CA fax: DualPortHelp@idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. 21