MicroTCA Power Module

Transcription

1 MicroTCA Power Module Preliminary Release Rev.52

2 Copyright , CorEdge Networks. All rights reserved. CorEdge Networks, 50 Commonwealth Ave. Suite 504, Boston, MA USA THIS DOCUMENT IS PROVIDED IN CONNECTION WITH A PRODUCT OR PRODUCTS FURNISHED UNDER LICENSE BY COREDGE NETWORKS. THIS DOCUMENT AND THE INFORMATION IN THIS DOCUMENT MAY ONLY BE USED IN ACCORDANCE WITH THE TERMS AND CONDITIONS OF THE LICENSE. EXCEPT AS PERMITTED BY SUCH LICENSE, NO PART OF THIS DOCUMENT MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM, PHOTOCOPIED OR TRANSMITTED, IN ANY FORM OR BY ANY MEANS, ELECTRONIC, MECHANICAL, RECORDING, OR OTHERWISE, WITHOUT THE PRIOR WRITTEN PERMISSION OF COREDGE NETWORKS. COREDGE NETWORKS ASSUMES NO RESPONSIBILITY FOR THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS, LINKS OR OTHER ITEMS CONTAINED IN THIS DOCUMENT. COREDGE NETWORKS MAY MAKE CHANGES TO THESE MATERIALS OR THE PRODUCTS DESCRIBED HEREIN AT ANY TIME WITHOUT NOTICE. COREDGE NETWORKS MAKES NO COMMITMENT TO UPDATE THESE MATERIALS. THIS DOCUMENT SUPERSEDES ALL PRIOR DOCUMENTS AND REVISIONS REGARDING THIS SUBJECT MATTER. THE FURNISHING OF THIS DOCUMENT DOES NOT GRANT, NOR IS INTENDED TO GRANT, ANY RIGHT OR LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY PATENTS, PENDING PATENT APPLICATIONS, TRADEMARKS, COPYRIGHTS, MASK WORKS, TRADE SECRETS, KNOW-HOW OR ANY OTHER INTELLECTUAL PROPERTY RIGHTS COVERING THE INFORMATION IN THIS DOCUMENT. EXCEPT AS PROVIDED IN THE LICENSE, COREDGE NETWORKS ASSUMES NO LIABILITY WHATSOEVER FOR ANY DIRECT, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF OR THE INABILITY TO USE THE INFORMATION OR PRODUCTS DESCRIBED HEREIN. THIS DOCUMENT AND THE INFORMATION IN THIS DOCUMENT IS PROVIDED WITHOUT EXPRESS OR IMPLIED WARRANTIES OF ANY KIND RELATING TO THE SALE OR USE OF COREDGE PRODUCT OR PRODUCTS INCLUDING WARRANTIES RELATING TO MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, TITLE OR FITNESS FOR A PARTICULAR PURPOSE. THE INFORMATION CONTAINED IN THIS DOCUMENT AND THE PRODUCTS IT DESCRIBES ARE NOT DESIGNED, MANUFACTURED, OR INTENDED FOR USE OR SALE FOR HIGH RISK ACTIVITIES SUCH AS ON-LINE CONTROL OF EQUIENT IN HAZARDOUS ENVIRONMENTS, REQUIRING FAIL-SAFE PERFORMANCE, OPERATION OF NUCLEAR FACILITIES, AIRCRAFT NAVIGATION OR COMMUNICATION SYSTEMS, AIR TRAFFIC CONTROL, DIRECT LIFE SUPPORT MACHINES, OR WEAPON SYSTEMS IN WHICH FAILURE COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE. CorEdge Networks and the CorEdge logo are trademarks of CorEdge Networks. Users Guide Rev.52 Page 2 of 22

3 Revision History REVISION DATE DESCRIPTION ENGINEER.41 8/30/2006 Initial Draft.50 9/01/2006 Preliminary Release.51 9/01/2006 Modified Voltage Threshold table value.52 10/04/2006 Fixed Fig 3 Users Guide Rev.52 Page 3 of 22

4 Table of Contents Introduction CorEdge Company Information Contact Information References Overview of MicroTCA MicroTCA Platform Backplane and Chassis AMC s Cooling Units MCH CorEdge Feature Summary CorEdge Overview Functional Description Connectors LED Indicators Blue LED JTAG Installation Installation Instructions Installation Sequence Removal Sequence Carrier I Controller (IC) Enhanced Carrier I-C functions Power Channel Control Watchdog Timer Local Sensors Input Supply Voltages Internal Supply Voltages Hot Swap Micro Switch Temperature Sensors Specifications Hardware Specification Operating and Storage Environment Specifications Output Connector Assignments List of Figures Figure 1 MicroTCA High Level Overview... 8 Figure 2 MicroTCA Management Infrastructure... 9 Figure 3 - Side View Figure 4 - Block Diagram Figure 5 - Front Panel Figure 6 Blue LED sequence Users Guide Rev.52 Page 4 of 22

5 List of Tables Table 1 LED Definitions Table 2 Hardware Specifications Table 3 Operating and Storage Specifications Table 4 Output Connector Pinouts Users Guide Rev.52 Page 5 of 22

6 Introduction This user s guide describes the installation and use of CorEdge Networks in MicroTCA Systems. The is an intelligent Field Replaceable Unit that controls the power entry, conversion, monitoring, and distribution of power within MicroTCA/AMC Systems. 1.1 CorEdge Company Information CorEdge Networks, headquartered in Boston, MA, with offices in Fremont, CA, River Edge, NJ and Minneapolis, MN, is a developer of intellectual property and products focused on next-generation networking applications for telecommunications, data center, and high-performance computing markets. 1.2 Contact Information This section provides contact information for sales, technical support and consulting services. Sales: sales@coredgenetworks.com Technical Support: support@coredgenetworks.com Product Information: info@coredgenetworks.com This product has been developed and is fully supported by CorEdge Networks, Inc. Contact Technical Support for help and information. See your maintenance agreement for details on your level of technical support. Please include the following information: Caller s name, phone number, and address Customer (i.e., Company) Name Specific product component for which support is requested (e.g., schematics) The customer s cooperation with providing this information will assist CorEdge support staff in routing the support request or comments to the appropriate individual and will allow CorEdge to track the discussion and provide timely follow-up as needed. 1.3 Acronyms, Definitions Acronyms and definitions used in this document are listed below. AMC Advanced Mezzanine Card ATCA Advanced Telecom Computing Architecture EMMC Enhanced Module Management Controller JTAG Joint Test Action Group IC Intelligent Platform Management Controller IB Intelligent Platform Management Bus MCH MicroTCA Carrier Hub MCMC MicroTCA Carrier Management Controller MMC Module Management Controller NEBS Network Equipment Building Systems (Telecordia) Users Guide Rev.52 Page 6 of 22

7 RoHS Restriction of Hazardous Substances SDR Sensor Data Records VDC Volts, Direct Current 1.4 References [1] PICMG 3.0 R2.0 AdvancedTCA Base Specification, as amended by ECN and ECN [2] PICMG MicroTCA RC1.0 Micro Telecommunications Computing Architecture Base Specification [3] PICMG AMC.0 R1.0 Advanced Mezzanine Card Base Specification [4] ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001 [5] ANSI/TIA/EIA : Electrical Characteristics of Multipoint-Low- Voltage Differential Signaling (M-LVDS) Interface Circuits for Multipoint Data Storage, March 1, 2002 [6] II Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document Revision 1.0, November 15, 1999 Copyright 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. [7] II Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 20, Copyright 2004 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. [8] II Intelligent Platform Management Interface Specification Second Generation, v2.0. Document Revision 1.0, February 12, Copyright 1999,2000, 2001, 2002 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. [9] II Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998 Copyright 1998, Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. [10] II Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, September 27, 1999 Copyright 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved. [11] II Wired for Management Baseline, Version 2.0. [12] CorEdge Global Specification 12G02897W18 Controlled and Reportable Material Disclosure [13] CorEdge Printed Circuit Board Design for Manufacturability Guidelines DOI [14] ECCG - In Circuit Test (ICT) Design for Test (DFT) Guidelines Revision A, Draft dated [15] MCG Design for Boundary Scan Test Guideline Rev 1.0 dated February 05, 2004 [16] Telcordia GR-1089-CORE, Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunication Equipment [17] Telcordia GR-63-CORE NEBS Requirements: Physical Protection [18] IEC Information Technology Equipment-Safety, Second Edition , IEC (International Electrotechnical Commission) [19] 32002L0095 Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal L 037, 13/02/2003 P Users Guide Rev.52 Page 7 of 22

8 2 Overview of MicroTCA MicroTCA is an industry open-standard that is currently under development through the PCI Industrial Computer Manufacturer s Group (PICMG). The standard is aimed at defining a platform infrastructure for Advanced Mezzanine Card (AMC) modules for use in Telecom and other embedded markets. MicroTCA platforms provide smaller form-factor and lower-entry cost options over existing platform solutions. Figure 1 MicroTCA High Level Overview 2.1 MicroTCA Platform Figure-1 shows a block diagram of the MicroTCA platform with interconnection between MCHs, s, Cooling Units (CUs) and AMCs. The overview of MicroTCA management infrastructure is shown in Figure-2 below. For MicroTCA platform, each of these functional blocks is briefly described in the following sections. Users Guide Rev.52 Page 8 of 22

9 Figure 2 MicroTCA Management Infrastructure Backplane and Chassis The backplane and chassis provide the physical and mechanical infrastructure to support the other MicroTCA platform elements AMC The AMC modules provide application-specific processing and I/O capability to the MicroTCA platform. Modules plug into the MicroTCA system backplane and receive power and cooling from the MicroTCA platform. Interconnect between modules is provided by the system fabric interface (shown in green of Figure-1). PICMG standards currently define PCI-Express, Advanced Switching, Ethernet, Serial Rapid I/O, and SATA fabrics for AMCs. PICMG standards also define clocking, power, and management requirements for these modules. Users Guide Rev.52 Page 9 of 22

10 2.1.3 s One or more power modules supply power to each of the elements within the MicroTCA platform. The power distribution topology is radial separate power rails are routed to each AMC, MCH, and Cooling Unit. In addition, each MicroTCA element receives both management power (3.3V for II support), and Payload Power (12V to be regulated for non-ii circuitry). The power modules and the MCH work together to manage the power supplied to each AMC module. The power supply modules provide II interfaces (IB-0) to communicate with the MCH module(s) Cooling Units One or more cooling units provide cooling capability to the MicroTCA platform. Power is supplied to the Cooling Units from the system s. Fans are controlled and managed over an IB interface (IB-0) by the MCH(s) MCH The MCH provides management and control of shelf level resources (Cooling Units, Cooling Unit power, clocking, JTAG test), and module level resources (AMC modules, AMC module power). The MCH interfaces with the Cooling Units and s through a dedicated IB bus (IB-0). Another IB bus (IB-L) connects the MCHs and the AMC modules. MCH modules may operate in redundant (active-standby), or non-redundant configurations. In redundant configurations, MCH modules provide a dual-star network platform-level network with the ability to seamlessly fail-over MCH functionality without loss of service. 3 CorEdge Feature Summary Figure 3 shows a side view of the Figure 3 - Side View Users Guide Rev.52 Page 10 of 22

11 The -48V key features are: Single Width / Full Height Form Factor Max Payload Power Output: 396W: +12V Non-redundant mode only Power conversion to +3.3V for Management power and +12V DC for Payload power Manages dual -48V DC power inputs Wide Input Voltage Range: 36V to 75V DC Status LEDs Face Plate Hot Swap switch control latch Hold-up Capacitor and EMI Filtering support MicroTCA Output Interface to MicroTCA Backplane (includes JTAG) CorEdge Enhanced Module Mgmt Controller (EMMC) o Intelligent Platform Management Interface (II) v1.5 support o Communicates with MicroTCA Carrier Hub using II over IB-0 o Controls Management and Payload Power Output (includes programmable power output current limiting) o Manages current sense and current limiting functions o Local Watchdog Timer support o Monitors local Voltage, Current and Temperature sensors 4 CorEdge Overview 4.1 Functional Description The () is a front accessible MicroTCA module that controls the entry, conversion and distribution of power to other modules in a MicroTCA shelf. The connects to -48V/-60V DC supplies typical in telecommunication installations through dual -48/60V inputs and converts to +12V DC Payload Power and +3.3V Management Power. The distributes independent +12 V DC Payload Power for up to twelve AMCs, up to two MCHs and up to two Cooling Units. The supports AMCs that operate in the range of 10-14VDC. A holdover capacitor provides protection against momentary shorts on the input power. The interfaces with the MCH Carrier Manager for monitoring and operational control. See Figure 4 for a Block diagram of. The Enhanced Module Management Controller (EMMC) communicates with a Micro TCA Carrier Hub (MCH) in the shelf via the IB-0 bus. The interfaces with the Carrier Manager to permit monitoring of the internal module status and operation of the power distribution control elements. The Carrier Manager manages power for the MicroTCA Carrier via a set of power management commands implemented by the EMMC. The provides the capability to ride through certain input power disturbances typical in carrier installations. A holdup capacitor stores energy which is then used to provide continuous operation during any input voltage transients. For the 396W non-regulated supply a holdup time of 8.7ms is provided. The MicroTCA Carrier power management process can be divided into two stages: early power and normal power. The early power stage starts from the moment the external power is applied to the ; and it ends when the MCH takes over power management. During the early power stage, the operates in autonomous mode Users Guide Rev.52 Page 11 of 22

12 for certain Power Channels. The autonomous mode automatically provides Management Power, asserts ENABLE#, and provides Payload Power to the Cooling Units and to MCH(s) that are present. After the MCH(s) are powered-up and fully initialized, the Carrier Manager is elected and power management enters the normal stage. In the normal stage, the Carrier Manger takes control and the s do not autonomously enable power to any modules. First, the Carrier Manager reads power information from the Carrier FRU Information and all the Modules. Based upon the FRU Information data and the status, the Carrier Manager determines roles for each Power Channel and the maximum available Payload Power from each. In normal mode, the Carrier Manager sends a Heartbeat command to the. If it fails to send this the will revert to autonomous mode. However, the will continue to supply channel power if this occurs. Front Panel Latch LEDs Input 48V Power Connector 'A' Input 48V Power Connector 'B' Power Switch Temp. Sensor Diode OR'ing, fuse, in-rush limiting, and hold-up circuit. EMI filtering 48V Watchdog Timer Isolating DC-DC Converter Temp. Sensor 12V bulk 3.9V bulk Payload Enable MOSFET OR'ing Enable Management Power Enable 16 12V Payload Power Control, Current-sense, and MOSFET OR'ing. 3.3V Management Power Control, Current-sense, and Diode OR'ing busses PP_Ch# 16 MP_Ch# 16 EN_Ch# PS1_Ch# PWR_ON_Ch# GA1,GA2,GA3 IB-0 _OK# Backplane Connector (Power & Ctl signals per channel) 3 P_[A,B,C]#... Mux ADC RST IN# Voltage, Current and Temperature Monitoring I/F EMMC 3 RST [A,B,C]# PS_# SMP 5 JTAG Figure 4 - Block Diagram Users Guide Rev.52 Page 12 of 22

13 4.2 Connectors Figure 5 shows the faceplate with the input power connector and its pin locations. Return -48V Green LED Latch Amber LED Red LED Blue LED Figure 5 - Front Panel Currently Unused 4.3 LED Indicators LED color Green Amber Red Blue LED indicates operating normally when LED blinking Currently unsupported. Input power feed failure or a major malfunction. The status output signal _OK# is negated. Hot Swap status. See sequence in following Section Table 1 LED Definitions Blue LED The supports the ATCA FRU required Blue LED. The LEDs are controlled by the IC controller. The state of the Blue LED during insertion and extraction is shown in Figure 6. Users Guide Rev.52 Page 13 of 22

14 Figure 6 Blue LED sequence 4.4 JTAG In MicroTCA platforms, an optional JTAG Switch Module (JSM) supports serial scan testing of complete MicroTCA Shelves, as well as their individual elements and it supports field upgrades. This testing is most often carried out during manufacturing tests in a factory setting, but MicroTCA also supports the use of these JTAG test capabilities in active systems in the field. JSM functions may be located in special slots on the backplane, or integrated into other Modules. The CorEdge provides a JTAG slave interface accordance with the MicroTCA Spec, Ref [2] and the AMC Spec, Ref [3]. The JTAG interface enables a to be tested by an external JTAG test tool or by a CorEdge MCH which can act as JTAG master. There are five JTAG signals defined on the Output Connector, TDI, TDO, TCK, TRST# and TMS. The connector pin assignments are defined in Section 7. The components on the that the JTAG signals interface with are the Flash and FPGA, within the EMMC. 5 Installation 5.1 Installation Instructions Please use the system in a static controlled environment: The s are installed in dedicated slots. Up to four slots are available in MicroTCA systems. As with all electronic equipment, the installer should follow good ESD prevention practices and install in a static controlled environment. Figure 5 shows the front view of the power module. The will operate with only one input power connector connected. 5.2 Installation Sequence Insert the into the target slot s card guides. Slide the into the slot until the mating and backplane connectors are fully seated. Attach one or both 48V/60V DC power cables to their respective connectors and drive their retention screws to hold the cables to the Face Plate. Push the latch handle into the Face Plate to lock the module into the slot. Users Guide Rev.52 Page 14 of 22

15 5.3 Removal Sequence Pull out the latch handle on the. This signals the EMMC to disable Payload power & Management power. The Blue LED (see Section Blue LED) will begin blinking as shutdown occurs. When the Blue LED stays on it is safe to extract the. Unscrew the power cable connectors retention screws. Disconnect both 48V DC power cables. Caution: Failure to disconnect power cables before removing the card could result in shock or damage to the module. Pull on the latch handle to disconnect the from the backplane connector and slide the out of the slot. 6 Carrier I Controller (IC) The uses the EMMC Micro Controller to receive commands from the Carried Manager through the IB bus. 6.1 Enhanced Carrier I-C functions The II software supports platform-specific and behavior-specific functions, including: Startup/shutdown Initialize-Initialize the IB subsystem, register I2C interface functions, etc. Shutdown-Shutdown the IB subsystem. Messaging Request-Send an II request message. Response-Send an II response message. Poll-Poll for an IB message and process it according to the type of message it is. Ticker-Increment the clock tick count of messages in internal tables, process time-outs, and retries. II Device Global Commands Event Commands FRU Inventory Device Commands FRU Control FRU Activation Policy Commands Set FRU Activation Get FRU LED Properties FRU LED State Commands Get Device Locator Record ID Get Address Info Users Guide Rev.52 Page 15 of 22

16 Actions Get LED Color Capabilities Get PICMG Properties IB Commands Power Level Commands Compute Power Properties Register a callback function-register a callback function to invoke when a particular IB message is received. FRU Data Support includes: Common Area Internal User Area Chassis Info Area Board Info Area Product Info Area Carrier Activation and Current Management Record 6.2 Power Channel Control The is controlled through the II interface on the MCH module. Power Channel Control Get Power Channel Status Reset Get Status Heartbeat Table 3.28 in the MicroTCA spec, Ref [2], provides details of Power Channel Control Command and the values of the commands listed below. Assert Enable Deassert Enable Enable Management Power Disable Management Power Enable Payload Disable Payload Users Guide Rev.52 Page 16 of 22

17 6.3 Watchdog Timer The watchdog timer is strobed by the EMMC. If it is not strobed it will reset the EMMC causing the IMPB-0 interface to be reset. This reset will not affect either Payload or Management power or the state of any of the Power Channels. 6.4 Local Sensors Sensors provide voltage and temperature monitoring functions for the components that reside on the Power Module. All the sensors provide Sensor Data Records, SDRs that provide information about the sensor type, locations, event generation and access information. The supports the following sensor device commands for the sensors outlined below. Get device SDR info Get device SDR Reserve device SDR Get sensor reading Get/Set sensor thresholds Get/Set sensor hysteresis Get/Set sensor event enable The EMMC monitors the follow nodes: Primary and secondary 48V DC input supply voltages The 12V Bulk Payload and 3.9V Bulk Management voltages Internal supply voltages Output load current with programmable over-current limiting for each channel Temperature Sensors Input Supply Voltages The provides a voltage sensor and SDR for for each power input. Input voltage sensors on the generate events to upper level management software that can trigger event processing and gracefully shut down the system when the input feed voltage is approaching its operational limits. The upper level management software can then send an emergency power down Chassis Control command to tell the to shut down until the input voltage reaches acceptable levels. Note that this command will shut down power to the MCH and the CU, as well as other Modules in the MicroTCA Carrier. Due to the fact that the Set Power Restore Policy and Chassis Control commands do not contain FRU Device IDs, explicit message bridging is used by the MicroTCA aware management software to send these commands to the s. Once voltages return to acceptable levels, the restarts according to normal procedure. s attempt to send events prior to removing power. The time required for the event to propagate to an event receiver and be stored is implementation-defined. In the normal case, the lower critical event is sent with plenty of time prior to the nonrecoverable event, thus allowing upper-level management software time to notice the condition of the input power. The following table shows the thresholds and actions taken: Users Guide Rev.52 Page 17 of 22

18 Voltage Thresholds Default -48V/-60V Settings Action if Threshold Exceeded Max Voltage (critical threshold) -72V Send Evt; Payload & Mgmt turned off Max Warning Voltage (non-critical threshold) -68V Send Evt Min Voltage (non-critical threshold) -44V Send Evt Min Warning Voltage (critical threshold) -40.5V Send Evt; Payload & Mgmt turned off Internal Supply Voltages Internal supply voltages are monitored and reported to the Carrier Manager. Sixteen channels of payload current and sixteen channels of management current are monitored. The status of each channel is provided to the Carrier Manager in response to the Get Power Channel Status Command. In addition, internally used voltages of 17V, Bulk12V, 5V, 3.3V Management voltage, 2.5V and 1.2V are monitored. The EMMC implements a Power Channel Notification sensor, and reports to the Carrier Manager any state changes of any Power Channel. The details of this sensor are described in Table 3-30, Power Channel Notification event message in Ref [2] Hot Swap Micro Switch The Hot Swap feature of the is implemented using the latch and a micro-switch. The micro-switch position can be read by the IC controller and provides Open/Closed change status to the IC controller. The controller provides this status to the Carrier Manager which maintains a hot swap state machine for control of field replaceable units, FRUs Temperature Sensors Two temperature sensors are monitored. One monitors DC-DC Converter Brick temperature. The second monitors inlet air temperature. Each sensor provides an SDR to describe the sensor. The following table identifies the thresholds settings. The EMMC sends a temperature event message to the Carrier Manager when it determines a threshold has been exceeded. Temperature Threshold Converter Brick Inlet Air Temp Max Operating Temp (upper critical threshold) +115 C +45 C Warning Operating Temp (upper non-critical threshold) +100 C +40 C Min Operating Temp (lower critical threshold) -40 C -5 C Warning Operating Temp (lower non-critical threshold) -5 C +5 C Users Guide Rev.52 Page 18 of 22

19 7 Specifications 7.1 Hardware Specification PARAMETER FORM FACTOR POWER INPUT (396W OUTPUT RATING) MANAGEMENT POWER CHANNELS (16) PAYLOAD POWER CHANNELS (16) SIGNAL INPUTS & OUTPUTS POWER SUPPLY MONITORING TEMPERATURE MONITORING MODULE WEIGHT HOLD UP TIME VALUE 172.5mm x 73.5mm x 28.95mm (Single Width/Full Height) ~416 Watts (8.7 amps at 48VDC) Input Power Up to 225 ma per channel (Total of 2A available for Mgmt Power) (Current limit set by Software; FailSafe limit set by hardware to 450mA) 380W Total Power Available to Payload (up to max of 9.6A on a ch) (Current limit for each channel selected in software) 3.3V logic inputs All onboard voltages monitored: BULK-12V, 3.3V, 5V, 2.5V, 1.2V, MOSFET Bias (17V) 2 temperature monitoring Brick temperature and Inlet Air temperature TBD 396W : 8.7ms hold up time Table 2 Hardware Specifications 7.2 Operating and Storage Environment Specifications The has been designed to meet Thermal & Operating Environments as specified in following table from the MicroTCA spec in Ref [2]. Users Guide Rev.52 Page 19 of 22

20 Table 3 Operating and Storage Specifications 8 Output Connector Assignments output connector pin assignments from the MicroTCA specification [2] are provided below. Users Guide Rev.52 Page 20 of 22

21 Users Guide Rev.52 Page 21 of 22

22 Table 4 Output Connector Pinouts Users Guide Rev.52 Page 22 of 22