Universal Patch Platform Uni-Patch System Patch and Test Module User Manual

Transcription

1 Universal Patch Platform Uni-Patch System Patch and Test Module User Manual

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3 Universal Patch Platform Uni-Patch System Patch and Test Module User Manual

4 1991, 1992, 1993, 1994, ADC Telecommunications, Inc. All Rights Reserved Printed in U.S.A. ADC Telecommunications, Inc. P.O. Box 1101, Minneapolis, Minnesota In U.S.A. and Canada: Outside U.S.A. and Canada: (952) Fax: (952) Contents herein are current as of the date of publication. In no event will ADC be liable for any special, incidental or consequential damages or commercial losses even if ADC has been advised thereof as a result of issue of this publication. ADC reserves the right to change the contents without prior notice. This publication may be verified at any time by contacting ADC s Product Information Center at , extension 3475, or by writing to ADC Telecommunications, Inc., Attn: Product Information Center, Mail Station #80, 4900 West 78th Street, Minneapolis, MN Page ii

5 REVISION HISTORY EDITION/ISSUE DATE REASON FOR CHANGE Issue 1 11/91 Preliminary Issue 2 10/92 Preliminary Issue 3 3/93 Preliminary Issue 4 10/94 Preliminary LIST OF CHANGES PAGE IDENTIFIER DESCRIPTION OF CHANGE All Issue 4 Added information about EIA-530/232 LED Test Module. TRADEMARK INFORMATION Uni-Patch is a trademark of ADC Telecommunications, Inc. RELATED MANUALS Universal Patch Platform EIA-530/232 LED Test Module User Manual ADCP ADMONISHMENTS Important safety admonishments are used throughout this manual to warn of possible hazards to persons or equipment. An admonishment identifies a possible hazard and then explains what may happen if the hazard is not avoided. The admonishments in the form of Dangers, Warnings, and Cautions must be followed at all times. These warnings are flagged by use of the triangular safety icon (seen below), and are listed in order of severity of injury or damage and likelihood of occurrence. Danger: Danger is used to indicate the presence of a hazard which will cause severe personal injury, death, or substantial property damage if the hazard is not avoided. Warning: Warning is used to indicate the presence of a hazard that can cause severe personal injury, death, or substantial property damage if the hazard is not avoided. Caution: Caution is used to indicate the presence of a hazard that will or can cause minor personal injury or property damage if the hazard is not avoided. Page iii

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7 UNIVERSAL PATCH PLATFORM UNI-PATCH SYSTEM PATCH AND TEST MODULE USER MANUAL Content Page 1. GENERAL FUNCTIONAL DESCRIPTION MODULE INSTALLATION OPERATION CUSTOMER SERVICES GENERAL 1.01 This User Manual describes the EIA-530 Multi-Circuit Patch Module, the UPP Trunk/Test Module, the EIA-530 Breakout Module, and the EIA-530/232 LED Test Module designed for use in the Universal Patch Platform Uni-Patch System The Universal Patch Platform Uni-Patch System is a dedicated patch facility developed to furnish patch cord access for communications systems with data rates from DC to 20 Mbps. The EIA-530 Patch Modules provide patch cord access to these systems and are designed for application in shielded or non-shielded installations. The UPP Trunk/ Test Module provides test equipment access to the UPP Uni-Patch system for testing. The EIA-530 Breakout Module is used to alter or reconfigure signal paths between Data Terminal Equipment and Data Communications Equipment. These modules are also specified for use in shielded and non-shielded facilities. The EIA-530/232 LED Test Module provides patch cord access and LED monitoring for communication systems with data rates up to 5 Mbps. This module is designed for use in shielded and non-shielded installations This User Manual is reissued to include the information and applications for the EIA-530/232 LED Test Module. 2. FUNCTIONAL DESCRIPTION 2.01 The specifications for the EIA-530 Multi-Circuit Patch Module, Trunk/Test Module, Breakout Module are covered on Table 1. Refer to UPP EIA-530/232 LED Test Module User Manual ADCP for EIA-530/232 LED Test Module specifications. A. EIA-530 Patch Module 2.02 The EIA-530 Multi-Circuit Patch Module is a plug-in type unit designed for insertion installation into any of the three rack mounted Uni-Patch System Chassis Assemblies described in the Uni-Patch System Chassis Assembly User Manual ADCP Page 1

8 Table 1. EIA-530 Uni-Patch Module Specifications PARAMETER SPECIFICATION REMARKS Physical (H W D) EIA-530 Patch Module inches COMSEC/Commercial and Trunk/Test Module ( cm) EIA-530 Breakout Module inches COMSEC/Commercial ( cm) EIA-530/232 LED Test Module inches ( cm) Blank Panel inches COMSEC/Commercial ( cm) Mechanical-Patch Module Module Insertion/Withdrawal 50 cycles, Min. Without module or signal with Conductive Finger Gasket degradation Module Insertion/Withdrawal 200 cycles, Min. Without module or signal without Conductive Finger Gasket degradation Module Insertion Force 22 Pounds Typical 32 Pounds Maximum Module Withdrawal Force 16 Pounds Typical 26 Pounds Maximum Patch Jack Port 10,000 cycles Without contact or signal Insertions/Withdrawals degradation Patch Cord Insertion Force 12 Pounds typical 14 Pounds Maximum Patch Cord Withdrawal Force 2 Pounds typical 5 Pounds Maximum Electrical System Data Rate DC to 20 Mbps, NRZ Frequency Range DC to 20 MHz Module Impedance DC-20 MHz; 100 ohms +/ 10 ohms 20 MHz 100 MHz; 100 EIA -530 Patch Module only. ohms +10/ 20 ohms Applies to 10 balanced interchange circuits with and without patch cords Environmental Ambient Temperature: Operating Non-operating 32 F to +140 F (0 C to +60 C) 35 F to +158 F ( 35 C to +70 C) Humidity: (no condensation) Operating 10% to 80% Non-operating 5% to 90% Altitude: Operating 30,000 feet, Max, Non-operating 30,000 feet, Max Mean Time Between Failure 87,600 Hours Meam Time To Replace 15 Minutes - Max. Module Replacement Page 2

9 2.03 The EIA-530 Multi-Circuit Patch Module, Figure 1, provides patch cord access to the high speed data signaling systems terminated to the Uni-Patch System patching platforms. A functional diagram of the patch module circuitry is shown on Figure 2. Data circuits are routed through the patch module via the rear mounted EQUIP gold contacts, the front mounted EQUIP and multi-contact spring assemblies, and the rear mounted gold contacts. Figure 1. EIA-530 Multi-Circuit Patch Module 1 EQPT EQPT 100 OHM SIGNAL CORRECTIONS 13 GOLD CONTRACT PADS 14 MON GOLD CONTRACT PADS A BLACK RED Figure 2. EIA-530 Patch Module Functional Diagram and Front Panels Page 3

10 2.04 Three module front ports provide patch cord access to the multi-contact spring assemblies. The EQUIP port multi-contact springs provide patch cord access towards the Data Terminal Equipment (DTE) portion of the connected circuit. The port multicontact springs provide patch cord access toward the Data Communications Equipment (DCE) portion of the connected circuit. The MON port springs, bridged to the multi-contact spring assembly, provides patch access to monitor a data circuit without service interruption. A wiring diagram of the EIA-530 Patch Module multi-contact spring assemblies and spring assignments is shown in Figure 3. A plug-in detail for RED and BLACK patch cord insertion is also included in Figure The circuit patch and monitor functions are activated with the insertion of the patch cord connector plug into the appropriate patch jack ports. B. UPP Trunk/Test Module 2.06 The Universal Patch Platform Trunk/Test Module (UPTM) is shown in Figure 4. The trunk/test module provides a straight through signal path for patching to the test equipment terminated to the chassis rear bulkhead DB-25 connectors. A functional diagram of the test module circuitry is shown on Figure 5. The UPTM provides test access of DTE or DCE signals terminated to a UPP chassis via EIA-530 patch cords. A wiring diagram of the test module is shown on Figure 6. C. EIA-530 Breakout Module 2.07 The EIA-530 Breakout Module, shown in Figure 7, provides the ability to alter or reconfigure EIA-530 circuit leads between DTE and DCE facilities. The breakout module functions are provided when the module is connected, in the communications line, in series with the DTE and DCE. A functional diagram of the module connections, using the appropriate UPP Patch Cords, is shown in Figure The signal leads are series connected through individual pin jacks and associated two-position DIP switches mounted to the front of the module. See Figure 9. The DIP switches enable the user to open and close each signal lead as required. Circuit reconfigurations or alterations are accomplished through the use of single wire jumpers inserted into the designated wire pin jacks The EIA-530 multi-circuit patch module front panel contains three patch cord ports for access to the module multi-contact spring assemblies. The patch module is 5.25 inches high, 0.95 inches wide, and 7.75 inches deep (13.33 cm H x 2.41 cm W x cm D) A multi-layered printed circuit board (PCB) is mounted to the patch module front panel. Two multi-contact spring assemblies, with 26 bifurcated spring contacts, are mounted to the front of the PCB. These are the EQUIP and ports. Mounted to the rear of the PCB are two sets of gold contact pads. Balanced 100 ohm circuit traces, on the PCB, provide the signal connections between the front mounted multi-contact spring assemblies and the rear mounted gold contact pads (Figure 2.) The gold contact pads interface with the chassis back panel DB-25 card edge connectors. The bifurcated spring assemblies provide patch cord access to all 25 signal leads of the terminated data circuit (Figure 3). Page 4

11 Figure 3. EIA-530 Module Spring Assemblies Wiring Diagram Page 5

12 Figure 4. Trunk/Test Module Figure 5. Trunk/Test Module Functional Diagram Page 6

13 ADCP EQUIP DB-25 CONNECTOR PINS DB-25 CONNECTOR PINS C1 W1 W2 E7 E7 C6 E1 Figure 6. Trunk/Test Module Wiring Diagram 11 W3 W4 E7 E1 E1 G6 EQUIPMENT BLANK MONITOR W5 E1 L1 UPPTRUNK/TEST MODULE WIRING DIAGRAM NON-ACTIVE ACTIVE FIGURE A Page 7

14 RED BREAKOUT MODULE BLACK BREAKOUT MODULE BREAKOUT BREAKOUT EQUIP EQUIP EQUIP EQUIP A 1995-A Figure 7. EIA-530 Red/Black Breakout Modules 2.11 The third PCB front mounted spring assembly is equipped with make contact springs only. These springs are bridged to the 26 signal leads of the spring assembly for the MON port (see Figure 3) The EIA-530 patch module front panels are color coded and keyed for proper patch cord connections (see Figure 2). The front panel of the Key A module is colored Red and keyed to accept Red keyed patch cord connectors only. The Key B module is colored Black and keyed to accept only the Black keyed patch cord connectors. The module keying is designed to prevent inadvertent patching from Red to Black or Black to Red systems The EIA-530 module PCB is a multi-layer printed circuit board. The circuit trace connections from the gold contact pads to the front mounted multi-contact spring assemblies are embedded in layers 3 and 4 of the board. Embedded in the inner and outer layers is copper shielding for EMI attenuation and inter module isolation. The copper shielding is connected to the chassis ground strips installed to the top and bottom edges of the PCB. The ground strips furnish a positive ground connection through specially designed chassis card guides mounted in each UPP chassis assembly. Page 8

15 ADC ADCP UPP PATCH MODULE EQUIP UPP PATCH MODULE EQUIP EQUIP ADC MON UPP PATCH CORDS MON RED RED BREAKOUT MODULE RED BREAKOUT EQUIP EQUIP ADC ADC A Figure 8. EIA-530 Breakout Module Functional Diagram Page 9

16 D. Trunk/Test Module 2.14 The Trunk/Test module (UPTM) is an EIA-530 Patch Module modified as follows: 1. The front panel contains two patch cord ports for access to the twenty-six single contact spring assemblies. The trunk/test module is 5.25 inches high, 0.95 inches wide, and 7.75 inches deep (13.33 cm H 2.41 cm W cm D). 2. The multi-layered printed circuit board, mounted to the front panel, contains 100 ohm circuit traces between the front mounted spring contacts and the rear mounted gold contacts. Only the EQUIP and MON port single spring contacts are connected to the gold contacts (Fig. 5). The middle port is blank. Reference the wiring diagram shown on Figure EIA-530 patch module and the Trunk/Test module are available for Red/Black shielded (COMSEC) installations and for Red/Black non-shielded Commercial applications. The following describes the difference between the shielded and un-shielded modules: 1. The COMSEC EIA-530 Patch Module and Trunk/Test module front panels are coated with a conductive paint. A two-piece metal shield is mounted over the front mounted connect springs and spring guides as shown on Figure 1 and Figure 4. A strip of finger stock is mounted to one side of the metal shield to insure shield bonding between adjacent patch modules or chassis sides. 2. The Commercial EIA-530 patch module and the trunk/test module contain none of the shielding described above for the COMSEC module. Except for the shielding, the modules are identical to those shown in Figures 1 and A five-position Berg jumper terminal is mounted to the patch and test module PCBs. The jumper terminals provide the user with ground strapping options for terminating data systems furnished with balanced or unbalanced signaling. Note: The following contact designations refer to the EQUIP and DB-25 connector pin assignments (see Figure 10): Contact E7 strapped through a 0.01 uf capacitor to chassis ground. Contact E7 strapped through a 0.01 uf capacitor to contact E1. Contact E7 strapped to contact E1. Contact E1 strapped to chassis ground. Contact E1 strapped to contact L1. E. EIA-530 Breakout Module 2.17 The EIA-530 breakout module, Figure 11, front panel contains two patch cord ports for access to the module multi-contact spring assemblies. The front panel is also equipped with three sets of cross connect pin jacks and associated DIP switches (see Figure 7). The breakout module is 5.25 high, 1.90 inches wide, and 5.25 inches deep (13.33 cm high 4.83 cm wide cm deep) Page 10

17 FRONT PANEL EQUIP PATCH PORT JUMPER WIRE PIN JACKS FRONT PANEL PATCH PORT DIP SWITCHES (NORMAL CLOSED) 1993-A Figure 9. Dip Switch and Pin Jack Wiring 2.18 A multi-layered printed circuit board (PCB) is mounted to the module front panel Two multi-contact spring assemblies, for the EQUIP and, ports are front mounted to the PCB. The PCB also contains six ten-position pin jack mountings for flex cable terminations to a second module mounted printed circuit board. Internal PCB circuit traces connect the pin jack mountings to the multi-contact spring assemblies The second PCB is mounted to the module front panel perpendicular to the first PCB. Mounted to this PCB are three sets of IN and Out pin jacks and associated DIP switches. Six ten-wire flex cables provide the connections between the two PCBs. One end of each flex cable terminates to the IN and OUT pin jacks on the second PCB (see Figure 11). Page 11

18 Figure 10. EIA-530 Patch Module and Trunk/Test Module Optional Ground Connections Page 12

19 Figure 11. EIA-530 Breakout Module with Flex Cabling F. EIA-530/323 LED Test Module 2.20 The EIA-530/232 LED Test Module provides patch cord access and visual LED monitoring of data signals from DC to 5 Mbps (EIA-530) and from DC to 19.2 Kbps (EIA-232). The module indicates the signal polarities of nine EIA-530 and nine EIA-232 signals with bicolor (red and yellow) LEDs. A tenth LED provides a visual signal indicating the presence of an EIA-232 signal Front panel connectors provide terminations for patch cord and test equipment. A UPP chassis rear panel assembly with a card edge connector and two female DB-25 connectors is provided for power supply and test equipment connections. A UPP-DMPS5 Power Supply is provided for module operation. Refer to EIA-530/232 LED Test Module User Manual ADCP for additional description, installation, and operation details. Page 13

20 Figure 12. Blank Panel G. Blank Panels 2.22 Blank module front panels, Figure 12, with the patch ports plugged, are required for all unused chassis module spaces. The blank panels provided for COMSEC applications are coated with a conductive paint for EMI shielding and chassis integrity. The same blank panels are furnished for commercial application without the conductive paint. 3. MODULE INSTALLATION 3.01 The EIA-530 Multi-Circuit Patch Module, Trunk/Test Module (UPTM), and EIA-530/232 LED Test Module can be installed in any of the four Universal Platform Uni-Patch System Chassis Assemblies. All chassis assemblies are designed for COMSEC applications. Reference the chassis User Manual ADCP The EIA-530 patch module, UPTM, and EIA-530/232 LED Test Module are installed from the front of the chassis. Use care when installing the modules into the chassis. Each chassis is equipped with card guides containing conductive spring contacts for positive ground connections to the module edge ground strips. Additional effort is required when inserting either module into the chassis (see Table 1). Page 14

21 3.03 Insert the module into the chassis until the PCB gold contact pads are fully engaged with the rear-mounted DB-25 card edge connectors. Secure the patch module to the chassis with the front panel captive screws The EIA-530 Breakout module is installed only in the 5.25-inch UPP chassis and the 3.50-inch UPP chassis. Two mounting spaces are required to install this module. Insert the module into the chassis card guides from the front. As the module does not require any power to function, it may be mounted in any chassis location. After insertion, secure the module to the chassis with the front panel captive screws Refer to UPP EIA-530/232 LED Test Module User Manual ADCP for installation details Install Red or Black blank module front panels in all unoccupied chassis locations and secure with the attached captive screws. The blank module panels are required for chassis integrity. 4. OPERATION A. EIA-530 Patch Module 4.01 The EIA-530 Patch Module is a passive module and does not require any power connections. After installation of the patch module, system operation consists of plugging a keyed Red or Black patch cord connector into the front mounted patch jack ports The patch cord plug will operate the make-before-break contact springs to open the normal through data circuit and connect the data signals to the patch cord. Inserting the patch cord connector into the MON patch jack port connects the bridged data signals to the patch cord with no interruption of the data signals Insertion of the patch cord plug into the EQUIP or front port multicontact spring assembly will open the normal springs towards the connected DCE or DTE (see Figures 2 and 3). The intercepted DCE (EQUIP) or DTE () data system is transferred to the patch cord for circuit patching or test. Patch cord insertion into the MON port spring assembly bridges the patch cord to the data system for monitor only. System data signaling will not be affected by the patch in the MON jack. B. UPP Trunk/Test Module 4.04 The UPP Trunk/Test Module is a passive module and does not require any power connections. The module is designed to provide rear panel access for system test equipment. Test equipment signals, terminated to the rear mounted DB-25 connectors, are routed to the module front mounted jack springs. Patch cords inserted into the UPTM jack ports extend the test signals to selected EIA-530 Patch Modules Page 15

22 4.05 The UPTM is also provided for signal patching between racks where patch cords are not feasible. A hard-wired cabled connection is established between the DB-25 and EQUIP connectors on UPP chassis mounted in racks at two different office locations. UPTM modules, plugged in at these chassis locations, provide the facilities for extending trunk and test signals between the rack locations. Trunk and Test signals are extended between the EIA-530 Patch modules and the UPTM modules in the same rack by patch cord. C. EIA-530 Breakout Module 4.06 The EIA-530 Breakout module is a passive module and does not require any power connections. Operation of this module consists of inserting the module in series with the DTE and DCE data circuits using EIA-530 patch cords (reference the Functional Schematic on Figure 8). With the module in place, signal paths are changed by inserting a jumper wire into the pin jack of the selected DTE signal. Insert the other end of the jumper into the DCE pin jack selected for the new signal path. When the jumper(s) are in place, the DIP switches for the associated pin jacks must be opened The original signal paths are restored by removing the jumpers and closing the operated DIP switches. The pin numbers shown on the modules correspond to the EIA-530 interface signal leads ADC Multi-Circuit Red and Black keyed UPP patch cords are recommended for all patching functions between EIA-530 Patch modules and the UPTM modules and EIA-530 Breakout modules. D. EIA-530/232 LED Test Module 4.09 Refer to UPP EIA-530/232 LED Test Module User Manual ADCP for operation details. Page 16

23 5. CUSTOMER SERVICE ADC offers the following customer support services: Product Information Center Technical Information System/Network Configuration Extension 3475 Quotation Proposals Product Specification Product Application Field Service Engineering Training Installation and Operation Assistance Extension 3223 Troubleshooting and Repair Field Assistance Sales Administration Ordering Delivery Extension 3000 General Product Information Product Return Department ADC Return Authorization number and instructions must be obtained before returning products Extension 3000 Product information and service can also be obtained by writing: ADC Telecommunications, Inc West 78th Street Minneapolis, Minnesota Contents herein are current as of the date of publication. In no event will ADC be liable for any special, incidental or consequential damages or commercial losses even if ADC has been advised thereof as a result of issue of this publication. ADC reserves the right to change the contents without prior notice. This publication may be verified at any time by contacting ADC s Product Information Center at , extension 3475, or by writing to ADC Telecommunications, Inc., Attn: Product Information Center, Mail Station #80, 4900 West 78th Street, Minneapolis, MN ADC Telecommunications, Inc. P.O. Box 1101, Minneapolis, Minnesota In U.S.A. and Canada: Outside U.S.A. and Canada: (612) Fax: (612) All Rights Reserved Printed in U.S.A. Page 17