Power Technology Directions

Transcription

1 Power Technology Directions Dr. Scott D. Strand 9/15/2006

2 Agenda Lead-free RoHS Issues Power Market Issues Digital Power and Power Operating Systems What We Need 2 Power Technology Directions 9/15/2006

3 Concerns with Lead-free RoHS Assemblies The EU server exemption to be reviewed in 2008/2009. Reliability and quality verification studies must begin now to determine the acceptability of lead-free assembly processes for highly reliable server power assemblies. Each supplier must perform their own verification testing of every lead-free assembly process they use. What is deemed acceptable for consumer products may not be good enough for highly reliable server products. The verification is assembly dependent due to several factors including copper weight and PCB thickness. Other countries, China for example, are in the process of defining restrictions on hazardous substances. These requirements are not yet fully defined or understood. Pb IBM Specification 97P Power Technology Directions 9/15/2006

4 Lead-free Server Assembly and Reliability Risks Lead-free Transition Limited to Consumer Electronics and Desktop PCs Server Manufacturers Taking Advantage of the Lead in Solder Exemption Lack of Manufacturing Experience at Server Complexity Temperature Compatibility of PCBs and Components Lead-free Server Reliability Unproven No Lead-free Server Field Experience --- Anywhere Lead-free Solder Joint Wearout (e.g., SnAgCu) Unknown Lead-free Solder Joints (e.g., SnAgCu) Mechanical Fragility Issues Potentially New Failure Mechanisms Due to Lead-free Processing Temperatures (e.g., components, PCBs) Microstructural stability of SAC under Long Term High Current Loading Unconfirmed Tin Whisker Formation Process Issues (solder profile definition, cleaning, etc.) Others??? Server Lead-free Transition Dependent on Readiness in All Areas, Including Power Assemblies Need Input from Power Assembly Industry on Lead-free Readiness Need to Identify Reliability Issues That May Be Unique to Power Assemblies 4 Power Technology Directions 9/15/2006 Laminate Voids Tin-Whisker Growth on Capacitor Terminations after 200+ Temperature Cycles from -40 C to +90 C Followed by Months of Ambient Storage Courtesy of the NASA Electronic Parts and Packaging Program

5 Lead-free PCB Concerns Damage due to high temperature (245 o C 260 o C) exposures External: Delamination Blistering Warpage Internal: Delamination Delamination Voids Resin Detachment from PTH Cloth - Resin Integrity (CAF) Resin Fracture Aggravated By: Increased Card Thickness Tighter Pitch Increased Copper Foil Weight Pad Cratering and Other Surface Concerns Examples of laminate cracking Blistering Pad Cratering Courtesy of Intel, Chart Source Gary Shade 5 Power Technology Directions 9/15/2006

6 Considerations for IBM Suppliers Does your testing on lead-free solder adequately address these issues? Can you show satisfactory test results for products of various complexities (POL, VRM, custom designs, etc.) at all of your production facilities? When will you be ready to produce lead-free product at expected server quality levels? IBM will be requiring this type of information as part of our system level lead-free qualification process. We look forward to discussing your lead-free qualification plans. 6 Power Technology Directions 9/15/2006

7 Market Trends Power is getting to be a bigger OEM headache Power Conversion is getting more complex Everybody wants more power for less cost Design times are squeezed Margins are getting squeezed Power supply design and qualification groups getting cut Power supply industry is in a squeeze Margins are falling Chinese, and EMS suppliers pressuring lower complexity margins Designs becoming more complex with time OEMs require/demand more free design support Semiconductor companies capturing more value 7 Power Technology Directions 9/15/2006

8 Power Management in Systems (2005 GTO) Power consumption can be reduced at various levels, ranging from hardware controls to software methods, including power efficient OS and applications Servers configured for expected peak load Average load can be much less Processor - over half of power when loaded Hardware power management options Slow down CPU (mobile applications, etc.) Power efficiency ~(processor voltage)2 Power down some nodes or slow down all nodes Trade-off power in memory & I/O vs. efficient CPU usage Need power usage profile - measurements, models Power efficiency gains from software Based on user models/expectations OS can further improve efficiency* More gains with other software approaches * Source: J. R. Lorch & A. J. Smith, "Improving Dynamic Voltage Scaling Algorithms with PACE", SIGMETRICS System Power (watts) Base Pentium-III measured Pentium-IV estimated CPU Memory I/O CPU Memory I/O Peak Loaded Idle P-III Idle P-IV System P-III Loaded Relative Efficiency Hardware OS-aided App-aided 8 Power Technology Directions 9/15/2006

9 Systems Will Be Designed With the Ability to Dynamically Manage and Optimize Power (2005 GTO) Power densities of all system-level elements (device to rack) are increasing exponentially Power dissipation is increasingly limiting the performance of processors and systems driving new design techniques The power of high-end processor chips has exceeded 200 Watts Blades will push the power to 5 KW/sq-ft within the next 5 years Costs for cooling data centers will increase significantly Future systems will need to dynamically manage power at runtime Ability to quickly turn system elements on/off, control frequency including microprocessors, caches, memory and busses Fans 23% I/O Fans 5% Processors 28% DRAM System I/O&Misc 30% 3% L3 11% Power distribution of a typical server 9 Power Technology Directions 9/15/2006

10 Total Power Spend Percentage Percentage 10 Power Technology Directions 9/15/2006

11 Power Spend of the Future Percentage Percentage 11 Power Technology Directions 9/15/2006

12 Power Operating System (POS) User Benefits Reduced system design and debug time, up to 90% for OEM and Power Supplier POS will set configuration, operating parameters, and perform debug Less design and debug cost Reduced system cost, 15-40% (reductions depend on OEM strategy Fewer power components and less redundancy Reduced component costs, produced in higher volumes Less expensive architectures Improved system reliability Parametric drift detection, auto re-start, on-the-fly reconfiguration could provide additional redundancy Managed loads reduce average junction temperatures Improved system efficiency Manage loads on Front Ends and POLs to maximize efficiency Manage control algorithms Improved component and software re-use Fewer, standard POLs and Front Ends can be configured at shipment Standard software kernel 12 Power Technology Directions 9/15/2006

13 What Does All This Mean? POS will alleviate many OEM headaches Power density constraints Design time Reliability Reduced power supply costs Supply chain flexibility Supply chain stability But POS could cause OEM headaches if not managed properly New technology could make power supplies more sole sourced, making OEMs pay disproportionately for more features and performance Lack of compatibility Supply chain flexibility Supply chain stability 13 Power Technology Directions 9/15/2006

14 What is a Power Operating System? The complete set of hardware, firmware, and software that controls all operations involving the consumption of power by a specified electronic system. All operations means conversion, distribution, phasing, turnon, shutdown, fault handling, load modulation, design, debug, etc. System can mean whatever the user or application specifies as the system A rack A room A building A subset of the servers in 17 different buildings The switching equipment involved in routing the digital feed for a major network televised event A single piece of electronics hardware Etc. 14 Power Technology Directions 9/15/2006

15 Structure of the POS 15 Power Technology Directions 9/15/2006

16 What is a POS? At a minimum a POS possesses. System-to-power-component level performance monitoring At least 3 levels: System, board, component System configuration software Voltages, ramps, margins, sequencing, etc. System and component debug software Simulation, error detection Real-time parametric programmability Change system, board and power management component parameters on-the-fly Data bridges (as required by the system architecture) Bus and protocol needed at each interface At least three layers of code Firmware POS application software session controls, commands, communication POS presentation and application layer (GUI) 16 Power Technology Directions 9/15/2006

17 Comments Regarding Digital Power and POS Digital Power Management is Not New!!! Used in Telecomm and Computer Systems Since 1980 s (for example, SPCN for AS/400, now iseries and PCN for S/390, now zseries) Also Has Been Used in UPS, Motor Drives, and Utility Industries Many Proprietary Solutions Standardization Efforts are under way, but need coordination from end users Little or No University Research to Satisfy industry needs Total Cost of Digital Power Solutions is Competitive 17 Power Technology Directions 9/15/2006

18 What is New in Digital Power? 1. Ability to Control Real-Time Cycle-by-Cycle Operation Of A Power Converter 2. Power Standard Command Protocol PMBus TM to manage power. 3. Cost Effective Solutions - Chip Set Manufacturers 18 Power Technology Directions 9/15/2006

19 Benefits of Digital Power Management Reduced Development, Qualification and manufacturing cost Higher Quality and Reliability at competitive cost Reduced Parts Count - Two chips at the most with unlimited functions due to firmware. Same control card for different applications. Low Inventory Reduced Board Area due to Integrated modules. Flexibility Through Programmability Engineering Changes through firmware and not by Soldering Iron Can be useful in Development, Qualification, Manufacturing, and Field. Calibration at Final Functional Test; application specific parameter Less Sensitive to Environment and Component Drift Better Noise Immunity Unlimited parameter monitoring continual quality improvement 19 Power Technology Directions 9/15/2006

20 Barriers To Implementation of Digital Power Legacy Systems and Risk Management Perception. It Will Cost More Piece Price Probably Will Increase Total Cost of Ownership Is Difficult To Quantify, but this must be the measure Not Many Digital Power Experts within the industry Power Is an analog world digital power is an uncomfortable area. Resources and Buy-In To Define Architecture To Best Implement A Digital Power Solution NOTE: This is not a power system item only. This requires buy-in and innovation throughout the entire system including the operating system, firmware, and service processor Without this Buy-In, The Advantages of Digital Power Are Limited To Essentially What is Available Today. Would An Optimized Digital Power Solution Justify The New Architecture? Each Chip Set Supplier Has Their Own Proprietary Tool for Optimizing the Loop And Setting Parameters. No standard Chip sets by semiconductor industry. Digital Power Offers Many Possibilities - Lack of usage of the available features. Digital Systems In A Noisy Environment Such As Power Demands Good Design Practices for Common Mode Noise and Differential Mode Noise Rejection. For Example: SF4 System Had An Issue Due to Noise on I 2 C Bus Causing Bits To Toggle Randomly 20 Power Technology Directions 9/15/2006

21 Potential POS Impacts Best Case: A well accepted POS standard Shorter concept to production times Shorter leadtimes More standard semi components Less inventory Worst Case: No standardization among POS versions or components, making everything more complex and semi-custom More sole-sourced semiconductors More software issues 21 Power Technology Directions 9/15/2006

22 Technical Challenges More Processors Per Server 1U & 2U Server Packages Higher Power Density Higher Transient Response - di/dt Higher Efficiency Lower Voltage - Higher Current Voltage/Current Distribution Within Server Ability to Hot Swap - Availability Error and Status Reporting Servicability Best Industry Reliability Lower Cost Shorter Development Cycles 22 Power Technology Directions 9/15/2006

23 Digital Power Control: Is it the solution? What We Need Higher Reliability - MTBF Higher Power Density Higher Transient Response - di/dt Higher Efficiency Lower Voltage - Higher Current Voltage/Current Distribution Increased Number Of Voltage Domains Ability to Hot Swap Error and Status Reporting Lower Cost Shorter Development Cycles Energy Savings and Conservation Digital Solution Fewer components More integration of function Control of compensation loops could allow greater transient response More control of loops and frequency Integration of function allows more room for power components Integration of function allows more space on boards Allows flexibility to define multiple voltage levels Support via software Allows much more information to be saved and reported Advantage is in reuse and development costs Provides a huge advantage Control of entire power system enabling management of power consumption 23 Power Technology Directions 9/15/2006

24 Digital Power Control: Is it the solution? How We Get There More Integration Higher Switching Frequencies Lower Switching and Conduction Losses Topology Influences Better EMI Design Innovative Design Lower Output Impedance Thermal Management Component Improvements Digital Solution Fewer components Digital control provides higher frequency capability Digital solution provides no advantage More control of loops, frequency, and feedback Digital solution provides no advantage Allows flexibility in the design/development phase Digital solution provides no advantage Greater control of switching and loops based on load Greater integration helps overall reliability 24 Power Technology Directions 9/15/2006

25 What Do We Need From The Industry? Solutions, solutions, solutions!!! Provide drop-in solutions to legacy products Complete solution from system interface to electronics Compliance to EU Lead-free standards Suppliers must perform compliance validation Best technical capabilities Standardization without sacrificing function and capability This needs to be driven by the end-users we have to get what we need or this just becomes another component solution Cooperation among component suppliers, power supply suppliers, and end users Information and solutions must be shared while maintaining competitive advantage and profit Component suppliers and power suppliers should work together to provide solutions to the industry share expertise and knowledge 25 Power Technology Directions 9/15/2006

26 Power Technology Directions Dr. Scott D. Strand 9/15/2006