High Connection Density, Inc. NexMod Technology Solutions

Transcription

1 High Connection Density, Inc. NexMod Technology Solutions 1

2 NexMod Product Line Product Timelines Networking RDRAM NexMod available now DDR NexMod Lite available February 2002 Blade server DDR NexMod available end of DDR NexMod Lite available February 2002 Combined solution concepts Memory with microprocessor Memory with ASIC/logic 2

3 NexMod Product Matrix Target Technologies and Markets Blade Server / 1U Server Target Markets Networking Target Technologies Rambus DDR DDR NexMod DDR NexMod Lite RDRAM NexMod (800/1066MHz) DDR NexMod Lite 3

4 Product Features Simplified Rambus Memory System Design Small Form Factor: 1.1 inches x 2.0 inches (27.9mm x 50.8mm), less than 0.5 inches in height 64MB up to 288MB capacities All configurations less than 0.5 inch height Area array connections to main board PGA BGA 4

5 Complete Rambus Channel On Module Components included on module RDRAM Termination resistors DRCG (Direct Rambus Clock Generator) VRM (Voltage Regulator Module) Customer benefits Most complexities removed from customer design Simplified system design (Shorter Time to Market) Reduced board area taken up by memory system Potential Mainboard Cost Reductions Relaxed Impedance Control Fewer Layers for the Board Connector 5

6 Standard Configurations 64MB NexMod 128MB NexMod 256MB NexMod Operates at standard Rambus voltages Module termination onboard shortens Tpd improving signal integrity Complete Rambus channel with onboard addition of VRM and DRCG Capacity from 64MB to 256MB, with and without ECC 6

7 Product Milestones Datasheet available now Mechanical mockup available now 800MHz RDRAM NexMod Samples available now for evaluation Volume Production available now 1066MHz RDRAM NexMod Samples available March 2002 Volume Production April

8 Performance Characteristics of NexMod Evaluation criteria Simulation using Speed 2000 Simulated configurations 4 device NexMod 4 device SO-RIMM Simulations conducted at 800 Mhz data rate 8

9 General Time Domain Plots (NexMod vs SO-RIMM) NexMod SO-RIMM Plots generated on Speed 2000 to predict electrical characteristics of NexMod versus competing solutions Plots show voltage as a function of time Input pulse in green Output signals from each pin shown Subsequent slides are zoomed-in pictures to compare NexMod versus SO-RIMM performance 9

10 Tpd Performance (NexMod vs SO-RIMM) NexMod Tpd (Max) = 573ps SO-RIMM Tpd (Max) = 996ps NexMod 573 ps SO-RIMM 996 ps Performance difference due to onboard channel termination 10

11 NexMod Delta Tpd (Max) +/- 17ps HCD RDRAM NexMod Delta Tpd Performance (NexMod vs SO-RIMM) SO-RIMM Delta Tpd (Max) +/- 34ps NexMod +/- 17 ps SO-RIMM +/- 34 ps Translates to higher margin 11

12 Thermal Solution Simulations conducted using Ansys software Objective: Validate effectiveness of thermal solution under worst case conditions Zero forced airflow Ambient at 70 C One chip in active read, 7 remaining chips in attention mode RDRAMs must remain below maximum junction temperature of 100 C Assumption: NexMod mounted on 8 inch by 8 inch, 12 layer mainboard 12

13 Power Output Conditions Worst case power output conditions Module in I DD6 condition 1 RDRAM in active read Watts 7 RDRAMs in attention mode Watts Power outputs shown are taken from highest of three RDRAM vendors Power output of termination layer components Total worst case power output of termination layer 2.02 Watts Calculated from Direct RDRAM 256/288Mb specifications 13

14 Thermal Model Finite element analysis using ½ model NexMod mounted on 8 inch by 8 inch motherboard Interconnects between module layers included in the model for heat conduction 14

15 Thermal Analysis Worst case conditions 70 C ambient Zero forced airflow One RDRAM in active read (2.000 W) Remaining 7 RDRAM in attention mode (0.375 W) Termination layer at worst case power output (2.02 W) Highest peak RDRAM temperature is 96 C 15

16 Thermal Analysis (cont.) Zero power to the VRM Case conditions 70 C ambient Zero forced airflow One RDRAM in active read (2.000 W) Remaining 7 RDRAM in attention mode (0.375 W) Termination layer at best case power output (0 W) Highest peak RDRAM temperature is 92 C 16

17 Electrical and Thermal Summary Electrical performance Simulations indicate that NexMod shows improved electrical performance vs SO-RIMM Tpd and delta Tpd are approximately half that of the SO-RIMM Translates to higher performance margin Tpd Delta Tpd SO-RIMM 996 ps* + 34 ps HCD RDRAM NexMod 573 ps + 17 ps * Tpd from input finger to output finger only Thermal performance HCD s RDRAM NexMod remains within specifications for device operation At 70 C ambient, worst case peak die temperature remains below maximum allowed junction temperature 17

18 DDR NexMod Product Features Maximum height: 0.46 inches for 2GB capacity Up to 2GB memory capacity, Registered with ECC 512MB granularity Uses 256Mb DDR devices Module clearance of 0.1 inches: TSOPs and other discretes can be placed on the mainboard beneath the module, improving board utilization 18

19 DDR NexMod 512MB Granularity mm [2.83 in] mm [2.83 in] mm [4.56 [4.57 in] mm [4.56 [4.57 in] 19

20 DDR NexMod Front and Side View mm mm [4.56 [4.57 in] in] mm [2.83 in] mm [0.44 [0.46 in] in] mm [0.12 [0.10 in] in] Expandable to 2GB without chip stacking or added connector footprint, 512MB granularity Components can be placed underneath without compromising electrical performance TSOPs ~0.1 inches Compact connector footprint FBGA-based design extendible as DDR speed increases BGA solutions inherently reduce cross talk, enabling performance at higher frequencies 20

21 DDR NexMod Lite Product Features Smaller form factor, lower density than the DDR NexMod Maximum height: 0.46 inches for 1GB capacity Up to 1GB memory capacity, Registered with ECC 512MB granularity Uses 256Mb DDR devices Module clearance of 0.1 inches: TSOPs and other discretes can be placed on themainboard beneath the module, improving board utilization 21

22 DDR NexMod Lite Front View mm [2.83 in] mm [2.83 in] Expandable to 1GB without chip stacking or added connector footprint, 512MB granularity Components can be placed underneath without compromising electrical performance TSOPs ~0.1 inches Compact connector footprint FBGA-based design extendible as DDR speed increases BGA solutions inherently reduce cross talk, enabling performance at higher frequencies 22

23 Conclusions - NexMod Provides: Ease of design A known working Rambus channel is delivered on the memory module Time to market No delays caused by the memory subsystem implementation More time to spend on the value-add features of the system Increased electrical system margin Quicker debug of the memory subsystem Fewer yield problems during manufacturing Application optimized density and granularity Cost savings Allows a less expensive mainboard (fewer layers) Relaxed impedance control for mainboard Connector 23

24 Contact Information For more information on application optimized module designs, contact your local sales rep, regional sales manager, or send an to: 24