IBM eserver Total Storage, On Demand

Transcription

1 IBM eserver Total Storage, On Demand Bill Ott, Vice President, eserver xseries & IntelliStation Development Systems and Technology Group 10/7/2005

2 IBM 2Q 2005 Business Status Key Accomplishments Operational Performance PC Sale Restructuring Actions Microsoft Settlement 2Q Performance Highlights Services Signings Power5-based Servers and Storage Key Middleware Growth Initiative Cash and Balance Sheet 2 10/7/2005

3 IBM 2Q05 Financial Summary 3 10/7/2005

4 IBM Revenue 1Q05 and 2Q /7/2005

5 IBM Geographic Revenue 5 10/7/2005

6 Global Services 6 10/7/2005

7 Systems & Technology 7 10/7/2005

8 Software 8 10/7/2005

9 IBM Systems & Technology Group Who Are We #1 Systems Vendor $19B in 2004 Fastest growing vendor in storage, UNIX servers and Intel-based servers Top blade-server vendor 10,000 development employees worldwide 21 development sites World Wide What We Do IBM eserver zseries mainframe iseries midmarket pseries UNIX xseries Intel-based BladeCenter Systems Control Software IBM TotalStorage Tape Disk Storage software Key Competitors: HP, Sun, EMC 9 10/7/2005

10 IBM Technology Leadership Core Products TotalStorage Disk Storage Core Technologies Operating Systems Processors IBM eserver Mainframe Servers Storage Networking Unix Servers Tape and Optical Systems Midrange Servers Storage Software Blade Servers Core on demand Technologies Intel processorbased Servers AMD processorbased Servers Clusters POWER Architecture Capacity on Demand Systems Consolidation Server & Storage Virtualization Partitioning Autonomic Computing Grid Computing Virtualization Engine Linux open standards 10 10/7/2005

11 Momentum in High Growth Segments IBM is First in worldwide server revenue for the ninth consecutive quarter First in UNIX-based server revenue First in blade server revenue. IBM overtook the top position in UNIX-based server revenue, growing nearly seven points year-to-year AND IBM led Blade server revenue for the eight consecutitve quarter ending 2Q05 with 40 percent of the revenue share Source: IDC Worldwide Quarterly Server Tracker, 2Q05, issued on August 25, /7/2005

12 IBM xseries Power, Packaging and Cooling Challenges 12 10/7/2005

13 The System Technology Challenge/Drivers More Speed! Higher Density! More Data Capacity! More Bandwidth! Lower Cost! Smaller! More Portable! More Open! 13 10/7/2005

14 Trends That Affect Power, Packaging, and Cooling Technology Drivers Processors Power Density (W/CM2) Chip Voltage (VDC) IO Media (HDD, CD, FDD) 2 2 Multicore 2 FBD Memory Multicore x IB & IB Modules PCI X 4x IB Cables/Switches PCI PCI Express 10 Gb Enet 40 Gb Enet 3.5" SATA/ 300 GB SAS 600 GB 36 GB HDD 3.5" 2.5" SFF, SCSI 2.5" SAS 1 Market Drivers Intel CPU / Rack (42U) ( * blade servers) Technology Enables Cooling Cooling Ability W/CM2 U 1 20 Heat Pipes Vapor Chamber 168 cores* (single core) 15 Chilled Air Rack 244 cores* (dual core) 15 Chilled Air / Water 488 cores* (quad core) 22 Power Power Density (W/in3) 3 Packaging Server 3.3V, 5V, 12V 5V, 12V Hybrid Rack / Tower Tower Rack Optimized 20 12V Distributed 12V Distributed Server Blade - Low Power Server Blade - High Power Modular Scalar Systems 14 10/7/2005

15 Challenges: Server designs have reached several limits: Power supply density: cooling a bottleneck, continued push higher Thermal: ability to move enough air to cool at server, rack and building levels Accoustics: increased airfow = more noise Ability to provide primary power, building and rack: over 30kW per rack Higher power driving higher input currents Running out of AC ampacity with primary connector, C13/C14 must use C19/C20 and further as input connectors Racks require more capacity than 60A 3-phase service Energy Efficient Designs "80 plus" desktop initiative gaining interest in Server market Other technology drivers Number of planar voltages is increasing. To conserve planar area, VRMs & SIPs need to be more common / smaller Lower load voltages, 1.8V, 1.5V, 1.2V, etc., coupled with high dynamic loads continues to drive "point-of-load" VRs. Power Management Growing need to monitor currents and power Dynamic voltage adjustments 15 10/7/2005

16 Thermal - Power Requirements Watts / U ,800 W per Rack W per Rack 600 1U Max Power High Density** Data Center 15,000 W per Rack 10,000 W per Rack 5,000 W per Rack Range of cooling capability in typical data centers Raised and Non-Raised Floor Blade Max Power Dashed lines are projected **When 20% of Racks are at 31.8kW (6 BladeCenters), Then high density data center limits are reached. 80% of racks must be at 5KW or below /7/2005

17 Power Supply Roadmap GENERAL N+N bulk power required for redundancy 12V distribution within the chassis drives VRM / VRD input, DASD, PCI, FANS High efficiency converter technologies Design for future power increases (mech. package, connectors) Focus on quality and reliability Voltage and current monitoring circuitry LOW END Density pressure will continue driving lower number of output voltages Facilitates denser power supply packaging trend Improved power supply efficiency Requires more use of VRDs and VRMs CBBs ISSUES Power supply densities limited at system level by cooling Connector ratings / dc power distribution AC Power distribution need more power than 60A 3-phase can provide 17 10/7/2005

18 Technical Challenges and Solutions What We Need Higher Reliability - MTBF Higher Power Density Higher Transient Response - di/dt Higher Efficiency Lower Voltage - Higher Current Voltage/Current Distribution Increased Number Of Voltage Domains Ability to Hot Swap Lower Cost Shorter Development Cycles Best Industry Quality Error and Status Reporting Power measurement capabilities How We Get There More Integration Higher Switching Frequencies Lower Switching and Conduction Losses Topology Influences RES/ZVS/ZCS Better EMI Design Innovative Design Lower Output Impedance Thermal Management Component Improvements Integrated Battery Technology Power Semiconductors Capacitors Interconnect 18 10/7/2005

19 Backup 19 10/7/2005

20 xseries Metrics History Density Date Updated:08/27/04 PS Density W / ci. in W/cu in Density Year PS Cost $ /W $0.12 $0.10 $0.08 Cost Cost $0.06 $0.04 $0.02 cost $ Year 20 10/7/2005

21 Server Load Power Proportions BladeCenter vs Rack Optimized Rack Optimized BladeCenter 29.8% 32.6% 22.1% 55.5% 4.6% 7.3% 17.7% 11.3% 8.6% 10.5% Po w er Cooling I/ O Subsystem Memory Pro cesso rs 21 10/7/2005

22 AC Power Distribution Challenge 1995 x-i-p series timeline mainframe timeline xseries customers are almost at the same AC input requirements as the Mainframes (60A 3-phase required for many applications) 22 10/7/2005

23 Momentum in High Growth Segments 8-way+ Revenue Marketshare Blade Revenue Marketshare 70% 67% 60% 60% 50% 44% 50% 40% 40% 30% 30% 31% 20% 24% 20% 10% 10% 0% Q201 Q401 Q202 Q402 Q203 Q403 0% Q202 Q302 Q402 Q103 Q203 Q303 Q403 IBM HP Dell IBM HP Dell Source: IDC and Systems and Technology Group Market Intelligence 23 10/7/2005