High Speed Backplane Connectors. Catalog Issued 4-05

Transcription

1 Catalog Issued 4-05

2 2 Disclaimer While Tyco Electronics has made every reasonable effort to ensure the accuracy of the information in this catalog, Tyco Electronics does not guarantee that it is error-free, nor does Tyco Electronics make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current. Tyco Electronics reserves the right to make any adjustments to the information contained herein at any time without notice. Tyco Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. The dimensions in this catalog are for reference purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult Tyco Electronics for the latest dimensions and design specifications. Copyright 2005 by Tyco Electronics Corporation. All International Rights Reserved. ACTION PIN, AMP, AMP-HDI, CHAMP, MULTI-BEAM XL, MULTIGIG RT, POLYSWITCH, SEC-Z, TRI-Q, TYCO, Z-DOK and Z-PACK are trademarks. Other products, logos, and company names mentioned herein may be trademarks of their respective owners. High Speed Backplane Connectors Table of Contents Signal Integrity Services: Taking SI to the Next Level Z-PACK HM-Zd Connector Product Line Overview , 3, and 2 Pair Right Angle Receptacle Assemblies Pair Vertical Receptacle Assemblies , 3, and 2 Pair Vertical Pin Header Assemblies , 3, and 2 Pair Right Angle Pin Header Assemblies Power and Guide Hardware New AdvancedTCA Connectors and Guide/Key Modules , 25 4 and 2 Pair Pin Headers for Cable Assemblies and 2 Pair Vertical Pin Headers and 2 Pair Right Angle Pin Headers Pair 5 and 0 Column Push-to-Release Cable Assemblies Pair 5 and 0 Column Push-to-Release Cable Assemblies Pair Cable Assemblies for Backplane Testing Recommended Printed Circuit Board Layouts PC Board Routing Guidelines Connector Housing Gathering Capabilities Mating Sequence Chart Application Tooling and Equipment , 43 2mm HM Compatible Summary Z-PACK HS3 Connector Product Line Overview Part Number Selection Chart , 50 6 Row Connectors Row Connectors Coding Keys (0 Row Only) Power and Guide Hardware Mating Sequence Chart Application Tooling and Equipment AdvancedTCA is a trademark of PICMG-PCI Industrial Computer Mfg s. Group.

3 Table of Contents (Continued) MULTIGIG RT Connector Product Line Overview Connector Sequencing Chart Mating Sequencing Chart Product Selection Guide Customization Options MULTIGIG RT Tier Connector System , 96 MULTIGIG RT Tier 2 Connector System , 98 MULTIGIG RT Tier 3 Connector System , 00 VITA 4 Connector Selection Grid Power Modules and Guide Hardware Reference Coming Soon: MULTIGIG RT Connector Future Products Z-PACK HM-Zd Connector Z-DOK and Z-DOK Connectors Product Line Overview Electrical Performance and Applications , 0 Z-DOK Connector Product , 2 Z-DOK 2 Product , 4 Z-DOK 4 Product , 6 Z-DOK 6 Product Sequencing Chart Work Sheet High Speed Card Edge Products High Speed Standard Edge Connector SEC-Z Connector Standard to Lead Free Part Number Cross Reference , 34 Part Number Index VITA is a trademark of VMEbus International Trade Association. 3

4 4 For more info: Signal Integrity Services: Taking SI to the Next Level Solutions Our goal is to apply system-level expertise to design, simulate, and verify a system to meet your performance goals. We have completed hundreds of system designs and have years of experience in system layout, design, simulation and product selection. Our modeling skills and techniques are second to none with an extensive library of Tyco Electronics product models ready to go to work on your design. Simulation Tyco Electronics Signal Integrity engineers use a very sophisticated suite of tools to provide accurate connector and system models to 20 GHz and beyond. Whether we are analyzing a connector or an entire system, Tyco Electronics has the tools and expertise to get the right answer. Our tool suite includes 2D and 3D full-wave analysis, with solutions in both the time and frequency domains. Models Tyco Electronics provides a variety of tools to aid customers in their design: SPICE single-line and multi-line models S-parameter models Customer evaluation boards using realistic system implementations Electrical Performance Reports (EPRs) with information on many high speed products. Testing With measurement capabilities beyond 0 Gb/s and 50 GHz, Tyco Electronics can characterize and provide detailed measurements of various products. Measurements of a product within a system, including measurements from silicon companies that have teamed with Tyco Electronics, can be invaluable to assure the successful implementation of a design. models@tycoelectronics.com simulation@tycoelectronics.com

5 Table of Contents Z-PACK HM-Zd Connector Product Line Overview , 3, and 2 Pair Right Angle Receptacle Assemblies Pair Vertical Receptacle Assemblies , 3, and 2 Pair Vertical Pin Header Assemblies , 3, and 2 Pair Right Angle Pin Header Assemblies Power and Guide Hardware New AdvancedTCA Connectors and Guide/Key Modules , 25 4 and 2 Pair Pin Headers for Cable Assemblies and 2 Pair Vertical Pin Headers and 2 Pair Right Angle Pin Headers Pair 5 and 0 Column Push-to-Release Cable Assemblies Pair 5 and 0 Column Push-to-Release Cable Assemblies Pair Cable Assemblies for Backplane Testing Recommended Printed Circuit Board Layouts PC Board Routing Guidelines Connector Housing Gathering Capabilities Mating Sequence Chart Application Tooling and Equipment , 43 Compatible 2mm HM Products Z-PACK HM-Zd Connector 5

6 Z-PACK HM-Zd Product Line Overview 6 Product Facts Z-PACK HM-Zd Connector is an extension of the Z-PACK 2mm HM product line Designed specifically for high speed differential applications A modular connector system with a standard module size of [.984] Contact pitch is.50 [.059] within a pair and 3.00 [.8] pair to pair within a column; column to column pitch is 2.50 [.098] Card Pitch is less than [.800] for 2 pair and 3 pair headers and [.000] for 4 pair headers Available in three versions: 2 signal contact pairs per column (20 pairs per [.984]) compatible with 5 row Z-PACK 2mm HM Connector 3 signal contact pairs per column (30 pairs per [.984]) 4 signal contact pairs per column (40 pairs per [.984]) compatible with 8 row Z-PACK 2mm HM Connector Available in vertical and right angle press fit pin headers and right angle and vertical press fit receptacles Optimized footprint for improved electrical performance and ease of trace routing (unobstructed routing channels on both daughtercard and backplane) Pin header and receptacle have the exact same footprint to simplify PC board layout Designed to meet Telcordia requirements Recognized under the Component Program of Underwriters Laboratories Inc., R File No. E28476 The Z-PACK HM-Zd Connector System is a high speed, differential connector system, which is compatible with the Z-PACK 2mm HM Connector Line. Z-PACK HM-Zd Connector provides Z-PACK 2mm HM Connector users with a migration path for serial switching applications from 3.25 Gb/s to 0+ Gb/s. The Z-PACK HM-Zd Connector System features a highly reliable dual beam contact system with fully encompassing grounds dedicated to each differential pair. In addition, the Z-PACK HM-Zd Connector footprint is optimized for both routability and system performance with the use of a.50 x 2.50 [.059 x.098] row to column grid. The connector design features a robust mating interface with integral prealignment and polarization built into the mating interface. Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Samples: go to Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com White Papers: available on product website at Electrical Performance Report: EPR #20GC04 Routing Guide: Routing Guide #20GC05- Technical Documents Product Specification Application Specification Qualification Test Report Material and Finish Contact Area Finish 0.80µm Au min. over.3µm Ni min. Compliant Pin Finish 0.8µm SnPb min. over.3µm Ni min. Contact Material Copper Alloy Housing Material Glass filled polyester, 94V-0 rated Ratings Current 0.7A per signal contact, fully energized 2A per shield, all shields energized Operating Voltage 500 VAC maximum, signal to signal 250 VAC maximum, signal to ground Temperature 65 C to 05 C Mating Force 0.38N maximum per contact (signal = contact, ground = contact) Durability 250 cycles * Reference Product Spec for complete list of performance data.

7 Z-PACK HM-Zd Connector 4 Pair Right Angle Receptacle Assemblies 2.50 [.098] 0.75 [.030].50 [.059].00 ± 0.0 [.039 ±.004] 2.35 ± 0.08 [.84 ±.003] 9.35 ± 0.08 [.762 ±.003] [.098] 5.67 ± 0.05 [.67 ±.002] 2.20 [.087] Z-PACK HM-Zd Connector 3.00 [.8] A Top Surface of Daughtercard [.079] 8.70 [.343].50 [.059].50 [.059] 3.68 [.45] 0.70 ± 0.6 [.42 ±.006] 7.20 ± 0.4 [.677 ±.006] All Plated Thru Holes 2.50 [.098] 9 x 2.50 [.098] = [.886].50 ± 0.20 [.059 ±.008] Recommended PC Board Layout Daughter Board, Component Side Shown.50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Number Column Count Module Length (Dim. A) Signals AdvancedTCA Zone 2 Daughtercard Connector. 2 See page 43 for Instruction Sheet Number. Grounds Application Tooling2 Insertion Repair Receptacle Housing Chiclet Removal Removal

8 Z-PACK HM-Zd Connector (Continued) 3 Pair Right Angle Receptacle Assemblies 2.50 [.098] 0.75 [.030].00 ± 0.0 [.039 ±.004] [.92].50 [.059] 6.85 ± 0.08 [.663 ±.003] 4.85 ± 0.08 [.585 ±.003].7 ± 0.05 [.440 ±.002] 2.20 [.087] 3.00 [.8] A All Plated Thru Holes.50 ± 0.20 [.059 ±.008] Top Surface of Daughtercard.00 ± 0.0 [.039 ±.004] [.079] 8.70 [.343].50 [.059] 0.70 ± 0.6 [.42 ±.006] [.94].50 [.059] 2.70 ± 0.4 [.500 ±.006] 3.68 [.45] 2.50 [.098] 9 x 2.50 [.098] = [.886] Recommended PC Board Layout Daughter Board, Component Side Shown.50 [.059] 6.85 ± 0.08 [.663 ±.003] 4.85 ± 0.08 [.585 ±.003].7 ± 0.05 [.440 ±.002] 2.20 [.087] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.0048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Top Surface of Daughtercard [.079] 8.70 [.343].50 [.059].50 [.059] 3.68 [.45] 0.70 ± 0.6 [.42 ±.006] 2.52 ± 0.4 [.493 ±.006] With Notch For PMC Applications Part Number Column Count Module Length Signals Grounds (Dim. A) For CompactPCI and AdvancedTCA PMC Applications. 2 See page 43 for Instruction Sheet Number. Application Tooling2 Insertion Repair Receptacle Housing Chiclet Removal Removal CompactPCI is a trademark of PICMG-PCI Industrial Computer Mfg s. Group.

9 Z-PACK HM-Zd Connector (Continued) 2 Pair Right Angle Receptacle Assemblies 2.50 [.098] 0.75 [.030].00 ± 0.0 [.039 ±.004] 8.90 [.744] A.50 [.059] 3.00 [.8] 0.75 [.030] 3.35 ± 0.08 [.526 ±.003] 8.68 [.342] Top Surface of Daughtercard All Plated Thru Holes.50 ± 0.20 [.059 ±.008].35 ± 0.08 [.447 ±.003] [.079] 8.70 [.343].50 [.059].50 [.059] 0.70 ± 0.6 [.42 ±.006] 8.20 ± 0.4 [.323 ±.006] 8.58 ± 0.05 [.338 ±.002] 3.68 [.45] 2.20 [.087] Z-PACK HM-Zd Connector 2.50 [.098] 9 x 2.50 [.098] = [.886] Recommended PC Board Layout Daughter Board, Component Side Shown.50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Number Column Module Count Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Receptacle Housing Removal Chiclet Removal

10 Z-PACK HM-Zd Connector (Continued) 4 Pair Vertical Receptacle Assemblies 2.50 [.098] 0.75 [.030].50 [.059] A 2.35 [.84] 9.35 [.762].00 [.039] 4.97 [.589] [.886] 2.50 [.098] Outline of Connector.50 [.059] Finished Hole Dia [.295] [.886] [.886] 3.75 [.48] [.650].50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification [.098] [.886] Recommended PC Board Layout Part Number Column Count * 0 Module Length Signals Grounds (Dim. A) See page 43 for Instruction Sheet Number. * RoHS Compliant. Application Tooling Insertion Repair Receptacle Housing Removal

11 Z-PACK HM-Zd Connector (Continued) 4 Pair Vertical Pin Header Assemblies 2.50 [.098] 2.50 [.098].50 [.059] 3.00 [.8] [.922] Max [ ] [.223].50 [.059] Z-PACK HM-Zd Connector A 0.75 [.030] 6.35 [.250] 2.95 ± 0.05 [.6 ±.002] 9 x 2.50 [.098] = [.886] 2.50 [.098] 3.40 ± 0.08 [.528 ±.003].50 [.059] All Plated Thru Holes Recommended PC Board Layout Backplane Component Side Shown PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Number Tail Length Mating Column Module Pin Count Length Length (Dim. A) AdvancedTCA Zone 2 Backplane Connector. 2 Shallow Wall for Daughtercards thicker than 3.50 [.38]. 3 See page 43 for Instruction Sheet Number. Application Tooling3 Signals Grounds Insertion Repair Pin Pin Housing Pin Header Removal Removal Insertion

12 Z-PACK HM-Zd Connector (Continued) 3 Pair Vertical Pin Header Assemblies 2.50 [.098] 2.50 [.098].50 [.059] [.223] 3.00 [.8] 8.93 [.745] Max..50 [.059] A 0.75 [.030] 6.35 [.250] 3.40 ± 0.08 [.528 ±.003] 2.95 ± 0.05 [.6 ±.002] 9 x 2.50 [.098] = [.886] 2.50 [.098].50 [.059] All Plated Thru Holes Recommended PC Board Layout Backplane, Component Side Shown PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.0048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Tail Mating Column Module Number Length Pin Count Length Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Pin Pin Housing Pin Header Removal Removal Insertion

13 Z-PACK HM-Zd Connector (Continued) 2 Pair Vertical Pin Header Assemblies 2.50 [.098].50 [.059] 3.00 [.8] 5.43 Max. [.607] [ ] 2.50 [.098] [.223].50 [.059] Z-PACK HM-Zd Connector A 0.75 [.030] 6.35 [.250] 2.95 ± 0.05 [.6 ±.002] 3.40 ± 0.08 [.528 ±.003] 9 x 2.50 [.098] = [.886] 2.50 [.098] All Plated Thru Holes Recommended PC Board Layout Backplane.50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Tail Mating Column Module Number Length Pin Count Length Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Pin Pin Housing Pin Header Removal Removal Insertion

14 Z-PACK HM-Zd Connector (Continued) 4 Pair Right Angle Pin Header Assemblies 2.50 [.098].65 [.065] [.360].50 [.059] [.99] 9.65 [.774] 2.20 [.087] 7.32 [.682] 7.68 [.696] 3.00 [.8] A Top Surface of Daughtercard 5.30 [.209] 6.35 [.250] 0.45 [.4] [.079].50 [.059] 6.90 [.272].50 [.059] 7.20 [.677] [.223] All Plated Thru Holes 2.50 [.098] 9 x 2.50 [.098] = [.886] Recommended PC Board Layout Component Side Shown.50 ± 0.20 [.059 ±.008].50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.0048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Tail Mating Column Module Number Length Pin Count Length Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Pin Housing Chiclet Header Removal Removal

15 Z-PACK HM-Zd Connector (Continued) 3 Pair Right Angle Pin Header Assemblies 2.50 [.098].65 [.065].50 [.059] 8.99 [.747] 5.5 [.596] [.83] 2.20 [.087] 3.3 [.524] Z-PACK HM-Zd Connector 3.00 [.8] A Top Surface of Daughtercard 5.30 [.209] 6.35 [.250] 0.45 [.4] [.079].50 [.059] 6.90 [.272].50 [.059] 2.70 [.500] [.223] All Plated Thru Holes 2.50 [.098] 9 x 2.50 [.098] = [.886] Recommended PC Board Layout Component Side Shown.50 ± 0.20 [.059 ±.008].50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.0048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Tail Mating Column Module Number Length Pin Count Length Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Pin Housing Chiclet Header Removal Removal

16 Z-PACK HM-Zd Connector (Continued) 2 Pair Right Angle Pin Header Assemblies 2.50 [.098].65 [.065] [.006].50 [.059].65 [.459] 5.49 [.60] 9.8 [.386] 2.20 [.087] 3.00 [.8] A Top Surface of Daughtercard 5.30 [.209] 6.35 [.250] 0.45 [.4] [.079].50 [.059] 6.90 [.272] 8.20 [.323] [.223].50 [.059] All Plated Thru Holes 2.50 [.098] 9 x 2.50 [.098] = [.886] Recommended PC Board Layout Component Side Shown.50 ± 0.20 [.059 ±.008].50 [.059] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.0048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Part Tail Mating Column Module Number Length Pin Count Length Length (Dim. A) See page 43 for Instruction Sheet Number. Application Tooling Signals Grounds Insertion Repair Pin Housing Chiclet Header Removal Removal

17 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware Universal Power Module Vertical Receptacle (3 Pos.) The Tyco Electronics Universal Power Module is a three position, modular, Hard Metric board-to-board power connector designed to be compatible with Z-PACK 2mm HM Connectors. The design is in an inverse-sex orientation and the vertical receptacle module meets the IEC 950 safety requirements for finger probe protection. Both the headers and receptacle utilize Tyco Electronics ACTION PIN press-fit leads for ease of assembly onto printed circuit boards. Additionally, the vertical receptacle leads are polarized to allow only one orientation onto the printed circuit board, eliminating the possibility of reverse placement. The Universal Power Module is compatible with a wide variety of other Tyco Electronics board-toboard connectors including Z-PACK HS3, Z-PACK HM-Zd, Z-PACK Strip-line 00, AMP-HDI, TBC, TBC Plus and Eurocard connectors. The housings are thermoplastic and the contacts are offered in either a standard or high current copper alloy. Contact finish is gold over nickel on the mating surfaces. The contacts are designed to carry 0 amperes per contact in standard assemblies and 5 amperes per contact in the high current assemblies. Actual values may vary depending upon connector size, board design, etc. The right angle header contacts are available with sequenced lengths for make-first/break-last applications. Generous alignment features designed into the housings and optional guide pins and receptacles make the Tyco Electronics Universal Power Module ideal for blind mating applications..35 [.447] [.079] Top Surface of Daughtercard 3.00 [.8] 2.5 [.478] Vertical Receptacle Outline 6.00 [.236] 3.00 [.8] Plated Thru Hole (2 Plcs.).50 [.059] Recommended PC Board Hole Layout 9.95 [.392] 2.50 [.098] 3.70 [.46] 9.50 [.374] 9.62 [.379] Mating Point Position Part Loaded Numbers Vertical ABC Receptacle AC High Current ABC PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Z-PACK HM-Zd Connector 7

18 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware (Continued) 3.00 [.8] 0.50 [.020] Expanded Universal Power Module Vertical Receptacles Material and Finish Housing Polyester, gray Contact Copper alloy, plated [ ] min. gold in mating area, [ ] min. tin-lead on ACTION PIN area, with entire contact underplated [ ] min. nickel Note: Contact lubrication with Bellcore approved lubricant B ± 0.05 [±.002].35 ± 0.08 [.447 ±.003] [.079] [.079] Ø 0.20 At Post [.008] Tip 2.5 ± 0.05 [.478 ±.002] 9.95 ± 0.05 [.392 ±.002] 3.70 ± ± [.46 ±.0] [.379 ±.02] [.039] Mating Point A Spaces At 3.00 [.8] 0.75 [.030] 0.75 [.030] 3.00 [.8] Related Product Data Guiding Hardware (Optional) pages 2-23 Application Tooling Header Seating Tool, Board Support Fixture, Receptacle Seating Tool, Board Support Fixture, Technical Documents Product Specification Application Specification 4-03 Tyco Electronics Instruction Sheet (Receptacle Seating Tool ) [.079] [.079] Plated Through Hole 48 Plcs. A Spaces At 3.00 [.8].50 [.059] 2.50 [.098] 3.00 [.8] Top Surface of Daughter Card Recommended PCB Hole Layout PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Position A B *Reference Product Specification Standard High Current *0A *5A Part Number Part Number Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative.

19 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware (Continued) Universal Power Module Right Angle Headers (3 Pos.) Material and Finish Housing polyester, natural color Contacts Copper alloy, plated [ ] min. gold in mating area, [ ] min. tin-lead on ACTION PIN post area, with entire contact underplated [ ] min. nickel [.472] Max [.8] 3.00 [.8] 0.90 [.429] ± 0.08 [.472 ±.003] 4.60 ± 0.3 [.575 ±.005] 9.70 ± 0.08 [.382 ±.003] Z-PACK HM-Zd Connector 6.00 [.236] Position A Position B 9.75 ± 0.05 [.384 ±.002] Position C 2.25 [.089].70 ± 0.08 [.46 ±.003] 5.70 [.68] [.079] 4.00 [.57] 3.22 ± 0.25 [.27 ±.00].50 [.059] 3.00 [.8] 3.50 [.38].50 [.059] Ø ± 0.05 Thru Hole [.079 ±.002] 2 Plcs. [.079] All Plated Through Hole 2 Plcs [.8] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] 2.98 SnPb Thickness = ± [.0003 ±.000] [.7] 2 Plcs. Note: For finishes other than tin-lead, reference Application Specification Recommended PC Board Hole Layout Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative. Blade Length Dimensions Standard High Current *0A *5A Position A Position B Position C Right Angle Header Part Numbers Right Angle Header Part Numbers 0.90 [.429] 0.90 [.429] 0.90 [.429] [.429] 9.30 [.366] 0.90 [.429] [.429] 9.30 [.366] 9.30 [.366] [.429] 7.68 [.302] 0.90 [.429] [.429] 7.68 [.302] 9.30 [.366] [.429] 7.68 [.302] 7.68 [.302] [.429] 0.90 [.429] 9.30 [.366] [.366] 0.90 [.429] 7.68 [.302] [.366] 9.30 [.366] 9.30 [.366] [.366] 9.30 [.366] [.366] 9.30 [.366] 7.68 [.302] [.366] 7.68 [.302] 9.30 [.366] [.302] 9.30 [.366] 7.68 [.302] [.302] 7.68 [.302] 9.30 [.366] [.302] 7.68 [.302] 7.68 [.302] *Reference Product Specification

20 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware (Continued) [.880] Expanded Universal Power Module Right Angle Headers Material and Finish Housing Polyester, gray Contacts Phosphor bronze, plated [ ] min. gold in mating area, [.00002] min. tin-lead on ACTION PIN area, with entire contact underplated [ ] min. nickel Note: Contact lubrication with Bellcore approved lubricant Related Product Data Guiding Hardware (Optional) pages 2-23 Application Tooling Header Seating Tool, Board Support Fixture, Receptacle Seating Tool, Board Support Fixture, Technical Documents Product Specification Application Specification 4-03 Tyco Electronics Instruction Sheet (Receptacle Seating Tool ).20 Min. [.047] 4 Plcs. B.50 [.059].50 [.059] 3.50 [.38] 6.00 [.236] A Max [.8] 0.26 [.404] 3.3 [.23] 0.04 ± 0.0 [.06 ±.004] Ø ± 0.05 Thru Hole [.079 ±.002] 2 Plcs [.236] 2.25 [.089] [.079] Recommended PC Board Hole Layout.38 [.448] 3.00 [.52] 4.60 ± 0.3 [.575 ±.005] ± 0.08 [.472 ±.003] 0.90 [.429].70 ± 0.08 [.46 ±.003] 5.70 [.68] All Plated Through Hole 6 Plcs [.8] 2.98 [.7] 2 Plcs. [.079] 4.00 [.57] 9.70 ± 0.08 [.382 ±.003] 3.22 ± 0.25 [.27 ±.00] 4.33 [.564] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative. Positions Dimensions Standard High Current *0A *5A A B Base Part Number Base Part Number Dash number indicates sequence pattern. See customer drawing for specific dash numbers. 2 RoHS Compliant. *Reference Product Specification

21 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware (Continued) Guide Pin (Unkeyed) Material and Finish Guide Pin Passivated stainless steel Part Number Dia. [.9] Dia. B See Chart LOCTITE sealant applied in this area. A 7.80 Dia. [.307] Z-PACK HM-Zd Connector Dimension A B Thread Part Numbers 7.50 [.295] [.974] M4 x 7-6g , [.362] 25.6 [.99] M4 x 7-6g [.500] 25.6 [.99] 8-32 UNC-2A [.500] 25.6 [.99] M4 x 7-6g [.244] 25.6 [.99] M4 x 7-6g [.500] 3.25 [.230] 8-32 UNC-2A [.50] 27.6 [.069] M4 x 7-6h [.079] 27.6 [.069] M3 x Hex Base. 2 RoHS Compliant. 3 Internal Thread. Female Guide Module (Unkeyed) Material and Finish Guide Module Zinc alloy, chromate conversion coated Related Product Data Application Tooling Seating Tool, Board Support Fixture, [.3] 9.70 [.382] Technical Documents Product Specification Application Specification 4-03 Part Number (as shown) Part Number (dual alignment posts) 5.40 Dia. [.23] 3.95 [.56] 4.00 [.57] 3.75 ± 0.08 Dia. [.25 ±.003] Drilled Hole 2 Plcs [.59] 5.75 [.226] 5.50 [.27] [.346] 4-40 UNC-2B.00 [.443] Recommended PC Board Hole Layout 2

22 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware (Continued) Guide Pin (Keyed) Material and Finish Guide Pin Zinc alloy, chromate conversion coated Part Number Ø 4.85 ± 0.05 [.9 ±.002] Ø.0 ± 0.05 [.043 ±.002] 24 R 0.50 [.020] 4.4 ± 0.05 [.63 ±.002] 45 A B.00 [.039].70 [.067] 6.35 [.250] Ø [ ] Ø 4.82 ± 0.05 [.90 ±.002] Ø.00 [.039] 3.85 [.52] 6-32 UNC-2B 6.00 Deep [.236] 5.92 ± 0.08 [.233 ±.003] Dimension Part A B Number [.020] 3.85 ± 0.05 [.52 ±.002] Row E HM Connector C L Ø 5.00 ± 0.05 [.97 ±.002] Recommended PC Board Layout (Position Shown Used with Part Number ) Female Guide Module (Keyed) [.346] [.05] Material and Finish Guide Module Zinc alloy, chromate conversion coated Part Number Dim. Thread Part A Number M M M M M M M M Ø 5.40 ± 0.08 [.23 ±.003] Ø 7.40 ± 0.08 [.29 ±.003] A 4.40 ± 0.05 [.73 ±.002] 9.70 ± 0.08 [.382 ±.003] 5.50 [.26].00 [.433] 6.75 [.659] 7.50 [.295] 5.00 [.59] 5.00 [.59] 2.82 [.] 4.00 [.57] 3.37 ± 0.08 [.33 ±.003] Threaded Hole See Table [.3.009].67 [.066] 3.02 ± 0.0 [.9 ±.004] 2 Plcs [.226] Footprint Ø 3.75 ± 0.08 [.25 ±.003] 2 Plcs. 22

23 Z-PACK HM-Zd Connector (Continued) Power and Guide Hardware 7.40 [.29] (Continued) Ø 5.5 ± 0.05 [.203 ±.002] [.079] 3 [.260] Series A 0.80 ± 0.05 [.03 ±.0006] Rad ± 0.05 [.50 ±.002] Rad. PCB Layout for Guidepost Note: Key hole orientation (Dim. A) per mating guide module Part Number table (Orientation shown on PCB layout is for Part Number ). Z-PACK HM-Zd Connector Contact, ESD 8.40 [.724] 6.00 [.236] Housing Plcs. [.57] Ø 3.96 ± 0.05 [.56 ±.002] 2 Plcs. Hole for Positive Retention Screw Ground Pad Ø 5.00 [.97] on Retention Hardware Side of PCB 3.70 [.46] 5.50 [.27] 3.88 [.255] Ø 3.96 ± 0.05 [.56 ±.002] - Z [.222] 2.25 [.482] 5.00 [.97] 6.3 [.635] 0.70 [.42] 2.50 [.492] - Y - Edge of Daughtercard 5.63 [.222] 2.25 [.482] Series Top of Motherboard PCB Layout Connector Side 3 [.260] 5.70 [.224] Ø 5.5 ± 0.05 [.203 ±.002] A 0.80 ± 0.05 [.03 ±.0006] Rad [.83] 6.99 [.275] 3.80 ± 0.05 [.50 ±.002] Rad. PCB Layout for Guidepost 6.50 [.256] [.40] Note: Key hole orientation (Dim. A) per mating guide module Part Number table (Orientation shown on PCB layout is for Part Number ) Series MULTIGIG RT Guide Modules Description Part Number Keyed/ESD Guide Module Assembly, [.799] Daughtercard* X Keyed Guide Pin, Backplane Connector, Threaded Post** X Keyed Guide Pin, Die Cast, Rolling Thunder, Backplane Connector** X * See customer drawing for specific keying options. ** Internal and external threaded versions available, see customer drawings for available options. 23

24 Z-PACK HM-Zd Connector (Continued) NEW AdvancedTCA Connectors NEW! AdvancedTCA Zone 2 Front Board Connector 4 Pair Right Angle Receptacle Part Number See page 7 for more details Backplane Connector 4 Pair Vertical Header Part Number See page for more details Front Board Connector Backplane Connector AdvancedTCA Guide/Keying Modules The AdvancedTCA Guide Modules can be used in a wide variety of applications. For motherboard-todaughtercard applications the vertical pin and right angle socket are used. This popular configuration is further supported by our wide offering of available keying positions. Each of the two keyed guide pins and guide sockets per module can be produced in a variety of different key positions. For co-planar applications, the right angle guide pins are used along with the right angle guide sockets. Both vertical and right angle guide pins are available in short or long sizes, to accommodate being used with different Tyco Electronics connectors. ATCA Name ATCA Location Description Part Number ra Backplane Rear Alignment Post [.8.57] PCB Thickness * ra Backplane Rear Alignment Post [.6.236] PCB Thickness * ra Backplane Rear Alignment Post [ ] PCB Thickness * A2 (RTM) Rear Transition Module Right Angle Male, Keyed * K/K2 Front Board Right Angle Female, Keyed * K/K2 Front Board Right Angle Female, Unkeyed Dummy * rk Rear Transition Right Angle Female * A Backplane Vertical Male, Keyed, Short * A2 Mid-Plane Vertical Male, Keyed, Long * * RoHS Compliant. ra A2 (RTM) K/K2 rk A A2 24

25 Z-PACK HM-Zd Connector (Continued) AdvancedTCA Power Connectors (Zone ) Backplane Connector Straight, Compliant Press Fit, Part Number * Material and Finish Insulators Thermoplastic, glass reinforced, black, UL94V-0 Signal Pins Copper alloy Power Contacts High conductivity copper alloy, plated [ ] min. gold in mating area per Tyco Electronics Specification , over [ ] min. nickel per Tyco Electronics Specification Solder tails [ ] tin plated per lead free Tyco Electronics Specification 2-65-, matt finish Notes:. Mounting Holes (Ø [.079] x 5.00 [.97] DP) for use with self tapping screw (customer supplied). 2. Positions 4 not populated and reserved for future use [.378] 6.60 [.260] 6.60 [.260] 3.90 [.54] 3.90 [.54] 2.20 [.087] Ø.00 [.039] 26 Plcs. See Note [.087] Ø.75 [.069] [.823] Max. [.079] [.888] [.047] 46.0 [.85] [.26] Max [.236] 3.00 [.8] 3.70 [.539] 2.20 [.835] [.94] 4.50 [.77] 0.00 [.394] 4.50 [.57] 9.40 [.370] 8.50 [.728] [.4] Max [.689] Max. Ø 2.50 [.098] 2 Plcs [.77] [.472] Ø.60 [.063] 8 Plcs [.874] 6.02 [.237] 4.60 [.80].00 [.039] 5.30 [.207] See Note Z-PACK HM-Zd Connector Printed Circuit Layout Front Board Connector Right Angle, Compliant Press Fit Part Number * Material and Finish Insulators Thermoplastic, glass reinforced, black, UL94V-0 Signal Pins Copper alloy Power Contacts High conductivity copper alloy, plated [ ] min. gold in mating area per Tyco Electronics Specification , over [ ] min. nickel per Tyco Electronics Specification Solder Tails [ ] tin plated per lead free Tyco Electronics Specification 2-65-, matt finish Notes:. Mounting Holes (Ø [.079] x 5.00 [.97] DP) for use with self tapping screw (customer supplied). 2. Positions 4 not populated and reserved for future use. * RoHS Compliant 8.50 [.728] 9.40 [.370] [.472] Ø.60 [.063] 8 Plcs [.77] 4.50 [.77] Ø 2.50 [.098] 2 Plcs. [.079] 6.00 [.236] 3.40 [.528] 0.00 [.394] 4.50 [.57] [.94] 3.70 [.539] 3.00 [.8] 0.45 [.4] Max [.689] Max [.047] 2.20 [.835] [.888] [.965] 46.0 [.85] Ø.70 [.067] 2 Plcs [.26] Max. Ø.00 [.039] 26 Plcs [.087] 3.90 [.54] See Note [.823] Max [.260] 2.47 [.49] [.087] [.260] 3.90 [.54] 8.65 [.734] 4.30 [.626] Max [.80] 5.30 [.207] See Note 2 Printed Circuit Layout 25

26 Z-PACK HM-Zd Connector (Continued) Vertical Pin Headers for Cable Assemblies Pair Part Tail Count Number Length Mating Pin Length Column Count Module Length With latch for cable assemblies. 2 See page 43 for Instruction Sheet Number. For PCB Layout, see pages -3. Application Tooling2 Signals Grounds Insertion Repair Pin Pin Housing Pin Header Removal Removal Insertion Right Angle Pin Headers for Cable Assemblies 26 Pair Part Tail Count Number Length Mating Pin Length Column Count Module Length With latch for cable assemblies. 2 See page 43 for Instruction Sheet Number. For PCB Layout, see pages 4-6. Signals Grounds Application Tooling2 Insertion Repair Pin Housing Chiclet Header Removal Removal

27 Z-PACK HM-Zd Connector (Continued) 4 Pair 5 Column and 4 Pair 0 Column Push-to-Release Cable Assemblies Note: Design shown for reference only. Contact Tyco Electronics for other variations and configurations. Z-PACK HM-Zd Connector 2 Pair 5 Column and 2 Pair 0 Column Push-to-Release Cable Assemblies Note: Design shown for reference only. Contact Tyco Electronics for other variations and configurations. 4 Pair Cable Assemblies for Backplane Testing Note: Design shown for reference only. Contact Tyco Electronics for other variations and configurations. 27

28 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts 4 Pair 2.70 [.06] 2.3 [.084] See Detail Z Top Surface of Daughtercard Z-PACK HM-Zd Backplane and Z-PACK 2mm HM Connectors Row B 0.0 Min. [.004] Gap 2.70 [.06] 24 [.079] = [.890] 2.3 [.084] [.098] = [.886] 24 [.079] = [.890] Row B Detail Z 4 [.079] = 8.00 [.35] Reference Spec for Hole Dimensions 25 Plcs. Ø 0.00 [.0004] Reference Spec for.50 [.059] = 6.50 [.650] Hole Dimensions 60 Plcs. Reference Spec for Hole Dimensions 200 Plcs. 7 [.079] = 4.00 [.55] Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. 3 Pair 2.70 [.06].80 [.07] See Detail Z Top Surface of Daughtercard Row B 2.70 [.06] 24 [.079] = [.890].80 [.07] [.098] = [.886] 24 [.079] = [.890] Row B 4 [.079] = 8.00 [.35] Reference Spec for Hole Dimensions 25 Plcs. Ø 0.00 [.0004] Reference Spec. 8 [.059] = [.472] for Hole Dimensions 60 Plcs. Reference Spec for Hole Dimensions 200 Plcs. 7 [.079] = 4.00 [.55] 2 Pair 2.70 [.06].80 [.07] See Detail Z Top Surface of Daughtercard Row B 2.70 [.06] 24 [.079] = [.890].80 [.07] [.098] = [.886] 24 [.079] = [.890] Row B 28 4 [.079] = 8.00 [.35] Reference Spec for Hole Dimensions 25 Plcs. Ø 0.00 [.0004] 5 Reference Spec..50 [.059] = 7.50 [.295] for Hole Dimensions 60 Plcs. Reference Spec for Hole Dimensions 200 Plcs. 7 [.079] = 4.00 [.55]

29 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Daughtercard and Z-PACK 2mm HM Connectors 4 Pair 4 [.079] = 8.00 [.35] 24 [.079] = [.890] Ø 0.00 [.0004] Reference Spec for Hole Dimensions 25 Plcs [.06] 2.70 [.06] PC Board Edge [.098] = [.886] [.059] = 6.50 [.650] 2.3 [.084] 2.3 [.084] Reference Spec for Hole Dimensions 60 Plcs. 24 [.079] = [.890] Reference Spec for Hole Dimensions 200 Plcs. Top Surface of Daughtercard.50 [.059] Row B 7 [.079] = 4.00 [.55] Z-PACK HM-Zd Connector Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. 3 Pair Row B 24 [.079] = [.890] Ø 0.00 [.0004] 2.70 [.06] 2.70 [.06] [.098] = [.886].80 [.07].80 [.07] 24 [.079] = [.890] Top Surface of Daughtercard 4 [.079] = 8.00 [.35] Reference Spec for Hole Dimensions 25 Plcs. PC Board Edge 8 [.059] = [.472] Reference Spec for Hole Dimensions 60 Plcs. Reference Spec for Hole Dimensions 200 Plcs..50 [.059] 7 [.079] = 4.00 [.55] 2 Pair Row B 24 [.079] = [.890] Ø 0.00 [.0004] 2.70 [.06] 2.70 [.06] [.098] = [.886].80 [.07].80 [.07] 24 [.079] = [.890] Top Surface of Daughtercard 4 [.079] = 8.00 [.35] Reference Spec for Hole Dimensions 25 Plcs. PC Board Edge 5 [.059] = 7.50 [.295] Reference Spec for Hole Dimensions 60 Plcs. Reference Spec for Hole Dimensions 200 Plcs..50 [.059] 7 [.079] = 4.00 [.55] 29

30 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Backplane Connector with Unkeyed Guide Pins C L of Signal Cavities A B C L of Signal Cavities Row B Top Surface of Daughtercard 5.50 [.27] Top Surface of Daughtercard Row B 5.50 [.27] C L of Guide Pin Top Surface of Daughtercard Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. Row B 5.50 [.27] C L of Guide Pin E PEM Nut Part Number KSF-M4 C 8.74 [.344] Annular Ring D Dimension Part A B C D E Number * * RoHS Compliant. 30

31 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Daughtercard Connector With Unkeyed Female Guide Modules [.87] 5.75 [.226].00 [.433] Z-PACK HM-Zd Connector Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. C L of Signal Cavities A C B C L of Signal Cavities C L of Guide Module Row B 5.50 [.27] Top Surface of Daughtercard C L of Guide Module Row B 5.50 [.27] Top Surface of Daughtercard C L of Guide Module Row B 5.50 [.27] Top Surface of Daughtercard Dimension Part A B C Number

32 Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Backplane Connector and Universal Power Modules Z-PACK HM-Zd Connector (Continued).55 [.06] Row B Top Surface of Daughtercard Row B Top Surface of Daughtercard Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. Row B Top Surface of Daughtercard 2.50 [.098] 3.30 [.30] [.224] Reference Spec. [.039] for Hole Dimensions for HM-Zd.50 [.059] Connector Outline Recommended PC Board Layout Component Side 3.00 [.8] Top Surface of Daughtercard Reference Spec for Hole Dimensions for Power Module 32

33 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Daughtercard Connector and Universal Power Modules 2.20 [.480] Z-PACK HM-Zd Connector [.03] See Recommended PC Board Layout Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. Top Surface of Daughtercard Row B Top Surface of Daughtercard Row B Top Surface of Daughtercard Row B Reference Spec for 4.05 Hole Dimensions [.59] for Power Module Reference Spec for Hole Dimensions for HM-Zd Leading Edge of Daughtercard [.079].50 [.059] 4.95 [.95].50 [.059] Recommended PC Board Layout Component Side 33

34 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) 6.42 [.253] 7.32 [.288] Z-PACK HM-Zd Backplane Connector and MULTIGIG RT Connector Guide Modules C L of Signal Cavities C L of Signal Cavities Row B Top Surface of Daughtercard 6.00 [.236] C L of Guide Pin Top Surface of Daughtercard Row B 6.00 [.236] Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing. C L of Guide Pin Top Surface of Daughtercard Row B 6.00 [.236] C L of Guide Pin 0.00 [.394] 0.67 [.026] 34

35 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Daughtercard Connector and MULTIGIG RT Connector Guide Modules 7.25 [.679] 5.00 [.97] 0.75 [.423] Z-PACK HM-Zd Connector Note:. Dimensions shown represent minimum stacking dimensions allowable. Customer specific applications will dictate actual module spacing [.253] 0.32 [.03] C L of Signal Cavities 7.32 [.288] C L of Signal Cavities C L of Guide Module Row B 6.00 [.236] Top Surface of Daughtercard C L of Guide Module Row B 6.00 [.236] Top Surface of Daughtercard C L of Guide Module Row B 6.00 [.236] Top Surface of Daughtercard 35

36 Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Connector Recommended Mid-Plane Layout Option # Z-PACK HM-Zd Connector (Continued) C L Top Surface of Daughtercard and Centerline of Row B, For Both Connector Pairs, Are Coplanar. See Note [.035] Pin Identification: Row A / Column See Note 2. Notes:. Minimum recommended backplane thicknesses calculated using maximum and minimum tolerances. No statistical methods were used. 2. Refer to the customer print for complete column and row designations. Backplane Thickness Tail Length Pin Identification: Row A / Column 0 See Note 2. C L Tail Min. Recommended Length Backplane Thickness

37 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Connector Recommended Mid-Plane Layout Option #2 [.472] Z-PACK HM-Zd Connector Pin Identification: Row A / Column See Note 2. Tail Length Notes:. Minimum recommended backplane thicknesses calculated using maximum and minimum tolerances. No statistical methods were used. 2. Refer to the customer print for complete column and row designations. 3. An additional row of holes must be drilled to accommodate this midplane application. See Note 3. Backplane Thickness Pin Identification: Row H / Column See Note 2. C L is coplanar Tail Min. Recommended Length Backplane Thickness

38 Z-PACK HM-Zd Connector (Continued) Recommended Printed Circuit Board Layouts (Continued) Z-PACK HM-Zd Connector Coplanar HM-Zd Right Angle Header 4 Pair HM-Zd Right Angle Receptacle 4 Pair 7.80 [.70] Min. For Coplanar Applications Centerlines of Holes on Receptacle PCB To Be Aligned To Holes in Header PCB 38

39 Z-PACK HM-Zd Connector (Continued) Z-PACK HM-Zd Connector Footprint and PC Board Trace Routing Accounts for system design requirements Footprint is optimized for low noise and ease of routing Footprint permits wide traces for long runs and without having to separate differential pairs Footprint supports quad routing techniques (see below) Z-PACK HM-Zd Connector Benefits of Quad Routing Better Platform Characteristics Performance variation due to layer connection is reduced Crosstalk is reduced Return loss is reduced Enables a lower cost solution Cost of better materials is offset by reduced processing Increased manufacturability less layers and decreased aspect ratios Decreased number of layers reduces the need for counterboring of PC boards Standard 4 Layers QuadRoute 2 Layers 4.75 [.87] 5.25 [.207] 4.75 [.87] 3.25 [.522] 4.75 [.87] Notes Regarding Quad Routing:. Within pin field, center signal pairs between signal columns 2. Trace separation is increased over standard recommendations to further limit trace to trace crosstalk 3. Recommend Quad Routing pairs together that are propagating in the same direction 5.25 [.207] 4.75 [.87].22 [.048] For further details request Report # 20GC05- or visit Notes Regarding Antipad Design:. An oval shaped antipad may be used to increase PC board manufacturability and to improve trace break-out 2. Antipad length shown is 2.92 [.4]. An antipad length up to 3.48 [.37] may be used [.5].50 [.059] 39

40 Z-PACK HM-Zd Connector (Continued) Connector Housing Gathering Capabilities C L of Receptacle.48 [.058] Offset.65 [.065] Offset C L of Receptacle [.967] [.992] Note: Dimensions are at nominal conditions. The offsets are to be applied to either side of the header center line. C L of Header C L of Header 40

41 Z-PACK HM-Zd Connector (Continued) Z-PACK HM-Zd Connector Mating Sequence Chart Fully Mated Reliable Mate Dim. A Dim B. Product Dim. C Fully Contact Fully Mated Family Reliable First Mate Mated Wipe Length Mate Last Break Ground Shield 6.78 [.66] 7.55 [.69] 4.28 [.69] HM-Zd Signal Level [.607] 5.85 [.624] 2.9 [.5] Signal Level 3.9 [.548] 4.35 [.565].4 [.056] HM-Zd 24.0 mm Pin [.083] [.35] N/A Guide mm Pin [.02] 3.60 [.244] N/A Hardware Key Blocking Point N/A [.867] N/A Signal Level [.79] 8.84 [.742] 5.77 [.227] HM-2mm Signal Level [.660] 7.34 [.683] 4.27 [.68] Signal Level 5.27 [.60] 5.84 [.624] 2.77 [.09] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Ground 6.50 [.650] 4.00 [.57] T Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Power Level [.935].25 [.443] Power Power Level [.876] 9.75 [.384] Module Power Level [.87] 8.25 [.325] MULTIGIG RT 2.50 Guide Pin Key [.309] N/A [.87] Guide N/A Hardware.492 Guide ESD Contact [.2] 8.25 [.79] Ground 7.08 [.672] 7.60 [.693] 4.78 [.88] HS Signal Level [.632] 6.47 [.648] 3.75 [.48] Signal Level 4.55 [.573] 4.97 [.589] 2.25 [.089] Power Level [.797] [.825] 8.0 [.39] UPM Power Level [.734] 9.35 [.762] 6.50 [.256] Power Level 7.03 [.670] 7.73 [.698] 4.88 [.92] UPM Guide Pin Key 3.39 [.236] 36.6 [.424] N/A Guide Keyed Guide Pin 3.39 [.236] 36.6 [.424] N/A Hardware Keyed Guide Pin [.387] [.575] N/A PreMate Power Level 6.84 [.663] 5.6 [.22] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Header to Level [.70] Min. Vertical PreMate Signal 3.8 [.50] Receptacle Level [.79] Min. PostMate Signal Level [.769] 2.54 [.00] Min. PreMate Power Level 5.32 [.603] 5.6 [.22] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Level [.64] Min. Receptacle to Vertical PreMate Signal 3.8 [.50] Level [.659] Header Min. PostMate Signal Level [.709] 2.54 [.00] Min. 4 Z-PACK HM-Zd Connector

42 Z-PACK HM-Zd Connector (Continued) Z-PACK HM-Zd Connector Application Tooling and Equipment Model AP Model BMEP 5T Model MEP 6T Typical Manual Arbor Frame Assembly (Commercially Available) Typical PC Board Support (Customer Supplied) Typical Receptacle Seating Tool IS Typical Pin Header Seating Tool IS Typical Chiclet Removal Tool IS Typical Receptacle Housing Removal Tool IS Typical Pin (Post) Extraction Tool IS Note: Typical power units from Tyco Electronics Automation Group include, but are not limited to those shown on this page. Typical Pin (Post) Insertion Tool IS Typical Header Removal Tools IS

43 Z-PACK HM-Zd Connector (Continued) Z-PACK HM-Zd Connector Application Tooling and Equipment (Continued) Type Description Instruction Sheet Part Number Seating Tool, Receptacle, 4 Pair, 0 Column Seating Tool, Receptacle, 4 Pair, 5 Column Seating Tool, Receptacle, 4 Pair, 2 Column Seating Tool, Receptacle, 4 Pair, 20 Column Seating Tool, Receptacle, 3 Pair Seating Tool, Receptacle, 2 Pair, 0 Column Seating Tool, Receptacle, 2 Pair, 20 Column Seating Tool, Header, 4 Pair, 0 Column Board to Board Seating Tool, Header, 4 Pair, 5 Column Insertion Seating Tool, Header, 4 Pair, 2 Column Tooling Seating Tool, Header, 4 Pair, 20 Column Seating Tool, Header, 3 Pair Seating Tool, Header, 2 Pair, 0 Column Seating Tool, Header, 2 Pair, 20 Column Seating Tool, Right Angle Header, 4 Pair, 0 Column Seating Tool, Right Angle Header, 4 Pair, 2 Column Seating Tool, Right Angle Header, 3 Pair Note Seating Tool, Right Angle Header, 2 Pair Note Receptacle Housing Removal Tool, 4, 3, 2 Pair, 0 Column Receptacle Housing Removal Tool, 4, 3, 2 Pair, 2 Column Receptacle Housing Removal Tool, 4, 3, 2 Pair, 5 Column Receptacle Housing Removal Tool, 4, 3, 2 Pair, 20 Column Housing Removal Tool, Vertical Header, 4 Pair Housing Removal Tool, Vertical Pin Header, 3 Pair Housing Removal Tool, Vertical Header, 2 Pair Extraction Tool, Individual Pin, Header, 4, 3, 2 Pair Board to Board Chiclet Removal Tool, Receptacle, 4 Pair Repair Chiclet Removal Tool, Receptacle, 3 Pair Tooling Chiclet Removal Tool, Receptacle, 2 Pair Insertion Tool, Individual Pin, Header, 4, 3, 2 Pair Housing Removal Tool, Right Angle Header, 4 Pair Note Housing Removal Tool, Right Angle Header, 3 Pair Note Housing Removal Tool, Right Angle Header, 2 Pair Note Chiclet Removal Tool, Right Angle Header, 4 Pair Note Chiclet Removal Tool, Right Angle Header, 3 Pair Note Chiclet Removal Tool, Right Angle Header, 2 Pair Note Seating Tool, Vertical Cable Header, 4 Pair Cable to Board Seating Tool, Vertical Cable Header, 2 Pair Insertion Seating Tool, Right Angle Cable Header, 4 Pair Note Tooling Seating Tool, Right Angle Cable Header, 2 Pair Housing Removal Tool, Vertical Header, 4 Pair Housing Removal Tool, Vertical Header, 2 Pair Note Cable to Board Housing Removal Tool, Right Angle Header, 4 Pair Note Repair Housing Removal Tool, Right Angle Header, 2 Pair Note Tooling Chiclet Removal Tool, Right Angle Header, 4 Pair Note Chiclet Removal Tool, Right Angle Header, 2 Pair Note Note:. Contact Tyco Electronics for Instruction Sheet. Z-PACK HM-Zd Connector 43

44 Compatible 2mm HM Products Z-PACK HM-Zd Connector (Continued) Z-PACK 2mm HM Type A & B Connector Modules Offered with five rows of signal contacts and two rows of ground contacts Type A offers center guiding and keying facility and 0 signal contacts Type B has 25 signal contacts Upper ground return shields are pre-fitted to receptacles and used with the 5+2 row male connectors Up to three levels of sequenced pins available on vertical pin headers Both types are end stackable without change in contact pitch Z-PACK 2mm HM Type D & E Connector Modules Offered with 8 rows of signal contacts and two rows of ground contacts Type D offers center guiding and keying facility and 76 signal contacts Type E has 200 signal contacts Upper ground return shields are pre-fitted to receptacles and used with 8+2 row male connectors Up to three levels of sequenced pins available on vertical pin headers Both types are end stackable without change in contact pitch Receptacles with Upper and Lower Ground Return Shields Mates with 5+2 and 8+2 row male product to improve signal integrity Three levels of performance a) reduced cross talk b) ground return shields c) reduced cross talk and ground return shields Z-PACK 2mm HM Connector Coding Keys Used in Type A, D, L and M male and female connectors Polarized features and used in the multipurpose center of the male and female housings Keys are inserted in the mating faces of the housings Available in up to 70 different options Shrouds Offered in type A, B, A/B, C, D, E, D/E, and F Product is offered in various standoff heights to accommodate a wide variety of pcb thicknesses 44 Z-PACK 2mm HM Type F & C Connector Modules Half size modules which are intended for use at the end of a column Type C has 55 signal pins and guidance features Type F has 88 signal pins and guidance features Upper ground return shields are pre fitted to receptacles and used with 5+2 and 8+2 row connectors Three levels of sequenced pins available on vertical pin headers Both types are end stackable without change in contact pitch Type AB/ DE Modules Offers maximum signal density and alignment features of standard Type A & D modules Type AB offers 25 signal contacts and guiding and keying features Type DE offers 200 signal contacts and guiding and keying features Offers all the advantages of sequenced pins, pre-shielded receptacles and end stackable Type L M & N Connectors DIN contacts can be fitted to types L, M and N style housings either in power or coax options 5 row and 5+2 row connector options Type L accommodates up to 6 DIN contacts Type M connectors are loaded with 55 signal contacts in row A to E and 3 cavities for DIN style contacts Type N accommodates up to 3 DIN contacts Right Angle Male Offering 5 row connector offering Type A, B & C style product mate with respective right angle product for card extender applications Type A has 0 signal contacts and center guidance and keying facility Type B offered in 25, 22 & 9 column offerings Type C has 55 signal contacts and guidance features Available in standard and reduced cross talk varieties Universal Power Module Offered in 3 to 2 position sizes Inverse sex configuration offers a vertical receptacle for backplane applications Polarized vertical press fit leads Up to 5 amperes per contact with a durability rating of 250 mating cycles Vertical Receptacles 5 & 8 row product offering Used with either vertical or right angle males in application Type A & D offers center keying and guidance Type B & E offers 25 columns of signal contacts Type C & F is a half size module with guidance features

45 Table of Contents Z-PACK HS3 Connector Product Line Overview Part Number Selection Chart , 50 6 Row Connectors Row Connectors Coding Keys (0 Row Only) Power and Guide Hardware Mating Sequence Chart Application Tooling and Equipment Z-PACK HS3 Connector 45

46 Z-PACK HS3 Connector Product Line Overview Product Facts High speed, high density two piece board-to-board backplane connector Dual beam provides redundant contact for improved reliability For data rates of 6.2+ Gb/s 0 row, 00 high speed lines per [.984] 6 row, 60 high speed lines per [.984] Controlled impedance: 50 ohm Single Ended 00 ohm Differential Feedthrough versions for midplane applications 250 mating cycles End stackable on 2.50 [.098] centerline, signal pin to signal pin Advanced ESD/Power (0 Amps) using optional guide pins and power contacts Applications High Speed Telecommunications Equipment Mid-range and high-end services Recognized under the Component Program of Underwriters Laboratories Inc., R File No. E28476 The emergence of high speed serial backplanes has forced interconnections to be able to transfer data at gigabit speeds. The Z-PACK HS3 connector system has been specifically designed to support this generation of high speed serial data transfer. Tyco Electronics has incorporated a controlled impedance microstrip path through the connector to minimize signal degradation and crosstalk. Compliant pins are used on both daughtercard and backplane. This connector family is press fit and is compatible with other Z-PACK HM family connectors on the same board edge. Z-PACK HS3 connectors support data rates of 6.2+ Gb/s per differential pair. The 6 row version is optimized for 20.32mm or 0.8 inch card centerline applications, while the 0 row version is optimized for high density for 25.4mm or.0 inch card centerline applications. The Tyco Electronics Universal Power Module (UPM) is designed to be compatible with the Z-PACK HS3 connector. Static Discharge Guide/ Power Pins, Guide Pin/ Power Receptacles, Universal Guide Pin and Receptacles, and Coding Keys (0 row only) are also available. Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Samples: go to Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com White Papers: available on product website at Electrical Performance Report: 6 row EPR #308505; 0 row EPR # Routing Guide: Routing Guide #20GC Technical Documents Product Specification Application Specification Qualification Test Report Material and Finish Contact Area Finish 0.80µm Au min. over.3µm Ni min. Compliant Pin Finish 0.8µm SnPb min. over.3µm Ni min. Contact Copper Alloy Housing Glass filled polyester, 94V-0 rated Ratings Current.5A per fully energized Operating Voltage 250 VAC max. Temperature 65 C to 05 C Mating Force 0.75N max. per contact (signal = contact, ground = contact) Durability 250 cycles * Reference Product Spec for complete list of performance data.

47 Z-PACK HS3 Connector (Continued) Performance Specifications Electrical Characteristics Characteristic Impedance 00 ± 0% Ohms Nominal Resistance 2 mohm Crosstalk See table at right Insertion Loss See chart below Asynchronous Diff. NEXT (%) Edge rate 20-80% HS3 0-Row Measured Noise Totals 50 ps 00 ps 50 ps 250 ps BC Pair Total NEXT 2.3%.9%.7%.3% DE Pair Total NEXT 4.0% 3.3% 3.0% 2.4% FG Pair Total NEXT 4.0% 3.4% 3.% 2.7% HJ Pair Total NEXT 2.3%.9%.7%.5% Synchronous Diff. NEXT (%) Edge rate 20-80% HS3 0-Row Measured Noise Totals 50 ps 00 ps 50 ps 250 ps BC Pair Total FEXT 0.5% 0.3% 0.3% 0.2% DE Pair Total FEXT.5% 0.8% 0.5% 0.5% FG Pair Total FEXT.4% 0.8% 0.7% 0.5% HJ Pair Total FEXT.0% 0.6% 0.4% 0.3% Edge rates specified are at the connector. Noise includes.60 [.063] footprints on both sides of the connector. Totals include contributions from 8 adjacent aggressor pairs. 2 Z-PACK HS3 Connector PRBS data pattern 0 Gb/s data rate BC Pair 64% Eye Opening 2.6ps Jitter Magnitude (db) Frequency (GHz) SDD2 B2C2 SDD2 D2E2 SDD2 F2G2 SDD2 H2J2 Calibrated to include only the connector and the.60 [.063] footprints on both sides of the connector. 47

48 Z-PACK HS3 Connector (Continued) Z-PACK HS3 Connector: Printed Circuit Design Rules for Backplane Routing Using Standard Commercial Design Rules This table lists routing specifications which meet design rules practiced by most printed circuit board vendors. This table should be used to route the Z-PACK HS3 connector for most applications and especially under one or more of these considerations:. Edge rates require the widest conductors possible. 2. Backplanes having layer counts above Backplanes which exceed 508mm (20") in length or width. 4. Cost is a major factor. Finished Drilled Pad Dia. Annular Pad-Pad Spacing Conductor Routing Options Hole Dia. Hole Dia. Ring 63 mils (.58mm) C/C 5 mil spacing 6 mil spacing 24 mils 28 mils 44 mils 2 mils 9 mils 9 mils 7 mils 0.6mm 0.7mm.mm 0.05mm 0.475mm 0.225mm 0.75mm 24 mils 28 mils 42 mils mil 2 mils mils 9 mils 0.6mm 0.7mm.05mm 0.025mm 0.525mm 0.275mm 0.225mm 24 mils 28 mils 40 mils tangency 23 mils 3 mils mils 0.6mm 0.7mm.0mm tangency 0.575mm 0.325mm 0.275mm Commercial Design Rules: Minimum pad diameter for tangency: Drill Diameter (D)+2 mils (0.3mm) Hole location tolerance: +/- 3 mils (0.075mm) Pad/Pad artwork tolerance: +/- 2 mils (0.05mm) Feature tolerance ( oz foil): +/ mils (0.075mm) Using Advanced Design Rules This table lists routing specifications which can be built by a limited number of leading edge printed circuit vendors using advanced design rules. This table can be used as a reference for Z-PACK HS3 connector in backplane applications where very high density is a major factor. The PCB vendor should be consulted regarding applicability of these rules to a specific design. Consideration should be given to the following:. Signal layer count reduction is possible with these design rules. 2. Backplanes which exceed 508mm (20") in length or width generally cannot be built with these rules. 3. Cost factors can potentially be higher. Finished Drilled Pad Dia. Annular Pad-Pad Spacing Conductor Routing Options Hole Dia. Hole Dia. Ring 63 mil (.58mm) C/C 5 mil spacing 6 mil spacing 24 mils 28 mils 38 mils tangency 25 mils 5 mils 3 mils 0.6mm 0.7mm 0.95mm tangency 0.625mm 0.35mm 0.3mm Two Conductor Routing 24 mils 28 mils 42 mils 2 mils 2 mils 4.5 mil lines/4 mil spacing 0.6mm 0.7mm.05mm 0.05mm 0.525mm 0.mm lines/0.09mm spacing 24 mils 28 mils 40 mils mil 23 mils 5.5 mil lines/4 mil spacing 0.6mm 0.7mm.0mm 0.025mm 0.575mm 0.25mm lines/0.mm spacing Advanced Design Rules: Minimum pad diameter for tangency: Drill Diameter (D)+0 mils (0.25mm) Hole location tolerance: +/- 2 mils (0.05mm) Pad/Pad artwork tolerance: +/- 2 mils (0.05mm) Feature tolerance ( oz foil): +/ mils (0.075mm) Z-PACK HS3 Connector Routing Pattern For more details request Report #20GC004- or visit products/simulation/files/ papers/20gc004_.pdf 24 mil finished hole +8 mil (42 mil) pad Option A: 0 mil traces 5 mil spaces Option B: 8 mil traces 6 mil spaces 24 mil finished hole +4 mil (38 mil) pad Option A: 2 mil traces 6 mil spaces Option B: 8 mil traces 8 mil spaces Drill Dia. 0.7mm (28 mils).4mm (56 mils) 0.5mm (20 mils) 0.9mm (36 mils) 0.4mm (6 mils) 48

49 Part Number Selection Chart 0 Row Z-PACK HS3 Connector Z-PACK HS3 Connector (Continued) Part Number Position Right Receptacle Univ Pwr Guide Pin Part Number Position Right Header Univ Pwr Guide Pin 2 Z-PACK HS3 Connector Part Number Position Right Receptacle ESD/HDI Guide Pin Part Number Position Right Header ESD/HDI Guide Pin Part Number Position Right Feed-Through ESD/HDI Guide Pin Part Number Position Right Shroud ESD/HDI Guide Pin Part Number Position Center Receptacle Part Number Position Center Header Part Number Position Center Feed-Through Part Number Position Center Shroud Part Number Position Center Receptacle Part Number Position Center Header Part Number Position Center Feed-Through Part Number Position Center Shroud Part Number Position Left Receptacle ESD/HDI Guide Pin Part Number Position Left Header ESD/HDI Guide Pin Part Number Position Left Feed-Through ESD/HDI Guide Pin Part Number Position Left Shroud ESD/HDI Guide Pin Part Number Position Left Receptacle Univ Pwr Guide Pin Part Number Position Left Header Univ Pwr Guide Pin 49

50 Z-PACK HS3 Connector (Continued) Part Number Selection Chart 6 Row Z-PACK HS3 Connector Part Number Position Right Receptacle Part Number Position Right Header Part Number Position Right Header Feed-Through Part Number Position Right Shroud Part Number Position Center Receptacle Part Number Position Center Header Part Number Position Center Header Feed-Through Part Number Position Center Shroud Part Number Position Center Receptacle Part Number Position Center Header Part Number Position Center Header Feed-Through Part Number Position Center Shroud Part Number Position Left Receptacle Part Number Position Left Header Part Number Position Left Header Feed-Through Part Number Position Left Shroud 50

51 Z-PACK HS3 Connector (Continued) Right Angle Receptacle 6 Row, Left Module (accepts ESD Guide Pin) [ ] 2.67 [.853].00 [.039] [.472] 4.0 [.555] 4.58 [.80] 5.75 [.226] 4.04 [.552] [.826] 0.00 [.393] 2.50 [.098] [.078].50 [.059] Z-PACK HS3 Connector.50 [.059].00 [.039] [.078] 0.80 [.425] 4.05 [.59] 9.83 [.375] [.078] Distance From Row a to Board Surface a b c d e f Location Pin Header Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification Ø 2.50 [.098] Finished Size Optional Power Contact P/N x 5.50 [.27] 5.75 [.226] [.079] 2.50 [.098] [.394].25 [.049] f e d c b a.00 [.039] 3.50 [.38] 7.00 [.276] Recommended PC Board Layout (Component Side Shown) 5

52 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 6 Row, Center Module A C 2.67 [.853].00 B 2.50 [.039] [.098] [.078] [ ] [.472] 4.0 [.555].50 [.059].50 [.059].00 [.039] [.078] 0.80 [.425] 4.05 [.59].82 [.072] [.078] Distance From Row a to Board Surface a b c d e f Location Pin Header Assemblies Number of Dimensions Part Application Tooling Positions A B C Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.079] [.886] 2.50 [.098] 0 Recommended PC Board Layout (Component Side Shown).25 [.049].00 [.039] 3.50 [.38] 7.00 [.276] f e d c b a

53 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 6 Row, Right Module (accepts ESD Guide Pin) [ ] 2.67 [.853] [.472] 4.0 [.555] 3.2 [.520] [.85] 2.57 [.849] [.393] [.226] 2.50 [.039] [.098] [.078].50 [.059] Z-PACK HS3 Connector.50 [.059].00 [.039] [.078] 0.80 [.425] 4.05 [.59].8 [.072] 9.8 [.386] 4.58 [.80] [.078] Distance From Row a to Board Surface a b c d e f Location Pin Header Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.098].00 [.039] [.38] f e d c b a 7.00 [.276] 0.00 [.394] [.079] Recommended PC Board Layout (Component Side Shown) 5.75 [.620].25 [.049] Ø 2.50 [.098] Finished Size Optional Power Contact P/N x 5.50 [.27] 53

54 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies 6 Row, Left Module (accepts ESD Guide Pin) E E.80 ± 0.8 [.464 ±.007] C 7.00 [.669] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A Note: For finishes other than tin-lead, reference Application Specification B Pin Header Assemblies Application Tooling Number of Dimensions Pin Part Positions A B C D E Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B K P E D [.039] [.38] f e d c b 7.00 [.276] a 2.50 [.098] [.394] 5.75 [.226].25 [.049] [.079] 6.42 [.253] Ø 2.50 [.098] Finished Size Optional Power Contact P/N x A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A Shown f e d c b a E Action Pin Area E E D D D KPinPin PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector 54 Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 60

55 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) 6 Row, Center Module C.80 ± 0.8 [.464 ±.007] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification Pin Header Assemblies Number of Dimensions Pin Part Positions A B C D E Numbers A B K P A B K P B A 7.00 [.669] Seating IS Sheet Application Tooling Signal Pin Ground Blade Repair Kit IS Sheet Repair Kit IS Sheet Z-PACK HS3 Connector [.886] 2.50 [.098].25 [.049] [.079] 0 Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 60 f e d c b a a b c d e f.00 [.039] 3.50 [.38] A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A [.276] Shown E E Action Pin Area E E D D D D KPinPin PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector 55

56 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) 6 Row, Right Module (accepts ESD Guide Pin).80 ± 0.8 [.464 ±.007] A 7.00 [.669] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification B Pin Header Assemblies Application Tooling Number of Dimensions Pin Part Positions A B D E Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B K P E D f e d c b a B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B E D KPinPin Ø 2.50 [.098] Finished Size Optional Power Contact P/N x 7.00 [.276].00 [.039] 5.75 [.620] 2.50 [.098] 3.50 [.38] f e d c b [.394] a.25 [.049] [.079] 6.42 [.253] Shown Action Pin Area E E D D PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 60 56

57 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds 6 Row, Left Module C.80 ± 0.8 [.464 ±.007] 7.00 [.669] 2 P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification B A Z-PACK HS3 Connector Pin Header Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Insertion IS Sheet Repair Kit IS Sheet [.039] [.38] f e d c b 7.00 [.276] a 2.50 [.098] [.394].25 [.049] [.079].25 [.049] [.039] [.38] a b c d e 7.00 [.276] f 2.50 [.098] [.394] [.079] Non-Coplanar Daughtercards (Pin a Header = Pin f Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) Coplanar Daughtercards (Pin a Header = Pin 5a Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) 57

58 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds (Continued) 6 Row, Center Module C.80 ± 0.8 [.464 ±.007] 7.00 [.669] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A Note: For finishes other than tin-lead, reference Application Specification B Pin Header Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Insertion IS Sheet Repair Kit IS Sheet [.079] [.886] 2.50 [.098] 0.25 [.049] f e d c b a.00 [.039] 3.50 [.38] 7.00 [.276] [.079] [.886] 2.50 [.098] 0.25 [.049] f e d c b a.00 [.039] 3.50 [.38] 7.00 [.276] Non-Coplanar Daughtercards (Pin a Header = Pin f Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) Coplanar Daughtercards (Pin a Header = Pin 5a Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) 58

59 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds (Continued) 6 Row, Right Module C.80 ± 0.8 [.464 ±.007] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.669] 2 Z-PACK HS3 Connector B Pin Header Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Insertion IS Sheet Repair Kit IS Sheet [.039] [.38] f e d c b 7.00 [.276] a 2.50 [.098] [.394].25 [.049] [.079] [.039] [.38] f e d c b 7.00 [.276] a 2.50 [.098] [.394].25 [.049] [.079] Non-Coplanar Daughtercards (Pin a Header = Pin f Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) Coplanar Daughtercards (Pin a Header = Pin 5a Shroud Side) Recommended PC Board Layout Reference Page 60 (Shroud Side Shown) 59

60 Z-PACK HS3 Connector (Continued) Layout Guide for Midplane Applications 6 Row Connectors Non-Coplanar Applications Coplanar Applications 5 5 a b c d e a b c d e f f Vertical Pin Header, Feed-Through Shroud Part No. Part No Vertical Pin Header, Feed-Through Shroud Part No. Part No a b c d e a b c d e 0 0 f f Vertical Pin Header, Feed-Through Shroud Part No. Part No Vertical Pin Header, Feed-Through Shroud Part No. Part No a b c d e a b c d e f f Right Module Right Module Center Module Center Module Left Module Left Module 60 Vertical Pin Header, Feed-Through Shroud Part No. Part No Vertical Pin Header, Feed-Through Shroud Part No. Part No

61 Z-PACK HS3 Connector (Continued) Right Angle Receptacle 0 Row, Left Module (accepts Universal Guide Pin) 2.0 [.83] ] [ [.29].00 [.039].0 [.437] 0.00 [.394] 7.75 [.305] Ø 5.40 [.23] 7.00 [.276] 5.75 [.226] [.900] 0.00 [.394] 2.50 [.098] [.079].50 [.059] 9.00 [.748] 2.0 [.83] 2 Z-PACK HS3 Connector [.059] [.59] [.46] [.049] 4.04 [.553].00 [.039] [.079] 0.80 [.425] [.078] Distance From Row a to Board Surface [.938] 4.80 [.89] 2.72 [.07] a b c d e f g h j k Location Receptacle Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification Ø 2.75 [.08] Optional Mounting Hole 0.00 [.394] 5.75 [.226] [.079] 2.50 [.098] k j h g f e d c b a [.394].25 [.049].00 [.039].50 [.059] 3.50 [.38] 4.00 [.55] Recommended PC Board Layout (Component Side Shown) 6

62 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 0 Row, Left Module (accepts ESD Guide Pin) [.29].00 [.039] 5.75 [.226] [.900] 4.04 [.553] 0.00 [.394] 2.50 [.098] [.079] 2.55 [.848] [ ] 9.00 [.748] 2.0 [.83].55 [.455] 5.42 [.23] 0.00 [.394].50 [.059].50 [.059] Ø [.098] [.387].25 [.59].70 [.049].00 [.46] [.039] 0.80 [.079] [.425] [.939] [.8] a b c d e f g h j k [.078] Distance From Row a to Board Surface Location Receptacle Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification Ø 2.50 [.098] Finished Hole Size For Optional Power Contact P/N X 0.00 [.394] 5 [.079] 0.00 [.394] 5.75 [.226] 2.50 [.098] k j h g f e d c b a Recommended PC Board Layout (Component Side Shown).25 [.049].00 [.039].50 [.059] 3.50 [.38] 7.00 [.276]

63 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 0 Row, Center Module [ ] [.29].00 [.039] 9.00 [.748] 2.0 [.83] A C B 2.50 [.098] [.079].50 [.059] 2 Z-PACK HS3 Connector [.059].82 [.59] [.072].00 [.039] 0.80 [.079] [.425] [.078] Distance From Row a to Board Surface a b c d e f g h j k Location Receptacle Assemblies Number of Dimensions Part Application Tooling Positions A B C Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.039] [.38] [.55] 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes [.886] 2.50 [.098] 0 Recommended PC Board Layout (Component Side Shown).25 [.049] Location k j h g f e d c b a 63

64 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 0 Row, Right Module (accepts Universal Guide Pin) [.29].00 [.039] [.079] 3.2 [.520] 0.00 [.394] 2.59 [.850] 5.75 [.226] Ø 5.40 [.23] 2.50 [.098] 2.0 [.83] [ ] 9.00 [.748] 2.0 [.83].50 [.059] 7.00 [.276].0 [.437] 0.00 [.394] [.078] [.059] [.59].25 Distance From [.049].00 Row a to.8 [.039] 0.80 Board Surface [.07] [.079] [.425] 9.85 [.388] a b c d e f g h j k Location [.07] 4.80 [.89] [.938] Receptacle Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.049] [.394] 2.50 [.098].00 [.039] [.38] [.55] 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes k j h g f e d c b a [.226] Ø 2.75 Optional [.08] Mounting Hole 0.00 [.394] Location 64 Recommended PC Board Layout (Component Side Shown)

65 Z-PACK HS3 Connector (Continued) Right Angle Receptacle (Continued) 0 Row, Right Module (accepts ESD Guide Pin) 2.55 [.848] [ ] [.29].00 [.039] [.079] 9.00 [.748] 2.0 [.83].50 [.059] 3.4 [.57] 0.00 [.394] 2.57 [.849] 5.75 [.226] 2.50 [.098] 5.42 [.23].55 [.455] 0.00 [.394] 2 Z-PACK HS3 Connector.50 [.059] a b c d 9.83 [.387] 4.05 [.078] [.59].25 Distance From [.049].00 Row a to.8 [.039] Board Surface [.07] [.079] 0.80 [.425] [.8] Ø 2.50 [.098] [.939] e f g h j k Location Receptacle Assemblies Number of Part Application Tooling Positions Number Insertion IS Sheet Hsg Removal IS Sheet Chiclet Removal IS Sheet P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification [.55] k j h g f e d c b a 5 [.079] 5.75 [.620] 0.00 [.394] [.38] [.098] [.049] [.039] Ø 2.50 [.098] Finished Recommended PC Board Layout (Component Side Shown) Hole Size For Optional Power Contact P/N X 0.00 [.394] 65

66 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies.80 ± [.464 ±.007] [.46] 0 Row, Left Module (accepts Universal Guide Pin) [.944] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A C Note: For finishes other than tin-lead, reference Application Specification B Application Tooling Number of Dimensions Pin Part Positions A B C D Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B [.039] [.38] [.55] 2.50 [.098] 0.00 [.394] 5.75 [.226].25 [.049] k j h g f e d c b a.00 [.039] 0.60 ± 0.05 [.023 ±.27 ] 5 Location Plated Thru Holes Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page [.57] Finished Hole For Optional Guide Pin P/N X* k j h g f e d c b a A A A A A A A A A A 5 * RoHS Compliant A A A A A A A A A A 4 A A A A A A A A A A 3 A A A A A A A A A A 2 A A A A A A A A A A Shown 3.70 [.46] 3.70 [.46] Action Pin Area D D APinPin BPinPin Contact Area Line Seating Plane Connector

67 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) 0 Row, Left Module (accepts ESD Guide Pin).80 ± 0.8 [.464 ±.007] [.945] 2 P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm E Part Number E Part Number A C Z-PACK HS3 Connector Note: For finishes other than tin-lead, reference Application Specification B Application Tooling Number of Dimensions Pin Part Positions A B C D E Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B K P [.039] [.38] [.55] 2.50 [.098] [.394] 5.75 [.226].25 [.049] k j h g f e d c b a 3.42 [.528] Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 74 K K K K K K K K K K 5 K K K K K K K K K K 4 Ø 2.40 Finished Hole For [.094] Optional Guide Pin P/N X Location K K K K K K K K K K 3 K K K K K K K K K K 2 K K K K K K K K K K k j h g f e d c b a Shown E E Action Pin Area E E D D D D KPinPin PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector 67

68 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) C.80 ± 0.8 [.464 ±.007] E E 0 Row, Center Module [.945] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A Part Number Part Number Note: For finishes other than tin-lead, reference Application Specification B Application Tooling Number of Dimensions Pin Part Positions A B C D E Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B K P A B K P [.039] 3.50 [.38] 4.00 [.55] [.886] 2.50 [.098] 0.25 [.049] Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 74 k j h g f e d c b a k j h g f e d c b a Location P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P Shown E E Action Pin Area E E D D D D KPinPin PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector

69 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) 0 Row, Right Module (accepts Universal Guide Pin) P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Note: For finishes other than tin-lead, reference Application Specification C A [.944].80 ± 0.8 [.464 ±.007] 3.70 [.46] 2 Z-PACK HS3 Connector B Application Tooling Number of Dimensions Pin Part Positions A B C D Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B [.039] 4.00 [.57] Finished Hole For Optional Guide Pin P/N X k j h g f e d c b a 5.75 [.620] 2.50 [.098] 0.00 [.394].25 [.049].00 [.039] 3.50 [.38] 4.00 [.55] k j h g f e d c b a B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B Shown 3.70 [.46] 3.70 [.46] Action Pin Area D D APinPin BPinPin Contact Area Line Seating Plane Connector Location 5 Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 74 69

70 Z-PACK HS3 Connector (Continued) Vertical Pin Header Assemblies (Continued) 0 Row, Right Module (accepts ESD Guide Pin) C A.80 ± 0.8 [.464 ±.007] E E [.944] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm Part Number Part Number Note: For finishes other than tin-lead, reference Application Specification B Application Tooling Number of Dimensions Pin Part Positions A B C D E Numbers Signal Pin Ground Blade Seating IS Sheet Repair Kit IS Sheet Repair Kit IS Sheet A B K P [.620] 0.00 [.394] 2.50 [.098] [.049] [.039] 3.50 [.38] k j h 3.42 g [.528] f 4.00 e [.55] d c b a [.079] 5 Ø 2.40 [.094] Plated Finished Hole For Optional Guide Pin P/N X Recommended PC Board Layout (Component Side Shown) For Non-Midplane Applications For Midplane Applications Reference Page 74 k j h g f e d c b a A A A A A A A A A A 5 A A A A A A A A A A 4 A A A A A A A A A A 3 A A A A A A A A A A Shown A A A A A A A A A A E E Action Pin Area E E D D D D KPinPin PPinPin APinPin BPinPin Contact Area Line Seating Plane Connector

71 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds 0 Row, Left Module C.80 ± 0.8 [.464 ±.007] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A [.944] 2 Z-PACK HS3 Connector Note: For finishes other than tin-lead, reference Application Specification B Receptacle Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Seating IS Sheet Repair Kit IS Sheet [.039] [.38] [.55] 2.50 [.098] 0.00 [.394] k j h g f e d c b a.25 [.049] 0.60 ±.002 [.023 ± 0.05 ] 5 Location Plated Thru Holes Non-Coplanar Daughtercards (Pin a Header = Pin k Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown).00 [.039] 3.50 [.38] 4.00 [.55] 0.60 ±.002 [.023 ± 0.05 ] Plated Thru Holes 2.50 [.098] [.394] k j h g f e d c b a.25 [.049] Location Coplanar Daughtercards (Pin a Header = Pin 5a Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown) 7

72 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds (Continued) 0 Row, Center Module C.80 ± 0.8 [.464 ±.007] [.944] P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm A Note: For finishes other than tin-lead, reference Application Specification B Receptacle Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Seating IS Sheet Repair Kit IS Sheet [.039] 3.50 [.38] 4.00 [.55] 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes [.886] 2.50 [.098] 0 k j h g f e d c b a.25 [.049] Non-Coplanar Daughtercards (Pin a Header = Pin k Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown) Location.00 [.039] 3.50 [.38] 4.00 [.55] 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes [.886] 2.50 [.098] 0 Coplanar Daughtercards (Pin a Header = Pin 0a Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown) k j h g f e d c b a.25 [.049] Location 72

73 Z-PACK HS3 Connector (Continued) Vertical Pin Header Shrouds (Continued) 0 Row, Right Module.80 ± 0.8 [.464 ±.007] [.945] 2 P.C.B. Hole Dimensions Drilled Hole 0.7±0.025mm Fin. Hole 0.55 to 0.65mm Cu-thickness to 0.050mm SnPb-thickness to 0.00mm C A Z-PACK HS3 Connector Note: For finishes other than tin-lead, reference Application Specification B Receptacle Assemblies Application Tooling Number of Dimensions Part Positions Ground Blade A B C Number Seating IS Sheet Repair Kit IS Sheet [.098] 0.00 [.394].25 [.049] 2.50 [.098] 0.00 [.394].25 [.049] 3.50 [.38] 0.60 ± 0.05 [.023 ±.27] Plated Thru Holes 5 k j h g f e d c b a.00 [.039] 4.00 [.55] Location 3.50 [.38] 0.60 ± 0.05 [.023 ±.27] Plated Thru Holes 5 k j h g f e d c b a.00 [.039] 4.00 [.55] Location Non-Coplanar Daughtercards (Pin a Header = Pin k Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown) Coplanar Daughtercards (Pin a Header = Pin 5a Shroud Side) Recommended PC Board Layout Reference Page 74 (Shroud Side Shown) 73

74 Z-PACK HS3 Connector (Continued) Layout Guide for Midplane Applications 0 Row Connectors Non-Coplanar Applications Coplanar Applications 0 a b c d e g h k a b c d e g h k 5 5 a b c d e g h k a b c d e g h k f j f j f j f j No. of Pos. Vertical Pin Header, Feed-Through Part No. Shroud Part No a b c d e g h k a b c d e g h k 0 f j f j Right Module Right Module Vertical Pin Header, Feed-Through Shroud Part No. Part No Vertical Pin Header, Feed-Through Shroud Part No. Part No Center Module Center Module No. of Pos. Vertical Pin Header, Feed-Through Part No. Shroud Part No Left Module Left Module 74 Vertical Pin Header, Feed-Through Shroud Part No. Part No Vertical Pin Header, Feed-Through Shroud Part No. Part No

75 Coding Keys (0 Row Only) Compatibility Z-PACK HS3, Z-PACK 2 row connectors Part Number (white) Part Number (red) Material & Finish Valox Power and Guide Hardware Universal Power Module Vertical Receptacle (3 Pos.) The Tyco Electronics Universal Power Module is a multi-position, modular, Hard Metric board-to-board power connector designed to be compatible with Z-PACK 2mm HM Connectors. The design is in an inverse-sex orientation and the vertical receptacle module meets the IEC 950 safety requirements for finger probe protection. Both the headers and receptacle utilize Tyco Electronics ACTION PIN press-fit leads for ease of assembly onto printed circuit boards. Additionally, the vertical receptacle leads are polarized to allow only one orientation onto the printed circuit board, eliminating the possibility of reverse placement. The Universal Power Module is compatible with a wide variety of other Tyco Electronics board-toboard connectors including Z-PACK HS3, Z-PACK HM-Zd, Z-PACK Strip-line 00, AMP-HDI, TBC, TBC Plus and Eurocard connectors. The right angle header contacts are available with sequenced lengths for make-first/break-last applications. Generous alignment features designed into the housings and optional guide pins and receptacles make the Tyco Electronics Universal Power Module ideal for blind mating applications. Z-PACK HS3 Connector (Continued).35 [.447] 0.90 [.429] 6.20 [.244] [.070] [.474] 4.55 [.573] [.079] Top Surface of Daughtercard 3.00 [.8] 2.5 [.478] Vertical Receptacle Outline 6.00 [.236] 3.00 [.8] Plated Thru Hole (2 Plcs.).50 [.059] Recommended PC Board Hole Layout 9.95 [.392] 2.50 [.098] 3.70 [.46] 9.50 [.374] Part Number Part Number [.379] Mating Point Position Part Loaded Numbers Vertical ABC Receptacle AC High Current ABC PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Z-PACK HS3 Connector

76 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) 3.00 [.8] 0.50 [.020] Expanded Universal Power Module Vertical Receptacles Material and Finish Housing Polyester, gray Contact Copper alloy, plated [ ] min. gold in mating area, [ ] min. tin-lead on ACTION PIN area, with entire contact underplated [ ] min. nickel Note: Contact lubrication with Bellcore approved lubricant B ± 0.05 [±.002].35 ± 0.08 [.447 ±.003] [.079] [.079] Ø 0.20 At Post [.008] Tip 2.5 ± 0.05 [.478 ±.002] 9.95 ± 0.05 [.392 ±.002] 3.70 ± ± [.46 ±.0] [.379 ±.02] [.039] Mating Point A Spaces At 3.00 [.8] 0.75 [.030] 0.75 [.030] 3.00 [.8] Related Product Data Guiding Hardware (Optional) pages 80 and 8 Application Tooling Header Seating Tool, Board Support Fixture, Receptacle Seating Tool, Board Support Fixture, Technical Documents Product Specification Application Specification 4-03 Tyco Electronics Instruction Sheet (Receptacle Seating Tool ) [.079] [.079] Plated Through Hole 48 Plcs. A Spaces At 3.00 [.8].50 [.059] 2.50 [.098] 3.00 [.8] Top Surface of Daughter Card Recommended PCB Hole Layout PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Position A B *Reference Product Specification Standard High Current *0A *5A Part Number Part Number Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative.

77 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) Universal Power Module Right Angle Headers (3 Pos.) 3.00 [.8] Material and Finish Housing polyester, natural color Contacts Copper alloy, plated [ ] min. gold in mating area, [ ] min. tin-lead on ACTION PIN post area, with entire contact underplated [ ] min. nickel [.472] Max [.8] 0.90 [.429] 6.00 [.236] ± 0.08 [.472 ±.003] 4.60 ± 0.3 [.575 ±.005] 9.70 ± 0.08 [.382 ±.003] 2 Z-PACK HS3 Connector Position A Position B 9.75 ± 0.05 [.384 ±.002] Position C 2.25 [.089].70 ± 0.08 [.46 ±.003] 5.70 [.68] [.079] 4.00 [.57] 3.22 ± 0.25 [.27 ±.00].50 [.059] 3.00 [.8] 3.50 [.38].50 [.059] Ø ± 0.05 Thru Hole [.079 ±.002] 2 Plcs. [.079] All Plated Through Hole 2 Plcs [.8] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] 2.98 SnPb Thickness = ± [.0003 ±.000] [.7] 2 Plcs. Note: For finishes other than tin-lead, reference Application Specification Recommended PC Board Hole Layout Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative. Blade Length Dimensions Standard High Current *0A *5A Position A Position B Position C Right Angle Header Part Numbers Right Angle Header Part Numbers 0.90 [.429] 0.90 [.429] 0.90 [.429] [.429] 9.30 [.366] 0.90 [.429] [.429] 9.30 [.366] 9.30 [.366] [.429] 7.68 [.302] 0.90 [.429] [.429] 7.68 [.302] 9.30 [.366] [.429] 7.68 [.302] 7.68 [.302] [.429] 0.90 [.429] 9.30 [.366] [.366] 0.90 [.429] 7.68 [.302] [.366] 9.30 [.366] 9.30 [.366] [.366] 9.30 [.366] [.366] 9.30 [.366] 7.68 [.302] [.366] 7.68 [.302] 9.30 [.366] [.302] 9.30 [.366] 7.68 [.302] [.302] 7.68 [.302] 9.30 [.366] [.302] 7.68 [.302] 7.68 [.302] *Reference Product Specification

78 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) [.880] Expanded Universal Power Module Right Angle Headers Material and Finish Housing Polyester, gray Contacts Phosphor bronze, plated [ ] min. gold in mating area, [.00002] min. tin-lead on ACTION PIN area, with entire contact underplated [ ] min. nickel Note: Contact lubrication with Bellcore approved lubricant Related Product Data Guiding Hardware (Optional) pages 80 and 8 Application Tooling Header Seating Tool, Board Support Fixture, Receptacle Seating Tool, Board Support Fixture, Technical Documents Product Specification Application Specification 4-03 Tyco Electronics Instruction Sheet (Receptacle Seating Tool ).20 Min. [.047] 4 Plcs. B.50 [.059].50 [.059] 3.50 [.38] 6.00 [.236] A Max [.8] 0.26 [.404] 3.3 [.23] 0.04 ± 0.0 [.06 ±.004] Ø ± 0.05 Thru Hole [.079 ±.002] 2 Plcs [.236] 2.25 [.089] [.079] Recommended PC Board Hole Layout.38 [.448] 3.00 [.52] 4.60 ± 0.3 [.575 ±.005] ± 0.08 [.472 ±.003] 0.90 [.429].70 ± 0.08 [.46 ±.003] 5.70 [.68] All Plated Through Hole 6 Plcs [.8] 2.98 [.7] 2 Plcs. [.079] 4.00 [.57] 9.70 ± 0.08 [.382 ±.003] 3.22 ± 0.25 [.27 ±.00] 4.33 [.564] PCB Hole Dim. Drilled Hole = ± [ ±.000] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = ± [.048 ±.00049] SnPb Thickness = ± [.0003 ±.000] Note: For finishes other than tin-lead, reference Application Specification Note: For additional Power Module options reference Catalog , "Power Connectors and Interconnection Systems, or contact your Tyco Electronics Sales Representative. Positions Dimensions Standard High Current *0A *5A A B Base Part Number Base Part Number Dash number indicates sequence pattern. See customer drawing for specific dash numbers. *Reference Product Specification

79 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) AMP-HDI-Static Discharge Guide/Power Pins Compatibility Z-PACK HS3, Z-PACK 2mm HM connectors Part Number * Nut Washer Max. Current Rating 0 Amperes *Additional sequence lengths are available, contact Tyco Electronics Material and Finish Brass, plated [ ] gold over [ ] nickel 4.6 Dia. [.64] [.980] 2.03 [.080] Dia. #2-56 UNC-2A Thread 2.06 [.475] 2 Z-PACK HS3 Connector AMP-HDI-Guide Pin/Power Receptacles Compatibility Z-PACK HS3 Connector Part Number * Max. Current Rating 0 Amperes *Additional lengths are available, see customer drawing..02±0.38 [.040±.05] 8.3 [.320] 6.35 [.250] 2.36 [.093] Dia. Bracket #2-56 UNC-2A Thread Material and Finish Contact Finish [ ] gold in contact area, over [ ] min. nickel underplate. Gold flash on remainder of the contact [.340] 2.27 [.483] 6.0 [.240] ESD-Guide Pin/Feed-through Compatibility Z-PACK HS3 Connector Part Number * Max. Current Rating 0 Amperes *Additional sequence lengths are available, contact Tyco Electronics RoHS Compliant 3.05±0.08 [.20±.003] 4.7±0.08 [.64±.003] Ø 2.03±0.03 [.080±.00] Material and Finish Brass, plated [ ] gold all over [ ] nickel underplate [.03] [.960].035 Spherical Radius [.00].78 [.070].00 [.433] [.47] 2.50 Max. [.098] M3 79

80 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) Guide Pin (Unkeyed) See Chart Material and Finish Guide Pin Passivated stainless steel Part Number Dia. [.9] Dia Dia. [.307] B LOCTITE sealant applied in this area. A Dimension A B Thread Part Numbers 7.50 [.295] [.974] M4 x 7-6g * 9.20 [.362] 25.6 [.99] M4 x 7-6g [.500] 25.6 [.99] 8-32 UNC-2A [.500] 25.6 [.99] M4 x 7-6g [.244] 25.6 [.99] M4 x 7-6g [.500] 3.25 [.230] 8-32 UNC-2A ** [.50] 27.6 [.069] M4 x 7-6h ** [.079] 27.6 [.069] M3 x *6.35 Hex Base **Internal Thread Female Guide Module (Unkeyed) Material and Finish Guide Module Zinc alloy, chromate conversion coated Related Product Data Application Tooling Seating Tool, Board Support Fixture, [.3] 9.70 [.382] Technical Documents Product Specification Application Specification 4-03 Part Number (as shown) Part Number (dual alignment posts) 5.40 Dia. [.23] 3.95 [.56] 4.00 [.57] 3.75 ± 0.08 Dia. [.25 ±.003] Drilled Hole 2 Plcs [.59] 5.75 [.226] 5.50 [.27] [.346] 4-40 UNC-2B.00 [.443] 80 LOCTITE is a trademark of Henkel Corp. Recommended PC Board Hole Layout

81 Z-PACK HS3 Connector (Continued) Power and Guide Hardware (Continued) Guide Pin (Keyed) Material and Finish Guide Pin Zinc alloy, chromate conversion coated Part Number Dimension Part A B Number Ø 4.85 ± 0.05 [.9 ±.002] Ø.0 ± 0.05 [.043 ±.002] 24 R 0.50 [.020] 4.4 ± 0.05 [.63 ±.002] [.020] 3.85 ± 0.05 [.52 ±.002] Row E HM Connector C L Ø 5.00 ± 0.05 [.97 ±.002] Recommended PC Board Layout (Position Shown Used with Part Number ) A B.00 [.039].70 [.067] 6.35 [.250] Ø [ ] Ø 4.82 ± 0.05 [.90 ±.002] Ø.00 [.039] 3.85 [.52] 6-32 UNC-2B 6.00 Deep [.236] 5.92 ± 0.08 [.233 ±.003] 2 Z-PACK HS3 Connector Female Guide Module (Keyed) [.346] [.05] Material and Finish Guide Module Zinc alloy, chromate conversion coated Part Number Dim. Thread Part A Number M M M M M M M M Ø 5.40 ± 0.08 [.23 ±.003] Ø 7.40 ± 0.08 [.29 ±.003] A 4.40 ± 0.05 [.73 ±.002] 9.70 ± 0.08 [.382 ±.003] 5.50 [.26].00 [.433] 6.75 [.659] 7.50 [.295] 5.00 [.59] 5.00 [.59] 2.82 [.] 4.00 [.57] 3.37 ± 0.08 [.33 ±.003] Threaded Hole See Table [.3.009].67 [.066] 3.02 ± 0.0 [.9 ±.004] 2 Plcs [.226] Footprint Ø 3.75 ± 0.08 [.25 ±.003] 2 Plcs. 8

82 Z-PACK HS3 Connector (Continued) Z-PACK HS-3 Connector Mating Sequence Chart Fully Mated Reliable Mate 82 Dim. A Dim B. Product Dim. C Fully Contact Fully Mated Family Reliable First Mate Mated Wipe Length Mate Last Break Ground Shield 6.78 [.66] 7.55 [.69] 4.28 [.69] HM-Zd Signal Level [.607] 5.85 [.624] 2.9 [.5] Signal Level 3.9 [.548] 4.35 [.565].4 [.056] HM-Zd 24.0 mm Pin [.083] [.35] N/A Guide mm Pin [.02] 3.60 [.244] N/A Hardware Key Blocking Point N/A [.867] N/A Signal Level [.79] 8.84 [.742] 5.77 [.227] HM-2mm Signal Level [.660] 7.34 [.683] 4.27 [.68] Signal Level 5.27 [.60] 5.84 [.624] 2.77 [.09] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Ground 6.50 [.650] 4.00 [.57] T Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Power Level [.935].25 [.443] Power Power Level [.876] 9.75 [.384] Module Power Level [.87] 8.25 [.325] MULTIGIG RT 2.50 Guide Pin Key [.309] N/A [.87] Guide N/A Hardware.492 Guide ESD Contact [.2] 8.25 [.79] Ground 7.08 [.672] 7.60 [.693] 4.78 [.88] HS Signal Level [.632] 6.47 [.648] 3.75 [.48] Signal Level 4.55 [.573] 4.97 [.589] 2.25 [.089] Power Level [.797] [.825] 8.0 [.39] UPM Power Level [.734] 9.35 [.762] 6.50 [.256] Power Level 7.03 [.670] 7.73 [.698] 4.88 [.92] UPM Guide Pin Key 3.39 [.236] 36.6 [.424] N/A Guide Keyed Guide Pin 3.39 [.236] 36.6 [.424] N/A Hardware Keyed Guide Pin [.387] [.575] N/A PreMate Power Level 6.84 [.663] 5.6 [.22] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Header to Level [.70] Min. Vertical PreMate Signal 3.8 [.50] Receptacle Level [.79] Min. PostMate Signal Level [.769] 2.54 [.00] Min. PreMate Power 5.6 [.22] Level 5.32 [.603] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Receptacle Level [.64] Min. to Vertical PreMate Signal 3.8 [.50] Header Level [.659] Min. PostMate Signal Level [.709] 2.54 [.00] Min.

83 Application Tooling and Equipment Z-PACK HS3 Connector (Continued) Model AP Model BMEP 5T Model MEP 6T Typical Manual Arbor Frame Assembly (Commercially Available) Insertion Tool Assembly IS Contact Replacement Tool IS Replacement Pin Assembly IS Z-PACK HS3 Connector Extraction Tool Assembly IS Setscrew IS Spacer Pin Support Tube IS Tool Tip IS Pusher IS Pin Repair Kit IS Chiclet Removal Tool IS Ground Blade Repair Kit IS Housing Removal Tool Kit IS Ground Blade Extraction Tool IS Ground Blade Insertion Tool IS Typical PC Board Support (Customer Supplied) Typical Receptacle Seating Tool IS Typical Pin Header Seating Tool IS

84 Engineering Notes 84

85 Table of Contents MULTIGIG RT Connector Product Line Overview Connector Sequencing Chart Mating Sequencing Chart Product Selection Guide Customization Options MULTIGIG RT Tier Connector System , 96 MULTIGIG RT Tier 2 Connector System , 98 MULTIGIG RT Tier 3 Connector System , 00 VITA 4 Connector Selection Grid Power Modules and Guide Hardware Reference Coming Soon: MULTIGIG RT Connector Future Products MULTIGIG RT Connector 85

86 MULTIGIG RT Connector Products 86 Product Facts Customizable impedance matched printed circuit wafer interface Inverse sex backplane connector system with pinless interface Superior crosstalk performance Optimized footprints for signal integrity and ease of board design Utilizes a 0.56 [.022] diameter via for lower cost board fabrication Three levels of signal contact sequencing Telcordia/Bellcore Compliant Available in modular or monoblock style Available for [.800] or [.00] card pitch systems Durability rated for 200 cycles Fully compatible with MP based fiber optic array interconnects Complete connector family includes Power Modules = > Maximize Amps/inch density, voltages in pairs Guidance Modules Die cast for strength Optional ESD contact Three sequence levels Press fit or hardware mounted Backplane drill pattern enabled keying Cable assemblies proposals available MULTIGIG RT connector products are fully compatible with 2mm HM equipment practices The MULTIGIG RT product line is a backplane interconnect family that offers levels of flexibility and customization never before seen in the industry. This printed circuit based, pinless, interconnect family is comprised of modular components which can be used in a variety of combinations. The connectors in this innovatively flexible platform can be combined to provide the density, data throughput, and signal integrity required for any application in today s computer, military, medical, or industrial control industries. Applications Telecommunications Equipment Metro Optical Networking equipment SONET switched platforms Aggregation switches Midrange Servers High End Servers High speed custom platforms Mass data storage Rugged, mission-critical applications The use of printed circuit wafers in this connector system allows for cost effective sequencing and electrical customization of the connector. Wafers can be manufactured specifically for differential or signal ended performance and the impedance, propagation delay, and crosstalk of the connector can be altered per customer requirements. This scalable board to backplane connector family is a robust, pinless design which eliminates the pin field on backplane boards and reduces the end user s Technical Documents Application Specifications Power Modules Signal Connectors Product Specifications Power Modules Signal Connectors Qualification Test Reports Power Connectors Signal Connectors Engineering Report Power Connectors Routing Guide RT 2 on tycoelectronics.com exposure to field failure in card cage systems. The MULTIGIG RT connector family is designed specifically for [.800] or [.00] card pitch systems. MULTIGIG RT 4 signals/inch, data rates up to 3.25 Gb/s MULTIGIG RT 2 3 signals/inch, data rates of 3.25 Gb/s to 6.4 Gb/s and has been demonstrated to support 0 Gb/s MULTIGIG RT 3 85 signals/inch, data rates above 0 Gb/s

87 MULTIGIG RT Connector Products (Continued) MULTIGIG RT Connector Sequencing Chart mm Key on Guide Pin 8.25 mm ESD Contact on Guide Pin Fully-Mated Wipe Length 2.5 mm 4.0 mm 5.5 mm Signal Level 8.25 mm 7.5 mm 9.75 mm Signal Level 3 Ground Level Signal Level 2.25 mm Power Level Power Level 2 EMI Shield, proposed Power Level 3 3 MULTIGIG RT Connector

88 MULTIGIG RT Connector Products (Continued) MULTIGIG RT Connector Mating Sequence Chart which shows the relationship of MULTIGIG RT Connector products with other Tyco Electronics products Fully Mated Reliable Mate 88 Dim. A Dim B. Product Dim. C Fully Contact Fully Mated Family Reliable First Mate Mated Wipe Length Mate Last Break Ground Shield 6.78 [.66] 7.55 [.69] 4.28 [.69] HM-Zd Signal Level [.607] 5.85 [.624] 2.9 [.5] Signal Level 3.9 [.548] 4.35 [.565].4 [.056] HM-Zd 24.0 mm Pin [.083] [.35] N/A Guide mm Pin [.02] 3.60 [.244] N/A Hardware Key Blocking Point N/A [.867] N/A Signal Level [.79] 8.84 [.742] 5.77 [.227] HM-2mm Signal Level [.660] 7.34 [.683] 4.27 [.68] Signal Level 5.27 [.60] 5.84 [.624] 2.77 [.09] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] Ground 8.00 [.709] 5.50 [.27] MULTIGIG RT Signal Level [.709] 5.50 [.27] T Signal Level [.650] 4.00 [.57] Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Ground 6.50 [.650] 4.00 [.57] T Signal Level 5.00 [.59] 2.50 [.098] MULTIGIG RT Power Level [.935].25 [.443] Power Power Level [.876] 9.75 [.384] Module Power Level [.87] 8.25 [.325] MULTIGIG RT 2.50 Guide Pin Key [.309] N/A [.87] Guide N/A Hardware.492 Guide ESD Contact [.2] 8.25 [.79] Ground 7.08 [.672] 7.60 [.693] 4.78 [.88] HS Signal Level [.632] 6.47 [.648] 3.75 [.48] Signal Level 4.55 [.573] 4.97 [.589] 2.25 [.089] Power Level [.797] [.825] 8.0 [.39] UPM Power Level [.734] 9.35 [.762] 6.50 [.256] Power Level 7.03 [.670] 7.73 [.698] 4.88 [.92] UPM Guide Pin Key 3.39 [.236] 36.6 [.424] N/A Guide Keyed Guide Pin 3.39 [.236] 36.6 [.424] N/A Hardware Keyed Guide Pin [.387] [.575] N/A PreMate Power Level 6.84 [.663] 5.6 [.22] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Header to Level [.70] Min. Vertical PreMate Signal 3.8 [.50] Receptacle Level [.79] Min. PostMate Signal Level [.769] 2.54 [.00] Min. PreMate Power 5.6 [.22] Level 5.32 [.603] Min. MULTI-BEAM XL PostMate Power 4.34 [.7] Right Angle Receptacle Level [.64] Min. to Vertical PreMate Signal 3.8 [.50] Header Level [.659] Min. PostMate Signal Level [.709] 2.54 [.00] Min.

89 MULTIGIG RT Connector Products (Continued) Product Selection Guide Vertical Receptacle (Backplane) Connector MULTIGIG RT connectors consist of interlocking left end and right end signal modules (half or full), center signal modules, and stand alone modules available in vertical receptacles (backplane application) and right angle plugs (daughtercard application), and complementary mechanical guide assemblies (available in size 0.80 [.425] or 7.20 [.283]. The guide assembly provides blind mating and misalignment for the connectors. The 0.80 [.425] guide assembly also provides keying and is available with or without an internal contact for electrostatic discharge (ESD) protection. The modules are capable of being stacked in any configuration within the limitations given in this catalog to a maximum length of 20 between guide assemblies. These connectors perform at two separate density levels: Tier and Tier 2. The connectors are placed on the pc board by manually-operated or automatic machines. The modules have 6, 8, or 0 rows of signal contacts with [.800], [.000], or [.20] centerline spacing (profile size). A right angle plug module having 7 rows with [.800] spacing is also available for Tier 2 only to accommodate special applications used by the VMEbus International Trade Association (VITA). The signal contacts, along with the ground contacts (in Tier modules only) and ESD contacts (if using the 0.80 [.425] guide assembly with ESD contact) provide sequencing for each group of modules. When corresponding with personnel, use the terminology provided to facilitate your inquiries for information. Basic terms and features of this product are provided in the art below and on the following page. 3 MULTIGIG RT Connector Half Left End Module Standoff Polarization Post Standoff Center Module Housing Ground Contact (In Tier Only) Half Right End Module Standoff Polarization Post Polarization Slot Polarization Slot Polarization Rib Contact Cavities Eye-of-Needle Compliant Pin Signal Contact Standoff Full Left End Module Stand Alone Module Full Right End Module 0.8 mm Guide Pins 7.2 mm Guide Pin Mounting Post With Screw Hole Mounting Post With Threads Mounting Post Collar Key No Key 89

90 MULTIGIG RT Connector Products (Continued) Product Selection Guide (Continued) Right Angle Plug (Daughtercard) Connector Half Left End Module Center Module PC Wafers (Blades) Half Right End Module Housing Contact Pads Alignment Pin Eye-of-Needle Compliant Pin Signal Contact Full Left End Module Stand Alone Module Full Right End Module 0.8 mm Guide Module 7.2 mm Guide Module ESD Contact (Inside Module) (Optional) Housing No Key Key Pilot Post Screw Hole Mounting Post Signal Modules Tier and Tier 2 receptacles contain eye-of-needle compliant pin signal contacts; the Tier receptacle also contains ground contacts. Each housing features standoffs for thermal venting, polarization ribs (on end modules) and polarization slots (on the center module) for proper stacking of the modules, and polarization posts to ensure correct orientation on the pc board. Plugs contain eye-of-needle compliant pin signal contacts and pc wafers (blades). The housing features alignment pins to ensure correct orientation on the pc board. Guide Assemblies The guide assembly consists of a guide pin (used with receptacles) and a guide module (used with plugs). The guide pin features a collar and mounting post (having a screw hole or threads) with or without a key. The guide pins are available with various length mounting posts. The mounting post is used with customer supplied hardware to attach the guide pin to the pc board. Guide pins must be chosen according to thickness of pc board being used; otherwise, interference with proper mating or damage to system components will occur. Guide pins with keys are available in various keying positions. The guide module features a housing with or without a key and with a screw hole, mounting post, and pilot post. The mounting post and pilot post are used to position the guide module on the pc board, and the screw hole is used with customer supplied hardware to attach the module to the pc board. The 0.80 [.425] guide module is available with or without an ESD contact located inside the module. 90

91 MULTIGIG RT Connector Products (Continued) Product Selection Guide (Continued) Possible Module Configurations Used with Power Modules Three Signal Modules and One Power Module Guide Pin Receptacle Full Left End Module* Receptacle Center Module Receptacle Full Right End Module* Power Receptacle Module Guide Pin Guide Module Plug Full Left End Module* Plug Center Module Plug Full Right End Module* Two and One-Half Signal Modules and One Power Module Power Receptacle Guide Receptacle Receptacle Module Pin Left End Module Center Module Power Plug Module Receptacle Full Right End Module* Guide Module Guide Pin 3 MULTIGIG RT Connector Power Plug Module Guide Module Plug Left End Module Plug Center Module Plug Full Right End Module* Guide Module Four Signal Modules with One Power Module Guide Pin Receptacle Full Left End Module* Receptacle Center Module Receptacle Center Module Receptacle Full Right End Module* Guide Pin Power Receptacle Module Guide Module * A Half Left End Module and a Half Right End Module can be used instead. Plug Full Left End Module* Plug Center Module Plug Center Module Plug Full Right End Module* Guide Module Power Plug Module 9

92 MULTIGIG RT Connector Products (Continued) Customization Options The MULTIGIG RT Product Line is fully customizable. This is accomplished by means of stacking the PCB wafers in the correct location to achieve the desired mix of High Speed Differential, High Speed Single-ended, and low speed/high speed density signals. In addition, power can be carried through the PCB wafers by replacing one or more signal wafers for a power wafer. Shown below is a Tyco Electronics proposal for a typical MULTIGIG RT Connector application. As you can see, we took full advantage of the MULTIGIG RT Connector capabilities. Contact your Tyco Electronics representative to have a proposal drawn-up to meet your specific needs. Typical MULTIGIG RT Connector Implementation MULTIGIG RT 7.2mm Guide Receptacle MULTIGIG RT mm Right End Plug 3 Open Pin Field Wafers (9 Single-ended Lines Each) 8 Single-ended Wafers (6 Lines Each) 2 Power Wafers (3 Lines Each) MULTIGIG RT mm Center Plug 6 Differential Pair Wafers (3 Pairs Each) MULTIGIG RT mm Center Plug 6 Open Pin Field Wafers (9 Single-ended Lines Each) MULTIGIG RT mm Right End Plug 6 Open Pin Field Wafers (9 Single-ended Lines Each) 92

93 MULTIGIG RT Connector Products (Continued) Customization Options (Continued) Tier Options The Tier connector system can be customized with Differential and Singleended wafers. In addition, a power wafer is available for the [.000] pitch product that provides 4 power lines and 2 sense lines per wafer. Shown below are differential, single-ended and power options. 3 MULTIGIG RT Connector 93

94 MULTIGIG RT Connector Products (Continued) Customization Options (Continued) Tier 2 and Tier 3 Options Signal Options Available: 0.8" Shown The Tier 2 and Tier 3 connector system is fully customizable due to the lack of a bussed ground system. This allows us to stack the many options available (with more being Differential Wafers developed as needed) in any configuration that is necessary to meet the customers needs. Shown here are some of the options that are currently available. Single-ended w/ : S/G Ratio Single-ended w/ 2: S/G Ratio Open Pin Field (No Reference Ground) Mixed, Differential and S/E Lines Custom, Vita 4, Mixed Up to 4 Power Lines/Wafer Total of 9 AMPS/Wafer 94

95 MULTIGIG RT Tier Connector System Target Applications High speed telecommunications equipment Midrange and high-end servers Networking equipment Blindmate design High speed custom platforms Mass data storage Rugged, mission-critical applications Product Features Excellent performance to 3.25 Gb/s High density: 40 contacts per inch provides 70 contact pairs per inch for differential signaling Options include [.800] and [.000] pitch card spacing Modular options for signal, power, keying and guidance Optimized footprints Robust design Low noise levels Supports differential pair widths of 6 mils with 9 mil spacings Single-ended option available; contact Tyco Electronics for performance data The MULTIGIG RT Tier connector meets customer requirements for high-density and high-performance two-piece interconnects. In Tyco Electronics and independent lab tests, the MULTIGIG RT Tier connector has performed in excess of 3 Gb/s using standard FR-4 board material and routing techniques. The MULTIGIG RT Tier connector is a differential connector with a contact density of 70 pairs per inch. The robust connector uses daughtercard plugs with a printed circuit board (PCB) wafer design and backplane receptacles with a completely enclosed dualbeam design. All signal lines use redundant points of contact for high reliability. The MULTIGIG RT Tier connector is available for both [.800] and [.000] pitch card spacing. The totally modular system allows flexibility in choosing signal and power modules as well as guidance, keying, and electrostatic discharge (ESD) modules to meet the most demanding applications. Signal modules can be customized for specific electrical requirements such as sequencing that are critical in high speed applications. Power modules are available with two- and four-voltage options, each circuit capable of carrying 5 amps. The robust metal guide pin provides eight keying options and a unique ESD contact to discharge static when daughtercards are hot-plugged. 3 MULTIGIG RT Connector Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com 95

96 MULTIGIG RT Tier Connector System (Continued) Mechanical Design Summary Mechanical Features Extremely rugged connector for mission critical applications Three signal sequencing levels plus an additional three power sequencing levels Keyed guide modules standard: cannot mate connector incorrectly, and provide ± 3 mm of gather Options available include: Power modules Electrostatic discharge guide pins Multiple guide pin keying options High signal density: 70 pairs for differential signals [.800] Pitch Connector Type Style Signal Pattern Part Number Center N/A Stand Alone N/A (Backplane) Half Left N/A Receptacle Half Right N/A Full Left N/A Full Right N/A Center S.E Diff Stand Alone S.E Diff S.E Half Left (Daughtercard) Diff Plug S.E Half Right Diff Full Left S.E Diff Full Right S.E Diff [.00] Pitch Connector Type Style Signal Pattern Part Number Center N/A Stand Alone N/A (Backplane) Half Left N/A Receptacle Half Right N/A Full Left N/A 402- Full Right N/A Center S.E Diff Stand Alone S.E Diff S.E Half Left (Daughtercard) Diff Plug S.E Half Right Diff Full Left S.E Diff Full Right S.E Diff The drawings below show the nominal dimensions for the MULTIGIG RT connector modules Dim. A B C D E F [.800] [.000] Connector Connector Dim. AA BB CC DD EE FF [.800] [.000] Connector Connector R = R = L = L = Left/Right End Module Center Module Left Full End Module Right Full End Module C F B E A Plug (Daughtercard) D CC FF AA BB DD Receptacle (Backplane) EE Stand Alone Backplane Stand Alone Daughtercard 96

97 MULTIGIG RT Tier 2 Connector System Target Applications High speed telecommunications equipment Midrange and high-end servers Networking equipment Blindmate design High speed custom platforms Mass data storage Rugged, mission-critical applications Product Features Excellent performance to Gb/s High density: 3 contacts per inch provides 56 contact pairs per inch for differential signaling Options include [.800] and [.000] pitch card spacing Modular options for signal, power, keying and guidance Optimized footprints Robust design Low noise levels Supports differential pair widths of 6 mils with 9 mil spacings Single-ended, open pin field and power wafers available The MULTIGIG RT Tier 2 connector is the latest product release to meet customer requirements for high-density and highperformance two-piece interconnects. In Tyco Electronics and independent lab tests, the MULTIGIG RT Tier 2 connector has performed in excess of 6 Gb/s using standard FR-4 board material and routing techniques, and has been demonstrated to 0 Gb/s. The MULTIGIG RT Tier 2 connector system provides the flexibility to configure the daughtercard for Differential, Single-ended, Open Pin Field, or Power within a single connector module. All of these options then mate into a common Backplane Receptacle. The robust connector uses daughtercard plugs with a printed circuit board (PCB) wafer design and backplane receptacles with a completely enclosed dualbeam design. All signal lines use redundant points of contact for high reliability. The MULTIGIG RT Tier 2 connector is available for both [.800] and [.000] pitch card spacing. The totally modular system allows flexibility in choosing signal and power modules as well as guidance, keying, and electrostatic discharge (ESD) modules to meet the most demanding applications. Signal modules can be customized for specific electrical requirements such as sequencing that are critical in high speed applications. Power modules are available with two- and four-voltage options, each circuit capable of carrying 5 amps. The robust metal guide pin provides eight keying options and a unique ESD contact to discharge static when daughtercards are hot-plugged. 3 MULTIGIG RT Connector Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com 97

98 MULTIGIG RT Tier 2 Connector System (Continued) Mechanical Design Summary [.800] Pitch Connector Type Style Signal Part Pattern Number Center N/A Stand Alone N/A Half Left N/A (Backplane) Receptacle Half Right N/A * Full Left N/A 404- Full Right N/A Right End N/A Center S.E. * Diff Stand Alone S.E. * Diff S.E. * Half Left (Daughtercard) Diff. * Plug S.E. * Half Right Diff. * Full Left S.E. * Diff Full Right S.E. * Diff * Contact Tyco Electronics [.00] Pitch Connector Type Style Signal Part Pattern Number Center N/A Stand Alone N/A 403- (Backplane) Half Left N/A * Receptacle Half Right N/A * Full Left N/A Full Right N/A Center S.E. * Diff Stand Alone S.E. * Diff S.E. * Half Left (Daughtercard) Diff. * Plug S.E. * Half Right Diff. * Full Left S.E. * Diff Full Right S.E. * Diff * Contact Tyco Electronics. The drawings below show the nominal dimensions for the MULTIGIG RT 2 connector modules Dim. A B C D E F [.800] [.000] Connector Connector Dim. AA BB CC DD EE FF [.800] [.000] Connector Connector R = R = L = L = Left/Right End Module Center Module Left Full End Module Right Full End Module C F B E A Plug (Daughtercard) D CC FF 98 AA BB DD Receptacle (Backplane) EE Stand Alone Backplane Stand Alone Daughtercard

99 MULTIGIG RT Tier 3 Connector System Target Applications High speed telecommunications equipment Midrange and high-end servers Networking equipment Blindmate design High speed custom platforms Mass data storage Rugged, mission-critical applications Product Features Excellent performance to 0+ Gb/s High density: 85 contacts per inch provides 42 contact pairs per inch for differential signaling Options include [.800] and [.000] pitch card spacing Modular options for signal, power, keying and guidance Optimized footprints Robust design Low noise levels Supports differential pair widths of 6 mils with 9 mil spacings Single-ended, open pin field and power wafers available Supports Quad routing MULTIGIG RT 3 products are on 2.4mm column spacing The MULTIGIG RT Tier 3 connector is the latest product release to meet customer requirements for high-density and highperformance two-piece interconnects. In Tyco Electronics and independent lab tests, the MULTIGIG RT Tier 3 connector has performed in excess of 0 Gb/s using standard FR-4 board material and routing techniques, and has been demonstrated to 0 Gb/s. The MULTIGIG RT Tier 3 connector system provides the flexibility to configure the daughtercard for Differential, Single-ended, Open Pin Field, or Power within a single connector module. All of these options then mate into a common Backplane Receptacle. The robust connector uses daughtercard plugs with a printed circuit board (PCB) wafer design and backplane receptacles with a completely enclosed dualbeam design. All signal lines use redundant points of contact for high reliability. The MULTIGIG RT Tier 3 connector is available for both [.800] and [.000] pitch card spacing. The totally modular system allows flexibility in choosing signal and power modules as well as guidance, keying, and electrostatic discharge (ESD) modules to meet the most demanding applications. Signal modules can be customized for specific electrical requirements such as sequencing that are critical in high speed applications. Power modules are available with two- and four-voltage options, each circuit capable of carrying 5 amps. The robust metal guide pin provides eight keying options and a unique ESD contact to discharge static when daughtercards are hot-plugged. 3 MULTIGIG RT Connector Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com 99

100 MULTIGIG RT Tier 3 Connector System (Continued) Mechanical Design Summary [.800] Pitch Connector Type Style Signal Part Pattern Number (Backplane) Center N/A Receptacle Full Right N/A Center S.E. * (Daughtercard) Diff Plug Full Right S.E. * Diff * Contact Tyco Electronics [.00] Pitch Connector Type Style Signal Part Pattern Number (Backplane) Center N/A Receptacle Full Right N/A Center S.E. * (Daughtercard) Diff Plug Full Right S.E. * Diff * Contact Tyco Electronics. The drawings below show the nominal dimensions for the MULTIGIG RT 3 connector modules Dim. A B C D E F [.800] [.000] Connector Connector Dim. AA BB CC DD EE FF [.800] [.000] Connector Connector R = R = L = L = Left/Right End Module Center Module Left Full End Module Right Full End Module C F B E A Plug (Daughtercard) D CC FF AA BB DD Receptacle (Backplane) EE Stand Alone Backplane Stand Alone Daughtercard 00

101 VITA 4 Connector Selection Grid Actual VITA 4, 2 Slot Backplane VITA 4, referred to as VXS, is the next Generation of VME Backplanes 3 MULTIGIG RT Connector Connector Description Part Number P0 P5 P4 P3 P2 P J0 J5 J4 J3 J2 J Tier 2, 7 Row, Center Module, [.800] Pitch, Right Angle Tier 2, Left End Module, [.800] Pitch, Right Angle Tier 2, Center Module, [.800] Pitch, Right Angle Tier 2, Center Module, [.800] Pitch, Right Angle Tier 2, Right End Module, [.800] Pitch, Right Angle Tier, Monolithic, [.800] Pitch, Right Angle Tier 2, Center Module, [.800] Pitch, Vertical Tier 2, Left End Module, [.800] Pitch, Vertical Tier 2, Center Module, [.800] Pitch, Vertical Tier 2, Center Module, [.800] Pitch, Vertical Tier 2, Right End Module, [.800] Pitch, Vertical Tier, Monolithic Module, [.800] Pitch, Vertical

102 Power Modules and Guide Hardware Reference Part Number Y Mating Point 3.70 [.539] 3.50 [.38] 2-Position Vertical Receptacle 8.45 [.338] Contact 3.60 [.42] Y Housing 6.25 [.640] 3.8 [.25] Section Y-Y Pin a Plated Through Hole 2 Plcs. Mating Header Footprint Center Lines 0.75 [.030] 2 Plcs [.8] Daughter Card Primary Side 4 Plcs. [.079] Connector Outline 3.60 [.42] [.079] 3.00 [.8] 5.25 [.600].625 [.064] Recommended PCB Hole Layout PCB Hole Dim. Drilled Hole = 0.70 ± 0.02 [.028 ±.00] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = [ ] SnPb Thickness = 0.05 [.0006] Max. Part Number Y Mating Point 3.70 [.539] 3.50 [.38] 4-Position Vertical Receptacle Contact 5.65 [.66] 3.60 [.42] Y Housing 6.25 [.640] Section Y-Y 3.8 [.25] Pin a Plated Through Hole 24 Plcs [.8] Daughter Card Primary Side 4 Plcs. [.079] Connector Outline Mating Header Footprint Center Lines 02 [.079] 3.00 [.8] 5.25 [.600].625 [.064] 0.75 [.030] 4 Plcs. Recommended PCB Hole Layout Plcs. [.42] PCB Hole Dim. Drilled Hole = 0.70 ± 0.02 [.028 ±.00] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = [ ] SnPb Thickness = 0.05 [.0006] Max.

103 Power Modules and Guide Hardware Reference (Continued) Part Number X 2-Position Right Angle Plug Y L Contact Housing [.724] Daughtercard Edge 4.70 [.579] Dim. L Part Circuit Circuit 2 Number Y [.079] [.38] 3.60 [.236] [.27] [.42] [.47] [.699] Connector Outline Plcs. [.42] [.34] Section Y-Y 5 Plcs. [.079] 5.50 [.27] Pin a 8.00 [.709] Recommended PCB Hole Layout PCB Hole Dim. Drilled Hole = 0.70 ± 0.02 [.028 ±.00] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = [ ] SnPb Thickness = 0.05 [.0006] Max. Primary Side of Backplane Plated Through Hole 2 Plcs. 3 MULTIGIG RT Connector Part Number 4027-X 4-Position Right Angle Plug Y L Contact Housing [.724] Daughtercard Edge 4.70 [.579] Dim. L Part Cavity Cavity 2 Cavity 3 Cavity 4 Number Y [.079] [.38] 3.60 [.236] [.27] [.42] [.70] [.699] Connector Outline Plcs. [.42] 5 Plcs. [.079] 8.00 [.709] [.34] Section Y-Y 5.50 [.27] Pin a Recommended PCB Hole Layout PCB Hole Dim. Drilled Hole = 0.70 ± 0.02 [.028 ±.00] Finished Hole = 0.60 ± 0.05 [.024 ±.002] Cu Thickness = [ ] SnPb Thickness = 0.05 [.0006] Max. Plated Through Hole 24 Plcs. Primary Side of Backplane 03

104 Power Modules and Guide Hardware Reference (Continued) 7.2 mm Wide, No Key 7.08 [.279] A 4.0 Across 7.40 [.6] Flats [.29].85 [.073] 30 0' [.997] 3.88 [.255] 7.0 [.280] 8.60 [.732] - Z - C L of - Z [.329] 8.40 [.724] 7.30 [.287] Pin Part Number 4070-X Dim. A Part Number [.46] 5.63 [.65] 0.50 [.43] 3.88 [.53] Guide Module Part Number [.57] 9.0 mm Wide, with Keying 7.40 [.29].50 ± 0.03 [.059 ±.00] G [.079] [.945] Pin Part Number X Dim. G Part Number Ø 9.00 [.354] Mounting Screw for 9.0 mm Ø 5.50 [.27] Guide Modules.50 [.059] Measured Counterclockwise 2.48 [.49] 5.00 [.97] 5.50 [.27] 4.75 [.87] ESD Orientation A 2.50 Top of [.492] Motherboard Edge of Daughtercard 5.50 [.27] [ ] 2.70 ± 0.08 [.06 ±.003] Ø 3.00 ± 0.05 [.8 ±.002] Ø 4.65 ± Plcs. [.83 ±.002] 5.25 [.207] [.896] Guide Module Part Number X Dim. A Part Number No Key [.06] 9.78 Max. [.385].30 ± 0.0 [.05 ±.004] 5.50 [.27] [.020] Max [.38] Part Number

105 Power Modules and Guide Hardware Reference (Continued) 0.8 mm Wide, Guide Module, with Keying, with ESD Contact Measured Counterclockwise Contact, ESD Housing Ø 5.55 [.29] 3 [.260] 6.50 [.256] 5.00 [.97] 6.00 [.236] 8.40 [.724] Ø 7.70 [.303] 3.70 ESD Orientation [.46] Ø 3.96 ± Plcs. [.56 ±.002] Ø 3.96 ± 0.05 [.56 ±.002] 2.50 [.492] Edge of Daughtercard 8.0 [.39] Top of Motherboard Guide Module Part Number X Ø 0.00 [.394] A 5.63 [.222] [.482] [.97] 5.70 [.224].50 [.059] 3.88 [.255] 5.63 [.222] 5.50 [.27] 7.40 [.29] 6.3 [.635].50 ± 0.03 [.059 ±.00] G 4.00 [.57] 2 Plcs [.482] 0.70 [.42] Dim. A Part Number No Key Ø 0.00 [.394] 3 MULTIGIG RT Connector 4.65 [.83] [.40] 6.99 [.275] [.079] 3 [.260] Pin Part Number Pin Part Number X 0.8 mm Wide, Guide Pin, with Keying, with ESD Contact Plcs. [.97] Edge of Daughtercard Top of Motherboard [.236] [.57] Ø 7.70 [.303] 2 Plcs ESD Orientation [.46] Ø 3.96 ± Plcs. [.56 ±.002] Ø 3.96 ± 0.05 [.56 ±.002] 2.50 [.492] B A Contact, ESD 5.63 [.222] [.669] [.97] [.483] 5.63 [.222] 5.50 [.27] Guide Module Part Number [.863] Housing 4.00 [.57] 2 Plcs [.669] 0.70 [.42] [.953] Dim. A Dim. B Part Number Dim. G Part Number

106 Coming Soon: MULTIGIG RT Future Products In development We continue to develop new and exciting options for the MULTIGIG RT Product Line. Shown here are two examples of this effort. Options with Integrated POLYSWITCH Device for Hot Swap Applications (In Development) 0 Gb/s Active Equalization Chip Integrated Unto a PCB Wafer 06

107 Table of Contents Z-DOK and Z-DOK Connectors Product Line Overview Electrical Performance and Applications , 0 Z-DOK Connector , 2 Z-DOK 2 Connector , 4 Z-DOK 4 Connector , 6 Z-DOK 6 Connector Sequencing Chart Work Sheet Z-DOK and Z-DOK Connectors 07

108 08 Product Facts Z-DOK Connector Data rates up to 0 Gb/s Familiar robust blindmate design derived from CHAMP.050 Series connector family Maximizes data throughput while minimizing pair to pair crosstalk and impedance discontinuities Available in size increments of 8 to 72 differential pairs Sequenced mating of ESD, ground and signal circuits to insure proper initialization of the mating cards Unique ESD contact system to insure dissipation of ESD in a make first break last mating sequence Product Facts Z-DOK Connector The CHAMP Z-DOK Connector is the latest addition to the CHAMP connector family Includes high speed and utility contacts in one connector Operating bandwidth up to 0+ Gb/s Robust 4 row, blindmate design Utilizes TRI-Q differential pair contact system providing 2 to signal to ground ratio Uniform 00 ohm impedance with less than 3% crosstalk Available in 8 pair increments from 8 to 72 pair Utility contacts can be arranged on either end of the connector Utility contacts are available in 4 lengths to accommodate power, ground, ESD and sensing design requirements Product Line Overview The CHAMP Z-DOK The second option is Applications Connector System includes the CHAMP Z-DOK The Z-DOK and Z-DOK two options for system Connector, which includes Connector Systems are designers. The first option a high speed section with suitable for use in high is the Z-DOK Connector, the same features as standard the Z-DOK Connector speed, co-planar docking which provides the following features: and adds up to 3 Utility applications.. Robust, blind-mateable, modules to each side of the Enterprise Switching high speed connector connector. Each Utility Equipment module provides flexibility High Speed 2. Data rates in excess of for systems designers to Telecommunications 0 Gb/s (Double XAUI include power, ground, ESD Equipment speeds) and sensing functions to Mid Range and High End 3. Differential pair, 00 ohm, I/O adapter cards and Servers low crosstalk docking applictions. Storage Area Networks 4. Available with and without sensing contacts System can be provided Platforms The Z-DOK Connector High Speed Custom in the same position sizes 5. Position sizes from 8 to The Z-DOK Connector TRI-Q as the standard Z-DOK 72 differential pair in contact arrangement is well Connector (8 to 72 differential pair). The Utility modules increments of 8 differential pair modules switching architectures and suited for high speed serial can be added to either side the robust design assures a 6. Unique TRI-Q contact of the high speed section highly reliable interconnect system that provides a 2 with a maximum of three (3) between host and media to signal to ground on each side. This arrangement will provide a total of adapter cards. Z-DOK ratio for maintaining Connectors can handle superior signal integrity six (6) positions for the escalating data rates without power, ground, ESD and sacrificing line density to sensing functions. Four different length contacts can achieve higher signal integrity. If I/O flexibility is be loaded into the Utility what you seek, the Z-DOK modules to provide the ultimate design flexibility. Connector will help insure the longevity of your packaging scheme through ease in changeability. Availability Fully validated SPICE models: requests to modeling@tycoelectronics.com Samples: requests to zdok@tycoelectronics.com Pro/E models and IGES models: requests to TycoCAD@tycoelectronics.com Application Specification Product Specification Design Objectives

109 Z-DOK Connector Electrical Performance Electrical Performance and Applications 3.25 Gb/s over 6 of FR4 0 Gb/s over 6 of FR4 Maximum Opening 89.2% Jitter 2.2% U.I. Maximum Opening 69.8% Jitter 0.5% U.I. TRI-Q Contact System Each differential pair is carefully designed to be in close proximity to a dedicated ground, providing true symmetrical impedance and low noise in a 00 Ω system. The ground contacts are confined to rows B & E to simplify trace routing, control pair-to-pair crosstalk, and to minimize impedance discontinuities at the connector to board interface [.00] Plcs. [.080] [.098].27 [.050] 4 Differential Pair* 4 Ground Contact Interface 2.54 [.00] Ground Rows 3.05 Signal [.20] Rows Row PC Board Rows F (Signals from row 4*) E (Grounds from rows 3 & 4*) D (Signals from row 3*) C (Signals from row 2*) B (Grounds from rows & 2*) * The differential pair contacts may be used for single ended lines. Consult Tyco Electronics for more information. 4 Z-DOK and Z-DOK Connectors.75 4 Plcs. [.069] 4 A (Signals from row *) 3 2 Host Board Layout * Contact interface rows. Host and Adapter Board Trace Routing Suggested two-layer routing pattern F E D C Ground PTH s B A Layer Layer 2 09

110 Electrical Performance and Applications (Continued) Plug Receptacle 6.93 [.273] ± 0.20 [.787 ±.008] Boardlock Centerlines 4.8 [.65] Z-DOK Connector Applications Rows A B C D E F Host Board Connector 9.50 [.374] Adapter Board Connector Rows A B C D E F 5.50 ± 0.20 [.60 ±.008] Row F to A Centerlines Inverted Application Adapter Board Connector Rows A B C D E F 3.20 [.26] Host Board Connector 9.50 [.374] 0.00 (Std. [.394] Height of Z-DOK) 5.50 ± 0.20 [.60 ±.008] Rows A B C D E F Inverted Mid-Board Application 0

111 Z-DOK Connector System Host Part Number X H Material and Finish Housing Polyester, natural Contacts Copper alloy Boardlocks Brass [.943] Plating Boardlocks 2.0 µm tin-lead over.00 µm nickel Contacts 0.76 µm min. gold in contact area, 2.5 µm tin-lead in termination area, over.27 µm min. nickel. Pin E Pin F Pin B 9.50 [.374] Pin D Row F Row D Row B Row A Pin A.57 [.456] 2 Plcs [.396] 2 Plcs [.356] 2 Plcs. Pin E Pin D Pin C Pin C.75 4 Plcs. Ø 2.60 ± 0.05 [.069] [.02 ±.002] Pin A Pin F Pin B A 2 Plcs. B 2 Plcs. Ø 0.60 ± 0.05 [.024 ±.002] N Plcs. C 2 Plcs. D 2.54 [.00] 3.05 [.20] 3.0 [.22] 2.80 [.0] 2.35 [.093] 2.03 [.080].67 [.066] 3.65 [.44] Ø 2.60 ± 0.05 [.02 ±.002] 6.93 [.273] 4 Z-DOK and Z-DOK Connectors Recommended PC Board Footprint Component Side Shown PC Board Edge Dimensions Pairs Part H D C B A Number Description with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks

112 Z-DOK Connector System (Continued) Adapter Part Number X H Material and Finish Housing Polyester, natural Contacts Copper alloy Boardlocks Brass [.038] Plating Boardlocks 2.0 µm tin-lead over.00 µm nickel Contacts 0.76 µm min. gold in contact area, 2.5 µm tin-lead in termination area, over.27 µm min. nickel. Pin F Pin E Pin B 9.50 [.374] 2.80 [.0] 3.0 [.22] Pin A.67 [.066] Row F Row D Row B Row A.57 [.456] 2 Plcs [.396] 2 Plcs [.356] 2 Plcs. A 2 Plcs. B 2 Plcs. Ø 0.60 ± 0.05 [.024 ±.002] N Plcs. C 2 Plcs [.20] D 2.03 [.080] Pin F Pin E Pin D Pin C 5.0 [.20] Ø 2.60 ± 0.05 [.02 ±.002].75 4 Plcs. [.069] PC Board Edge 2.54 [.00] Recommended PC Board Footprint Component Side Shown Pin B Pin A 0.90 [.035] Ø 2.60 ± 0.05 [.02 ±.002] 4.8 [.65] Dimensions Pairs Part H D C B A Number Description with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks with ESD Boardlocks 2

113 Z-DOK 2 Connector System Host Part Number X Housing Pin B Signal Ground Pin D Pin E [.943] 9.50 [.374] 8.6 [.32] Pin A Signal Contact H Utility Contact.95 [.470] T 3 Plcs. [.079] Row D 4.06 [.60] Row B Row A 5.07 [.200] Pin E Pin D Row F Pin C Pin B Pin A Spacing to Adapter Board Connector Pin at Location 6.60 [.260] Pin F 5.50 ± 0.20 [.60 ±.008] 2.50 [.098] 2.03 [.080] 2.54 [.00] Plcs. [.069] Recommended PC Board Footprint 3.05 [.20] [.26] To Board Edge 3.2 [.26] Ø 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes 5.56 [.29] Pin Z Pin Y Pin X Pin W 4 Z-DOK and Z-DOK Connectors Z-DOK 2 Host Connector Part Numbers Type Dim. H Dim. T Number Number of Utility of Diff. Contacts Pairs Part Number Host Connector Different Tail Lengths available upon request, contact Tyco Electronics. 3

114 Z-DOK 2 Connector System (Continued) Adapter Housing F Section E-E Pin D Pin E Pin B Signal Ground Contact [.094] E E 9.50 [.374] F H Pin A Signal Contact 8.6 [.32].95 [.470] Section F-F T Plcs. [.229] 4.8 [.89] 2 Plcs. Pin Z Pin Y Pin X Pin W Plcs. [.289] 2.03 [.080] 3.05 [.20] Ø 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes Pin F Pin E Pin D Pin C Pin B 3 Plcs. [.079] Pin A 2.86 [.3] [.00] [.098] Plcs. [.069] [.26] To Board Edge Recommended PC Board Footprint Z-DOK 2 Adapter Connector Part Numbers Type Dim. H Dim. T Sequence Sequence Number Number for Utility for Utility of Utility of Diff. Pin Loc. Pin Loc. 2 Contacts Pairs Part Number Adapter Connector Different Tail Lengths available upon request, contact Tyco Electronics. 4

115 Z-DOK 4 Connector System Host Part Number X Housing Pin B Signal Ground Pin D Pin E [.943] 9.50 [.374].26 [.443] Plcs. [.322] Plcs. [.282] Pin E Pin D 3 Plcs. [.079] Row F Row D Row B Row A Pin C Pin B Pin A Spacing to Adapter Board Connector Pin A Location Z-DOK 4 Host Connector Part Numbers Type Dim. H Dim. T Number Number of Utility of Diff. Contacts Pairs Part Number Host Connector Different Tail Lengths available upon request, contact Tyco Electronics. Pin A Signal Contact H Plcs. [.382] Pin F 5.50 ± 0.20 [.60 ±.008] 2.50 [.098] Utility Contact 2.03 [.080] 2.54 [.00] Plcs. [.069] Recommended PC Board Footprint.95 [.470] 3.05 [.20] [.26] To Board Edge 3.2 [.26] Ø 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes Z-DOK 4 Host Connector Part Numbers (Continued) Type Dim. H Dim. T Number Number of Utility of Diff. Contacts Pairs Part Number Host Connector Different Tail Lengths available upon request, contact Tyco Electronics. T 8.66 [.34] Plcs. [.22] Pin Z Pin Y Pin X Pin W 4 Z-DOK and Z-DOK Connectors 5

116 Z-DOK 4 Connector System (Continued) Adapter Housing F Section E-E Pin D Pin E Utility Contact Pin B Signal Ground Contact [.094] E E 9.50 [.374].26 Pin A.95 T [.443] Signal Contact [.470] H F Section F-F Plcs [.4] 2 Plcs. [.35] Pin F [.080] Ø 0.60 ± 0.05 [.3] Pin E 3.05 [.024 ±.002] 2 Plcs. Pin D 3 Plcs. [.20] Plated Thru Holes [.079] Pin Z Pin Y Pin X Pin W Pin C Pin B 3.0 Pin A [.22] 2 Plcs [.098] [.00] [.26] [.3].75 4 Plcs. [.069] To Board Edge Z-DOK 4 Adapter Connector Part Numbers Recommended PC Board Footprint Type Dim. H Dim. T Sequence Sequence Sequence Sequence Number Number for Utility for Utility for Utility for Utility of Utility of Diff. Pin Loc. Pin Loc. 2 Pin Loc. 3 Pin Loc. 4 Contacts Pairs Part Number Adapter Connector Different Tail Lengths available upon request, contact Tyco Electronics. 6

117 Z-DOK 6 Connector System Host Part Number X Housing Pin B Signal Ground Pin D Pin E [.943] 9.50 [.374] 4.36 [.565] 3 Plcs. [.079] Row D Row B Row A 2.80 [.504].27 [.444] 0.26 [.404] Row F Pin C Pin B Pin E Pin D Pin A Spacing to Adapter Board Connector Pin A Location Pin A Signal Contact Pin F 5.50 ± 0.20 [.60 ±.008] Z-DOK 6 Host Connector Part Numbers Type Dim. H Dim. T Number Number of Utility of Diff. Part Contacts Pairs Number Host Connector Different Tail Lengths available upon request, contact Tyco Electronics. H 2.50 [.098] 2.03 [.080] Utility Contact 2.54 [.00] Plcs. [.069] Recommended PC Board Footprint 3.05 [.20] [.26] To Board Edge.95 [.470].76 [.463] 3.2 [.26] Ø 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes T Plcs. [.22] Pin Z Pin Y Pin X Pin W 4 Z-DOK and Z-DOK Connectors 7

118 Z-DOK 6 Connector System (Continued) Adapter Housing F Section E-E Pin D Pin E Utility Contact Pin B Signal Ground Contact [.094] E E 9.50 [.374] F.0 [.433] 2 Plcs. Pin Z Pin Y Pin X Pin W 2.02 [.473] 2 Plcs. H Plcs. [.533] 2.03 [.080] 3.05 [.20] Pin A Signal Contact Ø 0.60 ± 0.05 [.024 ±.002] Plated Thru Holes [.565] [.470] Section F-F Pin F Pin E Pin D Pin C Pin B [.079] 3 Plcs. T Pin A 2.50 [.098] 2.54 [.00] Plcs. [.069] [.26] To Board Edge 2.86 [.3] 3.0 [.22] 4 Plcs. Recommended PC Board Footprint 8

119 Z-DOK 6 Connector System (Continued) Z-DOK 6 Adapter Connector Part Numbers Type Dim. H Dim. T Sequence Sequence Sequence Sequence Sequence Sequence Number Number for Utility for Utility for Utility for Utility for Utility for Utility of Utility of Diff. Pin Loc. Pin Loc. 2 Pin Loc. 3 Pin Loc. 4 Pin Loc. 5 Pin Loc. 6 Contacts Pairs Part Number Adapter Connector Different Tail Lengths available upon request, contact Tyco Electronics. 4 Z-DOK and Z-DOK Connectors 9

120 Sequencing Chart Alignment Begins 2.3 Fully-Mated Wipe Length Alignment Complete 9.0 ESD or Ground 7.0 Utility Contact Level 4 Power or Ground 5.5 Sig Gnd + Power 4.0 Utility Contact Level 3 Signal 3.0 Utility Contact Level 2 Sensing 2.0 Utility Contact Level ( Fully-Mated Wipe Length based on 5.5mm nominal separation of rows A-A or A-F) 20

121 Z-DOK Connector Sequencing Worksheet The Z-DOK Connector System allows you to choose the sequencing for the utility contacts. This is accomplished placing the desired pin length in each location on the adapter board side connector. The locations for each version; Z-DOK 2, Z-DOK 4, and Z-DOK 6 Connectors are shown below. Using the sequencing chart from page 20, fill in your desired sequence in the location of your choice. Contact your Tyco Electronics representative to have the next dash number on the drawing released. Z-DOK 2 Connector F Pin E Pin D Pin B Signal Ground Contact E E F H Pin A Signal Contact [.32] Z-DOK 4 Connector E Location 2 Sequence F F 2 H Pin D Pin E Pin A Signal Contact 3 4 Location Sequence Pin B Signal Ground Contact E.26 [.443] 4 Z-DOK and Z-DOK Connectors Z-DOK 6 Connector F Pin D Pin E Pin B Signal Ground Contact E E F 2 3 H Pin A Signal Contact [.565] Location Sequence 2

122 Engineering Notes 22

123 Table of Contents High Speed Card Edge Products High Speed Standard Edge Connector SEC-Z Connector High Speed Card Edge Products 23

124 High Speed Standard Edge Connector Product Facts : signal-to-ground ratio Designed for signal transmissions with rise and fall times of 0.5 nanoseconds or greater 40 signal/ground pairs per linear inch Less than 0 picosecond skew Propagation delay is typically 75 picoseconds from motherboard to daughtercard at the top of the connector 43 ohm impedance Multiple simultaneous switching: 7% 0.5 ns; 5% ns High performance maintained when using up to 50% of the ground contacts for power 50 to 30 dual positions (in increments of 0) and 73 dual position High Speed Standard Edge Connectors are the answer for a low cost, one-piece approach to high speed signal transmissions or density requirements. These Tyco Electronics connectors have an upper row of signal contacts on.27 [.050] centerline with a lower row of ground contacts within each circuit cavity. This achieves 0.64 [.025] centerline density in a.27 [.050] centerline connector with 40 signal/ground pairs per linear inch and a : signalto-ground ratio. The staggered contact height also reduces the daughtercard mating force. Board retainers align the connector with the motherboard and retain it for soldering. The use of high temperature tolerant materials ensures that these connectors will withstand various wave and reflow soldering techniques. Tyco Electronics High Speed Standard Edge Connectors are available in sizes of 50 to 30 dual positions (in increments of 0) and a 73 dual position, with solder lead lengths of 2.54 [.00] and 3.8 [.25]. Performance Specifications Contact Current Rating Signal contact ampere max. Ground contact.5 amperes max. Preground contact ampere max. Termination Resistance 20 milliohms max. (initial) 40 milliohms max. (final) Dielectric Withstanding Voltage 500 volts AC min. Insulation Resistance 000 megohms min. Mating Force 2.78 N [0 oz] max. per dual signal/ground contact pair using test blade Durability (Mating Cycles) Tested to 25 cycles with test blade Application Temperature +25 C for 20 seconds max. Operating Temperature Range -55 C to +85 C 24

125 High Speed Standard Edge Connector (Continued).94 Max. [.470] Accepts [ ] Daughtercard Housing [.60.65] Y Z B A Max [.09.] C 8.7 Max. [.75] 2 Plcs [ ] Signal Contacts Ground Contact [ ] J Y Z 3.30 [.30] 3.05 [.20].27 F Spaces at [.050] D 0.8 Virtual Size [.032].27 G Spaces at [.050] E [.35.65] Solder Shield 3.8 Virtual Size [.25].02 [.040] 3.05 [.20].02 [.040] 3.05 [.20] Dimensions No. of Dual Part A B C D E F G H J Positions Number H 3 Plcs [.200] Section Y-Y Section Z-Z 5.08 [.200] 5 High Speed Card Edge Products 25

126 High Speed Standard Edge Connector (Continued).94 Max. [.470] Accepts [ ] Daughtercard Z Y J Y Z B Housing A Max [.09.] 3.30 [.30] 3.05 [.20].27 F Spaces at [.050] D C.27 G Spaces at [.050] E [.60.65] H 3 Plcs. 8.7 Max. [.75] 2 Plcs [ ] [.35.65] Metal Hold-Down 5.08 [.200] Section Y-Y [ ].02 [.040] 3.05 [.20] Signal Contacts Ground Contact.02 [.040] 3.05 [.20] Section Z-Z 5.08 [.200] 3.8 Virtual Size [.25] 0.8 Virtual Size [.032] 26

127 High Speed Standard Edge Connector (Continued) Dimensions No. of Dual Part A B C D E F G H J Positions Number * * *Alternate Pattern Applies. 5 High Speed Card Edge Products 27

128 High Speed Standard Edge Connector (Continued).94 Max. [.470] Accepts [ ] Daughtercard Z Y J Y Z B Housing A Max [.30] 3.05 [.20].27 F Spaces at [.050] D [.09.] [ ] C.27 G Spaces at [.050] E [.60.65] [ ] [.35.65] Solder Shield H Metal Hold-Down 3 Plcs [.200] Section Y-Y [ ].02 [.040] 3.05 [.20] Signal Contacts Ground Contact.02 [.040] 3.05 [.20] Section Z-Z 5.08 [.200] 3.8 Virtual Size [.25] 3.8 Virtual Size [.25] 0.8 Virtual Size [.032] Dimensions No. of Dual Part A B C D E F G H J Positions Number

129 High Speed Standard Edge Connector (Continued) Part Number Dual Positions.94 Max. [.470] Accepts [ ] Daughtercard Z Y [.5.35] Y Z 3.8 Virtual Size [.25] [.29.3] [.5.25].27 7 Spaces at [.050] 0.8 Virtual Size [.032] Housing Max. [2.66] [ ] [.09.] 6.35 [.250] [ ] 2 Spaces at.27 [.050] [.60.65] [.75.95] 2 Plcs. 8.7 Max. [.75] 2 Plcs [ ] 3.8 Virtual Size [.25] [.35.65] Metal Hold-Down 5.08 [.200] Section Y-Y [ ].02 [.040] 3.05 [.20] Signal Contacts Ground Contact.02 [.040] 3.05 [.20] 5.08 [.200] Section Z-Z 5 High Speed Card Edge Products 29

130 SEC-Z Connector Product Facts High density card edge connector for high speed signal applications Used in servers, workstations, high-end PCs Memory Expansion Connector High performance and multiple CPU interface (SPARC, Alpha, AMD) 0.64 [.025] centerline density with.27 [.050] centerline daughtercard allowances High density: 80 lines/inch 00 cycles, min. durability Available in sizes from 240 position to 520 position (40 position increments) Active Part Numbers (additional sizes may be available).57 [.062] thick daughtercard 240 position position position position position [.093] thick daughtercard 480 position Product Specification Electrical Characteristics Crosstalk Less than 200 ps, : signal/ground ratio Current Rating ampere/contact 30 SPARC is a trademark of SPARC International. AMD is a trademark of Advanced Micro Devices, Inc.