PROBE CARD METROLOGY
|
|
|
- Adam Garrison
- 5 years ago
- Views:
Transcription
1 PROBE CARD METROLOGY HIGH TEMPERATURE TESTING OF PROBE CARDS Rod Schwartz VP & Technical Director Integrated Technology Corporation Dan Kosecki VP Software Development Integrated Technology Corporation
2 Purpose To show the effects of temperature on probe card parameters To prove the usefulness of high temperature probe card metrology To highlight some differences in probe card technology & construction
3 Equipment & Samples Probilt PB3500 Probe Card Analyzer with Hot Chuck Option Epoxy Ring Cards 3 Identical Cards J971 Type Designed for High Temperature Form Factor Card Logic Array Membrane Card Logic Array
4 Hot Chuck Block Diagram HPCDA Supply Computer Interface Air Filter & Heater Hot Chuck System Controller Heated Air Control Heated Air Flow Probe Card Hot Chuck
5 Hot Chuck System Controller
6 Heated Measurement Chuck
7 Heated Air Top-Hat
8 Bottom of Top-Hat
9 Top-Hat & Adapter
10 Hot Chuck Specifications Control Point Minimum Temp. Maximum Temp. Control Stability Heated Chuck Room 125 C +/- 1.0 C Heated Air Stream Room 125 C +/- 1.0 C
11 Metrology Environment Heated Air Flow Pogo Pins Pogo Pins Retainer Planarity Adjustors Camera & Optics Heated Chuck Heater Strips & Thermal Barrier X,Y,Z Stage Subchuck
12 Providing Leading Edge Technology to Meet Your Future Requirements Today Probe Card Construction PCB PCB Aperture Ring Aperture Ring Epoxy Probe Probe Tip Depth PC Botto Surfa Probe Details Ring Highest Probe Lowest Probe Probe Wire Diameter Epoxy Planarity Tip Length Epoxy Clearance Tip Diameter Tip Shape Flat E-tip (Radiused) Figure 3: PCB and Epoxy Ring Assembly
13 Probe Ring
14 Large Ceramic Probe Ring
15 Large Array on Probe Card
16 Cross Section View CHUCK TEMP. 25 C 25 C 60 C 120 C 80 C 10 mils 1000 mils 1004 mils
17 Pitch Change with Temp CHUCK TEMP 25 C 120 C 70 u 80 u
18 Alignment Shifts (3 Cards) Averages of 6 groups of 5 probes 3 groups each side, evenly spaced Boxes represent +/- 5 microns movement Lines represent direction and magnitude of movement (25 C C to 125 C) The + is 25 C C location #11-Red, #12-Blue, #14-Green Repeatability of multiple runs affected by stabilization time
19 Epoxy Ring Probe Card
20 Epoxy Card Array X,Y Pad Coordinates Y (microns) X (microns)
21 Alignment Shift (Epoxy Card) *Box = +/- 10u *The + in center of box is 25 C location *Each line is 5 probe average *Card 11 Red *Card 12 Blue *Card 13 Green *Length of line represents the shift in position from 25 C to 125 C.
22 Other Shifts (Epoxy Card) Parameter Card 11 Card 12 Card 14 Z Shift -221 u -147 u -148 u Planar 55u (25) 58u (25) 30u (25) Window 50u (125) 54u (125) 33u (125) Leakage 6-10 ua 6-9 ua 6-10 ua Increase
23 Memory Card Probes at 25, 36, 70 & 90 C Probes Movement with Temperature 15 Yoffset (microns) Series1 Series2 Series3-10 Xoffset (microns)
24 Form Factor Micro Spring MLC Connections Space Transformer Micro-Spring Contact Paddle Truncated Pyramid Probe Tip
25 Form Factor Probe Card
26 Form Factor Array X,Y Pad Coordinates Y (microns) X (microns)
27 Alignment Shifts (FFI) *Box = +/- 10u *The + in center of box is 25 C location *Each line is a single probe *Length of line represents the shift in position from 25 C to 125 C.
28 Other Shifts (FFI) Parameter FFI Card Value Z Shift -160 microns Planar Window Leakage Increase 36 microns (25 C) 48 microns (125 C) 0.4 to 0.6 ua
29 Form Factor Results Fairly predictable results Larger shift than epoxy ring Not as consistent as expected Data on only one card should not be taken as representative of type
30 Membrane Probe Head Window (opt) Springs Probe Frame PCB Membrane Plunger Bumps
31 Membrane Array X,Y Pad Coordinates Y (microns) X (microns)
32 Alignment Shifts (Membrane) *Box = +/- 10u *The + in center of box is 25 C location *Each line is a single probe *Length of line represents the shift in position from 25 C to 100 C.
33 Other Shifts (Membrane) Parameter FFI Card Value Z Shift -145 microns Planar Window Leakage Increase 72 microns (25 C) 71 microns (100 C) Not Run
34 Membrane Results Mylar expands and probes move a lot Very well behaved predictable results More temperature sensitive than other technologies Requires card to be designed for temperature of use
35 Cobra Probe Card
36 Cobra Head Cross Section Metalization Space Transformer Upper Die Mylar Lower Die "Cobra" Probe Needle
37 Cobra Considerations Lower die is close to wafer Heats up considerably Test time vs. Index Time changes heating Mylar insulator may move Probe stresses
38 Conclusions Probe movement for most technologies with temperature is NOT predictable, but it IS repeatable Epoxy card construction techniques can make a significant difference in temperature performance FFI cards are more predictable than epoxy, but there are still variations
39 Conclusions (2) Membrane card is the most predictable Membrane card has largest shifts with temperature
40 Future Studies Other Probe Card Technologies Scrub Mark vs. Analyzer Data Probe Material Variations Card Construction Techniques Path of Probe Movement vs. Temperature Change Stabilization Times vs. Repeatability
41 Acknowledgements Bill Williams Motorola Thanks for supplying cards for this study. Russ Allred - ITC Data Collection Hoa Do Thai - ITC Data Collection
Application Note. Pyramid Probe Cards
Application Note Pyramid Probe Cards Innovating Test Technologies Pyramid Probe Technology Benefits Design for Test Internal pads, bumps, and arrays High signal integrity Rf and DC on same probe card Small
Advances in Probe Card Analyzers
Providing Leading Edge Technology to Meet Your Future Requirements Advances in Probe Card Analyzers Test and Maintenance of Very High Pin Count Cards Rod Schwartz VP & Technical Director Integrated Technology
Introduction to Wafer Level Burn-In. William R. Mann General Chairman Southwest Test Workshop
Introduction to Wafer Level Burn-In William R. Mann General Chairman Southwest Test Workshop Outline Conventional Burn In and Problems Wafer Level BI Driving Factors Initial Die Level BI Technical Challenges
High and Low Temperature Wafer Probing Challenges
High and Low Temperature Wafer Probing Challenges Presenters: Authors: Wei Liang Sio Emanuele Bertarelli Yah Ean Koh Overview Motivation Probing challenges at high/low temperatures Production probing issues
Wafer Probe card solutions
Wafer Probe card solutions Innovative Solutions to Test Chips in the Semiconductor Industry Our long term experience in the electronic industry and our strong developing and process teams are inspired
Wafer Probe card solutions
Wafer Probe card solutions Innovative Solutions to Test Chips in the Semiconductor Industry Our long term experience in the electronic industry and our strong developing and process teams are inspired
Katana RFx: A New Technology for Testing High Speed RF Applications Within TI
Katana RFx: A New Technology for Testing High Speed RF Applications Within TI Compan Logo Probe Test Solutions Manager Overview Introduction Objectives Procedures Results Summary Follow-On Work 2 Introduction
Krzysztof Dabrowiecki, Probe2000 Inc Southwest Test Conference, San Diego, CA June 08, 2004
Structural stability of shelf probe cards Krzysztof Dabrowiecki, Probe2000 Inc Southwest Test Conference, San Diego, CA June 08, 2004 Presentation Outline Introduction Objectives Multi die applications
Advance Low Force Probe cards Used on Solder Flip Chip Devices. Daniel Stillman Texas Instruments Kevin Hughes FormFactor
Advance Low Force Probe cards Used on Solder Flip Chip Devices Daniel Stillman Texas Instruments Kevin Hughes FormFactor Overview Probe Solution Requirements Material Properties and Performance Production
Review of New, Flexible MEMS Technology to Reduce Cost of Test for Multi-site Wire Bond Applications
Review of New, Flexible MEMS Technology to Reduce Cost of Test for Multi-site Wire Bond Applications Dan Stillman Texas Instruments Ben Eldridge FormFactor Overview Project Background & Objective Probe
3D profiler for contactless probe card inspection. Rob Marcelis
3D profiler for contactless probe card inspection Rob Marcelis 1 Content Introduction Objectives Challenges Basics DOE Results Data transformation Advantages/disadvantages Summary conclusions Follow up
High Parallelism Memory Test Advances based on MicroSpring Contact Technology
High Parallelism Memory Test Advances based on MicroSpring Contact Technology Thomas Homorodi- Director of Marketing Robert Martin Technical Sales Eng. Southwest Test Workshop June 2001 Contents Introduction
Low Force MEMS Probe Solution for Full Wafer Single Touch Test
Matt Losey Yohannes Desta Melvin Khoo Lakshmikanth Namburi Georg Aigeldinger Touchdown Technologies Low Force MEMS Probe Solution for Full Wafer Single Touch Test June 6 to 9, 2010 San Diego, CA USA Towards
Rolling Up Solutions of Wafer Probing Technologies Joey Wu
Rolling Up Solutions of Wafer Probing Technologies Joey Wu Manager, Global Marketing Drivers of Semiconductor Industry Source: Yole, 2016 Source: Yole, 2016 Source: Yole, 2016 Source: Yole, 2016 Form-factor
MPI TS2500-RF 200 mm Fully Automated Probe System For RF Production Test Measurements
MPI TS2500-RF 200 mm Fully Automated Probe System For RF Production Test Measurements FEATURES / BENEFITS Designed for Wide Variety of RF On-Wafer Production Applications RF applications up to 67 GHz &
Probe station system
Probe station system Manufacturer: Micromanipulator Mode: 450PM-HR Descriptions: The Model 450PM 8 probe station offers stable and reliable probing performance. It is based on a design of Micromanipulator
Future Trends One Mann s Opinion
Future Trends One Mann s Opinion Bill Mann General Chair - SWTW Southwest Test Workshop Newport Beach, CA 92663 949-645-3294 william.mann@ieee.org Future Trends One Mann s Opinion Relative Reduction in
MPI TS150-THZ 150 mm Manual Probe System
MPI TS150-THZ 150 mm Manual Probe System Industry s first explicitly designed probe system for accurate measurements at mm-wave and sub-mm wave (THz) frequency range FEATURES / BENEFITS Variety of Applications
Key Considerations to Probe Cu Pillars in High Volume Production
Key Considerations to Probe Cu Pillars in High Volume Production Alexander Wittig (GLOBALFOUNDRIES) Amy Leong, Tin Nguyen, Tommaso Masi, Jarek Kister, Mike Slessor (Form Factor) Overview Key Industry Trends
Novel Precision Probe Array for Wafer Level Final Test of WLCSP Jathan Edwards
Novel Precision Probe Array for Wafer Level Final Test of WLCSP Johnstech International Presentation Outline Introduction to IQtouch Micro Final Test Probe Arrays for 300 500 micron pitch WLCSP Compare/contrast
Using MLOs to Build Vertical Technology Space Transformers
Presentation to Southwest Test Workshop 2002 Using MLOs to Build Vertical Technology Space Transformers Bill Fulton and Bill Pardee Wentworth Laboratories Overview 1. Terminology 2. Benefits of MLOs vs
Direct Attach ViProbe Series Probe Cards for Wafer Test
Direct Attach ViProbe Series Probe Cards for Wafer Test Probe Cards Direct Attach ViProbe Series FEINMETALL Direct Attach ViProbe Series represents a technology in advanced wafer probing. Our Direct Attach
MPI TS150-AIT 150 mm Manual Probe System
MPI TS150-AIT 150 mm Manual Probe System Industry s first explicitly designed 150 mm probe system providing accurate tests for mm-wave, THz, and automated impedance tuner applications FEATURES / BENEFITS
Measuring Z-stage accuracy using a force sensor
Measuring Z-stage accuracy using a force sensor Sancho Adam Southwest Test Conference June 2007 Contents Introduction / Background Objectives / Goals Methods / Materials / Procedures Results / Relevant
Spring Loaded Contacts
Spring Loaded Contacts Spring Probes ATE Test Probes Slim probes for automated testing Harwin supply a variety of Spring Probes, suitable for use on manual test jigs and automatic test equipment (ATE)
A Test-Setup for Probe-Card Characterization
Contents A test-setup for probe card characterization under Background production-like / Motivation operating conditions Third level 16pt Fourth level 14pt Michael Horn, Stephan Fuchs» Fifth level 12pt
Test and Measurement Challenges for 3D IC Development. R. Robertazzi IBM Research
Test and Measurement Challenges for 3D IC Development R. Robertazzi IBM Research PFA Bill Price. Pete Sorce. John Ott. David Abraham. Pavan Samudrala Digital Test Kevin Stawaisz. TEL P12 Prober Glen Lansman,
High Current Wafer Probing Solution
High Current Wafer Probing Solution Mark McLaren, Director of Sales and Marketing. Integrated Technology Corporation TEL: 480-968-3459, X365 Email: markm@inttechcorp.com PRODUCTIVITY SOLUTIONS FOR PROBE
Akrometrix Testing Applications
Akrometrix Optical Techniques: Akrometrix Testing Applications Three full-field optical techniques, shadow moiré, digital image correlation (DIC), and fringe projection (performed by the DFP) are used
Verification of Singulated HBM2 stacks with Die Level Handler. Dave Armstrong Toshiyuki Kiyokawa Quay Nhin
Verification of Singulated HBM2 stacks with Die Level Handler Dave Armstrong Toshiyuki Kiyokawa Quay Nhin Abstract Background only will delete on final material High-Bandwidth-Memory continues to evolve
MPI TS150-HP 150 mm High Power Manual Probe System For accurate High Power measurements up to 10 kv, 600 A
MPI TS15-HP 15 mm High Power Manual Probe System For accurate High Power measurements up to 1 kv, 6 A FEATURES / BENEFITS Universal Use Designed specifically for high power device measurement and wide
Products, Services & Capabilities
Products, Services & Capabilities Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: info@ironwoodelectronics.com Overview Company Overview Founded 1986 Over 5,000 products
Effects of Pad Structure on the Scrub Performance of MEMS Probes for Memory Devices Aaron Woodard
Effects of Pad Structure on the Scrub Performance of MEMS Probes for Memory Devices Aaron Micron Technology, Inc Outline Background / Trends / Test Requirements Experiment Design Results What Ifs Summary
Package (1C) Young Won Lim 3/20/13
Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published
An Introduction To Area Array Probing
An Introduction To Area Array Probing Fred Taber IBM Corporation 1998 Southwest Test WorkShop 1 Topics: Introduction & Background Considerations & Experiences Q & A 2 Introduction & Background Vertical
There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous parts to build complex systems.
Direct Connection and Testing of TSV and Microbump Devices using NanoPierce Contactor for 3D-IC Integration There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous
LQFP. Thermal Resistance. Body Size (mm) Pkg. 32 ld 7 x 7 5 x ld 7 x 7 5 x ld 14 x 14 8 x ld 20 x x 8.5
LQFP Low Profile Quad Flat Pack Packages (LQFP) Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. These packages
Reinforcement of PCB using Advanced Stiffeners for High Pin Count Devices
Nicolas SALLES (SV Probe) Rehan Kazmi, PhD (SV Probe) Wayne Nelson (Reid-Ashman Manufacturing) Reinforcement of PCB using Advanced Stiffeners for High Pin Count Devices 2007 San Diego, CA USA Overview
Advanced CSP & Turnkey Solutions. Fumio Ohyama Tera Probe, Inc.
Advanced CSP & Turnkey Solutions Fumio Ohyama Tera Probe, Inc. Tera Probe - Corporate Overview 1. Company : Tera Probe, Inc. 2. Founded : August, 2005 3. Capital : Approx. USD118.2 million (as of March
Multi Level Stacked Socket Challenges & Solutions
Multi Level Stacked Socket Challenges & Solutions Mike Fedde, Ranjit Patil, Ila Pal & Vinayak Panavala Ironwood Electronics 2010 BiTS Workshop March 7-10, 2010 Content Introduction Multi Level IC Configuration
Automotive Electronics Council Component Technical Committee
ATTACHMENT 6 AEC - Q100-006 REV-D ELECTRO-THERMALLY INDUCED PARASITIC GATE LEAKAGE TEST (GL) Acknowledgment Any document involving a complex technology brings together experience and skills from many sources.
Package (1C) Young Won Lim 3/13/13
Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published
P recise Eye. High resolution, diffraction-limited f/4.5 optical quality for high precision measurement and inspection.
High resolution, diffraction-limited f/4.5 optical quality for high precision measurement and inspection. Long working distance makes lighting and handling easier. Compact size. Coaxial lighting available
HIGH VALUE MANUAL 6 to 8 Wafer Probe Station
ΨProbing Solutions, Inc 400LS / 410LS HIGH VALUE MANUAL 6 to 8 Wafer Probe Station The PSI 400LS / 410LS Manual Wafer Probe Station is a powerful, yet economical 6 / 8 easy to use an analytical wafer probe
Panel Discussion Chair: Michael Huebner
Panel Discussion Chair: Michael Huebner FormFactor Inc. Panel members Panel Discussion Mark Ojeda (Spansion/Cypress) Panel: I/II Rey Rincon (Freescale) Panel: II Al Wegleitner (TI) Panel: I/II Clark Liu
Functional Testing of 0.3mm pitch Wafer Level Packages to Multi- GHz Speed made possible by Innovative Socket Technology
Functional Testing of 0.3mm pitch Wafer Level Packages to Multi- GHz Speed made possible by Innovative Socket Technology Ila Pal - Ironwood Electronics Introduction Today s electronic packages have high
Autonomous RF Measurement assistant
Autonomous RF Measurement assistant Gavin Fisher Applications Specialist Customer Application & Product Solutions Why is Device Modeling Critical DEVICE MODELING N+? IC Design IC Fabrication PDK Process
M20 and M22. (2.54mm and 2.00mm pitch)
M20 and M22 (2.54mm and 2.00mm pitch) M20 and M22 Connectors Great Design Flexibility Today s electronics and PCB designers are faced with many connector challenges, including applications with increased
These devices require adequately trained and experienced operating personnel.
MMA, 2014 PI Ceramic GmbH PD410 Circular PICMA Bender Piezo Actuators Figure 1: Circular PICMA bender actuator (here: PD410.10) INFORMATION Before soldering, installing and operating the actuator, read
Packaging for parallel optical interconnects with on-chip optical access
Packaging for parallel optical interconnects with on-chip optical access I. INTRODUCTION Parallel optical interconnects requires the integration of lasers and detectors directly on the CMOS chip. In the
About the Instructor
About the Instructor Kwang-Ting (Tim) Cheng PhD, 1988, Univ. of California, Berkeley 1988-1993: AT&T Bell Labs 1993-Present: Professor, Dept. of ECE, Univ. of California, Santa Barbara 1999-2002: Director,
Amphe-Lite Series contacts, sealing plugs, plastic dust caps
contacts, sealing plugs, plastic dust caps STANDARD CONTACTS FOR AMPHE-LITE SERIES Pin Socket 8 (Coax) 21-33102-21 21-33101-21 8 (Twinax) 21-33190-529 21-33191-530 10 (Power) 10-251415-105 10-407035-105
MAXIMUM SOLUTIONS. New Low Profile Target Connectors
MAXIMUM SOLUTIONS New Low Profile Target Connectors Mill-Max is excited to announce the release of our lowest profile target connectors with an above board height of only (2,21mm). Target connectors are
Update: Lambda project
Update: Lambda project Sabine Lange Detector Group DESY meeting, May 29-31, 2012 s1 Lambda project About Lambda: 2 x 6 3 chips (~28 x 85mm) high frame rate (8 read out lines, 2kHz readout) 10 gigabit Ethernet
ACCURACY, SPEED, RELIABILITY. Turnkey Production for: MEMS. Multi-Chip Modules. Semiconductor Packaging. Microwave Modules.
>> Turnkey Production for: MEMS Multi-Chip Modules Semiconductor Packaging Microwave Modules Flip Chip Photonics Packaging ACCURACY, SPEED, RELIABILITY ULTRA-PRECISION ASSEMBLY WORK CELL Turnkey production
Analysis of probe C.C.C. according to temperature and evaluation method Sanghun Shin, Seongyeon Wi, Yonggeon Shin, Wonha Jeon
Analysis of probe C.C.C. according to temperature and evaluation method Sanghun Shin, Seongyeon Wi, Yonggeon Shin, Wonha Jeon Willtechnology Co., Ltd. Overview Background Evaluation method Evaluation results
Socket Technologies
Socket Technologies Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: info@ironwoodelectronics.com Introduction Company Overview Over 5,000 products High Performance Adapters
IT3D(M)-300S-BGA (37) Lead-Free THERMAL CYCLING TEST REPORT
TR066E-018 ITD(M)-00S-BGA (7) Lead-Free THERMAL CYCLING TEST REPORT - Post 6000 Cycles Report - APPROVED TY.ARAI Nov. 18, 009 CHECKED TM.MATSUO Nov. 17, 009 CHARGED TY.TAKADA Nov. 17, 009 HIROSE ELECTRIC
Rigid/Bus Bars. Standard Copper Rigid / Bus. PC Board Stiffeners and Current Carrying Busses. Table of Contents. Benefits
Rigid/Bus Bars Circuit Components Inc. PC Board Stiffeners and Current Carrying Busses Table of Contents Standard Copper Rigid Bus Benefits...1 Part Specifications..2 Part Drawings.3 Snap-In Board Stiffener
,M,R,!iilll""M,:3 MEMS. ~ IliJctanill:5 Pac~ RSI. YSTEMS
,M,R,!iilll""M,:3 U!i!.,TIRAw.'";P,RElCISIONI,F'LEXIBLE W,I!:IIR:I;C,ICELL, MEMS ~ IliJctanill:5 Pac~.... RSI. YSTEMS ULTRA-PRECISION flexible ASSEMBLY WORK CELL Turnkey production for: MEMS Multi-Chip
HCI Power Connector System
1 of 28 C Section TABLE OF CONTENTS page no. 1. OBJECTIVE... 1 2. SCOPE... 2 3. DRAWINGS AND APPLICABLE DOCUMENTS... 4 4. GENERAL CUSTOMER INFORMATION... 4 4.1 PRODUCT APPLICATION... 4 4.2 COMPATIBILITY...
WHICH SIDE ARE YOU ON? DOUBLE SIDED PROBING
WHICH SIDE ARE YOU ON? DOUBLE SIDED PROBING Traditionally, devices with active regions on both sides of a wafer were limited to discrete devices. With advances in materials, functionality and packaging,
Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing
Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing Bassam Dabit FAB18 Test Process Integration Trung Nguyen CTM Test Process Integration Intel Corporation 06/06/2005 Introduction Motivation
Probe Card Metrology. Challenges and Solutions. Jim Powell, Applications Engineer Rudolph Technologies
Probe Card Metrology Challenges and Solutions Jim Powell, Applications Engineer Rudolph Technologies Agenda 1. Overview 2. Cost of Ownership 3. Probe Card Metrology 4. Top Challenges 5. Probe Card Circuit
I N T E R C O N N E C T A P P L I C A T I O N N O T E. Z-PACK TinMan Connector Routing. Report # 27GC001-1 May 9 th, 2007 v1.0
I N T E R C O N N E C T A P P L I C A T I O N N O T E Z-PACK TinMan Connector Routing Report # 27GC001-1 May 9 th, 2007 v1.0 Z-PACK TinMan Connectors Copyright 2007 Tyco Electronics Corporation, Harrisburg,
MPI TS2000-HP 200 mm Automated Probe System For accurate and reliable High Power measurements
MPI TS2000-HP 200 mm Automated Probe System For accurate and reliable High Power measurements FEATURES / BENEFITS Dedicated designed for High Voltage and High Current application On wafer high power device
Spring Probes and Probe Cards for Wafer-Level Test. Jim Brandes Multitest. A Comparison of Probe Solutions for an RF WLCSP Product
AND, AT THE WAFER LEVEL For many in the industry, performing final test at the wafer level is still a novel idea. While providing some much needed solutions, it also comes with its own set of challenges.
Achieving GHz Speed in Socketed BGA Devices
IC INTERCONNECT TOPIC #102 Technical Information from Ironwood Electronics Achieving GHz Speed in Socketed BGA Devices Ila Pal Director of R&D Ironwood Electronics Background For many products designed
ishell Design Review Cryostat & Optics Bench Dan Kokubun 9/11/2013
ishell Design Review Cryostat & Optics Bench Dan Kokubun 9/11/2013 Overview Overview Estimated Weight: 1040 lbs CG: within 2 of optical axis Helium lines run eastward Hall Effect box placement TBD Overview
TS1000T Ceramic Evaluation Board (CEB1000_1)
TS1000T Ceramic Evaluation Board (CEB1000_1) These ceramic evaluation boards for the high-temperature TS1000T-series accelerometers are optimized evaluation boards designed to allow users to quickly and
MPI TS2000-HP 200 mm Automated Probe System For accurate and reliable High Power measurements
MPI TS2-HP 2 mm Automated Probe System For accurate and reliable High Power measurements FEATURES / BENEFITS Dedicated designed for High Voltage and High Current application On wafer high power device
AMS Hardware QA Report
AMS Hardware QA Report ECE 492 Spring 2014 Latest Revision: 18 April 2014 Prepared by: Ben Richards Abstract This document details the Quality Assurance Test procedure for the 2014 LFEV- ESCM AMS subsystem.
Motorola Wafer Level Burn-in and Test
Motorola Wafer Level Burn-in and Test 00 Southwest Test Workshop Teresa McKenzie, Wafer Level Burn In Engineer Motorola (T.McKenzie@motorola.com) 6501 William Cannon Drive West; Austin, Texas 78735; 51-895-486
Automating Thermal Stress Reflow Simulation on PCBs
Automating Thermal Stress Reflow Simulation on PCBs Introduction The purpose of this paper is to demonstrate the reflow process of thermal stress reflow simulation on bare PCB s per IPC-TM-650 Test Method
Mac mini Mid 2010 IR Sensor Replacement
Replace a broken IR sensor/sleep LED. Written By: Andrew Bookholt ifixit CC BY-NC-SA www.ifixit.com Page 1 of 18 INTRODUCTION Use this guide to replace your mini's IR sensor/sleep LED assembly. Replacing
200 mm Semi-automated Probe System with BlueRay Technology
PA200BlueRay 200 mm Semi-automated Probe System with BlueRay Technology DATA SHEET The sets a new standard for high-speed accuracy. Its precision ensures smooth probe landing with safe, repeatable electrical
Quectel Cellular Engine
Cellular Engine Hand Soldering LGA Module User Guide Hand_Soldering_LGA_Module_User_Guide_V1.0 Hand_Soldering_LGA_Module_User_Guide_V1.0-0 - Document Title Hand Soldering LGA Module User Guide Revision
SCT500D Twin SMD Ceramic PTC Thermistor
Desciption The component consists of two high-performance ceramic PTCs mounted in a lead-frame for (SMD) direct soldering onto a printed-circuit board (PCB) or substrate. The ceramic PTCs are soldered
Renishaw touch-trigger probing technology. Rugged and flexible solutions for discrete point measurement on CMMs
Renishaw touch-trigger probing technology Rugged and flexible solutions for discrete point measurement on CMMs Touch-trigger probe technologies Resistive Simple Compact Rugged Strain-gauge Solid-state
Non-contact Test at Advanced Process Nodes
Chris Sellathamby, J. Hintzke, B. Moore, S. Slupsky Scanimetrics Inc. Non-contact Test at Advanced Process Nodes June 8-11, 8 2008 San Diego, CA USA Overview Advanced CMOS nodes are a challenge for wafer
Leveraging Multiprobe Probe Card learnings to help Standardize and improve Parametric and WLR Testing
Leveraging Multiprobe Probe Card learnings to help Standardize and improve Parametric and WLR Testing Company Logo Brandon Mair Dawn Copeland Teas Instruments Agenda Introduction Overview Similarities
28F K (256K x 8) FLASH MEMORY
28F020 2048K (256K x 8) FLASH MEMOR SmartDie Product Specification Flash Electrical Chip Erase 2 Second Typical Chip Erase Quick-Pulse Programming Algorithm 10 ms Typical Byte Program 4 Second Chip Program
DEI1600 SURGE BLOCKING MODULE (SBM)
Device Engineering Incorporated 385 East Alamo Drive Chandler, AZ 855 Phone: (480) 303-08 Fax: (480) 303-084 E-mail: admin@deiaz.com DEI1600 SURGE BLOCKING MODULE (SBM) FEATURES 1600V bidirectional surge
1551 S. Harris Court,. Anaheim, CA Phone: Fax:
1551 S. Harris Court,. Anaheim, CA 92806 Phone: 714.978.1551... Fax: 714.978.0431 Model 7300C Series: Single Head Die Bonders, Manual X-Y-Z Last revised: 09/19/18 - microscope Series Overview Application
Mounting Instructions for MTP Modules
VISHAY SEMICONDUCTORS www.vishay.com Modules By Kevin Liu This application note introduces Vishay s MTP rectifier-switch modules and discusses the assembly and PCB issues involved in their use. MTP modules
Stacked Silicon Interconnect Technology (SSIT)
Stacked Silicon Interconnect Technology (SSIT) Suresh Ramalingam Xilinx Inc. MEPTEC, January 12, 2011 Agenda Background and Motivation Stacked Silicon Interconnect Technology Summary Background and Motivation
Burn-in & Test Socket Workshop
Burn-in & Test Socket Workshop IEEE March 4-7, 2001 Hilton Mesa Pavilion Hotel Mesa, Arizona IEEE COMPUTER SOCIETY Sponsored By The IEEE Computer Society Test Technology Technical Council COPYRIGHT NOTICE
TSV Test. Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea
TSV Test Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea # Agenda TSV Test Issues Reliability and Burn-in High Frequency Test at Probe (HFTAP) TSV Probing Issues DFT Opportunities
Scanning Acoustic Microscopy For Metrology of 3D Interconnect Bonded Wafers
Scanning Acoustic Microscopy For Metrology of 3D Interconnect Bonded Wafers Jim McKeon, Ph.D. - Sonix, Director of Technology Sriram Gopalan, Ph.D. - Sonix, Technology Engineer 8700 Morrissette Drive 8700
Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]
![Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]](/thumbs/78/78371092.jpg "Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]")
Area Array Probe Card Interposer Raphael Robertazzi IBM Research 6/4/01 6/4/01 IBM RESEARCH Page [1] Motivation: Outline Probe Cards for Testing Complex ICs in the Developmental Stage. Hand Wired Space
Socket Mounting Recommendations and Reflow Profile
Purpose This document is meant to serve as a guide for mounting E-tec surface mount device (SMD) sockets to the printed circuit board (PCB). The recommendations described here are guidelines only, and
1551 S. Harris Court,. Anaheim, CA Phone: Fax:
1551 S. Harris Court,. Anaheim, CA 92806 Phone: 714.978.1551... Fax: 714.978.0431 Model 4KE / 4KEH Series: Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball- Wedge Triple-Convertible Wire Bonders Last
Application Note 5363
Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry
Photonics Integration in Si P Platform May 27 th Fiber to the Chip
Photonics Integration in Si P Platform May 27 th 2014 Fiber to the Chip Overview Introduction & Goal of Silicon Photonics Silicon Photonics Technology Wafer Level Optical Test Integration with Electronics
Probe Tips and Probe Holders Reference Manual
Probe Tips and Probe Holders Reference Manual 1555 Forrest Way Tel: 775-882-2400 Carson City, Nevada 89706-0316 Tel: 800-654-5659 E-Mail: sales@micromanipulator.com Fax: 775-882-7694 http://www.micromanipulator.com
PCB plug-in connectors on a new scale
PCB plug-in connectors on a new scale SKEDD direct plug technology revolutionises connection technology Pressfitting, wave soldering, THR soldering, and SMD soldering are all well-established processes
Application Note AN-1028 Design, Integration and Rework Guidelines for BGA and LGA Packages
Application Note AN-1028 Design, Integration and Rework Guidelines for BGA and LGA Packages Table of Contents Page Design considerations...2 Substrate...2 PCB layout...2 Solder mask openings...3 Terminations...4
Reflowing Xbox 360 Motherboard
Reflowing Xbox 360 Motherboard Reflow the solder on your Xbox 360's motherboard. Written By: Andrew Bookholt ifixit CC BY-NC-SA www.ifixit.com Page 1 of 31 INTRODUCTION Use this guide to reflow the solder
TGL2206-SM GHz 100 Watt VPIN Limiter
Applications Receive Chain Protection Commercial and Military Radar 5 mm x 5 mm QFN Package Product Features Functional Block Diagram Frequency Range: 2.0 to 5.5 GHz Insertion Loss: < 1.0 db Peak Power
Packaging of Selected Advanced Logic in 2x and 1x nodes. 1 I TechInsights
Packaging of Selected Advanced Logic in 2x and 1x nodes 1 I TechInsights Logic: LOGIC: Packaging of Selected Advanced Devices in 2x and 1x nodes Xilinx-Kintex 7XC 7 XC7K325T TSMC 28 nm HPL HKMG planar