A Test-Setup for Probe-Card Characterization
|
|
|
- Sabrina Thornton
- 5 years ago
- Views:
Transcription
1 Contents A test-setup for probe card characterization under Background production-like / Motivation operating conditions Third level 16pt Fourth level 14pt Michael Horn, Stephan Fuchs» Fifth level 12pt Infineon Technologies - Munich / Germany Page 1 Presentation for SWTW 2004
2 Outline Background / Motivation Test Concept Requirements Test Setup Probe-Card Measurement Results Summary Page 2
3 Background strong need for probe card evaluation process for: new probing technologies ( pad arrangements, pitch, multi DUT) new products: (materials, BEOL-stack) short time-to-market prohibits iterative improvement process evaluation process needs to start earlier missing links in the evaluation process: reliable prediction of c res performance c res stability under manufacturing conditions Page 3
4 Probe-Card Evaluation - IDEAL flow New Wfr. Process or Product Requirements Test- Setup blank wfr (alu...) Probe-Card Tester Test Program Test-/Product Wfrs. Probe-Card Tester Test Program Product Wfrs. Probe-Card New Probing Requirements PC Characterization Early Life Qualification Production Evaluation Production Release Specification Qual d Technologies Preferred Vendors Contact Stability Cleaning Recipe PC Planarity Prober Alignment Measurement - Stability Scrub Analysis incoming QC Yield Stability Cleaning Freq. Handling Issues Page 4
5 Test Concept - Requirements test scenario as close as possible to real probing conditions force current through contacts probing parameter variation temperature overdrive chuck-speed high number of Touch-Downs different contact materials Evaluation should be possible w/o specific product or test-chip amount of test-chip and/or product wfrs limited product schedule can be shifted low cost & flexible setup use existing equipment & h/w (but no tester) flexible channel assignment (Vcc, GND) Page 5
6 Test Setup- Overview 1/2 Multimeter Pwr. Supply V Personal Computer Parallel Port GPIB Interface Board Pogo Tower Probe Card Prober Page 6
7 Test Setup- Overview 2/2 Interface Board Page 7
8 Test-Setup Main Features Wafer handling: (w/ Prober-Interface Docking Unit) TSK APM 90 (available prober) Nr. of measurement channels: 128 flexible channel assignment of probe contact to Vdd or Gnd via GUI Current per needle: Repeatability (σ): Data Output: 0,1-200 ma ca. 1,4 mω ASCII format Page 8 number channel X-coordinate Y-coordinate comment DAISYDAISYDAISYDAISYDAISYDAISYDAISY VCC / GND GND VCC GND VCC GND VCC GND touchdown X Y X_abs Y_abs Example Result File
9 .. A Test-Setup for Probe-Card Characterization Test Sequence 1/ Unactivated State Probe-Card Aging State Page 9 3. Measurement State
10 Test Sequence 2/2 Power Supply on off Chuck up down t Multimeter Needle# Page 10
11 Test Setup- User Interface 1/ Page 11
12 Test Setup- User Interface 2/2 Mapping of Pins to Vdd and Gnd Page 12
![.05.04 Page 13 A Test-Setup for Probe-Card Characterization Measurement Results 1/3 cres [Ohm] Comparison of c Res for different Probing Technologies (@100mA, 90 C) 6 5](/docs-images/86/94123106/images/13-1.jpg "Probe-Card A Probe-Card B Probe-Card C cres [Ohm] 2.0 4 1.5 3 1.0 2 0.5 1 0 1177 2353 3529 4705 5881 7057 8233 9409 10585 11761 12937 14113 15289 16465 17641 18817 19993 Nr.")
13 Page 13 A Test-Setup for Probe-Card Characterization Measurement Results 1/3 cres [Ohm] Comparison of c Res for different Probing Technologies (@100mA, 90 C) 6 5 Probe-Card A Probe-Card B Probe-Card C cres [Ohm] Nr. Touch-Downs
14 Measurement Results 2/ Page 14
15 Measurement Results 3/3 cres starts to increase Page 15
16 Summary test-setup can identify contact-resistance issues better than using a product (no interpretation of test-data required) test setup enables us to assess performance trend of Probe-Cards in an early project phase less resources required during evaluation phase (ATE resources and test code development resources) Page 16
An Advanced Wafer Probing Characterization Tool for Low CRes at High Current Dr.-Ing. Oliver Nagler Francesco Barbon, Dr.
An Advanced Wafer Probing Characterization Tool for Low CRes at High Current Dr.-Ing. Francesco Barbon, Dr. Christian Degen Infineon Technologies AG, Germany Dep. of Test Technology & Innovation Overview
High Parallelism Memory Test Advances based on MicroSpring Contact Technology
High Parallelism Memory Test Advances based on MicroSpring Contact Technology Thomas Homorodi- Director of Marketing Robert Martin Technical Sales Eng. Southwest Test Workshop June 2001 Contents Introduction
Review of New, Flexible MEMS Technology to Reduce Cost of Test for Multi-site Wire Bond Applications
Review of New, Flexible MEMS Technology to Reduce Cost of Test for Multi-site Wire Bond Applications Dan Stillman Texas Instruments Ben Eldridge FormFactor Overview Project Background & Objective Probe
Real Time Contact Resistance Measurement & Control. Tony Schmitz Erwin Barret
Real Time Contact Resistance Measurement & Control Tony Schmitz Erwin Barret Introduction Agenda Why is CRES control important? Objectives of Real Time Method Offline Method Limitations & Goals of Real
Advance Low Force Probe cards Used on Solder Flip Chip Devices. Daniel Stillman Texas Instruments Kevin Hughes FormFactor
Advance Low Force Probe cards Used on Solder Flip Chip Devices Daniel Stillman Texas Instruments Kevin Hughes FormFactor Overview Probe Solution Requirements Material Properties and Performance Production
Application Note. Pyramid Probe Cards
Application Note Pyramid Probe Cards Innovating Test Technologies Pyramid Probe Technology Benefits Design for Test Internal pads, bumps, and arrays High signal integrity Rf and DC on same probe card Small
High and Low Temperature Wafer Probing Challenges
High and Low Temperature Wafer Probing Challenges Presenters: Authors: Wei Liang Sio Emanuele Bertarelli Yah Ean Koh Overview Motivation Probing challenges at high/low temperatures Production probing issues
Future Trends One Mann s Opinion
Future Trends One Mann s Opinion Bill Mann General Chair - SWTW Southwest Test Workshop Newport Beach, CA 92663 949-645-3294 william.mann@ieee.org Future Trends One Mann s Opinion Relative Reduction in
Katana RFx: A New Technology for Testing High Speed RF Applications Within TI
Katana RFx: A New Technology for Testing High Speed RF Applications Within TI Compan Logo Probe Test Solutions Manager Overview Introduction Objectives Procedures Results Summary Follow-On Work 2 Introduction
Leveraging Multiprobe Probe Card learnings to help Standardize and improve Parametric and WLR Testing
Leveraging Multiprobe Probe Card learnings to help Standardize and improve Parametric and WLR Testing Company Logo Brandon Mair Dawn Copeland Teas Instruments Agenda Introduction Overview Similarities
Test and Measurement Challenges for 3D IC Development. R. Robertazzi IBM Research
Test and Measurement Challenges for 3D IC Development R. Robertazzi IBM Research PFA Bill Price. Pete Sorce. John Ott. David Abraham. Pavan Samudrala Digital Test Kevin Stawaisz. TEL P12 Prober Glen Lansman,
Novel Precision Probe Array for Wafer Level Final Test of WLCSP Jathan Edwards
Novel Precision Probe Array for Wafer Level Final Test of WLCSP Johnstech International Presentation Outline Introduction to IQtouch Micro Final Test Probe Arrays for 300 500 micron pitch WLCSP Compare/contrast
High performance HBM Known Good Stack Testing
High performance HBM Known Good Stack Testing FormFactor Teradyne Overview High Bandwidth Memory (HBM) Market and Technology Probing challenges Probe solution Power distribution challenges PDN design Simulation
Low Force MEMS Probe Solution for Full Wafer Single Touch Test
Matt Losey Yohannes Desta Melvin Khoo Lakshmikanth Namburi Georg Aigeldinger Touchdown Technologies Low Force MEMS Probe Solution for Full Wafer Single Touch Test June 6 to 9, 2010 San Diego, CA USA Towards
Introduction to Wafer Level Burn-In. William R. Mann General Chairman Southwest Test Workshop
Introduction to Wafer Level Burn-In William R. Mann General Chairman Southwest Test Workshop Outline Conventional Burn In and Problems Wafer Level BI Driving Factors Initial Die Level BI Technical Challenges
Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing
Extra Large Multi-DUT Array Probing enabling > X100 Parallel Testing Bassam Dabit FAB18 Test Process Integration Trung Nguyen CTM Test Process Integration Intel Corporation 06/06/2005 Introduction Motivation
Key Considerations to Probe Cu Pillars in High Volume Production
Key Considerations to Probe Cu Pillars in High Volume Production Alexander Wittig (GLOBALFOUNDRIES) Amy Leong, Tin Nguyen, Tommaso Masi, Jarek Kister, Mike Slessor (Form Factor) Overview Key Industry Trends
Production Parametric Test - Challenges and Surprising Outcomes Running in a High Volume Manufacturing Environment
Production Parametric Test - Challenges and Surprising Outcomes Running in a High Volume Manufacturing Environment Karen Armendariz, Celadon Systems John Reynolds, Freescale Semiconductor Greg Tyrpak,
PROBE CARD METROLOGY
PROBE CARD METROLOGY HIGH TEMPERATURE TESTING OF PROBE CARDS Rod Schwartz VP & Technical Director Integrated Technology Corporation Dan Kosecki VP Software Development Integrated Technology Corporation
Advances in Probe Card Analyzers
Providing Leading Edge Technology to Meet Your Future Requirements Advances in Probe Card Analyzers Test and Maintenance of Very High Pin Count Cards Rod Schwartz VP & Technical Director Integrated Technology
Direct Attach ViProbe Series Probe Cards for Wafer Test
Direct Attach ViProbe Series Probe Cards for Wafer Test Probe Cards Direct Attach ViProbe Series FEINMETALL Direct Attach ViProbe Series represents a technology in advanced wafer probing. Our Direct Attach
Wafer Probe card solutions
Wafer Probe card solutions Innovative Solutions to Test Chips in the Semiconductor Industry Our long term experience in the electronic industry and our strong developing and process teams are inspired
Lecture 2 VLSI Testing Process and Equipment
Lecture 2 VLSI Testing Process and Equipment Motivation Types of Testing Test Specifications and Plan Test Programming Test Data Analysis Automatic Test Equipment Parametric Testing Summary VLSI Test:
Tangible Value Can be Realized by Standardizing Probe Interfaces
Keith Imai Semiconductor Test Consortium (STC) Tangible Value Can be Realized by Standardizing Probe Interfaces June 8-11, 8 2008 San Diego, CA USA STC at a Glance Global non-profit industry organization
Verification of Singulated HBM2 stacks with Die Level Handler. Dave Armstrong Toshiyuki Kiyokawa Quay Nhin
Verification of Singulated HBM2 stacks with Die Level Handler Dave Armstrong Toshiyuki Kiyokawa Quay Nhin Abstract Background only will delete on final material High-Bandwidth-Memory continues to evolve
Probing solutions and inherent customization to enable advanced copper-based 3D integration schemes
Probing solutions and inherent customization to enable advanced copperbased 3D integration schemes Dongpill Yang, SEC Jungwoo Sung, SEC, Technoprobe Raffaele Vallauri, Technoprobe DongHun Lee, Technoprobe
An Introduction To Area Array Probing
An Introduction To Area Array Probing Fred Taber IBM Corporation 1998 Southwest Test WorkShop 1 Topics: Introduction & Background Considerations & Experiences Q & A 2 Introduction & Background Vertical
There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous parts to build complex systems.
Direct Connection and Testing of TSV and Microbump Devices using NanoPierce Contactor for 3D-IC Integration There is a paradigm shift in semiconductor industry towards 2.5D and 3D integration of heterogeneous
3D profiler for contactless probe card inspection. Rob Marcelis
3D profiler for contactless probe card inspection Rob Marcelis 1 Content Introduction Objectives Challenges Basics DOE Results Data transformation Advantages/disadvantages Summary conclusions Follow up
Wafer Probe card solutions
Wafer Probe card solutions Innovative Solutions to Test Chips in the Semiconductor Industry Our long term experience in the electronic industry and our strong developing and process teams are inspired
Testing Principle Verification Testing
ECE 553: TESTING AND TESTABLE DESIGN OF DIGITAL SYSTES Test Process and Test Equipment Overview Objective Types of testing Verification testing Characterization testing Manufacturing testing Acceptance
A Fine Pitch MEMS Probe Card with Built in Active Device for 3D IC Test
3000.0 2500.0 2000.0 1500.0 1000.0 500.0 0.00-500.0-1000.0-1500.0 OSCILLOSCOPE Design file: MSFT DIFF CLOCK WITH TERMINATORREV2.FFS Designer: Microsoft HyperLynx V8.0 Comment: 650MHz at clk input, J10,
300 mm semi-/fully-automated probe system
300 mm semi-/fully-automated probe system DATA SHEET In device and process development, the right solution helps you handle test requirements that change from day to day. That s why Cascade Microtech developed
Monday 3/10/14 3:30pm
Monday 3/10/14 3:30pm DOING THE HEAVY LIFTING Within burn-in and test strategies the heavy lifting that falls to the technologies within test systems is this session's focus. The first paper outlines the
Kee Sup Kim Samsung Electronics. ramework for Massively Parallel esting at Wafer and Package Test
Kee Sup Kim Samsung Electronics ramework for Massively Parallel esting at Wafer and Package Test Key Message Massively parallel testing Possible Positive Return DFT Can be exciting 3 Outline Introduction
Functional Testing of 0.3mm pitch Wafer Level Packages to Multi- GHz Speed made possible by Innovative Socket Technology
Functional Testing of 0.3mm pitch Wafer Level Packages to Multi- GHz Speed made possible by Innovative Socket Technology Ila Pal - Ironwood Electronics Introduction Today s electronic packages have high
Impact of DFT Techniques on Wafer Probe
Impact of DFT Techniques on Wafer Probe Ron Leckie, CEO, INFRASTRUCTURE ron@infras.com Co-author: Charlie McDonald, LogicVision charlie@lvision.com The Embedded Test Company TM Agenda INFRASTRUCTURE Introduction
docking + interfacing dock'n'connect
docking + interfacing dock'n'connect esmo semicon docking + interfacing solutions excellent cost/performance ratio for supreme testing reliability All esmo semicon docking and interfacing products are
EE434 ASIC & Digital Systems Testing
EE434 ASIC & Digital Systems Testing Spring 2015 Dae Hyun Kim daehyun@eecs.wsu.edu 1 Introduction VLSI realization process Verification and test Ideal and real tests Costs of testing Roles of testing A
Krzysztof Dabrowiecki, Probe2000 Inc Southwest Test Conference, San Diego, CA June 08, 2004
Structural stability of shelf probe cards Krzysztof Dabrowiecki, Probe2000 Inc Southwest Test Conference, San Diego, CA June 08, 2004 Presentation Outline Introduction Objectives Multi die applications
Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]
![Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]](/thumbs/78/78371092.jpg "Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]")
Area Array Probe Card Interposer Raphael Robertazzi IBM Research 6/4/01 6/4/01 IBM RESEARCH Page [1] Motivation: Outline Probe Cards for Testing Complex ICs in the Developmental Stage. Hand Wired Space
ENG04057 Teste de Sistema Integrados. Prof. Eric Ericson Fabris (Marcelo Lubaszewski)
ENG04057 Teste de Sistema Integrados Prof. Eric Ericson Fabris (Marcelo Lubaszewski) Março 2011 Slides adapted from ABRAMOVICI, M.; BREUER, M.; FRIEDMAN, A. Digital Systems Testing and Testable Design.
Very Low Cost Probe Cards A Two Piece Approach
E Boyd Daniels & Martin Gao Texas Instruments Mitch Baumann Millennium Circuits Very Low Cost Probe Cards A Two Piece Approach June 6 to 9, 2010 San Diego, CA USA Agenda Problem Statement Scope 2 Piece
Probe Card Metrology. Challenges and Solutions. Jim Powell, Applications Engineer Rudolph Technologies
Probe Card Metrology Challenges and Solutions Jim Powell, Applications Engineer Rudolph Technologies Agenda 1. Overview 2. Cost of Ownership 3. Probe Card Metrology 4. Top Challenges 5. Probe Card Circuit
Reinforcement of PCB using Advanced Stiffeners for High Pin Count Devices
Nicolas SALLES (SV Probe) Rehan Kazmi, PhD (SV Probe) Wayne Nelson (Reid-Ashman Manufacturing) Reinforcement of PCB using Advanced Stiffeners for High Pin Count Devices 2007 San Diego, CA USA Overview
Panel Discussion Chair: Michael Huebner
Panel Discussion Chair: Michael Huebner FormFactor Inc. Panel members Panel Discussion Mark Ojeda (Spansion/Cypress) Panel: I/II Rey Rincon (Freescale) Panel: II Al Wegleitner (TI) Panel: I/II Clark Liu
Setting the Test Standard for Tomorrow. Nasdaq: AEHR
Setting the Test Standard for Tomorrow Nasdaq: AEHR Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding
MPI TS2500-RF 200 mm Fully Automated Probe System For RF Production Test Measurements
MPI TS2500-RF 200 mm Fully Automated Probe System For RF Production Test Measurements FEATURES / BENEFITS Designed for Wide Variety of RF On-Wafer Production Applications RF applications up to 67 GHz &
Effects of Pad Structure on the Scrub Performance of MEMS Probes for Memory Devices Aaron Woodard
Effects of Pad Structure on the Scrub Performance of MEMS Probes for Memory Devices Aaron Micron Technology, Inc Outline Background / Trends / Test Requirements Experiment Design Results What Ifs Summary
IC Testing and Development in Semiconductor Area
IC Testing and Development in Semiconductor Area Prepare by Lee Zhang, 2004 Outline 1. Electronic Industry Development 2. Semiconductor Industry Development 4Electronic Industry Development Electronic
June 6 to 9, 2010 San Diego, CA Probe Cards with Modular Integrated Switching Matrices
June 6 to 9, 2010 San Diego, CA Probe Cards with Modular Integrated Switching Matrices Authors: Evan Grund Jay Thomas Agenda Review of Traditional Scribeline Parametric IV and CV Probe Card Requirements
Standardizing WSP Wafer Socket Pogo Pin Probe Cards
John Hite Texas Instruments Standardizing WSP Wafer Socket Pogo Pin Probe Cards June 6 to 9, 2010 San Diego, CA USA Agenda Introduction WLCSP and WSP Probing WSP Standardization Standard Alignment / Mounting
Chip Card & Security ICs SLE Intelligent 1024 Byte EEPROM with Write Protection and Programmable Security Code
Chip Card & Security ICs SLE 5528 Intelligent 1024 Byte EEPROM with Write Protection and Programmable Security Code Short Product Information May 2007 Short Product Information Revision History: Current
AMD high pin count probing challenges on leading edge GPU: Technoprobe TPEG MEMS vs. Cobra
AMD high pin count probing challenges on leading edge GPU: Technoprobe TPEG MEMS vs. Cobra Foo Xin Reng AMD Raffaele Vallauri Technoprobe Claus Ploetz Advantest Outline Radeon R9 Series GPU : World s first
Multi-site Probing for Wafer-Level Reliability
Multi-site Probing for Wafer-Level Reliability Louis Solis De Ancona 1 Sharad Prasad 2, David Pachura 2 1 Agilent Technologies 2 LSI Logic Corporation s Outline Introduction Multi-Site Probing Challenges
LPDDR2 and LPDDR3 High Speed Wafer Test for KGD. Yosuke Kawamata/TeraProbe Takeshi Yanagisawa/ELPIDA Marc Loranger/FormFactor
LPDDR2 and LPDDR3 High Speed Wafer Test for KGD Yosuke Kawamata/TeraProbe Takeshi Yanagisawa/ELPIDA Marc Loranger/FormFactor Project Purpose High speed wafer evaluation KGD business High speed wafer test
APS/SPS200TESLA. 200 mm Fully-automated On-Wafer Probing Solution for High-power Devices
00 mm Fully-automated On-Wafer Probing Solution for High-power Devices DATA SHEET The is the industry s first fully-automated on-wafer probing solution focused on production performance for high-power
Chip Card & Security ICs SLE Intelligent 256-Byte EEPROM with Write Protection function and Programmable Security Code
Chip Card & Security ICs SLE 5542 Intelligent 256-Byte EEPROM with Write Protection function and Programmable Security Code Short Product Information May 2006 Short Product Information Revision History:
The Influences of Signal Matching During Multi-site Testing
Eddie McClanahan and Al Wegleitner Texas Instruments The Influences of Signal Matching During Multi-site Testing 2007 San Diego, CA USA Agenda Background Problem Statement Objective Methodology Results
Improving Test Throughput with Addressable Arrays and the Agilent N9201A
Improving Test Throughput with Addressable Arrays and the Agilent N9201A Agilent N9201A Array Structure Parametric Test Option for the Agilent 4070 and 4080 Series Parametric Testers Application Note N9201A-1
Non-contact Test at Advanced Process Nodes
Chris Sellathamby, J. Hintzke, B. Moore, S. Slupsky Scanimetrics Inc. Non-contact Test at Advanced Process Nodes June 8-11, 8 2008 San Diego, CA USA Overview Advanced CMOS nodes are a challenge for wafer
KGD Known Good >POWER< Die Diced Wafer Test at 7 kv and 1000 A
KGD Known Good >POWER< Die Diced Wafer Test at 7 kv and 1000 A Mauro Serra CREA Test Jens Lochbaum INFOTECH Automation Rainer Gaggl T.I.P.S. Messtechnik Overview IGBT Power Modules Classical chip test
Measuring Z-stage accuracy using a force sensor
Measuring Z-stage accuracy using a force sensor Sancho Adam Southwest Test Conference June 2007 Contents Introduction / Background Objectives / Goals Methods / Materials / Procedures Results / Relevant
TSV Test. Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea
TSV Test Marc Loranger Director of Test Technologies Nov 11 th 2009, Seoul Korea # Agenda TSV Test Issues Reliability and Burn-in High Frequency Test at Probe (HFTAP) TSV Probing Issues DFT Opportunities
TTP226. Preliminary 8 KEYS TOUCH PAD DETECTOR IC GENERAL DESCRIPTION
8 KEYS TOUCH PAD DETECTOR IC GENERAL DESCRIPTION The TTP222 is a touch pad detector IC which offers 8 touch keys. The touching detection IC is designed for replacing traditional direct button key with
200 mm Semi-automated Probe System with BlueRay Technology
PA200BlueRay 200 mm Semi-automated Probe System with BlueRay Technology DATA SHEET The sets a new standard for high-speed accuracy. Its precision ensures smooth probe landing with safe, repeatable electrical
Multi-Site Parallel Testing with the S535 Wafer Acceptance Test System APPLICATION NOTE
Multi-Site Parallel Testing with the S535 Wafer Acceptance Test System In semiconductor wafer production, minimizing the cost of test has been identified as the number one challenge. The biggest factor
Addressable Test Chip Technology for IC Design and Manufacturing. Dr. David Ouyang CEO, Semitronix Corporation Professor, Zhejiang University 2014/03
Addressable Test Chip Technology for IC Design and Manufacturing Dr. David Ouyang CEO, Semitronix Corporation Professor, Zhejiang University 2014/03 IC Design & Manufacturing Trends Both logic and memory
DOC. NO. FT02000-R011-E FULLY AUTOMATIC PROBER UF190/UF200 DEVICE CREATION GUIDE TOKYO SEIMITSU CO., LTD.
DOC. NO. FT02000-R011-E0 8-09-99 FULLY AUTOMATIC PROBER UF190/UF200 DEVICE CREATION GUIDE TOKYO SEIMITSU CO., LTD. CONTENTS Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Setting Parameter
Use of Lock-In Thermography for non-destructive 3D Defect Localization on System in Package and Stacked-Die Technology
Use of Lock-In Thermography for non-destructive 3D Defect Localization on System in Package and Stacked-Die Technology Rudolf Schlangen, S. Motegi, T. Nagatomo, DCG Systems, Fremont, CA, USA C. Schmidt,
VLSI Test Technology and Reliability (ET4076)
VLSI Test Technology and Reliability (ET4076) Lecture 8(2) I DDQ Current Testing (Chapter 13) Said Hamdioui Computer Engineering Lab Delft University of Technology 2009-2010 1 Learning aims Describe the
Using MLOs to Build Vertical Technology Space Transformers
Presentation to Southwest Test Workshop 2002 Using MLOs to Build Vertical Technology Space Transformers Bill Fulton and Bill Pardee Wentworth Laboratories Overview 1. Terminology 2. Benefits of MLOs vs
WHICH SIDE ARE YOU ON? DOUBLE SIDED PROBING
WHICH SIDE ARE YOU ON? DOUBLE SIDED PROBING Traditionally, devices with active regions on both sides of a wafer were limited to discrete devices. With advances in materials, functionality and packaging,
Gavin Fisher Cascade Microtech Europe
Gavin Fisher Cascade Microtech Europe Device measurement at it s simplest requires the following steps Probe and accessory physical Set-up for calibration Calibration instrumentation setting preparation
Globalization and its Impact on the Probing Process. Alan Romriell (Spansion) Manish Gulati (FormFactor)
Globalization and its Impact on the Probing Process Alan Romriell (Spansion) Manish Gulati (FormFactor) Recent article in EE Times Top 20 risk factors for tech companies Junko Yoshida (05/19/2008 3:52
Hybrid Wafer Testing Probe Card
Chris Sellathamby Scanimetrics Inc. Hybrid Wafer Testing Probe Card June 5, 2007 San Diego, CA USA Overview Existing Issues Contact Damage Challenge Wireless (Non-contact) for Data Contact Probes for Power
SKTM Socket Series Catalog High Speed Compression Mount
SKTM Socket Series Catalog High Speed Compression Mount Ardent Design Support Sockets Overview Ardent Compliant Contact Technology Socket Types BGA/LGA QFN/QFP/MEMS Optical Plunge to Board Lid Types Ordering
HIGH TECH CHIPS, INC. HTC151 LED FLASHER. 1.0 General description.
HTC151 LED FLASHER 1.0 General description. This circuit is designed to work as led flasher. LED s sequentially turn on and off according to the part used. D[0:2] inputs are used to control flashing frequency.
A Fine Pitch MEMS Probe Card with Built in Ac8ve Device for 3D IC Test
A Fine Pitch MEMS Probe Card with Built in Ac8ve Device for 3D IC Test Lakshmikanth Namburi Florent Cros Yong Hong Ting Hu Robert Smith ADVANTEST Gary Maier Van Thanh Truong Hsichang Liu Katsuyuki Sakuma
Test Cell Co-planarity Optimization Presenter: Troy Harnisch
Test Cell Co-planarity Optimization Presenter: Troy Harnisch Teradyne Co-authors: Doug Garrett, NXP Hoang Nguyen, Microsemi What is co-planarity of a test cell Parallel plane between wafer chuck and probe
2688 WESTHILLS COURT, SIMI VALLEY, CA
NEW PRODUCT INTRODUCTION 2688 WESTHILLS COURT, SIMI VALLEY, CA 93065-2635 To: All Hirose Sales Personnel and Partners From: Hirose USA Marketing Dept. Subject: New Product Release for IT11 Series October
Introduction to LabVIEW and NI Hardware Platform
Introduction to LabVIEW and NI Hardware Platform Corrie Botha Platform-Based Approach 2 With LabVIEW, You Can Program the Way You Think 3 With LabVIEW, You Can Program the Way You Think The graphical,
Parametric test systems
Semiconductor industry s most cost-effective fully automatic parametric testers Optimized for use in environments with a broad mix of products, where high flexibility and system speed are critical Choice
Spring Probes and Probe Cards for Wafer-Level Test. Jim Brandes Multitest. A Comparison of Probe Solutions for an RF WLCSP Product
AND, AT THE WAFER LEVEL For many in the industry, performing final test at the wafer level is still a novel idea. While providing some much needed solutions, it also comes with its own set of challenges.
SX Device In-System Programming Specifications
SX Device In-System Programming Specifications. SX Device Programming Specifications Rev 2.0 1999 Scenix Semiconductor, Inc. All rights reserved. Revision History REVISION RELEASE DATE SUMMARY OF CHANGES
Product / Process Change Notification
Product / Process Change Notification N 2016-067-A Dear Customer, Please find attached our INFINEON Technologies PCN: Introduction of new tester platform for final test for PROFET BTS432E2 E3062A, BTS442E2
A Seamless Tool Access Architecture from ESL to End Product
A Seamless Access Architecture from ESL to End Product Albrecht Mayer Infineon Technologies AG, 81726 Munich, Germany albrecht.mayer@infineon.com Abstract access to processor cores is needed from the first
MPI TS150-HP 150 mm High Power Manual Probe System For accurate High Power measurements up to 10 kv, 600 A
MPI TS15-HP 15 mm High Power Manual Probe System For accurate High Power measurements up to 1 kv, 6 A FEATURES / BENEFITS Universal Use Designed specifically for high power device measurement and wide
OPTICAL TECHNOLOGIES FOR TSV INSPECTION Arun A. Aiyer, Frontier Semiconductor 2127 Ringwood Ave, San Jose, California 95131
OPTICAL TECHNOLOGIES FOR TSV INSPECTION Arun A. Aiyer, Frontier Semiconductor 2127 Ringwood Ave, San Jose, California 95131 ABSTRACT: In this paper, Frontier Semiconductor will introduce a new technology
Analysis of probe C.C.C. according to temperature and evaluation method Sanghun Shin, Seongyeon Wi, Yonggeon Shin, Wonha Jeon
Analysis of probe C.C.C. according to temperature and evaluation method Sanghun Shin, Seongyeon Wi, Yonggeon Shin, Wonha Jeon Willtechnology Co., Ltd. Overview Background Evaluation method Evaluation results
SYSTEM LEVEL ESD - BEYOND THE COMPONENT LEVEL IC PROTECTION CHARVAKA DUVVURY
SYSTEM LEVEL ESD - BEYOND THE COMPONENT LEVEL IC PROTECTION CHARVAKA DUVVURY 1 1 Outline Impact from Advanced Technologies and High Speed Circuit Designs on Component Level ESD System Level ESD and the
March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 5
Proceedings Archive March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 5 2016 BiTS Workshop Image: Stiop / Dollarphotoclub Proceedings Archive Presentation / Copyright Notice The
Open NAND Flash Interface Specification: NAND Connector
Open NAND Flash Interface Specification: NAND Connector Connector Revision 1.0 23-April-2008 Hynix Semiconductor Intel Corporation Micron Technology, Inc. Phison Electronics Corp. Sony Corporation Spansion
Session 2. Burn-in & Test Socket Workshop Socket Design
Session 2 Burn-in & Test Socket Workshop 2000 Socket Design BURN-IN & TEST SOCKET WORKSHOP COPYRIGHT NOTICE The papers in this publication comprise the proceedings of the 2000 BiTS Workshop. They reflect
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
2 keys Touch Pad Detector IC
2 keys Touch Pad Detector IC Outline The TonTouch TM IC is capacitive sensing design specifically for touch pad controls. The device built in regulator for touch sensor. Stable sensing method can cover
ESD Sensitive. Parameters Minimum Typical Maximum Units Notes ppm. Parameters Minimum Typical Maximum Units Notes
Moisture Sensitivity Level (MSL) 1 FEATURES: LVCMOS, LVDS or LVPECL output option +2.5V or +3.3V operation -40 C to +85 C standard operating temperature range Ultra low RMS Jitter: 0.5ps typical, 1.0ps
Metrology and Probe Repair challenges with tighter pitch probe cards
Anil Kaza Intel Corporation Metrology and Probe Repair challenges with tighter pitch probe cards June 6 to 9, 2010 San Diego, CA USA Overview Current trends with technology generation Intel PCM Work Flow
High Versatility High Throughput Functional Testing. Robert Polster, David Calhoun, Keren Bergman
High Versatility High Throughput Functional Testing Robert Polster, David Calhoun, Keren Bergman Challenges of High-Throughput Functional Testing for Scalable Manufacturing Numerous Functional Applications
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings