Hirose Korea FFC To Board Connector

Transcription

1 Hirose Korea FFC To Board Connector TF12-Series 목차 1. 제품특징 page 2 2. 제품구성및사양 page 3 3. 제품상세내용 page No. 제품명 Pin 수 사양 관련 page 1 TF12S-4S-0.5SH Pitch, 1mm 높이 2 TF12S-6S-0.5SH Pitch, 1mm 높이 3 TF12-9S-0.5SH Pitch, 1mm 높이 4 TF12H-9S-0.6SH Pitch, 2mm 높이 5 TF12F-10S-0.5SH Pitch, 1mm 높이 6 TF12S-10S-0.5SH Pitch, 1mm 높이 7 TF12S-13S-0.5SH Pitch, 1mm 높이 8 TF12S-20S-0.5SH Pitch, 1mm 높이 5.Reflow profile (Lead-free) page 7 HIROSE KOREA Page1 2011/ FEBRUARY

2 TF12 - SERIES 0.5mm PITCH Back-Flip Type, 1 열하 ( ) 접점방식 FFC To Board CONNECTOR 특징 1. LOW PROFILE 제품에서높은 FPC 발거력 / MISS ALIGN 방지 1) 돌기형 FPC말단형상과 SLIDER의돌기형 HOOK가체결시결합하는구조로 FPC발거력향상구현 2) 체결시결합구조로 FPC오삽입등에의한 CONTACT MISS ALIGN방지 2. BACK-FLIP 방식에의한우수한작업성 / 접촉신뢰성향상 1) BACK-FLIP방식채택으로 FRONT-FLIP방식대비실장후 FPC체결작업시우수한작업성실현 2) BACK-FLIP방식은 FPC 수직발거방향과 SLIDER OPEN방향이서로역방향으로장기적인접촉신뢰성을향상시킴. 3. LOW PROFILE 제품에서우수한 FPC 삽입작업성 1) FPC삽입구폭 ( 두께방향 ) 은 MIN. 0.32로 0.12t, 0.2t FPC 사용시 60% 마진확보 4. 개별단자와 SLIDER의결합구조로 SLIDER 이탈현상방지 5. 단자와금구의전 / 후 PATTERN 으로납땜 BALANCE 및 PCB 고정강도향상 6. 단자의 Ni BARRIER 도금으로 LOW PROFILE 제품에서의 FLUX 오름방지 1) CONTACT부및 LEAD부 (SOLDER부) Au도금, 중간부 Ni BARRIER도금적용으로납땜시 FLUX오름에의한접촉불량현상방지 7. CASE 상측, SLIDER 등면을확용한실장흡착으로 PICK-UP ERROR 감소 용도 - NOTE PC LED BLU Interconnecting. - Compact devices for interconnecting the main circuite board with the HHP, LCD, PDA, HDD or other device. HIROSE KOREA Page2 2011/ FEBRUARY

3 제품규격 Rating Current 0.5A Voltage 50V Operating temperature range Storage temperature range Item 1.Insulation Resistance 2.Withstand voltage 3.Contact Resistance 4.FPC Retention Force 5.Mechanical operation 6.Moisture Resistance 7.Resistance to Soldering heat Specification 500MΩ Min Neither shot or insulation beakdown 100mΩ Max Ver.:130gf MIN/Hor.:130gf MIN Contact Resistance : 100mΩ Max Temperature : 40±2 Relative Humidity : 90 95% Duration : 72Hr Reflow : PROFILE :260 MAX 30s, 217 and over. 90~120s. Conditions Measureed at 100V DC 150V AC for 1 minute Measured at 1mA(or 1,000 Hz ) Measure at 0.2±0.03mm FFC 20 Time insertions and extractions. Contact Resistance : 100mΩ Max Insulation Resistance : 50MΩ Min No deformation of components affecting performance. 부품별적용원재료 Part Material Finish Remarks CASE LCP NATURAL(Beige) UL94V-0 SLIDER LCP BLACK UL94V-0 Contact Phosphor Bronze Gold plating over Ni Ni Barrier Metal Fitting Phosphor Bronze Sn plating over Ni - Reflow최대온도 250 를만족시킴으로 Lead-free Soldering의요구조건에적합한제품임. RoHS지침및유해물질관리기준에적합한제품임. TF12F-10S-0.5SH는 TF12S-10S-0.5SH와의구분을위하여원재료 COLOR는아래와같음. (CASE : BLACK, SLIDER : BROWN) TF12H-9S-0.5SH는고객특수사양으로원재료 COLOR는아래와같음. (CASE : BLACK, SLIDER : BLACK) Part Number의구성 TF 12 # - ** S SH Serieal Name Serieal No. TF 12 Blank, S : FPC t=0.2 3 Blank H F type : FPC t= Contact 수 Contact 분류 4,6,9,10,13,20 contacts S : Socket 6 Contact Pitch 0.5mm 7 Contact type SH(SMT horizontal mount type) HIROSE KOREA Page3 2011/ FEBRUARY

4 TF12-SERIES TF12-9S-0.5SH TF12H-9S-0.5SH HIROSE KOREA Page4 2011/ FEBRUARY

5 TF12-9S-0.5SH TF12H-9S-0.5SH HIROSE KOREA Page5 2011/ FEBRUARY

6 PACKING DIMENSION HIROSE KOREA Page6 2011/ FEBRUARY

7 Reflow Profile Using Lead-free Solder Paste Max Temperature( ) A' B' Preheating time Soldering time Time (Seconds) Recommended Application Conditions Reflow System: IR reflow Solder: Cream type Sn / 3 Ag / 0.5 Cu Flux content 11%wt Metal mask thickness: 0.15mm Preheating time: 150 ~190, 90±30seconds A'=150 ~170, B'=170 ~190 Soldering time: 250 Max 220 Min, 30~60 seconds HIROSE KOREA Page7 2011/ FEBRUARY