Memory Stick Connectors

Transcription

1 Memory Stick Connectors CB1 Series Card Push Insert/Push Eject <CB1G Series> Card ejection distance of 1 mm Mounting height of mm Mounting area: Smaller design is 78% of former size Outline Receptacle connectors for use with the new generation of digital media devices requiring Memory Stick type of consumer removable memory card. Several variations are available: Miniature, Low Profile and with or without ejection mechanism. Features 1. Indication of Incorrect Card Insertion The connector will not allow the card to be complete inserted from the wrong end or reversed. The card will stop about 7mm before complete insertion position, visually indicating incorrect insertion. 2. Protection of the Contacts Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly. 3. Excellent Card Handling The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities. Button Touch Ejection <CB1F Series> Card ejection with tactile button operation Card ejection distance of 1 mm Equipped with card ejection switch Without Card Ejection <CB1D Series> *Memory Stick is a registered trademark of the Sony Corporation. Miniaturized, low profile design Improved installation to the equipment is permitted using (M1.7) tapping screws Can be equipped with an ejection mechanism depending on the design of the equipment side portion Note: Please position the card ejection button at the side of the equipment. C18

2 Product Specifications Rating Current rating.5 Voltage rating 125V C Operating temperature range -2ç to +85ç(Note) Storage temperature range -4ç to +85ç Operating humidity range Relative humidity 96% max. (No condensation) 1. Insulation resistance 1 Mø min. 5 V DC 2. Withstanding voltage No flashover or insulation breakdown 5 V C / one minute 3. Contact resistance 1 mø max. 1m DC 4. Vibration No electrical discontinuity of 1 µs or more Frequency: 1 to 55 Hz, single amplitude of.75 mm, 2 hours / 3 axis 5. Humidity Item Specification Conditions 6. Temperature cycle 7. Durability (mating/unmating) Contact resistance: 4 mø max. from initial value Insulation resistance: 1 Mø min. Contact resistance: 4 mø max. from initial value Insulation resistance: 1 Mø min. Contact resistance: 4mø max. from initial value 96 hours at temperature of 4ç±2ç and humidity of 9% to 95% Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 3/5/3/5(Minutes) 5 cycles 12 cycles at 4 to 6 cycles per hour 8. Resistance to No deformation of any component. Reflow: t the recommended temperature profile soldering heat No affect on contacts Manual soldering: 3ç for 3 seconds Note :Includes temperature rise caused by current flow. Materials Part Material Finish Remarks Insulator Heat resistant glass reinforced therm oplastic compound Color: Black UL94V- Contacts Phosphor bronze Contact area: Gold plated Termination area: Tin-Iead plated or tinned copper plated Metal hold down Phosphor bronze or stainless steel Contact area: Nickel plating Termination area: Tin-Iead plated or tinned copper plated CB1E,CB1F,CB1G Series is without the termination area. Cover Stainless steel or cupper alloy The CB1E Series has termination area with tin-lead plated. Stainless steel Eject mechanism components Heat resistant glass reinforced UL94V- therm oplastic compound Ordering information CB 1 E - 1 S H - PEJC - * Series name : CB 6 Contact pitch : 1.5 mm 2 Series No. : 1 7 Surface mount 3 Ejector type : C } 8 Eject mechanism codes: E PEJC : Card Push insert/push eject With eject mechanism F EJL : Left button eject G EJR : Right button eject D 9 Suffix Without eject mechanism } 4 Number of contacts : 1 5 Connector type S : Receptacle C19

3 Low Profile, Push Insert-Push Eject Card ejected Card fully inserted Card pushed for ejection (5.525) Memory stick card outline 3.85 (3.25) CB1G-1S-1.5H-PEJC2 CL (31) 26.2 (21) 3.2 (19.8) 1.9± ±.1 1.9±.1 4± ±.1.9±.5 ±.3 1.9±.1 9.3± Button Touch Eject CB1F-1S-1.5H-TEJL-P CL Card ejected Card fully inserted (23) 39.8 (13) 4.5 (.8) Ø.55 4-Ø (5.525) (2) Eject stroke Memory stick card outline 3.85 (3.25) 4-Ø Ø ± ±.3 1.5± ±.3.6±.5.9±.5 ±.5 3±.5 1±.5 4.2±.5 3.4±.1 5.3± ±.3 1.9±.3 Without Card Ejection Ø Ø Ø ±.5 2± ±.3 1.5± ±.5 1±.1 ±.5 1±.5 5.8±.5 Ø Ø ± ±.3 2±.1 6.1±.5 CB1D-1S-1.5H CL Ø C2

4 Push Insert-Push Eject Normal type CB1EB-1S-1.5H-PEJC2 CL (19.5) Card ejected 24 (13.3) Card fully inserted 3.2 (12) Card pushed for ejection (5.525) Memory stick card outline (3.25) 1.5±.1 24±.3 2.4± ±.1 2.4±.1 4±.1 4±.1 8.6±.1.9±.5 ±.3 9.3± () With "U" cut-out Card ejected Card fully inserted Card pushed for ejection (5.525) Memory stick card outline 3.85 (3.25) 2.4± ±.1 2.4±.1 CB1EBG-1S-1.5H-PEJC2 CL (19.5) (13.3) (12) ±.3 8.6±.1 1.5±.1 4±.1 4±.1.9±.5 ±.3 9.3± With square window Card ejected Card fully inserted Card pushed for ejection (5.525) Memory stick card outline 3.85 (3.25) 1.9± ±.1 1.9± (19.5) (13.3) (12) ±.3 8.6±.1 1.5±.1 4±.1 4±.1 CB1EBH-1S-1.5H-PEJC2 CL ±.5 ±.3 9.3± C21

5 Left Ejection (6) Card ejected Memory stick card outline (3.3) Eject stroke Ø ±.5.4±.5 3±.1 CB1C-1S-1.5H-EJL(56) 1.5±.3.9±.1 2-Ø ±.1 48MX 4.95±.5 CL Front edge of the printed circuit board Ø1.2 P= 1.5±.5 3.2±.1 1± ±.5 Right Ejection Memory stick card outline (6) Card ejected CB1C-1S-1.5H-EJR(59) CL Ø (3.3) Eject stroke Front edge of the printed circuit board ±.5 3±.1 1.5±.3 2-Ø MX Ø ±.5.9±.1 ±.5 2.4± ±.5 3.2± ± ±.5 C22

6 With flange, for screw attachment ± ±.5 Ø (hole) 16.5±.5 1±.5 ±.5 Ø (hole) ±.1 4.9±.1 4.4± ±.1.9± ±.1 2-Ø ± Ø CB1-1S-1.5H(57) CL (hole) 3.8±.1 4.1±.1 6.3±.1 6.6±.1 3.3±.1 Without flange Ø ± ±.1 4.9± ±.1 1±.5 ±.5.9± ±.1 2-Ø (hole) 3.8±.1 4.1±.1 6.3±.1 6.6± ±.1 3.8± CB1-1S-1.5H(57) CL Ø2 BMemory Stick card insertion direction BMemory Stick fully inserted dimensions C23

7 Packaging specification (Tray packaging) Part Number: CB1G-1S-1.5H-PEJC2(1 tray: 4 pieces) Part Number: CB1F-1S-1.5H-TEJL-P(1 tray: 2 pieces) 3.1±.2 43± ±.5 252±.3 P=36±.2 3.1±.2 1± ±.5 195±.3 P=65±.2 PS 4PICS ± ±.3 P=36.5±.2 B B 27.5± ±.5 222±.3 55±.2 P=74±.2 B B ± ± ±.3 P=39.5±.2 19±.2 C C 215±.5 177±.3 P=29.5±.2 215±.5 16±.3 P=4±.2 2PICS CB1C(R1) 215±.5 16±.3 P=4±.2 CB1G SERIES 215±.5 16±.3 P=4±.2 2PICS PS CB1F(TEJL1) Part Number: CB1D-1S-1.5H(1 tray: 5 pieces) Part Number: CB1EB*-1S-1.5H-PEJC2(1 tray: 25 pieces) 32.25±.2 215±.5 177±.3 P=29.5±.2 19±.2 215±.5 16±.3 P=4± ± ±.5 22±.3 55±.2 P=55± P I C S P S CB1E(PEJC1) Part Number: CB1C-1S-1.5H-EJL(56)(1 tray: 2 pieces) Part Number: CB1C-1S-1.5H-EJR(59)(1 tray: 2 pieces) 33.4± ± ± ±.3 P=63.3±.2 215±.5 156±.3 P=52±.2 CB1C(L1) 2 P I C S Part Number: CB1*-1S-1.5H(57)(1 tray: 5 pieces) CB1(1) C24

8 BUsage Precautions 1.Care should be taken to correctly insert/withdraw the Memory Stick card. Following correct insertion/withdrawal procedures will prevent device or connector damage. When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below. CB1 Series CB1C Series Contacts Recommended holding area Recommended holding area Contacts, metal hold-down and ejection components areas Metal hold-down 2.Follow the recommended insertion angles, as illustrated below. <Memory Stick llowable Insertion ngles> CB1 Series CB1C Series ±2 MX Outline of the Memory Stick card ±1 MX ±1 MX Outline of the Memory Stick card ±.22 ±.5 MX ±.2 MX 15 Initial insertion (15 mm max.) Complete insertion (from 15 mm to full insertion) C25

9 3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward by.6 mm. Care should be taken that they will not be restricted or touch other components. side contact (.6) 4. pplication of an excessive external force to the push rod may prevent the ejection or insertion of the card. Do not apply any load in a direction other than the push direction. Push direction Do not twist or bend! Do not pull! Push rod C26

10 Recommended Temperature Profile 3ç IR Reflow Conditions Preheating : 15ç 3 to 9 sec. Soldering : 235±5ç 1 sec. max. 22ç min. 1 to 2 sec. 24ç max. 22ç 2ç 15ç Soldering Preheating 1ç ç <Recommended Conditions> S 5S 1S 15S 2S Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 6mm x 1mm x 1.6 mm Metal mask thickness :.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used. C27

11 Mouser Electronics uthorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Hirose Electric: CB1-1S-1.5H(52) CB1C-1S-1.5H-EJL(52) CB1C-1S-1.5H-EJR(52) CB1C-1S-1.5H(52)