SHIELD CAN CLIP ENGINEERING GUIDE SEP/2011

Transcription

1 SHIELD CAN CLIP ENGINEERING GUIDE SEP/2011

2 Shield Can Clip (PTC Series) [ Major Application ] - CELLULAR PHONE - PMP - WIBRO USB DONGLE - GPS MODULE - NAVIGATION - HSUPA / HSDPA module - MP4 - PON - HIPASS - UMPC [ Key Features ] Efficient use of the PCB space To increase productivity by mounting the Clip automatically Reduction in the term and the expense for the development by removing the frame Cost reduction Efficient purchase by standardization Easy repairs 2

3 Product Overview Part Name Size H x W x L Packing (Reel) Shield can Thickness Plating Mat l Customer PTC0703B PTC0703C PTC0704 PTC0704A PTC0801 PTC0703D PTC0703E PTC0901 PTC0706 (EMBOSS) PTC3121N PTC1121N 1.28 x 0.8 x 1.28 x 0.8 x 1.28 x 1.1 x 1.28 x 1.1 x 1.28 x 1.1 x x 0.8 x 1.15 x 0.8 x 1.20 x 1.1 x 1.28 x 1.0 x 0.8 x 0.8 x x 0.8 x , ~0.20 Sn SUS 3 SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,KTFT,PANTECH,KYOCERA 10, Sn SUS SAMSUNG MOBILE,LG MOBILE 10, ~0.20 Sn SUS SAMSUNG MOBILE,SAMSUNG TV, SAMSUNG LCD,LG DISPLAY 10, Sn SUS SAMSUNG MOBILE,SAMSUNG NETWORK 10, ~0.3 Sn SUS SAMSUNG MOBILE 10, ~0.2 Sn SUS SAMSUNG MOBILE,SAMSUNG COMPUTER, LG MOBILE,PANTECH,SKT,FOXCONN 10, Sn SUS SAMSUNG MOBILE 10, Sn SUS SAMSUNG MOBILE 10, ~0.2 Sn SUS SAMSUNG NETWORK,ZTE 10, Sn SUS 10, Sn SUS SAMSUNG MOBILE,QUALCOMM LG ELECTRONICS SAMSUNG MOBILE LG ELECTRONICS,PANTECH Embossing Clip is an advanced type of Clip that is designed to strengthen the retention force by adding Embossing on the joint part.

4 Application example Shield Can Clip Embossing HOLE Embossing Clip 4

5 Appilcation note Big size shield can which cover whole PCB had better separate to 2 piece of shield can. The minimum gap size between clip and clip is 0.3mm. The clip pad keeps 0.5mm distance from PCB edge. Clip should be separated from Magnetic strip components as far as possible. When the gap size between shield Can and plastic cover is less than 0.2mm, it is perfect for drop test. 5

6 Underfill When you artwork clip at near memory chip 1) in case of sealing with resin, keep 0.4mm distance from IC 2) in case of no sealing, 0.15~0.2mm distance from IC is enough * Sealing with Resin, they call underfill for protecting memory on drop test 6

7 Clip placement Case 1) when designing PCB with 4 pcs of clip Do not place the clip at the center position. Because it is not perfect for drop test and inserting shield can by manual. Recommended placement) It is good for assembly and drop test 7

8 Clip placement Case 2) artwork with 6 pcs of clip Case 3) artwork with 10pcs of clip especially in RF part More clip is better for EMI shielding 8

9 Clip application note Case 4) With screw When designing PCB with big shield can, you can use clip and screw at the same time Screw hole 9

10 Application example for base band As you can see, you can use the PCB space efficiently in base band part. 10

11 Clip placement guide considering noise emmission Clip should be placed within 20mm distance not to affect the wireless sensitivity - If shield can side length is less than 20mm, then clip should be placed at center. - When you consider assembly, clip should be placed within 5mm distance from corner. - Clip should be placed at shortest distance from hot spot. Without SHIELD CAN SMT SHIELD CAN CLIP GSM dBuV 93dBuV 90dBuV PCS 105dBuV 80dBuV 82dBuV according to the evaluation result, both have same shield effectiveness. 11

12 Remain space size of each clip Part Name Size H x W x L A B A (space size) B (space size) PTC0703 Series 1.28 x 0.8 x 0.25mm mm 0.3mm 7mm PTC0704 Series 1.28 x 1.1 x 0.25mm mm 0.3mm 7mm PTC x 1.1 x mm 3.9mm 0.3mm 4.3mm PTC3121,1121N PTC1001, x 0.8 x mm 4.4mm 0.20mm 4.8mm PTC x 1.0 x 0.15mm mm 0.20mm 7mm PTC x 0.6 x 0.1mm mm 0.15mm 7mm B A B A A 0.2mm A 0.3mm 4.8mm B B 7mm 12

13 Soldering Recommend(Mask 0.1T) Part Name Height from ground PCB Lay Out Solder Mask Lay Out(%) Part Name Height from ground PCB Lay Out Solder Mask Lay Out(%) PTC 0703 Series 0.25 PTC PTC 0704 Series 0.25 PTC3121N PTC1121N PTC1001 PTC PTC PTC

14 Appendix Item Spec Method Result Peeling strength (Lateral force) - More than 3 kgf PCB Clip Gage Push - Max : 5.2 kgf - Min : 4.2 kgf - AVG : 4.6 kgf Flexural Strength (Twist test) - Do not drop out (twist 1mm) Good Insertion/ Retention force - Insertion force : less than 1,000g - retention force : more than 60g - measure the force after 10 cycles(inserting and pulling out) ( Can Thickness : 0.2T ) -Insertion force : 420 g -retention force : 118 g Contact resistance mω Max - After inserting shield Can - Max : 34 mω - Min : 26 mω - AVG : 30 mω 14