Product Catalogue

Transcription

1 Product Catalogue

2 The largest factory of semiconductor packaging and testing in Latin America HT Micron has the most modern factory for semiconductor packaging and testing in Latin America. Built according to global standards, the structure has approximately 10,000 square meters. The majority of this area is for production composed of class 5000 and class 100,000 clean rooms.

3 Packaging The partnership with Hana Micron of South Korea gives HT Micron access to the most state of the art tchnology for semiconductor packaging. This partnership ensures an efficient and fast implementation of these packaging technologies in Brazil. The main steps of this process are: - Die attach: includes removal of the die from wafer, and positioning on a substrate (PCB); - Wire bonding: bond / weld of the wire, usually of gold, between the die and the substrate; - Molding: packaging, injection of epoxy to protect the links of gold and die; - Ball mount: installation, if applicable, the loose balls at the bottom of the component; - Mark Laser: Laser marking the PartNumber and batch production of the product; - Singularization: cutting and separation of components; Testing HT Micron has a highly qualified team with extensive packaging & testing experience. With professionals that have been in major worldwide semiconductor companies, having technically trained capacity to develop and apply tests on products. Through robust and effective testing, HT performs all testing steps needed to ensure reliability, durability and quality of products. They are: - Burn-in; - Core test at high temperature; - Speed test; - Core test at low temperature

4 DRAM DDR3 Memmory Using high quality inputs and technology, HT Micron develops locally packaged and tested DDR3L memory that can be used by all PCs, including desktops, notebooks and ultrabooks. This local packaging and test is in accordance with PADIS and fulfills the steps required to obtain the benefits of the ordinances from PPB.

5 Developed with the third generation of JEDEC DDR SDRAM standards, operating twice as fast as the previous generation and with lower power consumption of 1.35 V, DDR3L components are ideal to be used as main memory in applications that require high density, high operating frequencies and low power consumption. HT Micron DDR3L components offer fully synchronous operation and data paths with a 8-bit prefetch to achieve high bandwidth transfer. These components are backward compatible to 1.5 V without changes. Technology Density Arrange RoHS Tension Clock Packaging Operation Temperature DDR3 2 Gb 256x8 Sim 1.35 V 1600 MHz FBGA 0 C to +95 C DDR3 4 Gb 512x8 Sim 1.35 V 1600 MHz FBGA 0 C to +95 C

6 NAND Locally produced, non-volatile NAND Flash memories are encouraged by PADIS and fulfill the steps required to obtain benefits ordinances from PPB. NAND Flash memories can be used in Pen Drives, SSDs, hybrid storage, industrial applications, multimedia players, mobile phones and tablets. SiP Using System in Package (SiP) packaging technology, HT Micron has the capacity to supply Pen-Drives with different capacities and technologies. Through the concept of SiP (system in a package) it is possible to produce pendrives with reduced size and high capacity. This process fulfills the steps required to obtain the benefits of the ordinances from PADIS.

7 The NAND technology is extremely versatile and can be applied in a products diversity that requires reliable storage, high speed and long life and can be combined in several ways to generate wide range of densities using MLC technology that enables storage of 2 bytes per cell. The System-in-Package (SiP) based on NAND Flash with USB controllers, enables products with a wide range of densities while maintaining a small physical size and creating a high strength product with all of the components being encapsulated in a single package. These products are available in sizes 8GB, 16GB and 32GB with USB 2.0 interface allowing for high speed data transfer.

8 HT Micron is a Brazilian company focused on providing local solutions for semiconductor packaging and test. Founded in 2009 through a joint venture between South Korea s Hana Micron and Brazil s Parit Group (Participations in Innovation and Technology S / A), HT Micron aims to stimulate the generation of knowledge and added value in Brazil through partnerships with institutes of technology and universities. Av. Unisinos, 950 Sala Todos os direitos reservados. Imagens meramente ilustrativas. Grupo PARIT